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Technical content

  1. Mechanical Dimensions: 2. Schematic: 8 7 6 5 + og oc = 7S ° oN ° 4 ak a FY 0.064 qT or E F D i 0.100 8x0.017x0.024 0.620 Max +0.003 , 33 4 A TX RCV 0.475

8 Max 5

nf o o \\ | 3. Electrical Specifications: @25°C os 70.050 XYYWW oO ot ol Isolation: 1500 Vrms (PRI to SEC) x lo} XFO013 | mS a! o TX Turns Ratio: 1:2 (PRI:SEC) = oO °-008 P= o RCV Turns Ratio: 1:1 (PRI:SEC) (oor | -— 0.400 —| | PRI OCL: 1.20mH Typical @100KHz, 50mV ‘ 4 0.640 Q: 5 Min @10KHz, 5OmV fe} view P (SUGGESTED MOUNTING PAD) Cw/w: 35pF Maximum @100KHz, 50mV (PRI/SEC) PRI LL: 0.4uH Maximum @100KHz, S5OmV Pri DCR: 0.70 Ohms Max Notes: 1, Solderability: Leads shall meet MIL—STD-2026, Crosstalk: —60dB Typ (0.1 to 5MHz) Method 208H for solderability. 2. Flammability: UL94V-0 CHOKE OCL: 30uH Typ @100KHz, 50mV 3. ASTM oxygen index: > 28% 4. Insulation System: Class F 155°C. UL file E151556 5. Operating Temperature Range: All listed parameters are to be within tolerance from —40°C to +85°C 6. Storage Temperature Range: —55°C to +125°C 7. he itil 4 . 2: ShO Lead Coplonany:20.004"(0.102mm) XFMRS Inc] Te: transrormer 9. Electrical ond mechanical specifications 100% tested www.XFMRS.com T1/E1 DESIGN 10. RoHS Compliant Component 19! Recommended IR Reflow peak temp of 250°C Nox. UNLESS OTHERWISE SPECIFIED] P/N: XFOO13—00S21 Y ISep— 12-14] DOC. REV: B/1 xxx £0.010 DWN, _| Yuan p Dimensions in Inch | cHk. | YK Liao |Sep-12-14] BID 1) LD B Document is the property of XFMRS Group & is \\ O \\ A \\ not_allowed to _be duplicated without authorization. SCALE 3:1 SHT 1 OF 1