ZABG4002
Document overview
- Manufacturer or author: Diodes Incorporated
- PDF pages: 7
Technical content
Features
Four Stage FET Bias Controller Operating Range of 3.0V to 8.0V Low Quiescent Supply Current, 1.2mA Typical FET Drain Voltages Set at 2.0V FET Drain Current Selectable from 0 to 15mA Switchable FETs for Power Management Allows First and Second Stage FETs to Be Run at Different (Optimum) Drain Currents FET Drain Voltages and Currents Held Stable Over Temperature and VCC Variations FETs Protected against Overstress during Power-up and Power- down Internal Negative Supply Generator Allowing Single Supply Operation (Available for External Use) Low External Component Count Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3)
Applications
Twin LNB’s Quad LNB’s US LNB’s Microwave Links PMR and Cellular Telephone Systems Pin Assignments Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 20 15/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Single Universal LNB System Diagram Horizontal ZXHF 5002 ZABG 6002 ZXHF 5002 ZABG 4002 Vertical Gain stages GaAs FET’s Down Converter IF Switching, gain and control Horizontal ZXHF 5002 ZABG 6002 ZXHF 5002 ZABG 4002 Vertical Gain stages GaAs FET’s Down Converter IF Switching, gain and control (Top View) (Bottom View) CSUB VCC GND G3D2 VCC RCAL1 CSUB RCAL2 CNB2 CNB1 QFN1633 NOT RECOMMENDED FOR NEW DESIGN USE ZABG4003 ZABG 4002
Document number: DS32047 Rev. 3 - 3 2 of 7 www.diodes.com January 2019 © Diodes Incorporated ZABG4002 Device Description The ZABG series of devices are designed to meet the bias requirements of GaAs and HEMT FETs commonly used in satellite receiver LNBs with a minimum of external components whilst operating from a minimal voltage supply and using minimal current. The ZABG4002 provides four FET bias stage s, arranged in two pairs of two. Resistors connected to pins R CAL1 and RCAL2 set the FET drain currents of each pair over the range of 0 to 15mA, allowing input FETs to be biased for optimum noise and amplifier FETs for optimum gain. Drain voltages of all stages are set at 2.0V. The drain supplies are current limited to approximately 5% above the operating currents set by the RCAL resistors. As an additional feature the RCAL pins can also be used as logic inputs to disable pairs of FETs as part of a power management scheme or simply an alternative to LNA switching. Driven to a logic high (>3.0V), the inputs disable their associated FET bias stages by switching gate feeds to -2.5V and drain feeds open circuit. Depletion mode FETs require a negative voltage bias supply when operated in grounded source circuits. The ZABG4002 includes an integrated low noise switched capacitor DC-DC converter generating a regulated output of -2.5V to allow single supply operation. To facilitate the design of efficient low voltage 3.3V LNB systems and to maintain compatibility with higher voltage legacy designs, the ZABG4002 is capable of operating within the supply of 3.0V to 8V. These devices are unconditionally stable over the full working temperature with the FETs in place, subject to the inclusion of the recommended gate and drain capacitors. These ensure RF stability and minimal injected noise. It is possible to use less than the devices full complement of FET bias controls, unused drain and gate connections can be left open circuit without affecting operation of the remaining bias circuits. To protect the external FETs the circuits have been designed to ensure that, under any conditions including power up/down tra nsients, the gate drive from the bias circuits cannot exceed -3V. Additionally each stage has its own individual current limiter. Furthermore if the negative rail experiences a fault condition, such as overload or short circuit, the drain supply to the FETs will shut down avoiding excessive current flow. To minimise PCB space ZABG4002 is packaged in the 16 pin 3mm x 3mm QFN1633 package. Device operating temperature is -40° C to +85° C to suit a wide range of environmental conditions. NOT RECOMMENDED FOR NEW DESIGN USE ZABG4003
Document number: DS32047 Rev. 3 - 3 3 of 7 www.diodes.com January 2019 © Diodes Incorporated ZABG4002 Maximum Ratings Parameter Rating Unit Supply Voltage -0.6 to +10 V Supply Current 80 mA Power Dissipation 500 mW Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +150 °C otherwise stated.) Symbol Parameter Conditions Min. Typ. Max. Unit VCC Operating Voltage Range (Note 4) — 3.0 — 8.0 V ICC Supply Current ID1 = ID2 = ID3 = ID4 = 0 — 1.2 4.0 mA ICC(L) ID1 = ID2 = ID3 = ID4 = 10mA — 42 44 mA VCSUB Substrate Voltage ICSUB = 0 -3.0 -2.65 -2.0 V VCSUB(L) ICSUB = -200µA — -2.55 -2.0 V fOSC Oscillator Frequency — 150 240 600 kHz Gate Characteristics Gate (G1 to G4) IG Current Range — -100 — +500 µA VG(L) Voltage Low ID = 12mA, IG = -10µA -3.0 -2.5 -2.0 V VG(H) Voltage High ID = 8mA, IG = 0 0 0.7 1.0 V VG(DIS) Voltage Disabled ID = 0, IG = -10µA, Drain Characteristics Drain (D1 to D4) ID Current Range — 0 — 15 mA ID(OP) Current Operating Standard Application Circuit 8 10 12 mA ID(DIS) Current Disabled VD = 0, VRCAL = 3.0V — — 10 µA VD(OP) Voltage Operating ID = 10mA 1.8 2.0 2.2 V dID/dVCC Delta ID vs VCC VCC = 3.3 to 8.0V — 1.2 — %/V dID/dTOP Delta ID vs TOP TOP = -40° C to +85° C — 0.05 — %/° C dVD/dVCC Delta VD vs VCC VCC = 3.3 to 8.0V — 0.05 — %/V dVD/dTOP Delta VD vs TOP TOP = -40° C to +85° C — 50 — ppm/° C RCAL(1 and 2) VRCAL(DIS) Disable Threshold — 1.8 2.7 3.0 V IRCAL(DIS) Input Current VRCAL = 3.0V — 1.7 10 µA Output Noise VD(NOISE) Drain Voltage CGATE-GND = 10nF, CDRAIN-GND = 10nF — — 0.02 Vpk-pk VG(NOISE) Gate Voltage CGATE-GND = 10nF, CDRAIN-GND = 10nF — — 0.005 Vpk-pk Notes: 4. The two VCC pins are internally connected, only one of the pins needs to be powered for the device to func tion. See applications section for further information. 5. ESD sensitive, handling precautions are recommended. 6. The negative bias voltages are generated on-chip using an internal oscillator. Two external capacitors, C NB and CSUB of value 47nF are required for this purpose. 7. The package (QFN1633) exposed pad must either be connected to CSUB or left open circuit. 8. The characteristics are measured using two external reference resistors R CAL1 and RCAL2 of value 39kΩ, wired from pins RCAL1/2 to ground. Resistor RCAL1 sets the drain current of FETs 1 and 3, resistor R CAL2 sets the drain currents of FETs 2 and 4. 9. Noise voltage measurements are made with FETs and gate and drain capacitors of value 10nF in place. Noise volta ges are not measured in production. NOT RECOMMENDED FOR NEW DESIGN USE ZABG4003
Document number: DS32047 Rev. 3 - 3 4 of 7 www.diodes.com January 2019 © Diodes Incorporated ZABG4002 Typical Characteristics (Measured at TA = +25° C, VCC = 3.3V, RCAL1 = RCAL2 = 39kΩ (setting ID to 10mA), unless otherwise stated.) ZABG4002 Drain Current vs R CAL 10 100 1000 RCAL (k) Drain Current (mA) ZABG4002 Drain Voltage vs Drain Current 1.8 1.9 2.1 2.2 0 5 10 15 Drain Current (mA) Drain Voltage (V) ZABG4002 Drain Drain Current vs Temperature -40 -20 0 20 40 60 80 Temperature (° C) Drain Current (mA) ZABG4002 Drain Voltage vs Temperature 1.7 1.8 1.9 2.1 2.2 2.3 -40 -20 0 20 40 60 80 Temperature (° C) Drain Voltage (V) ZABG4002 Substrate Voltage vs Substrate Current -2.8 -2.6 -2.4 -2.2 0 50 100 150 200 250 Substrate Current (uA) Substrate Voltage (V) NOT RECOMMENDED FOR NEW DESIGN USE ZABG4003 ZABG4002 Drain Current vs Temperature
Document number: DS32047 Rev. 3 - 3 5 of 7 www.diodes.com January 2019 © Diodes Incorporated ZABG4002 Applications Circuit Applications Information Above is a partial applications circuit for the ZABG4002 showing all external components needed for biasing one of the four FET stages available. Each bias stage is provided with a gate and drain pin. The drain pin provides a regulated 2.0V supply that includes a drain c urrent monitor. The drain current taken by the external FET is com pared with a user selected level, generating a signal that adjusts the gate voltage of the FET to obtain the required drain current. If for any reason, an attempt is made to draw more than the user set drain current from th e drain pin, the drain voltage will be reduced to ensure excess current is not taken. The gate pin drivers are also current limited. The bias stages are split up into two pairs, with the drain current of each pair set by an external R CAL resistor. RCAL1 sets the drain currents of stages 1 and 3, whilst R CAL2 sets the drain currents of stages 2 and 4. This allows the optimisation of drain currents for differing tasks such as input stages where noise can be critical and later amplifier stages where gain may be more important. A graph showin g the relationship between the value of RCAL and ID is provided in the Typical Characteristics section of this datasheet. The R CAL pins can also be used as logic inputs. If set to a logic high state (>3.0V), the associated FET bias stages are disabled, dri ving gate pins to -2.5V and switching drain pins open -circuit. This feature can be used as part of a power management system that turns off any unwanted stages in a multi input receiver. The ZABG4002 includes a switched capacitor DC-DC converter that is used to generate the negative supply required to bias depletion mode FETs used in common source circuit configuration as shown above. This converter uses two external capacitors, C NB the charge transfer capacitor and CSUB the output reservoir capacitor. The circuit provides a regulated -2.5V supply both for gate driver use and for external use if required (for extra discrete bias stages, mixer bias, local oscillator bias etc.). The -2.5V supply is available from the CSUB pin. If any bias stages are not requ ired, their gate and drain pins may be left open circuit. If all bias stages associated with an R CAL resistor are not required, then this resistor may be omitted. To ease PCB layout, the pinout for the ZABG4002 includes two VCC pins. These pins are internally connected so only one of the pins needs to be powered for the device to function. It is probable that the extra pin will help avoid the need for trace cross -over components or ground plane disruption from reverse side PCB links. Note that the exposed pad of the package must be either left floating or connected to CSUB. JF1 Vcc C* C1 10nF 10nF CNB 47nF CSUB 47nF RCAL2 39k * Stripline Elements ZABG4002 RCAL1 39k Cnb1 Vcc Gnd Cnb2 Vcc G3D2 Csub Rcal2 Rcal1 GND RCAL1 CSUB RCAL1 RCAL2 CSUB CNB1 CNB2 VCC CNB RCAL2 NOT RECOMMENDED FOR NEW DESIGN USE ZABG4003
Document number: DS32047 Rev. 3 - 3 6 of 7 www.diodes.com January 2019 © Diodes Incorporated ZABG4002
Ordering Information
Part Number Package Reel Size (inches) Tape Width (mm) Quantity (Per Reel) ZABG4002JA16TC QFN1633 13 8 3000 Marking Information Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. QFN1633 Note 10: Controlling dimensions are in millimetres. Approximate dimensions are provided in inches. The package appearance may vary as shown, for further details please contact your local Diodes Incorporated’s sales office. QFN1633 Dim Min Max A 0.55 0.65 A1 0.00 0.05 A3 0.15 Typ b 0.18 0.28 D 2.95 3.05 D2 1.40 1.60 e 0.50 BSC E 2.95 3.05 E2 1.40 1.60 L 0.35 0.45 Z 0.625 Typ All Dimensions in mm E D e b Z L A Pin #1 ID ZABG 4002 YYWW Pin 1 Part Name Date Code Year/Week NOT RECOMMENDED FOR NEW DESIGN USE ZABG4003
Document number: DS32047 Rev. 3 - 3 7 of 7 www.diodes.com January 2019 © Diodes Incorporated ZABG4002 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IM PLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, correction s or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability a rising out of the application or use of this document or any product described herein; neither does Diodes Incor porated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applic ations shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorne y fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pendi ng. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or system s without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporat ed and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2019, Diodes Incorporated www.diodes.com NOT RECOMMENDED FOR NEW DESIGN USE ZABG4003