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Technical content

  1. Dimensions: 2. Schematic: F E c ta 0.018 0.100 : 0.265 #0.002 I- Th i" Max an 1 a ||G@—0 6 | T 2 oJ 1/0 5 2 ,.{ 35062S ° a

8 Sp as 8 3 4

o>! °xXYYWw is} ° L 71 on OS G | D [° —- 0.004 3. Electrical Specifications: @25°C

0.200 Min

A OCL: Pins 1-3 350uH Min @100KHz 50mV, 8mAdc vie Q: Pins 1-3 8 Min @10KHz 50mV ox LL: Pins 1-3 0.25uH Max @1MHz 50mV (short 6-4) DC Res.: 0.600 Ohms Max, Each Wdg q] Uj J Cw/w: Pins 1,2,3 to 6,5,4 30pF Max @1MHz 50mV —lo.o40 | io: Pi . =I: oo Turns Ratio: Pins (1-3):(6-4)=1:142% N ¢ Isolation: 1500Vac, Pri to Sec lomo! 10.100 } —| 0.200 | SUGGESTED PCB LAYOUT Notes: 1. Solderability: Leads shall meet MIL-STD-—202G, Method 208H for solderability. 2. Flammability: UL94V-0 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155°C. UL file £151556 7 5. Operating T Range: All lis Title: 6. Storage Temperature Range: —55'C to +125'C www.XFMRS.com 8. SHO Lead Coploronty: £0.004"(0.102mm) UNLESS OTHERWISE SPECIIED| P/N: XF3506—2S REV. B DOC REV: B/2 xxx £0,010 - DDNMDD A DY 0 t is th ty of XFMRS G & i Dimensions in INCH [chk | vk tise _er-o8t8 locument is the property o: roup is A O) X AK Y not allowed to be duplicated without authorization, SHEET 1 OF 1 | app. | ew |Apr-o8-16