XF1313-15HDMS_15 XFMRS | Alldatasheet

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Technical content

  1. Dimensions: 2.Schematic: D 0.030 Typ c Line Chip one r Tr reve Max ee a 6 10 mame) E 1 3 ; Mf ff 1 9 > . 4 s| | XFMRS | ‘x a vo allt =| | xF1313 2 - 8 8 “sg iw} | —TSHOMS | os 3 3.Electrical Specifications: @25°C yww @ HHHYUYY \\ Tape PIN10—7 OCL: 5.0mH +10% @10KHz 0.1V OmAdc 5 4, 1 iL (CONNECT PIN8-9) 0.530 Max 0.020 Typ PIN10—7 LL: 12uH Max @100KHz 100mV (CONNECT PIN 8+9, 1,2,4,5) 0.050 Typ TURNS RATIO: (10-7):(1-5) = 2.125:141% tie(8+9, 2+4) & DC Res.: Pins 1-2 0.350 Ohms Max oogdg It DC Res.: Pins 10-8 1.75 Ohms Max a SG DC Res.: Pins 9-7 1.75 Ohms Max e DC Res.: Pins 4-5 0.400 Ohms Max Ry ISOLATION VOLTAGE: 2000Vrms (Chip to Line)

3 OPERATING TEMP: —40°C TO 85°C

lo O o Oo UL1950 approved for the requirements of | 0.098 Typ Supplementary Insulation with 300 working volts. UL file #£165866 Suggested PCB Layout Note: 1. Solderability: Leads shall meet MIL-STD-—202, Title: Method 2080 for solderabilty XFMRS Inc HDSL_ TRANSFORMER 3 ASIM oxygen index > 28% , UNLESS OTHERWISE SPECIFIED] P/N: XF1313-—15HDMS| REV. A 4. Temperature rating: 155°C. UL file £151556, TOLERANCES: A® t# |Jun-05-01 5. Operating Temperature Range: 0°C to +70°C xxx +£0.010 - THIS DOCUMENT IS STRICTLY NOT ALLOWED TO BE DUPLICATED WITHOUT AUTHORIZATION| SHEET 1 OF 1[ APP. | BW [Jun—05-01