TLV62080 TI1 | Alldatasheet
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10µF VIN POWER GOOD SW VOS VIN EN GND GND PG FB 22µF 180k VOUT TLV62080 www.ti.com SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 1.2AHighEfficientStepDownConverterin2x2mmSONPackage Check forSamples: TLV62080 1FEATURES DESCRIPTION The TLV62080 deviceisa synchronousstep down• DCS-ControlTM ArchitectureforFastTransient
- 100% Duty Cycle forLowest Dropout medium to heavy loads,the converteroperatesin PWM mode and automaticallyentersPower Save• Power Save Mode forLightLoad Efficiency Mode operationatlightloadcurrentstomaintainhigh• Output DischargeFunction efficiencyovertheentireloadcurrentrange.
- Power Good Output To addressthe requirementsof system power rails,• Thermal Shutdown the internalcompensation circuitallows a large
- Availablein2x2mm 8-PinSON Package selectionof externaloutputcapacitorvaluesranging from10µF up to100uF effectivecapacitance.Withits• For Improved FeaturesSet,See TPS62080 DCS-ControlTM architectureexcellentload transient performanceand outputvoltageregulationaccuracyAPPLICATIONS isachieved.The deviceisavailablein2mm x 2mm
- BatteryPowered PortableDevices SON package withThermalPAD.
- PointofLoad Regulators
- System Power RailVoltageConversion Figure1. TypicalApplicationofTLV62080 Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2011,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 www.ti.com Table1. ORDERING INFORMATION TA PACKAGE MARKING PACKAGE PART NUMBER (1) –40°C to85°C RAU 8-PinQFN TLV62080DSG (1) FordetailedorderinginformationpleasecheckthePACKAGE OPTION ADDENDUM sectionattheend ofthisdatasheet. ABSOLUTE MAXIMUM RATINGS overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) VALUE UNIT VoltagerangeatVIN,PG, VOS (2) –0.3to7 V VoltagerangeatSW (2)(3) –0.3to(VIN + 0.3V) V VoltagerangeatFB (2) –0.3to3.6 V VoltagerangeatEN (2) –0.3to(VIN + 0.3V) V ESD rating,Human Body Model 2 kV ESD rating,Charged DeviceModel 500 V Continuoustotalpower dissipation See DissipationRatingTable Operatingjunctiontemperaturerange,TJ –40 to125 °C Operatingambienttemperaturerange,TA –40 to85 °C Storagetemperaturerange,Tstg –65 to150 °C (1) Stressesbeyond thoselistedunderabsolutemaximum ratingsmay cause permanentdamage tothedevice.These arestressratings onlyand functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunderrecommended operating conditionsisnotimplied.Exposuretoabsolute–maximum –ratedconditionsforextendedperiodsmay affectdevicereliability. (2) Allvoltagevaluesarewithrespecttonetworkgroundterminal. (3) Duringoperation,deviceswitching THERMAL INFORMATION TLV62080 THERMAL METRIC (1) UNITS DSG (8PINS) θJA Junction-to-ambientthermalresistance 65.1 θJCtop Junction-to-case(top)thermalresistance 100.7 θJB Junction-to-boardthermalresistance 135.7 °C/W ψJT Junction-to-topcharacterizationparameter 2.3 ψJB Junction-to-boardcharacterizationparameter 45.1 θJCbot Junction-to-case(bottom)thermalresistance 8.6 (1) Formore informationabouttraditionaland new thermalmetrics,see theIC Package ThermalMetricsapplicationreport,SPRA953 . RECOMMENDED OPERATING CONDITIONS (1) MIN TYP MAX UNIT VIN Inputvoltagerange 2.5 5.5 V VOUT Outputvoltagerange 0.5 4.0 V TA Operatingambienttemperature –40 85 °C TJ Operatingjunctiontemperature –40 125 °C (1) RefertotheAPPLICATION INFORMATION sectionforfurtherinformation.
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ELECTRICAL CHARACTERISTICS
Over recommended free-airtemperaturerange,TA = -40°C to85°C, typicalvaluesareatTA = 25°C (unlessotherwisenoted), VIN=3.6V. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY VIN Inputvoltagerange 2.5 5.5 V IQ QuiescentcurrentintoVIN IOUT = 0mA, Devicenotswitching 30 uA ISD Shutdown currentintoVIN EN = LOW 1 µA Under voltagelockout Inputvoltagefalling 1.8 2.0 V VUVLO Under voltagelockouthysteresis Risingabove VUVLO 120 mV TJSD Thermalshutdown Temperaturerising 150 °C Thermalshutdownhysteresis TemperaturefallingbelowTJSD 20 °C LOGIC INTERFACE (EN) VIH Highlevelinputvoltage 2.5V≤ VIN ≤ 5.5V 1 V VIL Low levelinputvoltage 2.5V≤ VIN ≤ 5.5V 0.4 V ILKG Inputleakagecurrent 0.01 0.5 µA POWER GOOD VPG Power good threshold VOUT fallingreferencedtoVOUT nominal –15 –10 –5 % Power good hysteresis 5 % VIL Low levelvoltage Isink= 500 µA 0.3 V IPG,LKG PG Leakage current VPG = 5.0V 0.01 0.1 µA OUTPUT VOUT OutputvoltagerangeTLV62080 0.5 4.0 V VFB Feedback regulationvoltage VIN ≥ 2.5Vand VIN ≥ VOUT + 1V 0.438 0.45 0.462 V IFB Feedback inputbiascurrent VFB = 0.45V 10 100 nA R DIS Outputdischargeresistor EN = LOW, VOUT = 1.8V 1 kΩ HighsideFET on-resistance ISW = 500 mA 120 m Ω R DS(on) Low sideFET on-resistance ISW = 500 mA 90 m Ω ILIM HighsideFET switchcurrentlimit Risinginductorcurrent 1.6 2.8 4 A Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):TLV62080
SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 www.ti.com DEVICE INFORMATION QFN
8 PIN 2X2 mm
NAME NO. VIN 8 PWR Power SupplyVoltageInput. EN 1 IN DeviceEnableLogicInput. LogicHIGH enablesthedevice,logicLOW disablesthedeviceand turnsitintoshutdown. GND 2,3 PWR Power and SignalGround. VOS 5 IN OutputVoltageSense Pinfortheinternalcontrolloop.Must be connectedtooutput. SW 7 PWR SwitchPinconnectedtotheinternalMOSFET switchesand inductorterminal. Connecttheinductoroftheoutputfilterhere. FB 4 IN Feedback Pinfortheinternalcontrolloop. Connectthispintotheexternalfeedbackdividertoprogramtheoutputvoltage. PG 6 OUT Power Good open drainoutput. Thispinispulledtolowiftheoutputvoltageisbelowregulationlimits.Can be leftfloatingifnotused. ThermalPad ConnectittoGND. FUNCTIONAL BLOCK DIAGRAMS Figure2. FunctionalBlock Diagram
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www.ti.com SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 TYPICAL CHARACTERISTICS PARAMETER MEASUREMENT INFORMATION Table2.ListofComponents REFERENCE DESCRIPTION MANUFACTURER C1 10uF,CeramicCapacitor,6.3V,X5R, size0603 Std 22uF,CeramicCapacitor,6.3V,X5R, size0805,C2 MurataGRM21BR60J226ME39L 47uF,TantalumCapacitor,8V,35m Ω,size3528,C3 KemetT520B476M008ATE035 L1 1.0µH, Power Inductor,2.2A,size3x3x1.2mm, XFL3012-102MEB Coilcraft R1 Dependingon theoutputvoltageofTLV62080, 1%; R2 39.2k,ChipResistor,1/16W,1%, size0603 Std R3 178k,ChipResistor,1/16W,1%, size0603 Std TABLE OF GRAPHS Figure Load Current,VOUT = 0.9V Figure3 Efficiency Load Current,VOUT = 1.2V Figure4 Load Current,VOUT = 2.5V Figure5 InputVoltage,VOUT = 0.9V Figure6 InputVoltage,VOUT = 2.5V Figure7OutputVoltage Accuracy Load Current,VOUT = 0.9V Figure8 Load Current,VOUT = 2.5V Figure9 SwitchingFrequency Load Current,VOUT = 2.5V, Figure10 VIN = 3.3V,VOUT = 1.2V,Load Current= 500mA, PWM Mode Figure11 TypicalOperation VIN = 3.3V,VOUT = 1.2V,Load Current= 10mA, PFM Mode Figure12 Load Transient VIN = 3.3V,VOUT = 1.2V,Load Current= 50mA to1A Figure13 LineTransient VIN = 3.3Vto4.2V,VOUT = 1.2V,Load = 2.2Ω Figure14 VIN = 3.3V,VOUT = 1.2V,Load = 2.2Ω Figure15 Startup VIN = 3.3V,VOUT = 1.2V,No Load Figure16 Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):TLV62080
Output Current (A) Efficiency (%) VIN = 2.8 V VIN = 3.6 V VIN = 4.2 V VOUT = 0.9 V G001 100 10u 100u 1m 10m 100m 1 3 Output Current (A) Efficiency (%) VIN = 2.8 V VIN = 3.6 V VIN = 4.2 V VOUT = 1.2 V G002 100 10u 100u 1m 10m 100m 1 3 Output Current (A) Efficiency (%) VIN = 3.6 V VIN = 4.2 V VIN = 5.0 V VOUT = 2.5 V G003 0.880 0.885 0.890 0.895 0.900 0.905 0.910 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) Output Voltage (V) IOUT = 1A, TA = 25°C IOUT = 1A, TA = −40°C IOUT = 1A, TA = 85°C IOUT = 10mA, TA = 25°C IOUT = 10mA, TA = −40°C IOUT = 10mA, TA = 85°C VOUT = 0.9 V G004 2.42 2.44 2.46 2.48 2.50 2.52 2.54 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) Output Voltage (V) IOUT = 1A, TA = 25°C IOUT = 1A, TA = −40°C IOUT = 1A, TA = 85°C IOUT = 10mA, TA = 25°C IOUT = 10mA, TA = −40°C IOUT = 10mA, TA = 85°C VOUT = 2.5 V G005 0.890 0.894 0.898 0.902 0.906 0.910 10u 100u 1m 10m 100m 1 3 Output Current (A) Output Voltage (V) TA = 25°C TA = −40°C TA = 85°C VIN = 3.6 V G006 TLV62080 SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 www.ti.com EFFICIENCY EFFICIENCY vs vs LOAD CURRENT LOAD CURRENT Figure3. Figure4. EFFICIENCY OUTPUT VOLTAGE vs vs LOAD CURRENT INPUT VOLTAGE Figure5. Figure6. OUTPUT VOLTAGE OUTPUT VOLTAGE vs vs INPUT VOLTAGE LOAD CURRENT Figure7. Figure8.
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2.46 2.48 2.50 2.52 2.54 10u 100u 1m 10m 100m 1 3 Output Current (A) Output Voltage (V) TA = 25°C TA = −40°C TA = 85°C VIN = 3.6 V G007 0 200m 400m 600m 800m 1 1.2 1.4 Output Current (A) Switching Frequency (Hz) VIN = 2.5V VIN = 3.3V VIN = 4.2V VIN = 5.0V VOUT = 2.5V G008 SW 2V/div t - 200ns/div V 20mV/div OUT L 0.5A/div COIL SW 2V/div t - 2 s/divµ V 20mV/div OUT L 0.2A/div COIL TLV62080 www.ti.com SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 OUTPUT VOLTAGE SWITCHING FREQUENCY vs vs LOAD CURRENT LOAD CURRENT Figure9. Figure10. TYPICAL APPLICATION (PWM MODE) TYPICAL APPLICATION (PFM MODE) Figure11. Figure12. Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):TLV62080
t - 50 s/divµ V 20mV/div OUT L 1A/div COIL 50mA t - 100 s/divµ V 50mV/div OUT 3.3V 4.2V V 1V/div IN EN 5V/div t - 20 s/divµ V 1V/div OUT L 0.5A/div COIL PG 1V/div EN 5V/div t - 20 s/divµ V 1V/div OUT L 0.2A/div COIL PG 1V/div TLV62080 SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 www.ti.com LOAD TRANSIENT LINE TRANSIENT Figure13. Figure14. START UP START UP (WITHOUT LOAD) Figure15. Figure16.
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IN,MIN OUT OUT,MAX DS(on) LV V I (R + R )/c61 /c43 /c180 TLV62080 www.ti.com SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 DETAILED DESCRIPTION DEVICE OPERATION The TLV62080 synchronousswitchedmode converterisbased on DCS ™ Control(DirectControlwithSeamless transitionintoPower Save Mode). Thisisan advanced regulationtopologythatcombines the advantagesof hystereticand voltagemode control. The DCS ™ Controltopologyoperatesin PWM (PulseWidth Modulation)mode formedium to heavy load conditionsand in Power Save Mode at lightload currents.In PWM the converteroperateswithitsnominal switchingfrequencyof2MHz havinga controlledfrequencyvariationovertheinputvoltagerange.As theload currentdecreasestheconverterentersPower Save Mode, reducingtheswitchingfrequencyand minimizingthe IC quiescentcurrenttoachievehighefficiencyovertheentireloadcurrentrange.DCS ™ Controlsupportsboth operationmodes (PWM and PFM) usinga singlebuildingblockhavinga seamlesstransitionfromPWM toPower Save Mode withouteffectson theoutputvoltage.The TLV62080 offersbothexcellentDC voltageand superior loadtransientregulation,combined withverylowoutputvoltageripple,minimizinginterferencewithRF circuits. POWER SAVE MODE As theloadcurrentdecreasestheTLV62080 entersthePower Save Mode operation.DuringPower Save Mode theconverteroperateswithreducedswitchingfrequencyinPFM mode and witha minimum quiescentcurrent maintaininghighefficiency.The power save mode occurswhen theinductorcurrentbecomes discontinuous.Itis based on a fixedon timearchitecture.The typicalon timeisgivenby ton=210ns·(VIN / VOUT ).The switching frequencyoverthewholeloadcurrentrangeisshown inFigure10. 100% DUTY CYCLE LOW DROPOUT OPERATION The deviceofferslow inputtooutputvoltagedifferenceby entering100% dutycyclemode. Inthismode thehigh sideMOSFET switchisconstantlyturnedon and thelow sideMOSFET isswitchedoff.Thisisparticularlyuseful inbatterypowered applicationstoachievelongestoperationtimeby takingfulladvantageofthewhole battery voltagerange.The minimum inputvoltagetomaintainswitchingregulation,dependingon theloadcurrentand outputvoltagecan be calculatedas: (1) With: VIN,MIN = Minimum inputvoltage IOUT,MAX = Maximum outputcurrent R DS(on) = HighsideFET on-resistance R L = Inductorohmic resistance ENABLING /DISABLING THE DEVICE The deviceisenabledby settingtheEN inputtoa logicHIGH. Accordingly,a logicLOW disablesthedevice.If the deviceis enabled,the internalpower stage willstartswitchingand regulatethe outputvoltageto the programmed threshold.The EN inputmust be terminatedwitha resistancelessthan1M Ω pulledtoVIN orGND. OUTPUT DISCHARGE The outputgetsdischargedby theSW pinwitha typicaldischargeresistorofR DIS whenever thedeviceshuts down. Thisisthe case when the devicegetsdisabledby enable,thermalshutdown trigger,and undervoltage lockouttrigger. SOFT START Afterenablingthedevice,an internalsoft-startcircuitrymonotonicallyramps up theoutputvoltageand reaches the nominaloutputvoltageduringa softstarttime(100µs,typical).Thisavoidsexcessiveinrushcurrentand createsa smooth outputvoltageriseslope.Italso preventsexcessivevoltagedrops of primarycellsand rechargeablebatterieswithhighinternalimpedance. Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):TLV62080
SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 www.ti.com Iftheoutputvoltageisnotreachedwithinthesoftstarttime,such as inthecase ofheavy load,theconverterwill enterregularoperation.Consequently,theinductorcurrentlimitwilloperateas describedbelow.The TLV62080 isabletostartintoa pre-biasedoutputcapacitor.The converterstartswiththeappliedbiasvoltageand ramps theoutputvoltagetoitsnominalvalue. POWER GOOD The TLV62080 has a power good outputgoinglow when the outputvoltageisbelow itsnominalvalue.The power good keeps highimpedance once theoutputisabove 95% oftheregulatedvoltage,and isdriventolow once theoutputvoltagefallsbelow typically90% oftheregulatedvoltage.The PG pinisa open drainoutputand isspecifiedtosinktypicallyup to0.5mA. The power good outputrequiresa pullup resistorthatisrecommended connectingtothedeviceoutput.When thedeviceisoffdue todisable,UVLO orthermalshutdown,thePG pinis athighimpedance. The PG signalcan be used forsequencingof multiplerailsby connectingto the EN pinof otherconverters. Leave thePG pinunconnectedwhen notused. UNDER VOLTAGE LOCKOUT To avoidmis-operationofthedeviceatlow inputvoltages,an under voltagelockoutisimplemented,thatshuts down thedeviceatvoltageslowerthanVUVLO witha VHYS_UVLO hysteresis. THERMAL SHUTDOWN The devicegoes intothermalshutdown once thejunctiontemperatureexceeds typicallyTJSD .Once thedevice temperaturefallsbelowthethresholdthedevicereturnstonormaloperationautomatically. INDUCTOR CURRENT LIMIT The InductorCurrentLimitpreventsthedevicefromhighinductorcurrentand drawingexcessivecurrentfromthe batteryor inputvoltagerail.Excessivecurrentmight occur with a shorted/saturatedinductoror a heavy load/shortedoutputcircuitcondition. The incorporatedinductorpeak currentlimitmeasures the currentduringthe high sideand low sidepower MOSFET on-phaseinPWM mode. Once thehighsideswitchcurrentlimitistripped,thehighsideMOSFET is turnedoffand thelow sideMOSFET isturnedon toreducetheinductorcurrent.Untiltheinductorcurrentdrops down tolow sideswitchcurrentlimit,thelow sideMOSFET isturnedoffand thehighsideswitchisturnedon again.Thisoperationrepeatsuntiltheinductorcurrentdoes notreachthehighsideswitchcurrentlimit.Due to the internalpropagationdelay,the realcurrentlimitvaluecan exceed the staticcurrentlimitinthe electrical characteristicstable.
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L MAX,OUTMAX, L fL V VI III /c180 /c45 /c180/c61/c68 /c68/c43/c61 TLV62080 www.ti.com SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011
APPLICATION INFORMATION
The inductorand the outputcapacitortogetherprovidea low pass frequencyfilter.To simplifythisprocess Table3 outlinespossibleinductorand capacitorvaluecombinationsforthemost application. Table3.MatrixofOutput Capacitor/InductorCombinations C OUT µF L µH 10 22 47 100 150 0.47 1 + +(2)(3) + + 2.2 + + + + 4.7 (1) Capacitancetoleranceand biasvoltagede-ratingisanticipated.The effectivecapacitancecan vary by+20% and -50%.Inductortoleranceand currentde-ratingisanticipated.The effectiveinductance can varyby +20% and -30%. (2) Plusmark indicatesrecommended filtercombinations. (3) Filtercombinationintypicalapplication. InductorSelection Main parameterfortheinductorselectionistheinductorvalueand thenthesaturationcurrentoftheinductor.To calculatethemaximum inductorcurrentunderstaticloadconditions,Equation2 isgiven. (2) Where IOUT,MAX = Maximum outputcurrent ΔIL = Inductorcurrentripple fSW = Switchingfrequency L = Inductorvalue It'srecommended to choose the saturationcurrentforthe inductor20%~30% higherthan the IL,MAX , out of Equation2.A higherinductorvalueisalsousefultolowerripplecurrent,butwillincreasethetransientresponse timeas well.The followinginductorsarerecommended tobe used indesigns. Table4.ListofRecommended Inductors INDUCTANCE CURRENT RATING DIMENSIONS DC RESISTANCE TYPE MANUFACTURER[µH] [mA] L x W x H [mm 3] [mΩ typ] 1.0 2500 3 x 3 x 1.2 35 XFL3012-102ME Coilcraft 1.0 1650 3 x 3 x 1.2 40 LQH3NPN1R0NJ0 Murata 2.2 2500 4 x 3.7x 1.65 49 LQH44PN2R2MP0 Murata 2.2 1600 3 x 3 x 1.2 81 XFL3012-222ME Coilcraft CapacitorSelection The inputcapacitoris the low impedance energy source forthe converterwhich helps to providestable operation.A low ESR multilayerceramiccapacitorisrecommended forbest filteringand shouldbe placed between VIN and GND as closeas possibletothatpins.For most applications10μF willbe sufficient,a larger valuereducesinputcurrentripple. Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):TLV62080
10µF VIN POWER GOOD SW VOS VIN EN GND GND PG FB 22µF 180k VOUT /c247 /c248 /c246/c231 /c232 /c230 /c43/c180/c61/c247 /c248 /c246/c231 /c232 /c230 /c43/c180/c61 2R 1R1V45. 02R 1R1VV FBOUT TLV62080 SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 www.ti.com The architectureoftheTLV62080 allowstouse tinyceramic-typeoutputcapacitorswithlow equivalentseries resistance(ESR). These capacitorsprovidelow outputvoltagerippleand are recommended. To keep its resistanceup tohighfrequenciesand togetnarrowcapacitancevariationwithtemperature,it'srecommended to use X7R orX5R dielectric.The TLV62080 isdesignedtooperatewithan outputcapacitanceof10µF to100µF, as outlinedinTable3. Table5.ListofRecommended Capacitors CAPACITANCE DIMENSIONSTYPE MANUFACTURER[µF] L x W x H [mm 3] 10 GRM188R60J106M 0603:1.6x 0.8x 0.8 Murata 22 GRM188R60G226M 0603:1.6x 0.8x 0.8 Murata 22 GRM21BR60J226M 0805:2.0x 1.2x 1.25 Murata SettingtheOutput Voltage By selectingR 1 and R 2,theoutputvoltageisprogrammed tothedesiredvalue.The followingequationcan be used tocalculateR 1 and R 2. Figure17. TypicalApplicationCircuit (3) For bestaccuracy,R2 shouldbe keptsmallerthan40kΩ toensurethatthecurrentflowingthroughR2 isatleast 100 timeslargerthan IFB . Changing the sum towardsa lowervalueincreasesthe robustnessagainstnoise injection.Changingthesum towardshighervaluesreducesthequiescentcurrent. PCB Layout The PCB layoutisan importantsteptomaintainthehighperformanceoftheTLV62080 device. The input/outputcapacitorsand the inductorshouldbe placedas closeas possibleto the IC.Thiskeeps the tracesshort.Routingthesetracesdirectand wide resultsinlow traceresistanceand low parasiticinductance.A common power GND shouldbe used. The low sideof the inputand outputcapacitorsmust be connected properlytothepower GND toavoida GND potentialshift. The sense tracesconnectedtoFB and VOS pinsaresignaltraces.Specialcareshouldbe takentoavoidnoise being induced.By a directrouting,parasiticinductancecan be kept small.GND layersmight be used for shielding.Keep thesetracesaway fromSW nodes.
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10µF 2.5V .. 5.5V 65.3k 39.2k VIN POWER GOOD SW VOS VIN EN GND GND PG FB 22µF 180k VOUT 1.2V TLV62080 www.ti.com SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 Figure18. PCB Layout Suggestion THERMAL INFORMATION Implementationof integratedcircuitsin low-profileand fine-pitchsurface-mountpackages typicallyrequires specialattentiontopower dissipation.Many system-dependentissuessuch as thermalcoupling,airflow,added heat sinks and convectionsurfaces,and the presence of other heat-generatingcomponents affectthe power-dissipationlimitsofa givencomponent. Threebasicapproachesforenhancingthermalperformancearelistedbelow:
- Improvingthepower dissipationcapabilityofthePCB design
- Improvingthethermalcouplingofthecomponent tothePCB by solderingtheThermalPAD ™
- Introducingairflowinthesystem For more detailson how to use the thermalparameters,see the applicationnotes:Thermal Characteristics APPLICATION EXAMPLES Figure19. 1.2VOutput VoltageApplication Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLink(s):TLV62080
10µF 3.0V .. 5.5V 178.6k 39.2k VIN POWER GOOD SW VOS VIN EN GND GND PG FB 22µF 180k VOUT 2.5V TLV62080 SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 www.ti.com Figure20. 2.5VOutput VoltageApplication
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www.ti.com SLVSAK9A –OCTOBER 2011–REVISED NOVEMBER 2011 Changes from Original(October2011)toRevisionA Page Copyright© 2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLink(s):TLV62080
www.ti.com 9-Mar-2012 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TLV62080DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV62080DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 8-Mar-2012 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV62080DSGR WSON DSG 8 3000 195.0 200.0 45.0 TLV62080DSGT WSON DSG 8 250 195.0 200.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 8-Mar-2012 Pack Materials-Page 2
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