XFPOE9AWULS XFMRS | Alldatasheet

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Technical content

  1. Dimensions: 2. Schematic: A 1CT:1CT QIN 4 0.528 ' L 2 Max gx 3 = = XMIT ° as r Sx 1S 5 20 E o= | CHIP SIDE 22 UTP SIDE 0.039 | |— Ty | L. oooa! I 8 3], 7

0.035 Min 10 » | — RCV

— 12 13 ARARRARAR AAR 7 OO0000000000 1CT:1CT| 15 = oy | 0.025 =z a x ia = of corey 3. Electrical Specifications: @25°C o o 3 DS re) R UTP Impedance: 100 OHMS = ° 3 2 oo Turns Ratio: TX=1CT:1CT+2% = RX=1CT:1CT42% x ry oS Isolation Voltage: 2500Vrms, Input to Output ° | 0.039 UTP Side OCL: 350uH Min @100KHz 0.1V, 8mAdc - Gee | “thogonnanono UTP Side Q: 16 Min @100KHz 0.1V, o.o16—| ——_—_ — Rise Time (10-90%): 4.0ns Typical . C D | L-o.429 —| Insertion Loss (1-100MHz): -1.0dB Maximum

0.429 SUGGESTED PAD LAYOUT Retum Loss: 3OMHz 60MHz 80MHz

=20d8 -14dB 9 -11.5dB Typ CMRR: 3OMHZ SOMHz 100MHz —42dB -37d8 -33dB Typ Notest Crosstalk: 30MHz 60MHz = 100MHz . - —45dB = -40dB = -35dB_ Typ 1. Solderability:; Leads shall meet MIL-STD-202G, Method 208H for solderabiiity. Balanced DC Line Current: 720mA Max @57Vde continuous Pins 22, 15 2, Flammability: UL84V-0 1200mA Max @57Vde for 200milliseconds Pins 22, 15 3. ASTM oxygen index: > 28% 4, Insulation System: Closs F 156°C. UL file £151556 5. Operating Temperature Range: All listed parameters are to be within tolerance from —25°C to +850 XFMRS Inc| Te 6. Storage Temperature Range: —55'°C to +125C XEMRS 10/100 POE+ Ethernet 7. Aqueaus wash compatible www. <com 8. SMD Lead Copl rity: +0.004"(0.1021 O Gacticl ond machovealspetsiong 10% ts UNLESS OTHERWISE SPECIED|P/N: XFPOESAWULS | REV. A 10. RoHS Compliant Co it . We Designed te ‘mest UL80950 with supplementary Insulation TOLERANCES: Jan-30-10| with an operating voltage up to 250Veme. DOC, REV A/2 xxx £0,010 2 Dimensions _in_Inch |_cHK. | YK Liao [Jon-30-10 [ ) R () BID [) Document is the property of XFMRS Group & is \\ \\ A I\\ not_allowed to be duplicated without authorization. SCALE 3:1 SHT 1 OF 1 doe Huff |Jan—30-10