MPC755ECS02AD NXP | Alldatasheet
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This document contains information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2002, 2006. All rights reserved. Freescale Semiconductor Advance Information This document describes part-number-specific changes to recommended operating conditions and revised electrical specifications, as applicable, from those described in the general MPC755 RISC Microprocessor Hardware Specifications (MPC755EC). The MPC755 and MPC745 are reduced instruction set computing (RISC) microprocessors that implement the PowerPC™ instruction set architecture. Specifications provided in this document supersede those in the MPC755 RISC Microprocessor Hardware Specifications, Rev. 4 or later, for the part numbers listed in Table A only. Specifications not addressed herein are unchanged. Because this document is frequently updated, refer to the website listed on the back cover of this addendum or contact your Freescale sales office for the latest version. Note that headings and table numbers in this document are not consecutively numbered. They are intended to correspond to the heading or table affected in the general hardware specification. Document Number: MPC755ECS02AD Rev. 2.1, 02/2006 Freescale Part Numbers Affected: XPC755BRX300LD XPC755BRX350LD XPC755BRX400LD XPC755BPX300LD XPC755BPX350LD XPC755BPX400LD XPC745BPX300LD XPC745BPX350LD MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC7n5BxxnnnLD Series
MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC7n5BxxnnnLD Series, Rev. 2.1
2 Freescale Semiconductor
Part numbers addressed in this document are listed in Table A. For more detailed ordering information see Section 10, “Ordering Information.” There are currently no known errata for the part numbers addressed by this data sheet.
3 General Parameters
The following general parameters apply to all part numbers described herein: Core power supply 2.0 V ±100 mV DC (nominal; see Table 3 for recommended operating conditions) I/O power supply 1.8 V ±100 mV dc (proces sor bus interface only; not supported on L2 interface), or
2.0 V ±100 mV dc (processor bus interface only; not supported on
L2 interface), or
3.3 V ±165 mV dc (input thresholds are configuration pin selectable)
4.1 DC Electrical Characteristics
All part numbers affected by this specification support 3.3 V and 1.8 V/2.0 V I/O voltages, but do not support 2.5 V I/O voltages. Table 2 describes the input threshold voltage settings. These settings apply to Table A. Significant Differences from Hardware Specifications by Part Number Freescale Part Number Operating Conditions Significant Differences from Hardware SpecificationCPU Frequency (MHz) VDD Tj (°C) XPC755BRX300LD 300 2.0 V ±100 mV 0 to 105 2.0 V/1.8 V I/O voltage supported, 2.5 V I/O not supported; all nominal core voltages are 2.0 V ±100 mV; AC timing different for processor bus and L2 bus interfaces; L2 bus interface AC timing not guaranteed in 1.8 V/2.0 V mode. XPC755BRX350LD 350 XPC755BRX400LD 400 XPC755BPX300LD 300 XPC755BPX350LD 350 XPC755BPX400LD 400 XPC745BPX300LD 300 2.0 V/1.8 V I/O vo ltage supported, 2.5 V I/O not supported; all nominal core voltages are 2.0 V ±100 mV; AC timing different for processor bus interface. XPC745BPX350LD 350 Note: The X prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13. These are from a limited production volume of prototypes manufactured, tested, and Q.A. inspected on a qualified technology to simulate normal production. These parts have only preliminary reliability and characterization data. Before pilot production prototypes may be shipped, written authorization from the customer must be on file in the applicable sales office acknowledging the qualification status and the fact that product changes may still occur while shipping pilot production prototypes.
MPC745 does not provide an L2 interface. including all part numbers described herein. including all part numbers described herein. Table 2. Input Threshold Voltage Setting Caution: The input threshold selection must agree with the OVDD/L2OVDD voltages supplied. Table 3. Recommended Operating Conditions Table 6. DC Electrical Specifications
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4.2.2 Processor Bus AC Specifications
All part numbers described herein have slower AC timing characteristics than later revisions of the part. The affected processor bus AC timing specifications are given in Table 10.
4.2.4 L2 Bus AC Specifications
- XPC755BRX300LD
- XPC755BRX350LD
- XPC755BRX400LD
- XPC755BPX300LD
- XPC755BPX350LD
- XPC755BPX400LD SYSCLK input high voltage 1.8/2.0 KV IH 1.5 OV DD + 0.3 V 3.3 KV IH 2.4 OV DD + 0.3 V SYSCLK input low voltage 1.8/2.0 KV IL –0.3 0.2 V 3.3 KV IL –0.3 0.4 V Output high voltage, IOH = –6 mA 1.8/2.0 V OH (L2)OVDD – 0.45 — V 3.3 V OH 2.4 — V Output low voltage, IOL = 6 mA 1.8/2.0 V OL —0 . 4 5 V 3.3 V OL —0 . 4 V Notes: 1. Nominal voltages; see Table 3 for recommended operating conditions. 2. For processor bus signals, the reference is OVDD. L2OVDD is the reference for the L2 bus signals. 3. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK) and IEEE 1149.1 boundary scan (JTAG) signals.
Table 10. Processor Bus AC Timing Specifications Table 6. DC Electrical Specifications (continued)
the SRAM, the SRAM will not recognize a logical high on a given signal until the reflected wave arrives. of the L2 bus interface of the affected part numbers described herein in 1.8 V/2.0 V mode. Table 12. L2 Bus Interface AC Timing Specifications
300 MHz 350 MHz 400 MHz
- All input specifications are measured from the midpoint of the signal in question to the midpoint voltage of the rising edge of
the input L2SYNC_IN. Input timings are measured at the pins.
- All output specifications are measured from the midpoint voltage of the rising edge of L2SYNC_IN to the midpoint of the
signal in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load.
- The outputs are valid for both single-ended and differential L2CLK modes. For pipelined registered synchronous
- Guaranteed by design and characterization.
MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC7n5BxxnnnLD Series, Rev. 2.1
6 Freescale Semiconductor
Ordering Information
10.1 Part Numbers Addressed by This Specification
Table 20 provides the ordering information for the MPC755 parts described in this specification.
10.3 Part Marking
Parts are marked as the example shown in Figure 29. Figure 29. Part Marking for BGA Device Table 20. Part Numbering Nomenclature
- Processor core frequencies supported by parts addressed by this specification only. Parts addressed by other
specifications may support other maximum core frequencies.
- The X prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13.
technology to simulate normal production. These parts have only preliminary reliability and characterization data. shipping pilot production prototypes. MMMMMM is the 6-digit mask number. ATWL YYWWA is the traceability code. assembled in the United States.
MPC755 RISC Microprocessor Hardware Specifications Addendum for the XPC7n5BxxnnnLD Series, Rev. 2.1 Freescale Semiconductor 7 Table B provides a revision history for this hardware specifications addendum. Table B. Document Revision History Rev. No. Date Editor/ Writer Substantive Change(s) 2.1 02/15/2006 BM/NB Changed document order number (was MPC755BLDPNS, Rev. 2). Updated to Freescale template. Updated section numbers to match the hardware specifications document. 2 Updated document. Corrected Section 1.4.2.4. 0–1 Initial releases.
Document Number: MPC755ECS02AD Rev. 2.1 Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. The described product contains a PowerPC processor core. The PowerPC name is a trademark of IBM Corp. and used under license. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2002, 2006. Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. How to Reach Us: Home Page: www.freescale.com email: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 (800) 521-6274 480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7
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