MPC755ECS03AD NXP | Alldatasheet
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This document contains information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2003, 2006. All rights reserved. Freescale Semiconductor Advance Information This document describes part-number-specific changes to recommended operating conditions and revised electrical specifications, as applicable, from those described in the general MPC755 RISC Microprocessor Hardware Specifications (MPC755EC). The MPC755 and MPC745 are reduced instruction set computing (RISC) microprocessors that implement the PowerPC™ instruction set architecture. The devices described in this specification are no longer in production and this document is provided for reference only. For recommended upgrades or replacement devices, contact your Freescale sales office. Specifications provided in this document supersede those in the MPC755 RISC Microprocessor Hardware Specifications, Rev. 6 or later, for the part numbers listed in Table A only. Specifications not addressed herein are unchanged. Note that headings and table numbers in this document are not consecutively numbered. They are intended to correspond to the heading or table affected in the general hardware specification. Document Number: MPC755ECS03AD Rev. 0.1, 02/2006 Freescale Part Numbers Affected: XPC755BRX400LE XPC755BPX400LE XPC755CRX450LE MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC755xxxnnnLE Series
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4.1 DC Electrical Characteristics
Freescale SOP 3-13. These are from a limited production volume of prototypes manufactured, tested, and Q.A. still occur while shipping pilot production prototypes. Table 3. Recommended Operating Conditions 1
- These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not
4.2.1 Clock AC Specifications
Table 7. Power Consumption for MPC755
400 MHz 450 MHz
- These values apply for all valid processor bus and L2 bus ratios. The values do not include I/O supply power (OVDD and
<10% of VDD power. Worst case power consumption for AVDD = 15 mW and L2AVDD = 15 mW.
- Maximum power is measured at nominal VDD (see Table 3) while running an entirely cache-resident, contrived sequence of
instructions which keep the execution units maximally busy.
- Typical power is an average value measured at the nominal recommended VDD (see Table 3) and 65°C in a system while
running a typical code sequence.
- Not 100% tested. Characterized and periodically sampled.
Table 8. Clock AC Timing Specifications
- Caution: The SYSCLK frequency and PLL_CFG[0:3] settings must be chosen such that the resulting SYSCLK (bus)
MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC755xxxnnnLE Series, Rev. 0.1
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Ordering Information
10.1 Part Numbers Addressed by This Specification
Table 20 provides the ordering information for the MPC755 parts described in this specification. Table 20. Part Numbering Nomenclature
755 C = HiP4DP RX = CBGA 450
- The X prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13. These
MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC755xxxnnnLE Series, Rev. 0.1 Freescale Semiconductor 5
10.3 Part Marking
Parts are marked as the example shown in Figure 29. Figure 29. Part Marking for BGA Device MMMMMM is the 6-digit mask number. ATWL YYWWA is the traceability code. assembled in the United States.
MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC755xxxnnnLE Series, Rev. 0.1
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Table B provides a revision history for this hardware specifications addendum. Table B. Document Revision History Rev. No. Date Editor/ Writer Substantive Change(s) 0.1 02/15/2006 BM/NB Changed document order number (was MPC755XLEPNS, Rev. 0). Updated to Freescale template. Updated section numbers to match the hardware specifications document. 0 Initial release.
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Document Number: MPC755ECS03AD Rev. 0.1 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. The described product contains a PowerPC processor core. The PowerPC name is a trademark of IBM Corp. and used under license. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2003, 2006. Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. How to Reach Us: Home Page: www.freescale.com email: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 (800) 521-6274 480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7
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