XCC3351MODENIAMOZR

Texas Instruments

CC335xMOD SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion Module APRIL 2025

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CC335xMOD SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion Module

1 Features

Wi-Fi 6 (802.11ax)
Bluetooth® Low Energy 5.4 in CC33x1MOD
Companion module to any processor or MCU host capable of running a TCP/IP stack
Integrated 2.4GHz and 5GHz PA for a complete wireless system with up to +18dBm output power
Operating temperature: –40°C to +85°C
Application throughput up to 50Mbps
Regulatory Certification (in progress) – FCC – IC/ISED – ETSI/CE – MIC (TELEC)
QuickTrack Qualified
Bluetooth Controller Subsystem Qualified Extended Features
Wi-Fi 6 – 2.4GHz and 5GHz, 20MHz, single spatial stream – MAC, baseband, and RF transceiver with support for IEEE 802.1 1 a/b/g/n/ax – Target wake time (TWT), OFDMA, MU-MIMO (downlink), Basic Service Set Coloring, and trigger frame for improved ef ficiency – Hardware-based encryption and decryption supporting WP A2 and WPA3 – Excellent interoperability – Support for 4-bit SDIO or SPI host interfaces
Bluetooth Low Energy 5.4 – LE Coded PHYs (long range), LE 2M PHY (high speed), and Advertising Extension – Host controller interface (HCI) transport with an option for UAR T or shared SDIO – Internal coexistence mechanism with Wi-Fi to share the same antenna
Enhanced Security – Secured host interface – Firmware authentication – Anti-rollback protection
Multirole support (for example, concurrent STA and AP) to connect with Wi-Fi devices on different RF channels (Wi-Fi networks)
Optional antenna diversity or selection
3-wire or 1-wire PTA for external coexistence with additional 2.4GHz radios (for example, Thread or Zigbee)
Clock sources – 40MHz XTAL fast clock (Integrated into the module) – Internal slow clock or external 32.768kHz slow clock
Small package size – Easy to design with 65-pin, 11mm × 11mm LGA package, 0.65mm pitch

2 Applications

Grid infrastructure – Electricity meter – String inverter – Microinverter – Energy storage power conversion system (PCS) – EV charging infrastructure
Building and home automation – HVAC controller – HVAC gateway – Thermostat – Building security gateway – Garage door system – IP network camera and video doorbell – Wireless security camera
Appliances – Refrigerator and freezer – Oven – Washer and dryer – Residential water heater and heating system – Air purifier and humidifier – Coffee machine – Air conditioner indoor unit – Vacuum robot – Robotic lawn mower
Medical – Infusion pump – Electronic hospital bed and bed control – Multiparameter patient monitor – Blood pressure monitor – CPAP machine – Telehealth systems – Ultrasound scanner – Ultrasound smart probe – Electric toothbrush
Retail Automation and Payment
Printers ADVANCE INFORMATION CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADV ANCE INFORMATION for preproduction products; subject to change without notice.

3 Description

The SimpleLink™ Wi-Fi CC33xx family of devices is where affordability meets reliability, enabling engineers to connect more applications with confidence. CC335xMOD devices are certified modules designed to simplify hardware design and reduce time-to-market.

CC3350MOD: A 2.4GHz and 5GHz Wi-Fi 6 companion module
CC3351MOD: A 2.4GHz and 5GHz Wi-Fi 6 and Bluetooth Low Energy 5.4 companion module The CC335xMOD offers the latest standards from Wi-Fi and BLE while maintaining compatibility with Wi-Fi 4 (802.11 a/b/g/n) and Wi-Fi 5 (802.11ac). These CC335xMOD devices are based on the 10th-generation connectivity combo chip from Texas Instruments. As such, the CC335xMOD is based on proven technology. These modules are an excellent choice to use in cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP. CC335xMOD brings the efficiency of Wi-Fi 6 to embedded device applications for the Internet of Things (IoT). Device Information PART NUMBER Wi-Fi 2.4/5GHz SISO BLUETOOTH LOW ENERGY CC3350MODENIAMOZR ✔ CC3351MODENIAMOZR ✔ ✔ CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

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4 Functional Block Diagrams

The diagram below shows the functional block diagram of the CC335xMOD module. CC335x 1.8-V IRQ SLOW_CLK_IN nRESET SDIO/SPI UART ANT_SEL Logger COEX

40 MHz

3.3-V

2.4 GHz

5 GHz

The diagram below shows a hardware overview of the CC335x IC used inside the CC335xMOD. CC335x 2.4/5GHz Wi-Fi and BLE Companion IC System Power Clock User OTP Packet RAM Execution / Data RAM Wi-Fi & BLE Core Wi-Fi MAC / Modem BLE MAC / Modem 2.4/5GHz Wi-Fi / BLE RF ELPCryptoDMA Interfaces SDIO /SPI UART Coexistence Antenna Diversity nReset 2.4GHz ANT CC3351 only 5GHz ANT CC335x Hardware Overview www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

6.5 WLAN Performance: 2.4GHz Receiver

6.7 WLAN Performance: 5GHz Receiver

6.11 Current Consumption: 2.4GHz WLAN Static

6.12 Current Consumption: 5GHz WLAN Static

6.13 Current Consumption: 2.4GHz WLAN Use Cases..14

8.1 Typical Application—CC335xMOD Reference

11 Mechanical, Packaging, and Orderable

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5 Pin Configuration and Functions

5.1 Pin Diagram

Figure 5-1 shows pin assignments for the 65-pin LGA package. GND GND 28 27 26 25 24 23 22 21 20 19 18 17 1629 15 44 45 46 47 48 49 50 51 52 53 54 55 56 1 GND GND GND GND RF_OUT GND GND GND VPP_IN SLOW_CLK_IN nReset GND GND GND COEX_PRIORITY COEX_REQ COEX_GRANT UART RTS UART CTS UART RX UART TX ANT_SEL 1V8_IN 1V8_IN GND Host_IRQ_BLE GND 6265 63 60 GND GND GND GND GND GND GND 3V3_IN GND GND GND GND 3V3_IN

42 GND

SDIO_D3 SDIO_D2 SDIO_D1 SDIO_D0 Logger Host_IRQ_WL SWDIO GND GND SWCLK GND Figure 5-1. CC3351MOD Pin Diagram (Top View) www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

5.2 Pin Descriptions

Table 5-1. Pin Descriptions PIN SIGNAL NAME TYPE DIR (I/O) VOLTAGE LEVEL SHUTDOWN STATE STATE AFTER POWER-UP

DESCRIPTION

1 GND GND GND

2 GND GND GND

3 SDIO CLK Digital I 1.8V HiZ HiZ SDIO clock or SPI clock 4 SDIO CMD Digital I/O 1.8V HiZ HiZ SDIO command or SPI PICO 5 SDIO_D3 Digital I/O 1.8V HiZ PU SDIO data D3 or SPI CS 6 SDIO_D2 Digital I/O 1.8V HiZ HiZ SDIO data D2 7 SDIO_D1 Digital I/O 1.8V HiZ HiZ SDIO data D1 8 SDIO_D0 Digital I/O 1.8V HiZ HiZ SDIO data D0 or SPI POCI 9 Logger3 Digital O 1.8V PU PU Tracer (UART TX debug logger) 10 Host_IRQ_WL3 Digital O 1.8V PD 0 Interrupt request to host for WLAN 11 Host_IRQ_BLE Digital O 1.8V PD PD Interrupt request to host for BLE (in shared SDIO mode) 12 SWDIO Digital I/O 1.8V PU PU Serial wire debug I/O 13 SWCLK Digital I 1.8V PD PD Serial wire debug clock

14 GND GND GND

15 GND GND GND

16 GND GND GND

17 nReset Digital I 1.8V PD PD Reset line for enabling or disabling device (active low) 18 SLOW_CLK_IN Digital I 1.8V PD PD 32.768kHZ RTC clock input 19 VPP_IN POW 1.8V OTP programming input supply

20 GND GND GND

21 GND GND GND

22 GND GND GND

23 RF_OUT RF I/O Bluetooth Low Energy and

WLAN 2.4 and 5 GHz RF port

24 GND GND GND

25 GND GND GND

26 GND GND GND

27 GND GND GND

28 GND GND GND

29 GND GND GND

30 GND GND GND

31 GND GND GND

32 GND GND GND

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Table 5-1. Pin Descriptions (continued) PIN SIGNAL NAME TYPE DIR (I/O) VOLTAGE LEVEL SHUTDOWN STATE STATE AFTER POWER-UP

33 GND GND GND

34 GND GND GND

35 GND GND GND

36 GND GND GND

37 3V3_IN POW VDD PA Voltage 38 3V3_IN POW VDD PA Voltage

39 GND GND GND

40 GND GND GND

41 GND GND GND

42 GND GND GND

43 GND GND GND

44 GND GND GND

45 COEX_PRIORITY 2 Digital I 1.8V PU PU External coexistence interface: priority 46 COEX_REQ 2 Digital I 1.8V PU PU External coexistence interface: request 47 COEX_GRANT2 Digital O 1.8V PD PD External coexistence interface: grant 48 UART RTS Digital O 1.8V PU PU Device RTS signal: flow control for BLE HCI 49 UART CTS Digital I 1.8V PU PU Device CTS signal: flow control for BLE HCI 50 UART RX Digital I 1.8V PU PU UART RX for BLE HCI 51 UART TX Digital O 1.8V PU PU UART TX for BLE HCI 52 ANT_SEL 2 Digital O 1.8V PD PD Antenna select control line 53 1V8_IN POW Main supply voltage for analog and digital - VDD_MAIN_IN, VDDA_IN1, VDDA_IN2, VIO 54 1V8_IN POW Main supply voltage for analog and digital - VDD_MAIN_IN, VDDA_IN1, VDDA_IN2, VIO

55 GND GND GND

56 GND GND GND

57 GND GND GND

58 GND GND GND

59 GND GND GND

60 GND GND GND

61 GND GND GND

62 GND GND GND

63 GND GND GND

Table 5-1. Pin Descriptions (continued) PIN SIGNAL NAME TYPE DIR (I/O) VOLTAGE LEVEL SHUTDOWN STATE STATE AFTER POWER-UP

64 GND GND GND

65 GND GND GND

All digital I/Os (with the exception of SDIO signals) are Hi-Z when the device is in shutdown mode with internal PU/PD according to the "shutdown state" column. 2. See software release notes for support level. 3. Logger and Host_IRQ_WL pins are sensed by the device during boot, see CC33xx Hardware Integration. CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

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6 Specifications

All specifications are given at the module pins. Typical values are measured with nominal device at 25°C.

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1) PARAMETER PINS MIN MAX UNIT 1V8_IN 1.8V Supply 53,54 –0.5 2.1 V 3V3_IN 3.3V Supply 37,38 –0.5 4.2 V Input Voltage to all digital pins –0.5 1V8_IN + 0.5 V VPP VPP OTP Voltage 19 –0.5 2.1 V TA Operating Ambient Temperature –40 85 °C Tstg Storage temperature –40 105 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) RF pins ±1000 V Other pins ±2000 Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) RF pins ±250 Other pins ±500 (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

PARAMETER PINS MIN TYP MAX UNIT 1V8_IN 1.8V Supply 53,54 1.62 1.8 1.98 V 3V3_IN 3.3V Supply 37,38 2.97 3.3 3.63 VPP DC supply rail for OTP memory 19 1.62 1.8 1.98 V TA Operating ambient temperature –40 85 °C Maximum power dissipation 2 W

6.4 Electrical Characteristics

PARAMETER DESCRIPTION TEST CONDITIONS MIN TYP MAX UNIT VIH High Level Input Voltage 0.65 × VIO VIO V VIL Low Level Input Voltage 0 0.35 × VIO VOH High Level Output Voltage at 4mA VIO – 0.45 VIO VOL Low Level Output Voltage at 4mA 0 0.45 www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

6.5 WLAN Performance: 2.4GHz Receiver Characteristics PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Operational Frequency Range 2412 2472 MHz Sensitivity: 8% PER for 11b rates, 10% PER for 11g/n/ax rates 1Mbps DSSS TBD dBm 2Mbps DSSS TBD 11Mbps CCK TBD 6Mbps OFDM TBD 54Mbps OFDM TBD HT MCS0 MM 4K TBD HT MCS7 MM 4K TBD HE MCS0 4K TBD HE MCS7 4K TBD Maximum input level: 8% PER for 11b rates, 10% PER for 11g/n/ax rates

1 DSSS 0

dBmOFDM6, HT MCS0, HE MCS0 0 OFDM54, HT MCS7, HE MCS7 –9 Adjacent Channel Rejection 1Mbps DSSS 45 dB 11Mbps CCK 39 6Mbps OFDM 20 54Mbps OFDM 3 HT MCS0 20 HT MCS7 3 HE MCS0 16 HE MCS7 –1 RSSI Accuracy –90dBm to –30dBm –3 3 dB Max non destructive input power 5 dBm 6.6 WLAN Performance: 2.4GHz Transmitter Power PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Operational Frequency Range(1) 2412 2472 MHz Maximum output power at 3V3_IN > 3.0V(2) 1Mbps DSSS TBD dBm 6Mbps OFDM TBD 54Mbps OFDM TBD HT MCS0 MM TBD HT MCS7 MM TBD HE MCS0 TBD HE MCS7 TBD Transmit center frequency accuracy –25 25 ppm (1) • Channels 1 (2142MHz) through 11 (2462MHz) are supported for FCC.

Channels 1 (2142MHz) through 13 (2472MHz) are supported for Europe and Japan. Note that channel 14 is not supported for Japan. (2) • The 11g/n/ax low rates on edge channels (2412MHz and 2462MHz) have reduced TX power to meet FCC emission limits.
The power of 802.11b rates is reduced to meet ETSI requirements in Europe. CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

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6.7 WLAN Performance: 5GHz Receiver Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Operational Frequency Range 5180 5845 MHz Sensitivity: 10% PER for 11g/n/ax rates 6Mbps OFDM TBD dBm 54Mbps OFDM TBD HT MCS0 MM 4K TBD HT MCS7 MM 4K TBD HE MCS0 4K TBD HE MCS7 4K TBD Maximum input level: 10% PER for 11g/n/ax rates OFDM6, HT MCS0, HE MCS0 –23 OFDM54, HT MCS7, HE MCS7 –24 Adjacent Channel Rejection 6Mbps OFDM 20 dB 54Mbps OFDM 3 HT MCS0 18 HT MCS7 0 HE MCS0 16 HE MCS7 –1 RSSI Accuracy –90dBm to –30dBm –3 3 dB

6.8 WLAN Performance: 5GHz Transmitter Power

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Operational Frequency Range 5180 5845 MHz Maximum output power at 3V3_IN > 3.0V 6Mbps OFDM TBD dBm 54Mbps OFDM TBD HT MCS0 MM TBD HT MCS7 MM TBD HE MCS0 20MHz TBD HE MCS7 20MHz TBD Transmit center frequency accuracy –20 20 ppm

6.9 BLE Performance: Receiver Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT BLE 125Kbps (LE Coded) Receiver Characteristics Receiver sensitivity PER <30.2% –102.4 dBm Receiver saturation PER <30.2% 2 dBm Co-channel rejection(1) Wanted signal at –79dBm, modulated interferer in channel dB Selectivity, ±1MHz(1) Wanted signal at –79dBm, modulated interferer at ±1MHz. dB Selectivity, ±2MHz(1) Wanted signal at –79dBm, modulated interferer at ±2MHz. –37 / –30 dB Selectivity, ±3MHz(1) Wanted signal at –79dBm, modulated interferer at ±3MHz. –39 / –36 dB Selectivity, ±4MHz(1) Wanted signal at –79dBm, modulated interferer at ±4MHz. –45 / –41 dB www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

6.9 BLE Performance: Receiver Characteristics (continued)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RSSI Accuracy Dynamic range of –90 to –20dBm –4 4 dB BLE 500Kbps (LE Coded) Receiver Characteristics Receiver sensitivity PER <30.2% –99.6 dBm Receiver saturation PER <30.2% 2 dBm Co-channel rejection(1) Wanted signal at –72dBm, modulated interferer in channel. dB Selectivity, ±1MHz(1) Wanted signal at –72dBm, modulated interferer at ±1MHz. dB Selectivity, ±2MHz(1) Wanted signal at –72dBm, modulated interferer at ±2MHz. –35 / –25 dB Selectivity, ±3MHz(1) Wanted signal at –72dBm, modulated interferer at ±3MHz. –40 / –37 dB Selectivity, ±4MHz(1) Wanted signal at –72dBm, modulated interferer at ±4MHz. –45 / –40 dB RSSI Accuracy Dynamic range of –90 to –20dBm –4 4 dB BLE 1Mbps (LE 1M) Receiver Characteristics Receiver sensitivity(2) PER <30.2%, 37-byte packets –98.2 dBm Receiver sensitivity(2) PER <30.2%, 255 byte-packets –97 dBm Receiver saturation PER <30.2% 2 dBm Co-channel rejection(1) Wanted signal at -67dBm, modulated interferer in channel 10 dB Selectivity, ±1MHz(1) Wanted signal at -67dBm, modulated interferer at ±1MHz 0 / 0 dB Selectivity, ±2MHz(1) Wanted signal at -67dBm, modulated interferer at ±2MHz. –35 / –28 dB Selectivity, ±3MHz(1) Wanted signal at -67dBm, modulated interferer at ±3MHz –38 / –32 dB Selectivity, ±4MHz(1) Wanted signal at -67dBm, modulated interferer at ±4MHz –45 / –40 dB Out-of-band blocking 30MHz to 2000MHz, Wanted signal at -67dBm –23 dBm Out-of-band blocking 2003MHz to 2399 MHz, Wanted signal at -67dBm –30 dBm Out-of-band blocking 2484MHz to 2997 MHz, Wanted signal at -67dBm –30 dBm Out-of-band blocking 3000MHz to 6 GHz, Wanted signal at -67dBm –21 dBm Intermodulation Wanted signal at 2402MHz, -64dBm. Two interferers at 2405 and 2408MHz respectively, at the given power level –40 dBm RSSI accuracy Dynamic range of –90 to –20dBm –4 4 dB BLE 2Mbps (LE 2M) Receiver Characteristics Receiver sensitivity(3) PER <30.2% –94.1 dBm Receiver saturation PER <30.2% 2 dBm Co-channel rejection(1) Wanted signal at -67dBm, modulated interferer in channel 10 dB Selectivity, ±2MHz(1) Wanted signal at -67dBm, modulated interferer at ±2MHz. 0 / 0 dB Selectivity, ±4MHz(1) Wanted signal at -67dBm, modulated interferer at ±4MHz –35 / –28 dB Selectivity, ±6 MHz(1) Wanted signal at -67dBm, modulated interferer at ±6 MHz –35 / –28 dB CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

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PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Alternate channel rejection, ±8MHz(1) Wanted signal at -67dBm, modulated interferer at ±8MHz –37 / –32 dB Out-of-band blocking 30MHz to 2000MHz, Wanted signal at -67dBm –23 dBm Out-of-band blocking 2003MHz to 2399 MHz, Wanted signal at -67dBm –30 dBm Out-of-band blocking 2484MHz to 2997 MHz, Wanted signal at -67dBm –30 dBm Out-of-band blocking 3000MHz to 6 GHz, Wanted signal at -67dBm –21 dBm Intermodulation Wanted signal at 2402MHz, -64dBm. Two interferers at 2405 and 2408MHz respectively, at the given power level –44 dBm RSSI Accuracy Dynamic range of –90 to –20dBm –4 4 dB (1) Numbers given as C/I dB (2) BLE 1M PHY sensitivity on channels 17 and 39 may degrade by up to 2.5dB. (3) BLE 2M PHY sensitivity on channel 17 may degrade by up to 1.5dB.

6.10 BLE Performance: Transmitter Characteristics

The CC33X1 devices support BLE TX setting 0,5,10, or 20dBm PARAMETER DESCRIPTION MIN TYP MAX UNIT Output Power, highest setting(1) 7 dBm (1) Bluetooth low energy power is restricted to comply with the ETSI 10-dBm EIRP limit requirement. 6.11 Current Consumption: 2.4GHz WLAN Static Modes All results are based on measurements taken using the RadioTool evaluation application (typ values are taken with nominal devices at room temp). PARAMETER TEST CONDITIONS 1V8_IN 3V3_IN UNIT TYP MAX TYP MAX Continuous TX(1) 1 DSSS TX Power = 18.4dBm TBD TBD TBD mA

6 OFDM TX Power = 18dBm TBD TBD TBD TBD

54 OFDM TX Power = 15.5dBm TBD TBD HT MCS0 TX Power = 18dBm TBD TBD HT MCS7 TX Power = 15.5dBm TBD TBD HE MCS0 TX Power = 18dBm TBD TBD HE MCS7 TX Power = 15.5dBm TBD TBD Continuous RX 62 0 mA Continuous Listen (for Beacon) 55.5 0 mA (1) Peak current 3V3_IN can hit 450mA during device calibration. Peak current 1V8_IN of 300mA, including peripherals and internal CPU www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

6.12 Current Consumption: 5GHz WLAN Static Modes

All results are based on measurements taken using the RadioTool evaluation application (typ values are taken with nominal devices at room temperature). PARAMETER TEST CONDITIONS 1V8_IN 3V3_IN UNIT TYP MAX TYP MAX Continuous TX(1)

6 OFDM TX Power = TBD TBD TBD

54 OFDM TX Power = TBD TBD TBD

HT MCS0 TX Power = TBD TBD TBD HT MCS7 TX Power = TBD TBD TBD HE MCS0 TX Power = TBD TBD TBD HE MCS7 TX Power = TBD TBD TBD Continuous RX 110 0 mA Continuous Listen (For Beacon) 88 0 mA (1) Peak current 3V3_IN can hit 450mA during device calibration. Peak current 1V8_IN of 300mA including peripherals and internal CPU 6.13 Current Consumption: 2.4GHz WLAN Use Cases MODE DESCRIPTION TYP(1) UNIT System with 3.3V to Ext. DC/DC at 85% Efficiency DTIM = 1 WLAN beacon reception every DTIM=1 (~102ms) 588 µADTIM = 3 WLAN beacon reception every DTIM=3 (~306ms) 365 DTIM = 5 WLAN beacon reception every DTIM=5 (~510ms) 311 System with 1.8V DTIM = 1 WLAN beacon reception every DTIM=1 (~102ms) 904 µADTIM = 3 WLAN beacon reception every DTIM=3 (~306ms) 562 DTIM = 5 WLAN beacon reception every DTIM=5 (~510ms) 479 (1) Current measured on 1V8_IN supply

6.14 Current Consumption: 5GHz WLAN Use Cases

MODE DESCRIPTION TYP(1) UNIT System with 3.3V to Ext. DC/DC at 85% Efficiency DTIM = 1 WLAN beacon reception every DTIM=1 (~102ms) 720 µADTIM = 3 WLAN beacon reception every DTIM=3 (~306ms) 395 DTIM = 5 WLAN beacon reception every DTIM=5 (~510ms) 341 System with 1.8V DTIM = 1 WLAN beacon reception every DTIM=1 (~102ms) 1107 µADTIM = 3 WLAN beacon reception every DTIM=3 (~306ms) 607 DTIM = 5 WLAN beacon reception every DTIM=5 (~510ms) 525 (1) Current measured on 1V8_IN supply CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

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6.15 Current Consumption: BLE Static Modes

All results are based on measurements taken using the RadioTool evaluation application (typ values are taken with nominal devices at room temp). PARAMETER TEST CONDITIONS 1V8_IN 3V3_IN UNIT TYP MAX TYP MAX TX TX Power = 0dBm TBD TBD mATX Power = 10dBm TBD TBD TX Power = 17.8dBm TBD TBD RX 62 0 mA

6.16 Current Consumption: BLE Use Cases

over operating free-air temperature range (unless otherwise noted) MODE TYP(1) UNIT BLE Advertise 100ms 646 µA BLE Connection, 1s 3106 µA (1) Current measured on 1V8_IN supply

6.17 Current Consumption: Device Modes

Nominal device at room temperature MODE DESCRIPTION 1V8_IN 3V3_IN UNIT TYP MAX TYP MAX Shutdown External supplies are available, device held in reset (nReset is low) 10 2 µA Sleep Low power mode - RAM in retention 330 2

6.18 Timing and Switching Characteristics

6.18.1 Power Supply Sequencing

For proper operation of the CC335xMOD module, perform the recommended power-up sequencing as follows: 1. All supplies (1V8_IN, 3V3_IN, VPP) must be available before nReset is released. 2. For an external slow clock, confirm that the clock is stable before nReset is deasserted (high). 3. The nReset pin must be held low for at least 10μs after the stabilization of the external power supplies.

6.18.2 Clocking Specifications

The CC335x device uses two clocks for operation:

A fast clock running at 40MHz for WLAN/BLE functions
A slow clock running at 32.768kHz for low power modes The fast clock is integrated inside the CC335xMOD and does not need to be supplied externally. The slow clock can be generated internally from the CC335x device or can be supplied externally to the CC335xMOD.

6.18.2.1 Slow Clock Generated Internally

To minimize external components, the slow clock can be generated by an internal oscillator. However, this clock is less accurate and consumes more power than sourcing the slow clock externally. For this scenario the SLOW_CLK_IN pin must be left not connected. www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

6.18.2.2 Slow Clock Using an External Oscillator

For excellent power consumption, the slow clock can be generated externally by an oscillator or sourced from elsewhere in the system. The external source must meet the requirements shown below. This clock can be fed into the CC335xMOD pin SLOW_CLK_IN and must be stable before nReset is deasserted and the device is enabled. Table 6-1. External Slow Clock Requirements Parameter Description MIN TYP MAX Unit Input slow clock frequency Square wave 32768 Hz Frequency accuracy Inital + temperature + aging ±250 ppm Input Duty cycle 30% 50% 70% Tr/Tf Rise and fall time 10% to 90% (rise) and 90% to 10% (fall) of digital signal level 100 ns VIL Input low level 0 0.35 × VIO V VIH Input high level 0.65 × VIO 1.95 V Input impedence 1 MΩ Input capacitance 5 pF CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

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6.19 Interface Timing Characteristics

6.19.1 SDIO Timing Specifications

SDIO is the main host interface for WLAN, and it supports a maximum clock rate of 52MHz. The CC335x device also supports a shared SDIO interface for both BLE and WLAN.

6.19.1.1 SDIO Timing Diagram: Default Speed

Figure 6-1. SDIO Default Input Timing Figure 6-2. SDIO Default Output Timing www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

Table 6-2. SDIO Timing Parameters: Default Speed Parameter Description MIN MAX Unit fclock Clock frequency, CLK 26 MHz tHigh High Period 10 ns tLow Low Period 10 tTLH Rise time, CLK 10 tTHL Fall time, CLK 10 tISU Setup time, input valid before CLK ↑ 5 tIH Hold time, input valid after CLK ↑ 5 tODLY Delay time, CLK ↓ to output valid 2 14 CL Capacitive load on outputs 15 40 pF

6.19.1.2 SDIO Timing Diagram: High Speed

Figure 6-3. SDIO HS Input Timing Figure 6-4. SDIO HS Output Timing CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

18 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated

Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

Table 6-3. SDIO Timing Parameters: High Speed Parameter Description MIN MAX Unit fclock Clock frequency, CLK 52 MHz tHigh High Period 7 ns tLow Low Period 7 tTLH Rise time, CLK 3 tTHL Fall time, CLK 3 tISU Setup time, input valid before CLK ↑ 6 tIH Hold time, input valid after CLK ↑ 2 tODLY Delay time, CLK ↑ to output valid 2 14 CL Capacitive load on outputs 15 40 pF www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

6.19.2 SPI Timing Specifications

SPI is another host interface for WLAN. The CC335x device also supports shared SPI interface for both BLE and WLAN.

6.19.2.1 SPI Timing Diagram

(inverted) CS tCS_SU tISU tIH tDr SCLK (SPO = 0) PICO SCLK (SPO = 1) POCI 1 / fclock Peripheral Mode, SPH = 0 CS (inverted) CS tCS_SU tISU tIH tDr SCLK (SPO = 0) PICO SCLK (SPO = 1) POCI 1 / fclock tHigh/Low tHigh/Low Peripheral Mode, SPH = 1 tTHL/TLH tTHL/TLH Figure 6-5. SPI Timing

6.19.2.2 SPI Timing Parameters

PARAMETER DESCRIPTION MIN MAX UNIT fclock Clock frequency, CLK 26 MHz tHigh High Period 10 ns tLow Low Period 10 tTLH Rise time, CLK 3 tTHL Fall time, CLK 3 tCSsu CS Setup time, CS valid before CLK ↑ 3 tISU PICO, input valid before CLK ↑ 3 tIH PICO Hold time, input valid after CLK ↑ 3 tDr, tDf - Active Delay time, CLK ↑/↓ to output valid 2 10 tDr, tDf - Sleep Delay time, CLK ↑/↓ to output valid 12 CL Capacitive load on outputs 15 40 pF CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

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Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

6.19.3 UART 4-Wire Interface

UART is the main host interface for BLE, which supports the host controller interface (HCI) transport layer.

6.19.3.1 UART Timing Parameters

Figure 6-6. UART Timing Diagram PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNIT Baud rate 37.5 4364 Kbps Baud rate accuracy per byte Receive/Transmit –2.5 1.5 % Baud rate accuracy per bit Receive/Transmit –12.5 12.5 % CTS low to TX_DATA on t3 0 2 μs CTS high to TX_DATA off Hardware flow control t4 1 Byte CTS High Pulse Width t6 1 bit RTS low to RX_DATA on t1 0 2 μs RTS high to RX_DATA off Interrupt set to 1/4 FIFO t2 16 Bytes STR - Start bit D0..Dn - Data bits (LSB ﬁrst) PAR - Parity bit (if used) STP - Stop bit TX STR D0 D1 D2 Dn PAR STP tb www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

7 Device Certification

The CC3350MOD and CC3351MOD modules from TI are certified for FCC, IC, ETSI/CE, and Japan MIC. The module is also Wi-Fi CERTIFIED ™ with the ability to request a certificate transfer for Wi-Fi Alliance ® members. TI customers who build products based on the CC335xMOD device from TI can save on testing costs and time per product family.

7.1 FCC Certification and Statement

The CC335xMOD modules from TI are certified for the FCC as a single-modular transmitter. The modules are FCC-certified radio modules that carry a modular grant. Users are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void the authority of the user to operate the equipment. This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:

This device may not cause harmful interference.
This device must accept any interference received, including interference that may cause undesired operation of the device. CAUTION FCC RF Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions to satisfy RF exposure limits. This transmitter must not be colocated or operate with any other antenna or transmitter.

7.2 IC/ISED Certification and Statement

IC RF Radiation Exposure Statement: To comply with IC RF exposure requirements, this device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter. Pour se conformer aux exigences de conformité RF canadienne l'exposition, cet appareil et son antenne ne doivent pas étre co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur. The CC335xMOD modules from TI are certified for IC as a single-modular transmitter. The CC335xMOD modules from TI meet IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC regarding certified modules in authorized equipment. This device complies with Industry Canada license-exempt RSS standards. Operation is subject to the following two conditions:

This device may not cause interference.
This device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
L'appareil ne doit pas produire de brouillage
L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

7.3 ETSI/CE

The CC335xMOD modules conform to the EU Radio Equipment Directive. For further details, see the full text of the EU Declaration of Conformity for the CC3351MOD devices.

7.4 MIC Certification

The CC335xMOD modules from TI are MIC-certified against articles 49–20 and the relevant articles of the Ordinance Regulating Radio Equipment. Operation is subject to the following condition:

The host system does not contain a wireless wide area network (WWAN) device.

7.5 Manual Information to the End User

The OEM integrator must be aware of not providing information to the end user regarding how to install or remove this RF module in the user’s manual of the end product that integrates this module. The end user's manual must include all required regulatory information and warnings as shown in this manual. www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

7.6 Module Markings

The figure below shows the markings for the CC335xMOD module. CC33MOD Test Grade: 5& T99H627.0X MXX SN: TIYYYYWWXXXXX TI.com/product/CC335&MOD Figure 7-1. CC335xMOD Module Markings The table below describes the CC335xMOD markings. Table 7-1. Description of CC335xMOD Markings MARKING DESCRIPTION CC33MOD TI Model P/N 5& Test grade (For more information see the Test Grades section) T99H627.0X Internal Part Identifier MXX Internal Part Identifier SN(Serial Number): TIYYYYWWXXXXX SN: Reserved for TI Use TI.com/product/CC335&MOD Link to module product page CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

Table 7-1. Description of CC335xMOD Markings (continued) MARKING DESCRIPTION ◯ Pin 1 Indicator CE logo CE Compliance Mark QR Code Internal Use

7.6.1 Test Grades

See the table below for more information about test grades for CC335xMOD. Table 7-2. Test Grade Markings for CC335xMOD TEST GRADE PART NUMBER WLAN 2.4/5GHz BLUETOOTH LOW ENERGY

50 CC3350MODENIAMOZR Tested —

51 CC3351MODENIAMOZR Tested Tested

8 Application Information

8.1 Typical Application—CC335xMOD Reference Design

+Vs4 Output 3 GND 2 LFSPXO073707REEL SLOW_CLK_IN_1V8 GND i 50Ohm GNDGND L1 L2 M830520 GND GND RF_OUT VCC_BRD_1V8 C0G/NP0 0201 10pF C18 EXTERNAL SLOW CLOCK (op onal) CC33X1MOD TARGET 3V3_IN37 3V3_IN38 SDIO_CLK3 SDIO_CMD4 SDIO_D08 SDIO_D17 SDIO_D26 SDIO_D35 Host_IRQ_BLE11 Host_IRQ_WL10 COEX_GRANT47 COEX_PRIORITY45 COEX_REQ46 UART_CTS49 UART_RTS48 UART_RX50 UART_TX51 1V8_IN53 1V8_IN54 Reset17 ANT_SEL52 Logger9 RF_OUT 23 SLOW_CLK_IN18 SWCLK13 SWDIO12 VPP_IN19 GND 1 GND 2 GND 14 GND 15 GND 16 GND 20 GND 21 GND 22 GND 24 GND 25 GND 26 GND 27 GND 28 GND 29 GND 30 GND 31 GND 32 GND 33 GND 34 GND 35 GND 36 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 GND 61 GND 62 GND 63 GND 64 GND 65 CC33x1MODENIAMOZR GND SDIO_CLK_1V8 SDIO_CMD_1V8 SDIO_D0_1V8 SDIO_D1_1V8 SDIO_D2_1V8 SDIO_D3_1V8 LOGGER_1V8 IRQ_WL_1V8 IRQ_BLE_1V8 SWDIO SWCLK RESET_1V8 SLOW_CLK_IN_1V8 ANT_SEL_1V8 UART_TX_1V8 UART_RX_1V8 UART_CTS_1V8 UART_RTS_1V8 COEX_GRANT_1V8 COEX_REQ_1V8 COEX_PRIORITY_1V8 i 50Ohm RF_OUT VBAT_CC_1V8 VBAT_CC_3V3 VBAT_CC_1V8 Figure 8-1. CC335xMOD Reference Schematics

8.2 Design Recommendations

This section describes the layout recommendations for the CC335xMOD module, RF trace, and antenna. Table 8-1 summarizes the layout recommendations. Table 8-1. Layout Recommendations Summary ITEM DESCRIPTION Thermal 1 The proximity of ground vias must be close to the pad. 2 Signal traces must not be run underneath the module on the layer where the module is mounted. 3 Have a complete ground pour in layer 2 for thermal dissipation. 4 Have a solid ground plane and ground vias under the module for a stable system and thermal dissipation. 5 Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if possible. 6 Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting layer. RF Trace and Antenna Routing 7 The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate. 8 The RF trace bends must be gradual, with an approximate maximum bend of 45° with trace mitered. RF traces must not have sharp corners. 9 RF traces must have via stitching on the ground plane beside the RF trace on both sides. 10 RF traces must have constant impedance (microstrip transmission line). CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

Table 8-1. Layout Recommendations Summary (continued) ITEM DESCRIPTION 11 For best results, the RF trace ground layer should be the ground layer immediately below the RF trace. The ground layer should be solid. 12 There must be no traces or ground under the antenna section. 13 RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered.

8.2.1 General Layout Recommendations

Ensure that the following general layout recommendations are followed:

Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.
Do not place signal traces underneath the module on a layer where the module is mounted.

8.2.2 CC335xMOD RF Layout Recommendations

The RF section of this wireless module gets top priority in terms of layout. It is very important for the RF section to be laid out correctly to ensure optimum performance from the module. A poor layout can cause low-output power, EVM degradation, sensitivity degradation, and mask violations. The image below shows the RF placement and routing of the CC3351MOD module with an external antenna. SMA/U.FL (Op onal) RF Trace SMA/U.FL (Op onal) Antenna Matching CC33x1MOD Chip Antenna Figure 8-2. RF Section Layout Follow these RF layout recommendations for the CC335xMOD device:

RF traces must have 50Ω impedance and should be no shorter than 9.24mm.
RF trace bends must be made with gradual curves, and 90° bends must be avoided.
RF traces must not have sharp corners.
There must be no traces or ground under the antenna section.
RF traces must have via stitching on the ground plane beside the RF trace on both sides.
RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the PCB product in consideration of the product enclosure material and proximity. www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 27 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

8.2.3 Thermal Board Recommendations

The TI module uses µvias for layers 1 through 4 with full copper filling, providing heat flow all the way to the module ground pads. TI recommends using one big ground pad under the module with vias all the way to connect the pad to all ground layers (see Block of Ground Pads on the Bottom Side of Package). Figure 8-3. Block of Ground Pads on the Bottom Side of Package For more general layout recommendations, refer to the CC33xx Hardware Integration document. This document describes how to integrate the CC335xMOD into any system, and the hardware requirements for this device. Layout and schematic considerations are listed here as well, which TI highly recommends following to achieve the device performance listed in this data sheet. CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

9 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop systems are listed below.

9.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

9.2 Device Nomenclature Boilerplate

Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null Production version of the silicon die that is fully qualified. Support tool development evolutionary flow: TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing. TMDS Fully-qualified development-support product. X and P devices and TMDX development-support tools are shipped against the following disclaimer: Device development evolutionary flow: TMX Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. TMP Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. TMS Production version of the silicon die that is fully qualified. Support tool development evolutionary flow: TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing. TMDS Fully-qualified development-support product. TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer: "Developmental product is intended for internal evaluation purposes." Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

9.3 Tools and Software

Design Kits and Evaluation Modules CC3351MOD BoosterPack plug-in module The CC3351MOD BoosterPack™ plug-in module (BP-CC3351MOD) is a test and development board that can be easily connected to TI LaunchPad™ development kits or processor boards; thus enabling rapid software development. www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 29 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

Toolbox SimpleLink Wi-Fi Toolbox is a collection of tools to help development and testing of the CC33xx. The Wi-Fi toolbox package provides all the capabilities required to debug and monitor WLAN/Bluetooth ® Low Energy firmware with a host, perform RF validation tests, run pretest for regulatory certification testing, and debug hardware and software platform integration issues. CC33xx device drivers The CC33XX are single-chip Wi-Fi 6 and Bluetooth Low Energy 5.4 companion devices for both Linux- and RTOS-based systems. CC33XX-SOFTWARE is a collection of software development sources aimed to facilitate quick setup, out-of-box experience, and accelerate development in Linux or RTOS environments.

9.4 Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. Application Reports CC33xx Production Line Guide Texas Instruments™ provides many resources to assist users in quickly examining the functionality and performance of the TI devices. This document provides the necessary information to guide the user in production line testing for CC33xx. The devices' functions can be checked using tools and software provided by Texas Instruments. Performance testing is more involved as external equipment is required for a thorough examination. SimpleLink CC33xx Security Features This document describes the CC33xx security-related features, which are made available to vendors through an ecosystem that incorporates simple and concise APIs, tools, and documentation SimpleLink CC33xx Host Interfaces This document describes the host interface between the host processor and CC33xx companion IC and provides the system designer with all the required technical information for easy integration User's Guides CC33xx WLAN Features User's Guide This document provides information about CC335xMOD family of devices and Wi-Fi® features, as well as TI proprietary enhancements. The document does not provide the complete application programming interface (API) set, but a high-level overview of the features. CC33xx Hardware Integration This document describes how to integrate the CC335xMOD into any system, and the hardware requirements for this device. Layout and schematic considerations are listed here as well, which TI highly recommends following to achieve the device performance listed in this data sheet. WFA QuickTrack Control Application with CC33xx User's Guide This document provides information about using the QuickTrack Control App to certify CC33xx devices according to Wi-Fi® standards. The document provides a high-level overview of the certification process.

9.5 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

9.6 Trademarks

SimpleLink™ is a trademark of Ti. TI E2E™ is a trademark of Texas Instruments. Bluetooth® is a registered trademark of Bluetooth SIG, Inc. All trademarks are the property of their respective owners.

9.7 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

9.8 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES April 2025 * Initial Release www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 31 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

P R E V I E W w w w . ti.c o m PA C K A G E O U T L IN E C (0 .2 3 ) T Y P 2 .1 1 .9 0 .8 8 0 .7 2 2 X 7 .8 2 X 7 .8 2 4 X 0 .6 5 5 2 X 0 .3 5 0 .2 5 9 X 1 0 .0 5 0 .7 0 .3 1 .4 5 T Y P 1 .4 5 T Y P 2 4 X 0 .6 5 4 X 0 .5 5 0 .4 5 4 X 1 .1 4 X 1 .1 5 2 X 0 .5 5 0 .4 5 A 1 1 .1 1 0 .9 B 1 1 .1 1 0 .9 (0 .2 5 ) T Y P Q F M - 2 .1 m m m a x h e ig h tM O Z 0 0 6 5 A Q U A D F L AT M O D U L E 4 2 2 9 8 5 1 /A 0 7 /2 0 2 3 N O T E S : 1 . A ll lin e a r d im e n s io n s a re in m illim e te rs . A n y d im e n s io n s in p a re n th e s is a re fo r re fe re n c e o n ly. D im e n s io n in g a n d to le ra n c in g p e r A S M E Y 1 4 .5 M . 2 . T h is d ra w in g is s u b je c t to c h a n g e w ith o u t n o tic e . A R E A P IN 1 IN D E X 0 .1 S E AT IN G P L A N E X 0 .5 )(4 5 P IN 1 ID 1 5 2 9 4 3 5 6 5 7 5 9 6 0 6 2 6 5 6 3 0 .1 5 C A B 0 .0 5 C 5 8 6 1 6 4 0 .1 5 C A B 0 .0 5 C 1 4 1 6 2 8 3 0 4 2 4 4 S O L D E R M A S K T Y P S C A L E 1 .5 0 0 www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 33 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

P R E V I E W w w w . ti.c o m E X A M P L E B O A R D L AY O U T 5 2 X (0 .5 ) 4 8 X (0 .6 5 )

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0 .0 5 M IN T Y P 0 .0 5 M A X A L L A R O U N D 0 .0 5 M IN A L L A R O U N D (R 0 .0 5 ) T Y P (0 .3 ) (1 .4 5 ) T Y P (0 .7 ) (1 .4 5 ) T Y P 8 X (1 .1 ) 5 2 X (0 .3 ) 4 X ( 0 .5 ) Q F M - 2 .1 m m m a x h e ig h tM O Z 0 0 6 5 A Q U A D F L AT M O D U L E 4 2 2 9 8 5 1 /A 0 7 /2 0 2 3 N O T E S : (c o n tin u e d ) 3 . T h is p a c k a g e is d e s ig n e d to b e s o ld e re d to a th e rm a l p a d o n th e b o a rd . F o r m o re in fo rm a tio n , s e e Te x a s In s tru m e n ts lite ra tu re n u m b e r S L U A 2 7 1 (w w w . ti.c o m /lit/s lu a 2 7 1 ). L A N D PA T T E R N E X A M P L E S C A L E :1 0 X P K G P K G S E E S O L D E R M A S K D E TA IL S 1 4 1 5 1 6 2 8 2 9 3 0 4 2 4 3 4 45 6 5 7 5 9 6 0 6 2 6 5 6 3 M E TA L U N D E R S O L D E R M A S K S O L D E R M A S K O P E N IN G 9 X (4 5 X 0 .5 ) 5 8 6 1 6 4 M E TA L E D G E S O L D E R M A S K O P E N IN G E X P O S E D M E TA L N O N S O L D E R M A S K D E F IN E D S O L D E R M A S K D E TA IL S M E TA L U N D E R S O L D E R M A S K S O L D E R M A S K O P E N IN G E X P O S E D M E TA L S O L D E R M A S K D E F IN E D CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 www.ti.com

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P R E V I E W w w w . ti.c o m E X A M P L E S T E N C IL D E S IG N 5 2 X (0 .5 ) 4 8 X (0 .6 5 ) (R 0 .0 5 ) T Y P 5 2 X (0 .3 ) 8 X (1 .1 ) (1 .4 5 ) T Y P (0 .7 ) (1 .4 5 ) T Y P (0 .3 ) 4 X ( 0 .5 ) Q F M - 2 .1 m m m a x h e ig h tM O Z 0 0 6 5 A Q U A D F L AT M O D U L E 4 2 2 9 8 5 1 /A 0 7 /2 0 2 3 N O T E S : (c o n tin u e d ) 4 . L a s e r c u ttin g a p e rtu re s w ith tra p e z o id a l w a lls a n d ro u n d e d c o rn e rs m a y o ffe r b e tte r p a s te re le a s e . IP C -7 5 2 5 m a y h a v e a lte rn a te d e s ig n re c o m m e n d a tio n s . P K G P K G S O L D E R PA S T E E X A M P L E B A S E D O N 0 .1 2 5 m m T H IC K S T E N C IL S C A L E :1 0 X 1 4 1 5 1 6 2 8 2 9 3 0 4 2 4 3 4 45 6 5 7 5 9 6 0 6 2 6 5 6 3 5 8 6 1 6 4 (4 5 X 0 .5 ) M E TA L U N D E R S O L D E R M A S K www.ti.com CC3350MOD, CC3351MOD SWRS353 – APRIL 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 35 Product Folder Links: CC3350MOD CC3351MOD ADVANCE INFORMATION

www.ti.com 17-April-2025 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples XCC3351MODENIAMOZR ACTIVE QFM MOZ 65 1500 TBD Call TI Call TI -40 to 85 Samples (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3)MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4)There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6)Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

www.ti.com 2-Aug-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) XCC3350MODENIAMOZR Active Preproduction QFM (MOZ) | 65 1500 | LARGE T&R - Call TI Call TI -40 to 85 XCC3351MODENIAMOZR Active Preproduction QFM (MOZ) | 65 1500 | LARGE T&R - Call TI Call TI -40 to 85 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2025, Texas Instruments Incorporated

Product Information

XCC3351MODENIAMOZR specifications and overview.

Summary

CC335xMOD SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion Module APRIL 2025

Description

CC335xMOD SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion Module APRIL 2025

Source title XCC3351MODENIAMOZR Datasheet(PDF) - Texas Instruments

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