ZXBM5210
Document overview
- Manufacturer or author: Diodes Incorporated
- PDF pages: 17
Technical content
Features
Supports single-coil reversible DC motor applications Operating voltage: 3V to 18V Four modes of operations: Forward, Reverse, Brake and Standby Low quiescent current of 0.85mA typical in normal operation and 32µA in standby mode Internal overcurrent protection Undervoltage lockout and overvoltage protection Overtemperature protection -40C to +85C/+105C operating temperature 6kV ESD withstand capability Standard SO-8 and thermally enhanced SO-8EP packages Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ Pin Assignments OUT1 OUT2 VDD VM GND VREF REVFWD (Top View) SO-8 OUT1 OUT2 VDD VM GND VREF REVFWD (Top View) SO-8EP
Applications
5V/9V/12V/15V DC reversible motors and actuators Home appliances Handheld power tools Valve open and close Remote control motorized toys Medium voltage/low power DC motors Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500 ppm total Br + Cl) and <1000ppm antimony compounds. THE ZXBM5210 IS NOT RECOMMENDED FOR NEW DESIGNS. PLEASE CONTACT US.
Document number: DS36765 Rev. 2 - 3 2 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Typical Applications Circuit STNDBYVDD VREF Power CONTROL LOGIC Full Bridge Drive FWD Over current protection REV UVLO and OVL GND TSD VM Vm Duty control SYSTEM POWER Dz Optional Motor Coil GND Forward and Reverse control signal VM Note: 4. C1 is for power stabilization and to strengthen the noise immunity , the recommended capacitance is 100nF to 1µF or more. C2 is a re-circulating capacitor for back rush voltage and recommended capacitance is 100nF for low current applications to 10µF or more for large current applications. See Application Note section Pin Descriptions Package: SO-8 Pin Number Pin Name Function
1 OUT1 Driver Output
2 VM Power Supply Voltage
3 VDD Power Supply Voltage
4 FWD Forward Control Input (logic level, 5.5V max) 5 REV Reverse Control Input (logic level, 5.5V max)
6 VREF Input reference voltage to set the internal PWM oscillator duty ratio
7 OUT2 Driver Output
8 GND Ground
Package: SO-8EP Pin Number Pin Name Function 4 FWD Forward Control Input (logic level, 5.5V max) 5 REV Reverse Control Input (logic level, 5.5V max) Pad Pad The exposed pad is for thermal dissipation and it is internally connected to the ground. On the PCB layout, it can be connected to GND or left open circuit.
Document number: DS36765 Rev. 2 - 3 3 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Functional Block Diagram STNDBYVDD VREF OUT1 OUT2 Power CONTROL LOGIC Full Bridge Drive FWD Over current protection REV UVLO and OVL GND TSD VM Vm Duty control Absolute Maximum Ratings (Note 5) (@TA = +25°C, unless otherwise specified.) Symbol Characteristic Values Unit VM and VDD, Supply Voltage (Note 6) 24 V VOUT1, VOUT2 VREF All Other Pins Except FWD and REV Pins 24 V VFWD and VREV FWD and REV Pin Voltage 7 V VREVERSE Reverse Supply Voltage on All Pins -0.3 V IOUTPUT Output Current (Source And Sink) - Peak 1500 mA SO-8EP (Note 8) 2980 mW TS Storage Temperature Range -65 to +150 C TJ Maximum Junction Temperature +150 C ESD HBM Human Body Model ESD Withstand Capability VDD, VM, VREF, FWD, REV, GND and OUT1 OUT2 pins 6 kV Notes: 5. Stresses greater than those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions be yond those indicated under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings for extended periods can affect device reliability. 6. The absolute maximum supply voltage of 24V is a transient stress rating and is not meant as a functional operating condition. It is not recommended to operate the device at the absolute maximum rated conditions for any period of time. 7. SO-8 soldered to minimum recommended landing pads (see Package Outline Dimensions section) on a 1” x 1” two-layer 2oz. copper FR4 PCB (1.6mm thickness) without any via or copper flood on the bottom layer . See thermal de-rating curves in the Thermal Performance section. 8. SO-8EP exposed pad soldered to minimum recommended landing pads (see Package Outline Dimensions section) on a 2” x 2” two-layer 2oz. copper FR4 PCB (1.6mm thickness) with four thermal vias in the exposed pad to the copper flood on the bottom layer. See thermal de-rating curves in the Thermal Performance section. Recommended Operating Conditions Symbol Characteristic Conditions Min Max Unit VDD Supply Voltage Operating 3 18 V TA Operating Temperature Range Operating, SO-8 Package -40 +85 C Operating, SO-8EP Package -40 +105 C
Document number: DS36765 Rev. 2 - 3 4 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Electrical Characteristics (Note 9) (@TA = +25°C, VDD = 12V, unless otherwise specified.) Symbol Characteristics Conditions Min Typ Max Unit IDD Supply Current No Load — 0.85 2.5 mA IDD_STNDBY Standby Supply Current FWD = REV = LOW (GND) — 32 45 µA VUV_TH Undervoltage Lockout Threshold Voltage Decreasing — 2.6 — V VUVLO_R Undervoltage Lockout Release Threshold Voltage Increasing — 2.8 3.0 V VUV_HYS Undervoltage Hysteresis Voltage Increasing — 200 — mV VOV_TH Overvoltage Threshold Voltage Increasing — 20.7 24 V VOV_RLTH Overvoltage Release Threshold Voltage Decreasing 17.0 19 — V VOH Output Voltage High IOUT = 300mA TA = -40C to +105C VDD - 0.25 VDD - 0.15 — V IOUT = 500mA TA = -40C to +105C VDD - 0.43 VDD - 0.25 — V VOL Output Voltage Low IOUT = 300mA TA = -40C to +105C — 0.15 0.25 V IOUT = 500mA TA = -40C to +105C — 0.25 0.43 V VOH+ VOL Output Voltage of n- and pMOS and Bond Wire Voltage Drop Combined IOUT = 300mA TA = -40C to +105C — 0.3 0.5 V IOUT = 500mA TA = -40C to +105C — 0.5 0.86 V IOUT = 300mA, VDD = 3V TA = -40C to +105C — 0.39 0.66 V RON_Total Combined n- and pMOS RDSON Including Bond Wire Resistance IOUT = 500mA TA = -40C to +105C — 1 1.72 Ω IOUT = 300mA, VDD = 3V ILIM_TH Overcurrent Protection Threshold — 1.2 1.5 — A VREF VREF Voltage Range (DC Voltage Speed Control Mode) — 3 — VDD (18V max) V IVREF VREF Bias Current (DC voltage Speed Control Mode) VREF = VDD -15 0 15 μA fOUT Output PWM Switching Frequency (Internal PWM Oscillator) VREF control mode 20 26.5 35 kHz PWM speed control mode 20 — 100 kHz fFWD_REV Input PWM Frequency of Speed Control Signal PWM control mode 20 — 100 kHz tDEAD Dead Time Between Current Reversal VDD = 3V to 18V TA = -40C to +105C 2.1 3 3.9 μs tSDN_DELAY Shutdown Delay – Internal Circuits Active after FWD = REV = L (Except from Brake Mode) FWD = GND REV = GND 125 180 — μs VFWDH FWD Input H Level — 2 — 5.5 V VFWDL FWD Input L Level — 0 — 0.8 V IFWDH FWD Pin Current – H Level FWD pin: VFWD = 5V — 50 — μA IFWDL FWD Pin Current – L Level FWD pin: VFWD = 0V — 50 — μA VREVH REV Input H Level — 2 — 5.5 V VREVL REV Input L Level — 0 — 0.8 V IREVH REV Pin Current – H Level REV pin: VRVS = 5V — 50 — μA IREVL REV Pin Current – L Level REV pin: VRVS = 0V — 50 — μA DPWM_MIN Output Minimum Duty Ratio — 0% — 100 % TJ_SDN_TH IC Junction Temperature Thermal Shutdown Threshold — — +165 — °C TJ_SDN_HYST IC Junction Temperature Thermal Shutdown Hysteresis — — +25 — °C Note: 9. Typical data is at TA = +25C, VDD = 12V. The maximum and minimum parameters values over the operating temperature range are not tested in production, they are guaranteed by design, characterization and process control.
Document number: DS36765 Rev. 2 - 3 5 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Application Note Rotation Control and Standby Modes The device has FWD and REV pins for controlling the motor rotation directions. The device has four motor operation modes: 1) Standby mode, 2) Forward mode, 3) Reverse mode and 4) Brake mode. The four modes are controlled by the FWD and REV logic pins. FWD REV VREF OUT1 OUT2 Operating mode L L x Open Open Standby mode – All switches are off. H L 3V to VDD H L Forward mode – Current flows from OUT1 to OUT2; VREF duty control L H 3V to VDD L H Reverse mode – Current flows from OUT2 to OUT1; VREF duty control H H x L L Brake mode – Short-circuit brake with low side switches on PWM L VDD H PWM Forward mode – Current flows from OUT1 to OUT2; PWM control mode L PWM VDD PWM H Reverse mode – Current flows from OUT2 to OUT1; PWM control mode H H x L L Brake mode – Short-circuit brake with low side switches on In the brake mode, switches S2 and S4 are ON allowing the motor to stop quickly. All the internal control circuits are fully operational. In the standby mode all the output drive switches are off and additionally, the internal circuits are also turned off to minimize power consumption. The power consumption in the standby mode is less than in the brake mode. If running motor enters the Standby mode, due to the body diodes the motor free wheels to idle state. Whenever the motor enters the standby mode from any mode (except the brake mode) the control logic will remain active in previous mode for at least 125µs before shutting down the internal circuits. To prevent the device from entering the standby mode during operating mode changes, the mode change signals should be completed within 125µs. In the forward mode, with switches S1-S2 ON and S3-S4 OFF, OUT1 is high and OUT2 is low. The motor current flows from OUT1 to OUT2. In the reverse mode, switches S1-S4 are ON while S1-S2 are OFF to allow motor current flow from OUT2 to OUT1. In the forward or reverse mode, for VREF speed control, the output drive duty ratio is generated internally based on the voltage on the VREF pin. For PWM speed control, external PWM signals applied to the FWD or REV pins control the PWM switching of the low side S2 (forward mode) or S4 (reverse mode). See application section for further details. The ZXBM5210 has three modes of speed control: VREF speed control mode, PWM speed control mode and by adjusting the supply voltage M S2S4 Off Off Off Standby mode GND Off Supply OUT1 OUT2 Forward mode M On Off Off On Supply GND OUT1 OUT2 Reverse mode M Off On On Off Supply GND OUT1 OUT2 On On OffOff Brake mode M Supply GND OUT2OUT1
Document number: DS36765 Rev. 2 - 3 6 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Application Note (continued) Motor Speed Control with DC Voltage on VREF Pin Motor speed can be controlled by adjusting the DC voltage into the V REF pin. The output drive PWM d uty ratio is defined by the ratio of the V REF voltage to the supply VDD voltage. In VREF speed control mode, FWD and REV pins are only used for direction control and therefore high frequency PWM control signal should not be applied to the FWD and REV pins. If repetitive direction changes required, it is recommended to keep direction change frequency of below 400Hz. The speed and direction control is given by: FWD REV VREF OUT1 OUT2 Operating mode L L x Open Open Standby mode – All switches are off. H L VDD H L Forward mode – Current flows from OUT1 to OUT2; 100% duty H L 3V to VDD H L Forward mode – Current flows from OUT1 to OUT2; VREF duty control L H VDD L H Reverse mode – Current flows from OUT2 to OUT1; 100% duty L H 3V to VDD L H Reverse mode – Current flows from OUT2 to OUT1; VREF duty control H H x L L Brake mode – Short-circuit brake with low-side switches on Motor Speed Control with a PWM Input Signal Motor speed can be controlled by adjusting the duty cycle of the PWM speed control si gnal into the FWD or REV while keeping the VDD pin at the nominal motor voltage. In this mode the input voltage on the VREF pin must be greater than or equal to VDD. In PWM speed control mode the high -side switches S1 and S3 are kept fixed while the low -side switches S2 or S4 are switched. In the forward mode, S1 is kept switched on, S2 is switched in accordance with the PWM signal and S3 and S4 are switched off. In reverse mode, S3 is switched on, S4 is switched in accordance with the PWM signal and S1 and S2 are switched off. The speed and direction control is given by: FWD REV VREF OUT1 OUT2 Operating mode L L x Open Open Standby mode – All switches are off. H L VDD H L Forward mode – Current flows from OUT1 to OUT2; 100% duty L H VDD L H Reverse mode – Current flows from OUT2 to OUT1; 100% duty H H x L L Brake mode – Short-circuit brake with low-side switches on PWM L VDD H PWM Forward mode – Current flows from OUT1 to OUT2; PWM control mode L PWM VDD PWM H Reverse mode – Current flows from OUT2 to OUT1; PWM control mode H H x L L Brake mode – Short-circuit brake with low-side switches on The motor speed is proportional to the input PWM signal duty. For example, for a 12V motor the VDD pin is maintained at 12V while varying the PWM control signal duty to adjust the motor speed linearly. The timing diagram below shows the output OUT1 and OUT2 in relation to PWM speed control signal at PWM pin. FWD OUT1 OUT2 REV Standby mode Forward mode Brake mode Reverse mode Frequency of PWM speed control signal can be between 8kHz to 100kHz. Recommended typical PWM signal frequency is 25kHz to keep switching frequency away from the audible band.
Document number: DS36765 Rev. 2 - 3 7 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Application Note (continued) Motor Speed Control with a PWM Input Signal (continued) Depending on the motor design and its inertia the minimum startu p PWM duty required can be typically between 30% to 50%. While the motor is rotating minimum PWM duty can generally be reduced down to 20%. How small the PWM duty can be without stalling the motor depe nds on the motor mechanical and coil design parameters and not limited by the output capability of the device. If voltage at VDD is lower than the nominal motor voltage, both startup PWM duty and minimum running PWM duty required will be higher. Motor Speed Control by DC Supply Voltage Motor speed can be controlled by varying the VDD supply voltage while the FWD and REV pins are set to either a logic high or low depending on forward or reverse direction needed. The VREF must be equal to VDD in this mode. For example, if the VDD for a 12V motor is changed from 12V to 3V the speed will be reduced from 100% to 25%. Re-Circulating Capacitor During motor operation when the low-side switch is turned off the bridge or the motor voltage may overshoot to high levels if there is no current path for the energy in the motor to flow. Such high voltages can damage the IC. A current path can be provided by adding a bypass capacitor from the VDD or VM to the GND. The value of the bypass capacitor depends on the motor coil design, motor current, motor voltage and the IC voltage limits. This could be in the range of 0.47µF for low current applications to 10uF or more for large current applications. Dead Time During motor current reversal (for motor rotation direction reversal), switch position changes between S1-S2 and S3-S4. Such change may result in cross conduction between high-side and low-side MOSFETs, e.g. S1 and S4 or S2 and S3. To prevent cross conduction the IC provides a dead time 3µs typical during current reversal or fast turn on of the low-side MOSFETs. Back-Rush Voltage Depending on motor characteristics, the environment and the ambient conditions back -rush voltage (at the bridge) may fluctuat e during brush commutation and PWM switching. Due to the energy in the coil this back-rush voltage can reach high levels if no adequate alternative current path is provided when inductor current path is interrupted. The back -rush voltage overshoot should not be allowed to go beyond the operating voltage range of the IC. This back-rush voltage overshoot can be minimized by using a re-circulating bypass capacitor at the VDD and VM pins. The value of the re-circulating bypass capacitor depends on the motor coil design, motor current, motor voltage and the IC voltage limits. This could be 0.47µF for low current applications to 10µF or more for large current applications. Undervoltage Lockout To make sure the minimum voltage needed to operate the driver is supplied, the driver has an undervoltage lockout. At startup the device will only start if the supply voltage is typically 2.8 or greater. During normal operation, the device will switch off all the output switches and power down if the supply voltage drops below 2.6V typical. Overvoltage Protection When the supply voltage exceeds 20.7V (typical) the driver will turn off all the output switches. The driver will return to normal condition if the supply voltage drops below 19V (typical) provided no other fault condition or signals are preventing it from entering normal operation. Inrush Current It is recommended to use the PWM duty cycle to control the average voltage supplied to the motor during power-up, standby mode, brake mode or during motor direction reversal. If a PWM signal is not available it is recommended to use a current limiting resistor or oth er protection devices if needed. Overcurrent Setting and Protection The internal overcurrent protection (OCP) threshold is 1.5A typical at 12V supply +25°C. When the motor current exceeds the OCP threshold for longer than 10 µs typical on any of the H-Bridge switches, the device will switch off all the output switches and remain off for 5ms typical. The IC returns to normal operation after the 5ms if overcurrent condition has gone away. If the motor current is still higher than the OCP threshold, the device will enter another 5ms standby mode.
Document number: DS36765 Rev. 2 - 3 8 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Application Note (continued) Thermal Shutdown The device has an internal thermal shutdown to prevent a thermal run -away scenario. The thermal shutdown is triggered when the junction temperature of the device reaches +165°C. It will remain in standby mode until the junction temperature falls by +25°C. Reverse Voltage Protection If reverse protection is needed this can be achieved by adding an external diode to the VDD and VM pins. Motor Electromagnetic and Audible Noise To help reduce electromagnetic and audible nose, capacitor can be connected from OUT1 to GND and OUT2 to GND pins. Alternatively, a capacitor can be connected between OUT1 and OUT2 with diodes between the output pins and GND as shown below. To prevent large currents it is recommended to keep any capacitor used at the output pins as small as possible and less than 1µF. OUT1 OUT2 OUT1 OUT2
Document number: DS36765 Rev. 2 - 3 9 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Typical Operating Characteristics Supply Current Standby Current Undervoltage Lockout (UVLO) Overvoltage Protection (OVP)
Document number: DS36765 Rev. 2 - 3 10 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Typical Operating Characteristics (continued) Output PWM Duty in PWM Speed Control Mode Output PWM Duty in VREF Speed Control Mode PWM Oscillator Frequency 100 0 10 20 30 40 50 60 70 80 90 100 Output PWM Duty (%) Input PWM Duty (%) Output PWM Duty vs Input PWM Duty 12V 18V TA = 25oC, Mode A PWM, Input PWM Frequency 25kHz
Document number: DS36765 Rev. 2 - 3 11 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Typical Operating Characteristics (continued) Low Side Switch On Voltage (VOL) High Side Switch On Voltage (VDD - VOH) 0.0 0.1 0.2 0.3 0.4 0.5 0 2 4 6 8 10 12 14 16 18 20 Low Side Swicth ON Voltae (V) Supply Voltage (V) Low Side Switch ON Voltage VOL vs. Supply Voltage IOUT = 300mA TA = +25 C
Document number: DS36765 Rev. 2 - 3 12 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Typical Operating Characteristics (continued) High Side Switch On Voltage (VDD - VOH) (cont.) H-Bridge Resistance – Total Resistance On (RDSON_TOTAL) of the High and the Low Side Switches 0.0 0.1 0.2 0.3 0.4 0.5 -50 -25 0 25 50 75 100 125 High Side Switch ON Voltage (V) Temperature ( C) HighSide Switch On Voltage (VDD-VOL) vs. Temperature 12V 18V IOUT = 300mA
Document number: DS36765 Rev. 2 - 3 13 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Thermal Performance (1) Package Type: SO-8 SO-8 Power Dissipation De-Rating Curve (Note 10) TA (C) -40 0 25 50 60 70 80 85 90 95 100 105 110 120 125 130 140 150 PD (mW) 1043 1043 1043 835 751 668 584 543 501 459 417 376 334 250 209 167 83 0 Note: 10. SO-8 soldered to minimum recommended landing pads (see Package Outline Dimensions section) on a 1” x 1” two-layer 2oz. copper FR4 PCB (1.6mm thickness) without any via or copper flood on the bottom layer. (2) Package Type: SO-8EP SO-8EP Power Dissipation De-Rating Curve (Note 11) TA (C) -40 0 25 50 60 70 80 85 90 95 100 105 110 120 125 130 140 150 PD (mW) 2980 29080 2980 2384 2146 1907 1669 1550 1430 1430 1192 1073 954 715 596 477 238 0 Note: 11. SO-8EP exposed pad soldered to minimum recommended landing pads (see Package Outline Dimensions section) on a 2” x 2” two-layer 2oz. copper FR4 PCB (1.6mm thickness) with four thermal vias in the exposed pad to the copper flood on the bottom layer
Document number: DS36765 Rev. 2 - 3 14 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210
Ordering Information
S : SO-8 SP : SO-8EP 13 : Tape & Reel Part Number Part Number Suffix Package Code Package Packing Qty. Carrier ZXBM5210-S-13 -13 S SO-8 2500 13” Tape & Reel ZXBM5210-SP-13 -13 SP SO-8EP 2500 13” Tape & Reel Marking Information (1) Package Type: SO-8 ( Top View ) BM5210 YY WW XX Logo Identification Code WW : Week : 01 to 52; 52 YY : Year (ex: 23 = 2023) XX : Internal Code represents week 52 and 53 Part Number Package Identification Code ZXBM5210-S-13 SO-8 BM5210 (2) Package Type: SO-8EP ( Top View ) BM5210 YY WW XX Logo Identification Code E WW : Week : 01 to 52; 52 YY : Year (ex: 23 = 2023) XX : Internal Code represents week 52 and 53 SO-8EP Part Number Package Identification Code ZXBM5210-SP-13 SO-8EP BM5210
Document number: DS36765 Rev. 2 - 3 15 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package Type: SO-8 (2) Package Type: SO-8EP SO-8 Dim Min Max A - 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h - 0.35 L 0.62 0.82 0 8 All Dimensions in mm SO-8EP (SOP-8L-EP) Dim Min Max Typ A 1.40 1.50 1.45 A1 0.00 0.13 - b 0.30 0.50 0.40 C 0.15 0.25 0.20 D 4.85 4.95 4.90 E 3.80 3.90 3.85 E0 3.85 3.95 3.90 E1 5.90 6.10 6.00 e - - 1.27 F 2.75 3.35 3.05 H 2.11 2.71 2.41 L 0.62 0.82 0.72 N - - 0.35 Q 0.60 0.70 0.65 All Dimensions in mm Gauge Plane Seating Plane EE1 h L D e b A 45° 7°~9° 0.254 Gauge Plane Seating Plane E N e b A 45° H F Exposed Pad Bottom View L Q C 4? ? 3° 9? (All sides) D 1 4 8 5
Document number: DS36765 Rev. 2 - 3 16 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package Type: SO-8 (2) Package Type: SO-8EP Dimensions Value (in mm) X 0.60 Y 1.55 C1 5.4 C2 1.27 Dimensions Value (in mm) C 1.270 X 0.802 X1 3.502 X2 4.612 Y 1.505 Y1 2.613 Y2 6.500 X Y C X Y
Document number: DS36765 Rev. 2 - 3 17 of 17 www.diodes.com December 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. ZXBM5210 IMPORTANT NOTICE 1. DIODES INCORPORATED (Diodes) AND ITS SUBSIDIARIES MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON -INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operation of Diodes ’ products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engineering customers and users who design with Diodes’ products. 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