ZXGD3004E6Q DIODES | Alldatasheet
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High-Gain Buffer with Typically 1.9A Output from 10mA Input 8 Amps Peak Output Current 40V Supply for +20V to -18V Gate Driving to Prevent dV/dt Induced False Triggering and Minimize On-Losses Emitter-Follower that is Rugged to Latch-Up/Shoot-Though Fast Switching Emitter-Follower Configuration 1ns Propagation Delay Time 14ns Rise/Fall Time, 1500pF Load Optimized Pin-Out to Simplify PCB Layout and Reduce Parasitic Trace Inductances Near-Zero Quiescent Supply Current Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) Mechanical Data Case: SOT26 Case material: molded plastic. ―Green‖ Molding Compound; UL Flammability Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.018 grams (Approximate) Ordering Information (Notes 4 & 5) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel ZXGD3004E6QTA Automotive 3004 7 8 3,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See http://www.diodes.com/quality/lead_free/ for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green" and Lead-Free. 3. Halogen and Antimony free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 5. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes -packaging/. Pin Name Pin Function VCC Driver Supply High IN1 & IN2 Driver Input * VEE Supply Voltage Low SOURCE Source Current Output SINK Sink Current Output Top View Pin-Out Top View SOT26 * Typically connect IN1 & IN2 together ** Typically connect SOURCE & SINK together
Document Number DS40818 Rev. 1 - 2 2 of 8 www.diodes.com March 2018 © Diodes Incorporated ZXGD3004E6Q Marking Information Date Code Key Year 2018 2019 2020 2021 2022 2023 2024 2025 Code F G H I J K L M Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D Typical Application Circuit 3004 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: F = 2018) M = Month (ex: 9 = September) ZXGD3004E6Q VCC VEE
Document Number DS40818 Rev. 1 - 2 3 of 8 www.diodes.com March 2018 © Diodes Incorporated ZXGD3004E6Q Absolute Maximum Ratings (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Value Unit Supply Voltage, with Respect to VEE VCC 40 V Input Voltage, with Respect to VEE VIN 40 V Output Difference Voltage (Source – Sink) V(source-sink) ±7 V Peak Pulsed Output Current (Source – Sink) IOM ±8 A Peak Pulsed Input Current IIN1, IIN2 ±1 A Thermal Characteristics (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation (Notes 6 & 7) Linear Derating Factor PD 1.1 8.8 W mW/°C Thermal Resistance, Junction to Ambient (Notes 6 & 7) RθJA 113 °C/W Thermal Resistance, Junction to Lead (Note 8) RθJL 105 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Electrostatic Discharge – Charged Device Model ESD CDM 1,000 V IV Notes: 6. For a device mounted on 25mm x 25mm 1oz copper that is on a single-sided 1.6mm FR-4 PCB; device is measured under still air conditions whilst operating in a steady-state. The heatsink is split in half with the pin 1 (VCC) and pin 3 (VEE) connected separately to each half. 7. For device with two active die running at equal power. 8. Thermal resistance from junction to solder-point at the end of each lead on pin 1 (VCC) and pin 3 (VEE). 9. Refer to JEDEC specification JESD22-A114, JESD22-A115 and JESD22-C101.
Document Number DS40818 Rev. 1 - 2 4 of 8 www.diodes.com March 2018 © Diodes Incorporated ZXGD3004E6Q Electrical Characteristics (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition Output Voltage, High VOUT(hi) — VIN1 - 0.4 — V Isource = 1µ A Output Voltage, Low VOUT(low) — VIN1 + 0.4 — Isink = 1µ A Source Output Leakage Current IL(source) — — 1 µA VCC = 40V, VIN1 = VIN2 = 0V Sink Output Leakage Current IL(sink) — — 1 µA VCC = 40V, VIN1 = VIN2 = VCC Quiescent Supply Current IQ — — 50 nA VCC = 32V, VIN1 = VIN2 = 0V Peak Pulsed Source Output Current I(source)M 1.2 1.9 — A IIN1 + IIN2 = 10mA Peak Pulsed Sink Output Current I(sink)M 1.2 1.9 — A IIN1 + IIN2 = -10mA Peak Pulsed Source Output Current I(source)M — 8 — A IIN1 + IIN2 = 1A Peak Pulsed Sink Output Current I(sink)M — 8 — A IIN1 + IIN2 = -1A Gate Driver Switching Times td(rise) tr td(fall) tf 1.1 13.4 0.95 12.4 — ns VCC = 15V, VEE = 0V, VIN = 0 to 12.5V, CL = 1.5nF, RL = 0.1Ω, RIN = 25Ω Gate Driver Switching Times td(rise) tr td(fall) tf 3.2 77.9 3.6 — ns VCC = 15V, VEE = 0V, VIN = 0 to 12.5V, CL = 1.5nF, RL = 0.1Ω, RIN = 1kΩ Switching Test Circuit and Timing Diagram ZXGD3004E6Q VCC VEE
Document Number DS40818 Rev. 1 - 2 5 of 8 www.diodes.com March 2018 © Diodes Incorporated ZXGD3004E6Q Typical Gate Driver Characteristics (@TA = +25° C, unless otherwise specified.)
Document Number DS40818 Rev. 1 - 2 6 of 8 www.diodes.com March 2018 © Diodes Incorporated ZXGD3004E6Q Typical Gate Driver Characteristics (Cont.)
Document Number DS40818 Rev. 1 - 2 7 of 8 www.diodes.com March 2018 © Diodes Incorporated ZXGD3004E6Q Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. SOT26 Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. SOT26 D e E1 E b A2 A1 Seating Plane L c a Y1 G X Y C SOT26 Dim Min Max Typ A1 0.013 0.10 0.05 A2 1.00 1.30 1.10 A3 0.70 0.80 0.75 b 0.35 0.50 0.38 c 0.10 0.20 0.15 D 2.90 3.10 3.00 e - - 0.95 e1 - - 1.90 E 2.70 3.00 2.80 E1 1.50 1.70 1.60 L 0.35 0.55 0.40 a - - 8° a1 - - 7° All Dimensions in mm Dimensions Value (in mm) C 2.40 C1 0.95 G 1.60 X 0.55 Y 0.80 Y1 3.20
Document Number DS40818 Rev. 1 - 2 8 of 8 www.diodes.com March 2018 © Diodes Incorporated ZXGD3004E6Q IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license unde r its patent or trademark rights, nor the rights of others. Any Customer or user of th is document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diod es Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, internation al or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into mul tiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems witho ut the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support d evices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be provided by Diodes In corporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2018, Diodes Incorporated www.diodes.com