XF2M-3515-1A

Densitron.

OLED DISPLAY MODULE REV. E

Manufacturer: Densitron.

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DD-160128FC-2B DENSITRON | Alldatasheet

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Product No. DD-160128FC-2B REV. E Page 1 / 33 Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data OLED DISPLAY MODULE Product Specification CUSTOMER Standard PRODUCT NUMBER DD-160128FC-2B CUSTOMER APPROVAL Date INTERNAL APPROVALS Product Mgr Doc. Control Electr. Eng Bazile Peter Bazile Peter Luo Luo Date: 15 Oct 10 Date: 15 Oct 10 Date: 15 Oct 10

Product No. DD-160128FC-2B REV. E Page 3 / 33 Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data REVISION RECORD Rev. Date Page Chapt. Comment ECR no. A 22 Nov 06 First Issue B 26 Dec 10 1. Overall dimensions 2. Weight 3. Driver Supply Voltage 4. Operating current for VDDH 5. Optics Characteristics 6. Mechanical Drawing 7. Block Diagram 8. Add RGB interface 9. Power up sequence 10. Low Temperature Operation 11. Operating temperature C 07 Dec 11 to Handling Precautions Support Acceories D 28 Nov 12 33 10 Errors on 10.1 DUO KIT E 24 Oct 14 3.2 3.4 3.5 5.2 5.4 Revised Drawing (sticky tape removed between glass and FPC) Electrical characteristic Block Diagram Serial Interface Power sequence Application Example

1 MAIN FEATURES

Display Format 160 (RGB) x 128 Dots Overall Dimensions Glass 39.9 x 34.0 x 1.6 mm Colour 262,144 Colour Active Area 33.575 x 26.864 mm Viewing Area 35.575 x 28.864 mm Display Mode Passive Matrix (1.69”) Driving Method 1/128 duty Driver IC SEPS525 Operating temperature -40 ~ +70 Storage temperature -40 ~ +80

2 MECHANICAL SPECIFICATION

2.1 MECHANICAL CHARACTERISTICS

Display Format 160 (RGB) x 128 Dots Overall Dimensions Glass 39.9 x 34.0 x 1.6 mm Viewing Area 35.575 x 28.864 mm Active Area 33.575 x 26.864 mm Dot Size 0.045 x RGB x 0.194 mm Dot Pitch 0.07 x RGB x 0.21 mm Weight 4.55 g IC Controller/Driver SEPS525F0A (COF)

2.2 MECHANICAL DRAWING

3 ELECTRICAL SPECIFICATION

3.1 ABSOLUTE MAXIMUM RATINGS

VSS = 0 V, Ta = 25 °C Item Symbol Min Max Unit Note Supply Voltage V DD -0.3 4 V Note 1, 2 Supply Voltage for I/O Pins V DDIO -0.3 4 V Driver Supply Voltage V DDH -0.3 16 V Operating Temperature Top -40 70 °C Storage Temperature Tst -40 85 °C Static Electricity Be su re that you are grounded when handling displays. Note 1: All the above voltages are on the basis of “VSS=0V”. Note 2: When this module is used beyond th e above absolute maximum ratings, permanent damage to the module may occur. Also for normal operations it’s desirable to use this module under the conditions according to Section 3.2 “Electrical Characteristics”. If this module is used beyond these conditions the module may malfunction and the reliability could deteriorate.

3.2 ELECTRICAL CHARACTERISTICS

Characteristics Symbol Conditions Min Typ Max Unit Supply Voltage V DD 2.6 2.8 3.3 V Supply Voltage x I/O pins V DDIO 1.6 2.8 3.3 V Driver Supply Voltage V DDH Note 1 13.5 14 14.5 V High Level Input V IH 0.8xVDD - VDD V Low Level Input V IL 0 - 0.4 V High Level Output V OH I OH = -0.4mA VDD-0.4 - - V Low Level Output V OL I OL = -0.1mA - - 0.4 V Operating current for VDD I DD - 2.5 3.5 mA Operating current for VDDH IDDH Note 2 10.5 13.2 mA Note 3 - 14.9 18.6 Note 4 - 26.2 32.8 Sleep Mode Current for VDD IDD, Sleep 3 5 uA Sleep Mode Current for VDDH IDDH, Sleep 1 5 uA Note 1 Brightness (Lbr) and Supply Voltage for Display (VDDH) are subject to the change of the panel characteristics and the customer’s request. Note 2 VDD = 2.8V, VDDH = 14V, 30% Display Area Turn On Note 3 VDD =2.8V, VDDH = 14V, 50% Display Area Turn On Note 4 VDD = 2.8V, VDDH = 14V, 100% Display Area Turn On

3.3 INTERFACE PIN ASSIGNMENT

Mating Connector type: 35-pin, 0.5 mm pitch FFC/FPC. Type: AVX 04-6238-035-000-800 No. Symbol Function 1 N.C. Reserved Pin (Supporting Pin). The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground

2 VSDH

These are the ground pins for analog circuits. It must be connected to external ground. VSDH: Data Driver Ground

3 VDDH

This is the most positive voltage supply pin of the chip. It must be connected to external source.

4 VSSH

These are the ground pins for analog circuits. It must be connected to external ground. VSSH: Scan Driver Ground

5 IREF

Current reference for brightness Adjustment This pin is segment (data) current reference pin. A 68KΏ Resistor should be connected between this pin and VSS

6 OSCA2 Fine Adjustment for Oscillation

The frequency is controlled by external 5.1 kΏ Resistor between OSCA1 and OSCA2. The oscillator signal is used for system clock generation. When the external clock mode is selected, OSCA1 is used external clock input.

7 OSCA1

8 VDDIO

Power supply for Interface logic level This is a voltage supply pin. It should be match with MCU interface voltage level. It must always be equal or lower than VDD

9 VSYNCO RGB Mode functional Pins

VSYNCO : Vertical Sync Output VSYNC: Vertical Sync Input HSYNC : Horizontal Sync Input DOTCLK : Dot Clock Input ENNABLE : Video Enable Input While using MCU interface, it must be connected to VDD.

10 VSYNC

11 HSYNC

12 DOTCLK

13 ENABLE

14 CPU Select CPU type

Low: 80-Series High: 68-Series

15 PS Select Parallel/Serial Interface

Low: Serial High: Parallel 16 D17 Host Data Input/Output Bus. These pins are 9-bit bi-directional data bus to be connected with MCU data bus. PS Description 1 8-bit Bus: D17 to D10 9-bit Bus: D17 to D9

17 D16

18 D15

19 D14

20 D13

21 D12

22 D11

23 D10

D[17] SCL: Synchronous Clock Input D[16] SDI: Serial Data Input D[15] SDO: Serial Data Output 24 D9

25 RS Selects Data/Command

Low: Command High: Parameter/data

26 CSB

Low: SEPS525 is selected and can be accessed High: SEPS525 is not selected and cannot be accessed

27 RDB

80-system bus interface: read strobe signal (active low ) 68-system bus interface: bus enable strobe (active high) When serial mode, fix it to VDD or VSS level

28 WRB

Write or Read/Write select 80-system bus interface: write strobe signal (active low) 68-system bus interface: read/write select Low: write, High: read When serial mode, fix it to VDD or VSS level

29 RESETB

Power Reset for Controller and Driver This pin is reset signal input. When the pin is low, initialization of the chip is executed.

30 VSS

A reference for the logic pins. It must be connected to external ground

31 VDD

Power supply for logic circuit This is a voltage supply pin. It must be connected to external source

32 VSSH

These are the ground pins for analog circuits. It must be connected to external ground. VSSH: Scan Driver Ground

33 VDDH

This is the most positive voltage supply pin of the chip. It must be connected to external source.

34 VSDH

These are the ground pins for analog circuits. It must be connected to external ground. VSDH: Data Driver Ground 35 NC Reserved Pin (Supporting Pin). The supporting pins can reduce the influences from stresses on the function pins. These pins must be connected to external ground

3.4 BLOCK DIAGRAM

MCU Interface Selection: CPU, PS Pins connected to MCU interface: D17~ D9, RS, CSB, RDB, WRB, and RESETB Pins connected to RGB interface: D17~ D12, VSYNC, HSYNC, DOTCLK, and ENABLE C1, C3, C5 0.1 μF C4, C6 4.7 μF/25V Tantalum Capacitor C2 4.7 μF R2 5.1k Ω R1: 68k Ω Active Area 1.69” 160 x RGB x 128 Pixels

3.5 TIMING CHARACTERISTICS

3.5.1 AC CHARACTERISTICS

3.5.1.1 6800-Series MPU Parallel Interface Timing Characteristics VDD = 2.8V, Ta = 25˚C Characteristics Symbol Min Max Unit Port Write Timing Address hold timing tAH6 5 - nS CSB Address setup timing tAS6 5 RS System cycle timing Write tCYC6 100 - nS E “L” pulse width Write tELW6 45 “H” pulse width tEHW6 45 Data setup timing tDS6 40 - nS DB[17:0] Data hold timing tDH6 10 Read Timing Address hold timing tAH6 10 - nS CSB Address setup timing tAS6 10 RS System cycle timing Write tCYC6 200 - nS E “L” pulse width Write tELW6 90 “H” pulse width tEHW6 90 Data setup timing (CL= 15pF) tDS6 0 70 nS DB[17:0] Data hold timing (CL= 15pF) tDH6  All the timing should be based on 10% and 90% of VDD. Write Timing

Product No. DD-160128FC-2B REV. E Page 14 / 33 Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 3.5.1.2 8080-Series MPU Parallel Interface Timing Characteristics Characteristics Symbol Min Max Unit Port Write Timing Address hold timing tAH8 5 - nS CSB Address setup timing tAS8 5 RS System cycle timing Write tCYC8 100 - nS WRB “L” pulse width Write tELW8 45 “H” pulse width tEHW8 45 Data setup timing tDS8 30 - nS DB[17:0] Data hold timing tDH8 10 Read Timing Address hold timing tAH8 10 - nS CSB Address setup timing tAS8 10 RS System cycle timing Write tCYC8 200 - nS RDB “L” pulse width Write tELW8 90 “H” pulse width tEHW8 90 Data setup timing (CL= 15pF) tDS8 0 60 nS DB[17:0] Data hold timing (CL= 15pF) tDH8 * All the timing should be based on 10% and 90% of VDD Write Timing Read timing

3.5.1.3 Serial Interface Timing Characteristics

VDD = 2.8V , Ta = 25˚C ITEM SYMBOL MIN MAX UNIT PORT Serial clock cycle SCL tCYCS 100 - nS SCL “H” pulse width SCL tSHW 45 “L” pulse width tSLW 45 Data setup timing Data tDSS 5 - nS SDI Hold timing tDHS 5 CSB-SCL timing tCSS 5 - nS CSB CSB-hold timing tCSH 5 RSB-SCL timing TRSS 5 - nS RS RSB-hold timing TRSH 5 * All the timing should be based on 10% and 90% of VDD Serial Interface Timing

3.5.1.4 RGB Interface Timing Characteristics:

4 OPTICAL SPECIFICATION

4.1 OPTICAL CH ARACTERISTICS

Characteristics Symbol Condition Min Typ Max Unit Brightness(White) L br Note 1 60 75 - cd/m 2 C.I.E.(White) (X) C.I.E. 1931 0.26 0.30 0.34 (Y) 0.29 0.33 0.37 C.I.E.(Red) (X) C.I.E. 1931 0.60 0.64 0.68 (Y) 0.30 0.34 0.38 C.I.E.(Green) (X) C.I.E. 1931 0.27 0.31 0.35 (Y) 0.58 0.62 0.66 C.I.E.(Blue) (X) C.I.E. 1931 0.10 0.14 0.18 (Y) 0.12 0.16 0.20 Dark Room Contrast CR - >10000:1 - - Viewing Angle >160 - - degree Note 1: Brightness (Lbr) and Supply Voltage for Display (VDDH) are subject to the change of the panel characteristics and the customer’s request. Optical measurement with polarizer is taken at VDD, VDDIO = 2.8V, VDDH = 14V and the software initial setting with section 5.4.1 Reference parameter table for normal operation mode.

5 FUNCTIONAL SPECIFICATION

5.1 COMMANDS

Please refer to the Technical Manual for the SEPS525

5.2 POWER UP/DOWN SEQUENCE

To protect panel and extend the panel lifetime, the driver IC power up/down routine should include a delay period between high voltage and low voltage power sources during turn on/off. It gives the panel enough time to complete the action of charge and discharge before/after the operation.

5.2.1 POWER UP SEQUENCE

VDD,, VDDIO ON VDDH ON Display On 1. Power up VDD & VDD IO 2. Send Display off command VDDH 3. Initialization 4. Clear Screen 5. Power up V DDH 6. Delay 100ms (When VDD & VDDIO is stable) V DD 7. Send Display on command Ground

5.2.2 POWER DOWN SEQUENCE

Display off VDDH off VDD,, VDDIO off 1. Send Display off command 2. Power down VDDH VDDH 3. Delay 100ms (When V DDH reach 0 and panel is completely discharges) VDD 4. Power down VDD & VDDIO Ground 1) Since an ESD protection circuit is connected between VDD, VDDIO and VDDH inside the driver IC, VDDH becomes lower than VDD & VDDIO whenever VDD & VDDIO is ON and VDDH is OFF. 2) VDDH should be kept float (disable) when it is OFF. 3) Power Pins (VDD, VDDIO, VDDH) can never be pulled to ground under any circumstance. 4) VDD & VDDIO should not be power down before VDDH power down.

5.3 RESET CIRCUIT

When RESETB input is low, the chip is initialized with the following status: 1. Frame frequency: 90Hz 2. OSC: internal OSC 3. Internal OSC: ON 4. DDRAM write horizontal address: MX1 = 00h, MX2 = 9Fh 5. DDRAM write vertical address: MY1 = 00h, MY2 = 7Fh 6. Display data RAM write: HC = 1, VC = 1, HV = 0 7. RGB data swap: OFF 8. Row scan shift direction: G0, G1, … , G126, G127 9. Column data shift direction: S0, S1, … , S478, S479 10. Display ON/OFF: OFF 11. Panel display size: FX1 = 00h, FX2 = 9Fh, FY1 = 00h, FY2 = 7Fh 12. Display data RAM read column/row address: FAC = 00h, FAR = 00h 13. Pre-charge time(R/G/B): 0 clock 14. Pre-charge current(R/G/B): 0 uA 15. Driving current(R/G/B): 0 uA

5.4 ACTUAL APPLICATION EXAMPLE

Product No. DD-160128FC-2B REV. E Page 21 / 33 Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data If the noise is accidentally occurred at the displaying window during the operation, please reset the display in order to recover the display function Power down Sequence

6 PACKAGING AND LABELLING SPECIFICATION

7 QUALITY ASSURANCE SPECIFICATION

7.1 CONFORMITY

The performance, function and reliability of the shipped products conform to the Product Specification.

7.2 DELIVERY ASSURANCE

7.2.1 DELIVERY INSPECTION STANDARDS

IPC-AA610, class 2 electronic assemblies standard

7.2.2 Zone definition

7.2.3 Visual inspection

Test and measurement to be conducted under following conditions： Temperature: 23±5 ℃ Humidity: 55±15%RH Fluorescent lamp: 30 W Distance between the Panel & Eyes of the Inspector: ≧30cm Distance between the Panel & the lamp: ≧50cm A Active B Outside Active

7.2.4 Standard of appearance inspection

Units: mm Class Item Criteria Minor Packing & Label Outside & inside package Presence of product no., lot no., quantity Critical Product must not be mixed with othe rs and quantity must not be different from that indicated on the label Major Dimension Product dimensions must be according to specification and drawing Major Electrical Product electrical characteri stics must be according to specification Critical OLED Display Missing lines, short circuits or wrong patterns on OLED display are not allowed Minor Black spot, white spot, dust Round type: as per following drawing  = (X+Y)/2 Acceptable quantity Size Zone A Zone B <0.1 Any number Any number 0.1<<0.2 3 0.2<<0.25 1 0.25< 0 Line type: as per following drawing Acceptable quantity Length Width Zone A Zone B - - W ≤0.05 Any number Any number L ≤2.0 W ≤0.1 3 L>2.0 0 Total acceptable quantity: 3 Minor Polariser scratch Scratch on protective film is permitted Scratch on polariser: same as No. 1 Minor Polariser bubble  = (X+Y)/2 Acceptable quantity Size Zone A Zone B <0.5 Any number Any number >0.5 0 X Y L W X Y

Product No. DD-160128FC-2B REV. E Page 26 / 33 Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data Class Item Criteria Minor Segment deformation 1b. Pin hole on dot matrix display Acceptable quantity Size a,b<0.1 Any number (a+b)/2≤0.1 Any number 0.5<<1.0 3 Total acceptable quantity: 7 2. Segments / dots with different width Acceptable a≥b a/b ≤4/3 a<b a/b>4/3 3. Alignment layer defect  = (a+b)/2 Acceptable quantity Size ≤0.4 Any number 0.4<≤1.0 5 1.0<≤1.5 3 1.5<≤2.0 2 Total acceptable quantity: 7 Minor Panel Chipping X ≤ 1/6 Panel length Y ≤ 1 Z ≤ T Minor Panel Cracking Cracks not allowed Minor Cupper exposed (pin or film) Not allowed if visible by eye inspection Minor Film or Trace Damage Not allowed if affect electrical function

Product No. DD-160128FC-2B REV. E Page 27 / 33 Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data Class Item Criteria Minor Contact Lead Twist Not allowed Minor Contact Lead Broken Not allowed Minor Contact Lead Bent Not allowed if bent lead causes short circuit Not allowed if bent lead extends horizontally more than 50% of its width Minor Colour uniformity Level of sample for approval set as limit sample Major PCB No unmelted solder paste should be present on PCB Critical Cold solder joints, missing solder connections, or oxidation are not allowed Minor No residue or solder balls on PCB are allowed Critical Short circuits on components are not allowed Minor Tray particles Size Quantity On tray <0.2 Any number >0.25 4 On display 0.25 2 L = 3 1

7.3 DEALING WITH CUSTOMER COMPLAINTS

7.3.1 Non-conforming analysis

Purchaser should supply Densitron with detailed data of non-conforming sample. After accepting it, Densitron should complete the analysis in two weeks from receiving the sample. If the analysis cannot be completed on time, Densitron must inform the purchaser.

7.3.2 Handling of non- conforming displays

If any non-conforming displays are found during customer acceptance inspection which Densitron is clearly responsible for, return them to Densitron. Both Densitron and customer should analyse the reason and discuss the handling of non- conforming displays when the reason is not clear. Equally, both sides should discuss and come to agreement for issues pertaining to modification of Densitron quality assurance standard.

8 RELIABILITY SPECIFICATION

8.1 RELIABILITY TESTS

Test Item Test Condition Evaluation and assessment High Temperature Operation 70°C±2, 240 hours No abnormalities in function and appearance Low Temperature Operation -40°C±2, 240 hours No abnormalities in function and appearance High Temperature Storage 80°C±2, 240 hours No abnormalities in function and appearance Low Temperature Storage -40°C±2, 240 hours No abnormalities in function and appearance High Temperature & High Humidity Storage(Operation) 60°C±2, 90%RH, 120 hours No abnormalities in function and appearance Thermal Shock 24 cycle of -40°C 1 Hour, 85°C 1 Hour No abnormalities in function and appearance  The brightness should be greater than 50% of the initial brightness.  The samples used for above tests do not include polarizer.  No moisture condensation is observed during tests.

8.1.1 FAILURE CHECK STANDARD

After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure teat at 23±5 °C; 55±15% RH

8.2 LIFE TIME

Function, performance, appearance, etc. shall be free from remarkable deterioration more than 10,000 hours under 75 cd/m² brightness and storage conditions of room temperature (25±10 °C), normal humidity (45±20% RH), and in area not exposed to direct sunlight. 2 End of lifetime is specified as 50% of initial brightness.

8.1 FAILURE CHECK STANDARD

After the completion of the described reliability test, the samples were left at room temperature for 2 hrs prior to conducting the failure test at 23±5°C; 55±15% RH.

9 HANDLING PRECAUTIONS

9.1 HANDLING PRECAUTIONS

1) Since the display panel is being made of glass, do not apply mechanical impacts such us dropping from a high position. 2) If the display panel is broken by some accident and the internal organic substance leaks out, be careful not to inhale nor lick the organic substance. 3) If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell structure may be damaged and be careful not to apply pressure to these sections. 4) The polarizer covering the surface of the OEL display module is soft and easily scratched. Please be careful when handling the OEL display module. 5) When the surface of the polarizer of the OEL display module has soil, clean the surface. It takes advantage of by using following adhesion tape. * Scotch Mending Tape No. 810 or an equivalent Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent such as ethyl alcohol, since the surface of the polarizer will become cloudy. Also, pay attention that the following liquid and solvent may spoil the polarizer: * Water * Ketone * Aromatic Solvents 6) Hold OEL display module very carefully when placing OEL display module into the system housing. Do not apply excessive stress or pressure to OEL display module. And, do not over bend the film with electrode pattern layouts. These stresses will influence the display performance. Also, secure sufficient rigidity for the outer cases. 7) Do not apply stress to the LSI chips and the surrounding molded sections. 8) Do not disassemble nor modify the OEL display module. 9) Do not apply input signals while the logic power is off. 10) Pay sufficient attention to the working environments when handing OEL display modules to prevent occurrence of element breakage accidents by static electricity. * Be sure to make human body grounding when handling OEL display modules. * Be sure to ground tools to use or assembly such as soldering irons. * To suppress generation of static electricity, avoid carrying out assembly work under dry environments. * Protective film is being applied to the surface of the display panel of the OEL display module. Be careful since static electricity may be generated when exfoliating the protective film.

Product No. DD-160128FC-2B REV. E Page 31 / 33 Copyright ©2011 DENSITRON TECHNOLOGIES plc. All rights reserved. – Proprietary Data 11) Protection film is being applied to the surface of the display panel and removes the protection film before assembling it. At this time, if the OEL display module has been stored for a long period of time, residue adhesive material of the protection film may remain on the surface of the display panel after removed of the film. In such case, remove the residue material by the method introduced in the above Section 5). 12) If electric current is applied when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful to avoid the above.

9.2 STORAGE PRECAUTIONS

1) When storing OEL display modules, put them in static electricity preventive bags avoiding exposure to direct sun light nor to lights of fluorescent lamps, etc. and, also, avoiding high temperature and high humidity environments or low temperature (less than 0°C) environments. (We recommend you to store these modules in the packaged state when they were shipped from Densitron Technologies Plc.) At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur with them. 2) If electric current is applied when water drops are adhering to the surface of the OEL display module, when the OEL display module is being dewed or when it is placed under high humidity environments, the electrodes may be corroded and be careful about the above.

9.3 DESIGNING PRECAUTIONS

1) The absolute maximum ratings are the ratings which cannot be exceeded for OEL display module, and if these values are exceeded, panel damage may be happen. 2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH specifications and, at the same time, to make the signal line cable as short as possible. 3) We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (VDD). (Recommend value: 0.5A) 4) Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring devices. 5) As for EMI, take necessary measures on the equipment side basically. 6) When fastening the OEL display module, fasten the external plastic housing section. 7) If power supply to the OEL display module is forcibly shut down by such errors as taking out the main battery while the OEL display panel is in operation, we cannot guarantee the quality of this OEL display module. 8) The electric potential to be connected to the rear face of the IC chip should be as follows: US2066 * Connection (contact) to any other potential than the above may lead to rupture of the IC.

9.4 OTHER PRECAUTIONS

1) When an OEL display module is operated for a long of time with fixed pattern may remain as an after image or slight contrast deviation may occur. Nonetheless, if the operation is interrupted and left unused for a while, normal state can be restored. Also, there will be no problem in the reliability of the module. 2) To protect OEL display modules from performance drops by static electricity rapture, etc., do not touch the following sections whenever possible while handling the OEL display modules. * Pins and electrodes * Pattern layouts such as the FPC 3) With this OEL display module, the OEL driver is being exposed. Generally speaking, semiconductor elements change their characteristics when light is radiated according to the principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning may occur. * Design the product and installation method so that the OEL driver may be shielded from light in actual usage. * Design the product and installation method so that the OEL driver may be shielded from light during the inspection processes. 4) Although this OEL display module stores the operation state data by the commands and the indication data, when excessive external noise, etc. enters into the module, the internal status may be changed. It therefore is necessary to take appropriate measures to suppress noise generation or to protect from influences of noise on the system design. 5) We recommend you to construct its software to make periodical refreshment of the operation statuses (re-setting of the commands and re-transference of the display data) to cope with catastrophic noise.

9.5 PRECAUTIONS WHEN DISP OSING OF THE OEL DISPLAY

1) Request the qualified companies to handle industrial wastes when disposing of the OEL display modules. Or, when burning them, be sure to observe the environmental and hygienic laws and regulations.

10 SUPPORTED ACCESSORIES

10.1 DUO KIT

Densitron has developed an easy to use yet powerful development and demonstration tool for driving its range of Passive matrix OLED displays from the USB port of a PC. DUO (Densitron USB OLED) kit is hot pluggable and does not require extra cables or power supply to run, allowing users to be up and running in minutes. The kit consists of an OLED display with transition Board, USB controller card, mini USB cable and a CD with software application and drivers. Part number: PDK-N-160128FC-2B

10.2 TRANSITION BOARD CARD

A Transition board card is like a daughterboard which is meant to be a circuit board for connections between the baseboards (DUO). It has connector pins for interfacing between the display and the baseboards. It also includes the OLED display. Part number: PDT-N-160128FC-2B

10.3 CONNECTOR BOARD CARD

A Connector board card is also a daughterboard which is a circuit board for connection between a microprocessor or microcontroller (customer’s system). Part number: EVK-CONNECT-010

10.4 CONNECTOR

Type: ZIF connector No. of connections Pitch (mm) Manufacturer Manufacturer part no. Distributor part no. 35 0.50 Omron XF2M-3515-1A Farnell/1112561 Digikey/ OR727CT-ND

Product Information

XF2M-3515-1A specifications and overview.

Summary

OLED DISPLAY MODULE REV. E

Description

OLED DISPLAY MODULE REV. E

Source title XF2M-3515-1A Datasheet(PDF) - Densitron.

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