ZXGD3004E6

ZXGD3004E6 ZETEX | Alldatasheet

Document overview

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Technical content

Features

• 40V operating voltage range  8 amps peak output current  Fast switching emitter-follower configuration  1ns propagation delay time  14ns rise/fall time, 1500pF load  Low input current requirement  1.9A(source)/1.9A(sink) output current from 10mA input  SOT23-6 package  Separate source and sink outputs for independent control of rise and fall time  Optimized pin-out to ease board la yout and minimize trace inductance  No Latch Up  No shoot through  Near - Zero quiescent and output leakage current Typical application circuit GND SINK VCC IN1 IN2 SOURCE VS Input VCC Input ZXGD3004

Issue 1 - October 2007 2 www.zetex.com © Zetex Semiconductors plc 2007

Applications

Power MOSFET and IGBT Gate Driving in  Synchronous switch-mode power supplies  Secondary side synchronous rectification  Plasma Display Panel power modules  1, 2 and 3-phase motor control circuits  Audio switching amplifier power output stages Pin configuration Pin description

Ordering information

VCC Driver supply. IN1 / IN2 Driver input pins. These are normally connected together by circuit tracks. GND Ground. SOURCE Source current output. SINK Sink current output. Device Reel size (inches) Tape width (mm) Quantity per reel ZXGD3004E6TA 7 8 embossed 3000 VCC IN1 GND SOT236 Top view SOURCE IN2 SINK

Issue 1 - October 2007 3 www.zetex.com © Zetex Semiconductors plc 2007 Absolute maximum ratings Thermal resistance NOTES: (a) For a device surface mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) For device with two active dice running at equal power. (c) Pulse width <=300us limit repetition rate to comply with maximum junction temperature. Parameter Symbol Limit Unit Supply voltage V CC 40 V Input voltage V IN 40 V Peak sink current(c) I(sink)PK 8A Source current @ IIN1 + IIN2 =10mA(a) I(source) 1.9 A Sink current @ IIN1 + IIN2 =10mA(a) I(sink) 1.9 A Input current(c) IIN1, IIN2 1A Power dissipation at TA =25°C(a)(b) PD 1.1 W Linear derating factor 8.8 mW/ °C Operating and storage temperature range T j, Tstg -55 to +150 °C Parameter Symbol Value Unit Junction to ambient(a)(b) R/H9052JC 113 °C/W

Issue 1 - October 2007 4 www.zetex.com © Zetex Semiconductors plc 2007 Electrical characteristics (at Tamb = 25°C unless otherwise stated). Switching time test circuits Timing diagram Parameter Symbol Min. Typ. Max. Unit Conditions Output voltage, high V OH VIN1 – 0.4 V I source = 1/H9262A Output voltage, low V OL VIN1 + 0.4 V I sink = 1/H9262A Source output leakage current IL(source) 1 /H9262AV CC = 40V, VIN1 = VIN2 = 0V Sink output leakage current IL(sink) 1 /H9262AV CC = 40V, VIN1 = VIN2 = VCC Quiescent current I Q 50 nA V CC = 32V, VIN1 = VIN2 = 0V Source output current I (source) 1.2 1.9 A I IN1+IIN2 = 10mA Sink output current I (sink) 1.2 1.9 A I IN1+IIN2 = 10mA Source output current I (source)PK 8A I IN1+IIN2 = 1A Sink output current I (sink)PK 8A I IN1+IIN2 = 1A Gate driver switching times td(rise) tr td(fall) tf 1.1 13.4 0.95 12.4 ns ns ns ns C L=1.5nF, RL=0.1/H9024, VCC=15V, VIN=12.5V, RS=25/H9024 Gate driver switching times td(rise) tr td(fall) tf 3.2 77.9 3.6 ns ns ns ns C L=1.5nF, RL=0.1/H9024, VCC=15V, VIN=12.5V, RS=1k/H9024

Issue 1 - October 2007 5 www.zetex.com © Zetex Semiconductors plc 2007 Typical gate driver characteristics 0.1 1 10 100 100 0.1 1 10 100 100m 1 10 100 0.1 1 10 100 0.1 100 0 100 200 300 400 500 600 700 800 0 200 400 600 800 1000 Rise Time Fall Time Rise and Fall Time TA = 25°C VCC= 15V VIN = 12.5V RS = 25Ω RL = 0.1Ω Time (ns) CL Capacitive Load (nF) Delay Rising Propagation Delay TA = 25°C VCC= 15V VIN = 12.5V RS = 25Ω RL = 0.1Ω Time (ns) CL Capacitive Load (nF) Delay Falling Peak Drive Current Rising Falling TA = 25°C VCC= 15V VIN = 12.5V RS = 25Ω RL = 0.1Ω Peak Drive Current (A) CL Capacitive Load (nF) 250KHz TA = 25°C VCC= 15V VIN = 12.5V RS = 25Ω RL = 0.1Ω Supply Current Duty Cycle = 50% Supply Current (mA) CL Capacitive Load (nF) 100KHz TA = 25°C VCC = 15V VIN = 12.5V RS = 25Ω CL = 1.5nF RL = 0.1Ω VOUT Switching Speed Voltage (V) Time (ns) VIN TA = 25°C VCC = 15V VIN = 12.5V RS = 1000Ω CL = 1.5nF RL = 0.1Ω VOUT VIN Switching Speed Time (ns) Voltage (V)

Issue 1 - October 2007 6 www.zetex.com © Zetex Semiconductors plc 2007

Issue 1 - October 2007 7 www.zetex.com © Zetex Semiconductors plc 2007 Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches DIM Millimeters Inches Min. Max. Min. Max. A 0.90 1.45 0.0354 0.0570 A1 0.00 0.15 0.00 0.0059 A2 0.90 1.30 0.0354 0.0511 b 0.35 0.50 0.0078 0.0196 C 0.09 0.26 0.0035 0.0102 D 2.70 3.10 0.1062 0.1220 E 2.20 3.20 0.0866 0.1181 E1 1.30 1.80 0.0511 0.0708 L 0.10 0.60 0.0039 0.0236 e 0.95 REF 0.0374 REF e1 1.90 REF 0.0748 REF L 0° 30° 0° 30° mm inches0.65 0.026 2.2 0.087 1.06 0.042 0.95 0.037

Issue 1 - October 2007 8 www.zetex.com © Zetex Semiconductors plc 2007 Zetex sales offices Europe Zetex GmbH Kustermann-park Balanstraße 59 D-81541 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc

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Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com © 2007 Published by Zetex Semiconductors plc Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as desi gn ideas. It is the responsibility of the user to ensure that t he circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoev er is assumed by Zetex with respect to the accuracy or use of such in formation, or infringement of patents or other intellectual prop erty rights arising from such use or otherwise. Zetex does not assume any le gal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restricti on or otherwise) for any damages, loss of profit, business, con tract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support devi ce or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issu ed to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict bet ween the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts dire ctly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunc tion to degradation of function or performance in use over ti me. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding reg- ulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the Ro HS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: “Preview” Future device intended for production at some point. Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production ha s been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet ver sion and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet cont aining finalized specifications. However, changes to specifications may occur, at any time and without notice.