TPS62825_V02 TI | Alldatasheet
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Technical content
TPS6282x 2.4-V to 5.5-V Input, 1-, 2-, 3-, 4-A Step-down Converter with 1% Output Accuracy in 1.5-mm × 1.5-mm QFN Package
1 Features
- Available as an integrated-inductor power module: TPSM82821 and TPSM82822
- DCS-Control ™ topology
- 1% feedback or output voltage accuracy (full temperature range)
- Up to 97% efficiency
- 26-mΩ and 25-mΩ internal power MOSFETs
- 2.4-V to 5.5-V input voltage range
- 4-μA operating quiescent current
- 2.2-MHz switching frequency
- Adjustable output voltage from 0.6 V to 4 V
- Power save mode for light load efficiency
- 100% duty cycle for lowest dropout
- Active output discharge
- Power good output
- Thermal shutdown protection
- Hiccup short-circuit protection
- A forced-PWM version for CCM operation
- Create a custom design using the TPS6282x with the WEBENCH® Power Designer
2 Applications
- Solid state drive
- Portable electronics
- Analog security and IP network cameras
- Industrial PC
- Multifunction printers
- Generic point of load
3 Description
The TPS6282x is an easy-to-use synchronous step- down DC-DC converters family with a very low quiescent current of only 4 μA. Based on the DCS- Control topology, it provides a fast transient response. The internal reference allows to regulate the output voltage down to 0.6 V with a high feedback voltage accuracy of 1% over the junction temperature range of –40°C to 125°C. The family devices are pin-to-pin and BOM-to-BOM compatible. The entire solution requires a small 470-nH inductor, a single 4.7-µF input capacitor and two 10-µF or single 22-µF output capacitor. The TPS6282x is available in two flavors. The first includes an automatically entered power save mode to maintain high efficiency down to very light loads for extending the system battery run-time. The second runs in forced-PWM maintaining a continuous conduction mode to ensure the least ripple in the output voltage and a quasi-fixed switching frequency. The device features a Power Good signal and an internal soft start circuit. It is able to operate in 100% mode. For fault protection, it incorporates a HICCUP short circuit protection as well as a thermal shutdown. The device is available in a 6-pin 1.5 x 1.5-mm QFN package, offering the highest power density solution. Device Information PART NUMBER PACKAGE(1) BODY SIZE (NOM) TPS62824x 6-Pin VSON-HR 1.5 mm x 1.5 mm TPS62825x TPS62826x TPS62827x (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Schematic Load (A) Efficiency (%) 100 100P 1m 10m 100m 1 4 Vout=3.3V Vout=2.5V Vout=1.8V Vout=1.2V Vout=0.6V Efficiency at VIN = 5 V www.ti.com TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 1 Product Folder Links: TPS62825 TPS62826 TPS62827 TPS62824A TPS62825A TPS62826A TPS62827A TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
13 Mechanical, Packaging, and Orderable
4 Revision History
Changes from Revision D (October 2020) to Revision E (December 2020) Page
- Changed device status of the TPS62825A and TPS62826A from Advance Information to Production Data.... 1 Changes from Revision C (March 2019) to Revision D (October 2020) Page Changes from Revision B (September 2018) to Revision C (March 2019) Page Changes from Revision A (May 2018) to Revision B (September 2018) Page Changes from Revision * (March 2018) to Revision A (May 2018) Page TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 www.ti.com
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5 Device Options
PART NUMBER OUTPUT VOLTAGE OPERATION MODE OUTPUT CURRENT TPS62824DMQ(1) Adjustable PSM/PWM TPS62825DMQ Adjustable 2 A TPS6282518DMQ 1.8 V TPS62826DMQ Adjustable 3 A TPS6282618DMQ 1.8 V TPS62827DMQ Adjustable 4 A TPS62824ADMQ Adjustable Forced-PWM 1 A TPS62825ADMQ Adjustable 2 A TPS62826ADMQ Adjustable 3 A TPS62827ADMQ Adjustable 4A (1) Preview status
6 Pin Configuration and Functions
Figure 6-1. DMQ Package 6-Pin VSON-HR Bottom View Table 6-1. Pin Functions PIN I/O DESCRIPTION NAME NO. EN 1 I Device enable pin. To enable the device, this pin needs to be pulled high. Pulling this pin low disables the device. Do not leave floating. PG 2 O Power good open-drain output pin. The pullup resistor can be connected to voltages up to 5.5 V. If unused, leave it floating. FB 3 I Feedback pin. For the fixed output voltage versions, this pin must be connected to the output. GND 4 Ground pin SW 5 PWR Switch pin of the power stage VIN 6 PWR Input voltage pin www.ti.com TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TPS62825 TPS62826 TPS62827 TPS62824A TPS62825A TPS62826A TPS62827A
7 Specifications
7.1 Absolute Maximum Ratings
Pins (1) VIN, FB, EN, PG –0.3 6 V SW (DC) –0.3 VIN + 0.3 SW (DC, in current limit) –1.0 VIN + 0.3 SW (AC, less than 10ns) (2) –2.5 10 Temperature Operating junction temperature, TJ –40 150 Storage temperature, Tstg –65 150 (1) All voltage values are with respect to network ground terminal. (2) While switching.
7.2 ESD Ratings
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±500 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
Over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage range, TPS62824x, TPS62825x and TPS62826x 2.4 5.5 V VIN Input voltage range, TPS62827x 2.5 5.5 V VOUT Output voltage range 0.6 4.0 V IOUT Output current range, TPS62824x 0 1 A IOUT Output current range, TPS62825x 0 2 A IOUT Output current range, TPS62826x 0 3 A IOUT Output current range, TPS62827x 0 4 A ISINK_PG Sink current at PG pin 1 mA VPG Pull-up resistor voltage 5.5 V TJ Operating junction temperature -40 125 °C
7.4 Thermal Information
THERMAL METRIC(1) TPS6282x UNITTPS6282x, JEDEC TPS62826EVM-794
6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 129.5 71.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 103.9 n/a (2) °C/W RθJB Junction-to-board thermal resistance 33.1 n/a (2) °C/W ψJT Junction-to-top characterization parameter 3.8 3.9 °C/W ψJB Junction-to-board characterization parameter 33.1 38.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) Not applicable to an EVM. TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 www.ti.com
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7.5 Electrical Characteristics
TJ = -40 °C to 125 °C, and VIN = 2.4 V to 5.5 V. Typical values are at TJ = 25 °C and VIN = 5 V , unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY IQ Quiescent current EN = High, no load, device not switching 4 10 µA IQ Quiescent current EN = High, no load, FPWM devices 8 mA ISD Shutdown current EN = Low, TJ = -40 ℃ to 85 ℃ 0.05 0.5 µA VUVLO Under voltage lock out threshold VIN falling 2.1 2.2 2.3 V Under voltage lock out hysteresis VIN rising 160 mV TJSD Thermal shutdown threshold TJ rising 150 °C Thermal shutdown hysteresis TJ falling 20 °C LOGIC INTERFACE EN VIH High-level threshold voltage 1.0 V VIL Low-level threshold voltage 0.4 V IEN,LKG Input leakage current into EN pin EN = High 0.01 0.1 µA SOFT START, POWER GOOD tSS Soft start time Time from EN high to 95% of VOUT nominal, TPS62827 1.75 ms Time from EN high to 95% of VOUT nominal, TPS62824x/5x/6x/7A 1.25 ms VPG Power good lower threshold VPG rising, VFB referenced to VFB nominal 94 96 98 % VPG falling, VFB referenced to VFB nominal 90 92 94 % Power good upper threshold VPG rising, VFB referenced to VFB nominal 103 105 107 % VPG falling, VFB referenced to VFB nominal 108 110 112 % VPG,OL Low-level output voltage Isink = 1 mA 0.4 V IPG,LKG Input leakage current into PG pin VPG = 5.0 V 0.01 0.1 µA tPG,DLY Power good deglitch delay PG rising edge 100 µs PG falling edge 20 OUTPUT VOUT Output voltage accuracy TPS6282x18, PWM mode 1.78 1.8 1.82 V VFB Feedback regulation voltage PWM mode 594 600 606 mV IFB,LKG Feedback input leakage current for adjustable output voltage VFB = 0.6 V 0.01 0.05 µA RFB Internal resistor divider connected to FB pin, for fixed output votlage TPS6282518, TPS6282618 7.5 MΩ IDIS Output discharge current VSW = 0.4V; EN = LOW 75 400 mA Load regulation IOUT = 0.5 A to 3 A, VOUT = 1.8 V 0.1 %/A POWER SWITCH RDS(on) High-side FET on-resistance 26 mΩ Low-side FET on-resistance 25 mΩ ILIM High-side FET switch current limit, DC TPS62824A 1.7 2.1 2.4 A TPS62825x 2.7 3.3 3.9 A TPS62826x 3.7 4.3 5.0 A TPS62827x 4.8 5.6 6.4 A ILIM Low-side FET negative current limit, DC TPS62824A/5A/6A/7A -1.6 A fSW PWM switching frequency IOUT = 1 A, VOUT = 1.8 V 2.2 MHz www.ti.com TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TPS62825 TPS62826 TPS62827 TPS62824A TPS62825A TPS62826A TPS62827A
7.6 Typical Characteristics
Input Voltage (V) RDS(on) (mOhm) 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 D010 TJ = 0 °C TJ = 25 °C TJ = 85 °C TJ = 125 °C Figure 7-1. High-Side FET On-Resistance Input Voltage (V) RDS(on) (mOhm) 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 D011 TJ = 0 °C TJ = 25 °C TJ = 85 °C TJ = 125 °C Figure 7-2. Low-Side FET On-Resistance Input Voltage (V) 6KXWGRZQ&XUUHQW 0.0 0.1 0.2 0.3 0.4 0.5 D000 TJ = -40 °C TJ = 25 °C TJ = 85 °C TJ = 125 °C Figure 7-3. Shutdown Current Input Voltage (V) 4XLHVFHQW&XUUHQW 0.0 2.0 4.0 6.0 8.0 D001 TJ = -40 °C TJ = 25 °C TJ = 85 °C TJ = 125 °C Figure 7-4. Quiescent Current Input Voltage (V) Output Discharge Current (mA) 100 150 200 250 300 350 400 450 500 D012 TJ = 0 °C TJ = 25 °C TJ = 85 °C TJ = 125 °C Figure 7-5. Output Discharge Current TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 www.ti.com
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8 Detailed Description
8.1 Overview
The TPS6282x are synchronous step-down converters based on the DCS-Control topology with an adaptive constant on-time control and a stabilized switching frequency. It operates in PWM (pulse width modulation) mode for medium to heavy loads and in PSM (power save mode) at light load conditions, keeping the output voltage ripple small. The nominal switching frequency is about 2.2 MHz with a small and controlled variation over the input voltage range. As the load current decreases, the converter enters PSM, reducing the switching frequency to keep efficiency high over the entire load current range. Since combining both PWM and PSM within a single building block, the transition between modes is seamless and without effect on the output voltage. In forced- PWM devices, the converter maintains a continuous conduction mode operation and keeps the output voltage ripple very low across the whole load range and at a nominal switching frequency of 2.2 MHz. The devices offer both excellent dc voltage and fast load transient regulation, combined with a very low output voltage ripple.
8.2 Functional Block Diagram
0.6 V Or Fixed Output Voltages PG VIN SW GND Output Discharge www.ti.com TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TPS62825 TPS62826 TPS62827 TPS62824A TPS62825A TPS62826A TPS62827A
8.3 Feature Description
8.3.1 Pulse Width Modulation (PWM) Operation
At load currents larger than half the inductor ripple current, the device operates in pulse width modulation in continuous conduction mode (CCM). The PWM operation is based on an adaptive constant on-time control with stabilized switching frequency. To achieve a stable switching frequency in a steady state condition, the on-time is calculated as: nsV VT IN OUT ON 450/c215/c61 (1) In forced-PWM devices, the device always operates in pulse width modulation in continuous conduction mode (CCM).
8.3.2 Power Save Mode (PSM) Operation
To maintain high efficiency at light loads, the device enters power save mode (PSM) at the boundary to discontinuous conduction mode (DCM). This happens when the output current becomes smaller than half of the ripple current of the inductor. The device operates now with a fixed on-time and the switching frequency further decreases proportional to the load current. It can be calculated as: /c215/c61 /c45/c233 /c249/c215 /c234 /c250 /c235 /c251
2 OUT
(2) In PSM, the output voltage rises slightly above the nominal target, which can be minimized using larger output capacitance. At duty cycles larger than 90%, the device may not enter PSM. The device maintains output regulation in PWM mode.
8.3.3 Minimum Duty Cycle and 100% Mode Operation
There is no limitation for small duty cycles since even at very low duty cycles, the switching frequency is reduced as needed to always ensure a proper regulation. If the output voltage level comes close to the input voltage, the device enters 100% mode. While the high-side switch is constantly turned on, the low-side switch is switched off. The difference between VIN and VOUT is determined by the voltage drop across the high-side FET and the DC resistance of the inductor. The minimum VIN that is needed to maintain a specific VOUT value is estimated as: IN,MIN OUT OUT,MAX DS(on) LV V I (R + R )/c61 /c43 /c180 (3) where
- V IN,MIN = Minimum input voltage to maintain an output voltage
- I OUT,MAX = Maximum output current
- R DS(on) = High-side FET ON-resistance
- R L = Inductor ohmic resistance (DCR)
8.3.4 Soft Start
About 250 μs after EN goes High, the internal soft-start circuitry controls the output voltage during start-up. This avoids excessive inrush current and ensures a controlled output voltage ramp. It also prevents unwanted voltage drops from high-impedance power sources or batteries. The TPS6282x can start into a pre-biased output. TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 www.ti.com
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8.3.5 Switch Current Limit and HICCUP Short-Circuit Protection
The switch current limit prevents the device from drawing excessive current in case of externally-caused overcurrent or short circuit condition. Due to an internal propagation delay (typically 60 ns), the actual AC peak current can exceed the static current limit during that time. If the current limit threshold is reached, the device delivers its maximum output current. Detecting this condition for 32 switching cycles (about 13 μs), the device turns off the high-side MOSFET for about 100 μs which allows the inductor current to decrease through the low-side MOSFET's body diode and then restarts again with a soft start cycle. As long as the overload condition is present, the device hiccups that way, limiting the output power. In forced PWM devices, a negative current limit (I LIMN) is enabled to prevent excessive current flowing backwards to the input. When the inductor current reaches I LIMN, the low-side MOSFET turns off and the high- side MOSFET turns on and kept on until TON time expires.
8.3.6 Undervoltage Lockout
The undervoltage lockout (UVLO) function prevents misoperation of the device if the input voltage drops below the UVLO threshold. It is set to about 2.2 V with a hysteresis of typically 160 mV.
8.3.7 Thermal Shutdown
The junction temperature (TJ) of the device is monitored by an internal temperature sensor. If T J exceeds 150°C (typ.), the device goes in thermal shutdown with a hysteresis of typically 20°C. Once T J has decreased enough, the device resumes normal operation.
8.4 Device Functional Modes
8.4.1 Enable, Disable, and Output Discharge
The device starts operation when Enable (EN) is set High. The input threshold levels are typically 0.9 V for rising and 0.7 V for falling signals. Do not leave EN floating. Shutdown is forced if EN is pulled Low with a shutdown current of typically 50 nA. During shutdown, the internal power MOSFETs as well as the entire control circuitry are turned off and the output voltage is actively discharged through the SW pin by a current sink. Therefore VIN must remain present for the discharge to function.
8.4.2 Power Good
The TPS6282x has a built-in power good (PG) function. The PG pin goes high impedance when the output voltage has reached its nominal value. Otherwise, including when disabled, in UVLO or in thermal shutdown, PG is Low (see Table 8-1). The PG function is formed with a window comparator, which has an upper and lower voltage threshold. The PG pin is an open-drain output and is specified to sink up to 1 mA. The power good output requires a pullup resistor connecting to any voltage rail less than 5.5 V. The PG signal can be used for sequencing of multiple rails by connecting it to the EN pin of other converters. Leave the PG pin unconnected when not used. The PG rising edge has a 100-µs blanking time and the PG falling edge has a deglitch delay of 20 µs. Table 8-1. PG Pin Logic DEVICE CONDITIONS LOGIC STATUS HIGH Z LOW Enable EN = High, VFB ≥ 0.576 V √ EN = High, VFB ≤ 0.552 V √ EN = High, VFB ≤ 0.63 V √ EN = High, VFB ≥ 0.66 V √ Shutdown EN = Low √ Thermal Shutdown TJ > TJSD √ UVLO 0.7 V < VIN < VUVLO √ Power Supply Removal VIN < 0.7 V √ www.ti.com TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: TPS62825 TPS62826 TPS62827 TPS62824A TPS62825A TPS62826A TPS62827A
9 Application and Implementation
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.
9.1 Application Information
The following section discusses the design of the external components to complete the power supply design for several input and output voltage options by using typical applications as a reference.
9.2 Typical Application
Figure 9-1. Typical Application of TPS62826x Figure 9-2. Typical Application of TPS62827
9.2.1 Design Requirements
For this design example, use the parameters listed in Table 9-1 as the input parameters. Table 9-1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input voltage, TPS62826x 2.4 V to 5.5 V Input voltage, TPS62827x 2.5 V to 5.5 V Output voltage 1.8 V Output ripple voltage <20 mV Maximum output current, TPS62826x 3 A Maximum output current, TPS62827x 4 A TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 www.ti.com
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Table 9-2 lists the components used for the example. Table 9-2. List of Components REFERENCE DESCRIPTION MANUFACTURER C1 4.7 µF, Ceramic capacitor, 6.3 V, X7R, size 0603, JMK107BB7475MA Taiyo Yuden C2, TPS62824x/5x/6x/7A 2 x 10 µF, Ceramic capacitor, 10 V, X7R, size 0603, GRM188Z71A106MA73D Murata C2, TPS62827 3 x 10 µF, Ceramic capacitor, 10 V, X7R, size 0603, GRM188Z71A106MA73D Murata C3 120 pF, Ceramic capacitor, 50 V, size 0402 Std L1 0.47 µH, Power Inductor, XFL4015-471MEB Coilcraft R1 Depending on the output voltage, 1%, size 0402 Std R2 100 kΩ, Chip resistor, 1/16 W, 1%, size 0402 Std R3 100 kΩ, Chip resistor, 1/16 W, 1%, size 0402 Std
9.2.2 Detailed Design Procedure
9.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS6282x device with the WEBENCH® Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available:
- Run electrical simulations to see important waveforms and circuit performance
- Run thermal simulations to understand board thermal performance
- Export customized schematic and layout into popular CAD formats
- Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH.
9.2.2.2 Setting The Output Voltage
The output voltage is set by an external resistor divider according to Equation 4: OUT OUT FB V V R 1 R2 1 R2 1V 0.6V © ¹ © ¹ (4) R2 must not be higher than 100 k Ω to achieve high efficiency at light load while providing acceptable noise sensitivity. Equation 5 shows how to compute the value of the feedforward capacitor for a given R2 value. For the recommended 100k value for R2, a 120-pF feedforward capacitor is used. 2 R µ 123 C (5) For the fixed output voltage versions, connect the FB pin to the output. R1, R2, and C3 are not needed. The fixed output voltage devices have an internal feedforward capacitor.
9.2.2.3 Output Filter Design
The inductor and the output capacitor together provide a low-pass filter. To simplify this process, Table 9-3 outlines possible inductor and capacitor value combinations for most applications. Checked cells represent combinations that are proven for stability by simulation and lab test. Further combinations should be checked for each individual application. www.ti.com TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: TPS62825 TPS62826 TPS62827 TPS62824A TPS62825A TPS62826A TPS62827A
Table 9-3. Matrix of Output Capacitor and Inductor Combinations, TPS62824x, TPS62825x, TPS62826x and TPS62827A NOMINAL L µH NOMINAL COUT µF 10 2 x 10 or 22 47 100 0.33 0.47 + +(1) + 1.0 (1) This LC combination is the standard value and recommended for most applications. (2) Inductor tolerance and current derating is anticipated. The effective inductance can vary by 20% and –30%. (3) Capacitance tolerance and bias voltage derating is anticipated. The effective capacitance can vary by 20% and –35%. Table 9-4. Matrix of Output Capacitor and Inductor Combinations, TPS62827 NOMINAL L µH NOMINAL COUT µF 22 3 x 10 47 100 0.33 0.47 +(1) + + 1.0
9.2.2.4 Inductor Selection
The main parameter for the inductor selection is the inductor value and then the saturation current of the inductor. To calculate the maximum inductor current under static load conditions, Equation 6 is given. SW IN OUT OUTL L MAX,OUTMAX, L fL V VI III /c180 /c45 /c180/c61/c68 /c68/c43/c61 (6) where
- I OUT,MAX = Maximum output current
- ΔI L = Inductor current ripple
- f SW = Switching frequency
- L = Inductor value It is recommended to choose a saturation current for the inductor that is approximately 20% to 30% higher than IL,MAX. In addition, DC resistance and size should also be taken into account when selecting an appropriate inductor. Table 9-5 lists recommended inductors. TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 www.ti.com
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Table 9-5. List of Recommended Inductors INDUCTANCE [µH] CURRENT RATING [A] DIMENSIONS [L x W x H mm] MAX. DC RESISTANCE [mΩ] MFR PART NUMBER(1) 0.47 4.8 2.0 x 1.6 x 1.0 32 HTEN20161T-R47MDR, Cyntec 4.6 2.0 x 1.2 x 1.0 25 HTEH20121T-R47MSR, Cyntec 4.8 2.0 x 1.6 x 1.0 32 DFE201610E - R47M, MuRata 4.8 2.0 x 1.6 x 1.0 32 DFE201210S - R47M, MuRata 5.1 2.0 x 1.6 x 1.0 34 TFM201610ALM-R47MTAA, TDK 5.2 2.0 x 1.6 x 1.0 25 TFM201610ALC-R47MTAA, TDK 6.8 4.5 x 4 x 1.8 11.2 WE-LHMI-744373240047, Würth (1) See the Third-party Products Disclaimer
9.2.2.5 Capacitor Selection
The input capacitor is the low-impedance energy source for the converters which helps provide stable operation. A low-ESR multilayer ceramic capacitor is recommended for best filtering and must be placed between VIN and GND as close as possible to those pins. For most applications, a minimum effective input capacitance of 3 µF should be present, though a larger value reduces input current ripple. The architecture of the device allows the use of tiny ceramic output capacitors with low equivalent series resistance (ESR). These capacitors provide low output voltage ripple and are recommended. To keep its low resistance up to high frequencies and to get narrow capacitance variation with temperature, TI recommends using X7R or X5R dielectrics. Considering the DC-bias derating the capacitance, the minimum effective output capacitance is 10 µF for TPS62824x, TPS62825x, TPS62826x and TPS62827A and 20 µF for TPS62827. A feed forward capacitor is required for the adjustable version, as described in Section 9.2.2.2. This capacitor is not required for the fixed output voltage versions. www.ti.com TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: TPS62825 TPS62826 TPS62827 TPS62824A TPS62825A TPS62826A TPS62827A
9.2.3 Application Curves
VIN = 5.0 V, VOUT = 1.8 V, TA = 25°C, BOM = Table 9-2, unless otherwise noted. Load (A) Efficiency (%) 100P 1m 10m 100m 1 4 D002 VIN = 2.5V VIN = 3.3V VIN = 4.2V VIN = 5.0V VOUT = 0.6 V Figure 9-3. Efficiency Load (A) Vout (V) 0.588 0.591 0.594 0.597 0.6 0.603 0.606 0.609 0.612 100P 1m 10m 100m 1 4 D021 VIN = 2.5 V VIN = 3.3 V VIN = 4.2 V VIN = 5.0 V VOUT = 0.6 V Figure 9-4. Load Regulation Load (A) Efficiency (%) 0 0.5 1 1.5 2 2.5 3 3.5 4 100 VIN=2.5V VIN=3.3V VIN=4.2V VIN=5.0V VOUT = 0.6 V F-PWM devices Figure 9-5. PWM Efficiency Load (A) Vout (V) 0 0.5 1 1.5 2 2.5 3 3.5 4 0.591 0.594 0.597 0.6 0.603 0.606 0.609 VIN=2.5V VIN=3.3V VIN=4.2V VIN=5.0V VOUT = 0.6 V F-PWM devices Figure 9-6. Load Regulation Load (A) Efficiency (%) 100 100P 1m 10m 100m 1 4 D003 VIN = 2.5V VIN = 3.3V VIN = 4.2V VIN = 5.0V VOUT = 1.2 V Figure 9-7. Efficiency Load (A) Vout (V) 1.188 1.191 1.194 1.197 1.2 1.203 1.206 1.209 1.212 100P 1m 10m 100m 1 4 D031 VIN = 2.4 V VIN = 3.3 V VIN = 4.5 V VIN = 5.0 V VOUT = 1.2 V Figure 9-8. Load Regulation TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 www.ti.com
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Load (A) Efficiency (%) 100 100P 1m 10m 100m 1 4 D006 VIN = 3.3V VIN = 4.2V VIN = 5.0V VOUT = 2.5 V Figure 9-15. Efficiency Load (A) Vout (V) 2.475 2.485 2.495 2.505 2.515 2.525 100P 1m 10m 100m 1 4 D061 VIN = 3.3 V VIN = 4.2 V VIN = 5.0 V VOUT = 2.5 V Figure 9-16. Load Regulation Load (A) Efficiency (%) 0 0.5 1 1.5 2 2.5 3 3.5 4 100 VIN=3.3V VIN=4.2V VIN=5.0V VOUT = 2.5 V F-PWM devices Figure 9-17. PWM Efficiency Load (A) Vout (V) 0 0.5 1 1.5 2 2.5 3 3.5 4 2.4625 2.47 2.4775 2.485 2.4925 2.5 2.5075 2.515 2.5225 2.53 2.5375 VIN=3.3V VIN=4.2V VIN=5.0V VOUT = 2.5 V F-PWM devices Figure 9-18. Load Regulation Load (A) Efficiency (%) 100 100P 1m 10m 100m 1 4 D005 VIN = 4.2V VIN = 5.0V VOUT = 3.3 V Figure 9-19. Efficiency Load (A) Vout (V) 3.260 3.280 3.300 3.320 3.340 100P 1m 10m 100m 1 4 D051 VIN = 4.2V VIN = 5.0V VOUT = 3.3 V Figure 9-20. Load Regulation TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 www.ti.com
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Load (A) Switching Frequency (kHz) 250 500 750 1000 1250 1500 1750 2000 2250 2500 2750 3000 D013 VOUT = 0.6V VOUT = 1.2V VOUT = 1.8V VOUT = 2.5V VIN = 3.3 V TPS62827 Figure 9-27. Switching Frequency Input Voltage (V) Switching Frequency (kHz) 250 500 750 1000 1250 1500 1750 2000 2250 2500 2750 3000 D014 VOUT = 0.6V VOUT = 1.2V VOUT = 1.8V VOUT = 2.5V VOUT = 3.3V IOUT = 1.0 A TPS62827 Figure 9-28. Switching Frequency Ambient Temperature (°C) Output Current (A) 45 55 65 75 85 95 105 115 125 D020 VIN = 2.5 V VIN = 3.3 V VIN = 5.0 V VOUT = 1.2 V θJA= 71.4°C/W Figure 9-29. Thermal Derating Ambient Temperature (°C) Output Current (A) 45 55 65 75 85 95 105 115 125 D015 VIN = 2.5 V VIN = 3.3 V VIN = 5.0 V VOUT = 1.8 V θJA= 71.4°C/W Figure 9-30. Thermal Derating Ambient Temperature (°C) Output Current (A) 45 55 65 75 85 95 105 115 125 D017 VIN = 3.3 V VIN = 5.0 V VOUT = 2.5 V θJA= 71.4°C/W Figure 9-31. Thermal Derating Ambient Temperature (°C) Output Current (A) 45 55 65 75 85 95 105 115 125 D016 VIN = 5.0 V VOUT = 3.3 V θJA= 71.4°C/W Figure 9-32. Thermal Derating TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 www.ti.com
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Load = 0.6 Ω TPS62825A/6A/7A Figure 9-39. Start-up with Load TPS62824A/5A/6A/7A Figure 9-40. Start-up with No Load Load = 1.8 Ω TPS6282x Figure 9-41. Disable, Active Output Discharge TPS6282x Figure 9-42. Disable, Active Output Discharge at No Load IOUT = 0.05 A to 1A TPS62824/5/6/7 Figure 9-43. Load Transient IOUT = 1 A to 2 A TPS62825/6/7 Figure 9-44. Load Transient TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 www.ti.com
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IOUT = 0.05 A to 1A TPS62824A/5A/6A/7A Figure 9-45. Load Transient IOUT = 1 A to 2 A TPS62825A/6A/7A Figure 9-46. Load Transient 7LPH V',9 D018 VOUT 1V/DIV ICOIL 2A/DIV VPG 5V/DIV IOUT = 1 A TPS6282x Figure 9-47. HICCUP Short Circuit Protection 7LPH V',9 D019 VOUT 1V/DIV ICOIL 2A/DIV VPG 5V/DIV IOUT = 1 A TPS6282x Figure 9-48. HICCUP Short Circuit Protection (Zoom In)
10 Power Supply Recommendations
The device is designed to operate from an input voltage supply range from 2.4 V to 5.5 V. Ensure that the input power supply has a sufficient current rating for the application. www.ti.com TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: TPS62825 TPS62826 TPS62827 TPS62824A TPS62825A TPS62826A TPS62827A
11 Layout
11.1 Layout Guidelines
The printed-circuit-board (PCB) layout is an important step to maintain the high performance of the device. See Section 11.2 for the recommended PCB layout.
- The input/output capacitors and the inductor should be placed as close as possible to the IC. This keeps the power traces short. Routing these power traces direct and wide results in low trace resistance and low parasitic inductance.
- The low side of the input and output capacitors must be connected properly to the GND pin to avoid a ground potential shift.
- The sense traces connected to FB is a signal trace. Special care should be taken to avoid noise being induced. Keep these traces away from SW nodes. The connection of the output voltage trace for the FB resistors should be made at the output capacitor.
- Refer to Section 11.2 for an example of component placement, routing and thermal design.
11.2 Layout Example
Solution size = 31mm2 Figure 11-1. PCB Layout Recommendation
11.2.1 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power dissipation limits of a given component. Two basic approaches for enhancing thermal performance are:
- Improving the power dissipation capability of the PCB design
- Introducing airflow in the system The Thermal Data section in Section 7.4 provides the thermal metric of the device on the EVM after considering the PCB design of real applications. The big copper planes connecting to the pads of the IC on the PCB improve the thermal performance of the device. For more details on how to use the thermal parameters, see the Thermal Characteristics Application Notes, SZZA017 and SPRA953. TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 www.ti.com
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.1.2 Development Support
12.1.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS6282x device with the WEBENCH® Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available:
- Run electrical simulations to see important waveforms and circuit performance
- Run thermal simulations to understand board thermal performance
- Export customized schematic and layout into popular CAD formats
- Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH.
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation, see the following:
- Thermal Characteristics Application Note, SZZA017
- Thermal Characteristics Application Note, SPRA953
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
DCS-Control™ and TI E2E™ are trademarks of Texas Instruments. WEBENCH® is a registered trademark of Texas Instruments. All trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions. www.ti.com TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: TPS62825 TPS62826 TPS62827 TPS62824A TPS62825A TPS62826A TPS62827A
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A SLVSEF9E – MARCH 2018 – REVISED DECEMBER 2020 www.ti.com
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www.ti.com 11-Dec-2020 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TPS62824ADMQR PREVIEW VSON-HR DMQ 6 3000 RoHS (In work) & Non-Green Call TI Call TI -40 to 125 TPS6282518DMQR ACTIVE VSON-HR DMQ 6 3000 RoHS & Green Call TI | NIPDAU Level-1-260C-UNLIM -40 to 125 CJ TPS6282518DMQT ACTIVE VSON-HR DMQ 6 250 RoHS & Green Call TI | NIPDAU Level-1-260C-UNLIM -40 to 125 CJ TPS62825ADMQR ACTIVE VSON-HR DMQ 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 JN TPS62825DMQR ACTIVE VSON-HR DMQ 6 3000 RoHS & Green Call TI | NIPDAU Level-1-260C-UNLIM -40 to 125 CI TPS62825DMQT ACTIVE VSON-HR DMQ 6 250 RoHS & Green Call TI | NIPDAU Level-1-260C-UNLIM -40 to 125 CI TPS6282618DMQR ACTIVE VSON-HR DMQ 6 3000 RoHS & Green Call TI | NIPDAU Level-1-260C-UNLIM -40 to 125 CK TPS6282618DMQT ACTIVE VSON-HR DMQ 6 250 RoHS & Green Call TI | NIPDAU Level-1-260C-UNLIM -40 to 125 CK TPS62826ADMQR ACTIVE VSON-HR DMQ 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 JO TPS62826DMQR ACTIVE VSON-HR DMQ 6 3000 RoHS & Green Call TI | NIPDAU Level-1-260C-UNLIM -40 to 125 CL TPS62826DMQT ACTIVE VSON-HR DMQ 6 250 RoHS & Green Call TI | NIPDAU Level-1-260C-UNLIM -40 to 125 CL TPS62827ADMQR PREVIEW VSON-HR DMQ 6 3000 RoHS (In work) & Non-Green Call TI Call TI -40 to 125 TPS62827DMQR ACTIVE VSON-HR DMQ 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 EH TPS62827DMQT ACTIVE VSON-HR DMQ 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 EH XPS62825ADMQR ACTIVE VSON-HR DMQ 6 3000 RoHS (In work) & Non-Green Call TI Call TI -40 to 125 XPS62826ADMQR ACTIVE VSON-HR DMQ 6 3000 RoHS (In work) & Non-Green Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
www.ti.com 11-Dec-2020 Addendum-Page 2 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant TPS6282518DMQR VSON- HR TPS6282518DMQT VSON- HR TPS62825ADMQR VSON- HR TPS62825DMQR VSON- HR TPS62825DMQT VSON- HR TPS6282618DMQR VSON- HR TPS6282618DMQT VSON- HR TPS62826DMQR VSON- HR TPS62826DMQT VSON- HR TPS62827DMQR VSON- HR PACKAGE MATERIALS INFORMATION www.ti.com 12-Dec-2020 Pack Materials-Page 1
(mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant HR *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS6282518DMQR VSON-HR DMQ 6 3000 182.0 182.0 20.0 TPS6282518DMQT VSON-HR DMQ 6 250 182.0 182.0 20.0 TPS62825ADMQR VSON-HR DMQ 6 3000 210.0 185.0 35.0 TPS62825DMQR VSON-HR DMQ 6 3000 182.0 182.0 20.0 TPS62825DMQT VSON-HR DMQ 6 250 182.0 182.0 20.0 TPS6282618DMQR VSON-HR DMQ 6 3000 182.0 182.0 20.0 TPS6282618DMQT VSON-HR DMQ 6 250 182.0 182.0 20.0 TPS62826DMQR VSON-HR DMQ 6 3000 182.0 182.0 20.0 TPS62826DMQT VSON-HR DMQ 6 250 182.0 182.0 20.0 TPS62827DMQR VSON-HR DMQ 6 3000 182.0 182.0 20.0 TPS62827DMQT VSON-HR DMQ 6 250 182.0 182.0 20.0 PACKAGE MATERIALS INFORMATION www.ti.com 12-Dec-2020 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 3X 0.3 0.2 3X 0.5 0.3 2X 4X 0.5
1 MAX
0.05 0.00 3X 0.9 0.7 3X 0.25 0.15 B 1.55 1.45 A 1.55 1.45 (0.2) TYP(0.2) MIN VSON - 1 mm max heightDMQ0006A PLASTIC SMALL OUTLINE - NO LEAD 4222645/C 10/2020 PIN 1 INDEX AREA SEATING PLANE 0.08 C 3 4
0.1 C A B
0.05 C 0.05 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. SCALE 6.000
www.ti.com EXAMPLE BOARD LAYOUT
0.05 MIN
0.05 MAX
4X (0.5) (0.65) 3X (0.25) 3X (0.6) (R0.05) TYP (0.45) 3X (1) 3X (0.2) VSON - 1 mm max heightDMQ0006A PLASTIC SMALL OUTLINE - NO LEAD 4222645/C 10/2020 PKG SYMM LAND PATTERN EXAMPLE SCALE:30X NOTES: (continued) 3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). SOLDER MASK OPENING SOLDER MASK METAL UNDER PADS 1-3 SOLDER MASK DEFINED METALSOLDER MASK OPENING SOLDER MASK DETAILS PADS 4-6 NON SOLDER MASK DEFINED
www.ti.com EXAMPLE STENCIL DESIGN 3X (0.25) 3X (0.6) 4X (0.5) (0.65) (R0.05) TYP 3X (0.85) 3X (0.2) (0.525) VSON - 1 mm max heightDMQ0006A PLASTIC SMALL OUTLINE - NO LEAD 4222645/C 10/2020 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PADS 4, 5 & 6: 81% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:30X PKG 3 4 SYMM EXPOSED METAL METAL UNDER SOLDER MASK TYP SOLDER MASK OPENING TYP
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