XC7SH125 PHILIPS | Alldatasheet
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Technical content
driver with 3-state output. The 3-state output is controlled by the output enable input (OE). A HIGH atOE causes the output to assume a high-impedance OFF-state. Table 1. Ordering information
XC7SH125_1 © NXP B.V. 2009. All rights reserved. [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
6.1 Pinning
Table 2. Marking codes
6 XC7SH125
XC7SH125_1 © NXP B.V. 2009. All rights reserved.
6.2 Pin description
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For TSSOP5 and SC-74A packages: above 87.5°C the value of Ptotderates linearly with 4.0 mW/K. For XSON6 packages: above 118°C the value of Ptotderates linearly with 7.8 mW/K. Table 3. Pin description Table 4. Function table Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
XC7SH125_1 © NXP B.V. 2009. All rights reserved.
- Recommended operating conditions
Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V).
XC7SH125_1 © NXP B.V. 2009. All rights reserved. [1] tpd is the same as tPLH and tPHL . ten is the same as tPZL and tPZH . tdis is the same as tPLZ and tPHZ . [2] Typical values are measured at VCC = 3.3 V. [3] Typical values are measured at VCC = 5.0 V. [4] C PD is used to determine the dynamic power dissipation PD (µW). VCC = supply voltage in Volts. Table 8. Dynamic characteristics GND = 0 V; For test circuit seeFigure9.
XC7SH125_1 © NXP B.V. 2009. All rights reserved. Measurement points are given inTable9. VOL and VOH are typical output voltage levels that occur with the output load. Measurement points are given inTable9. VOL and VOH are typical output voltage levels that occur with the output load. Table 9. Measurement points
XC7SH125_1 © NXP B.V. 2009. All rights reserved. Test data is given inTable10. T = Termination resistance should be equal to output impedance Zo of the pulse generator. C L = Load capacitance including jig and probe capacitance. Table 10. Test data
XC7SH125_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 4 September 2009 8 of 14 NXP Semiconductors XC7SH125 Bus buffer/line driver; 3-state 13. Package outline Fig 10. Package outline SOT353-1 (TSSOP5) UNIT A 1 A max. A 2 A 3 bp LH E Lp wyvce D (1) E(1) Z(1) q REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.1 1.0 0.8 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.60 0.15 0°0.1 0.10.30.425 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 0.46 0.21 SOT353-1 MO-203 SC-88A 00-09-01 03-02-19 w Mbp D Z e 0.15 5 4 q AA2 Lp (A3) detail X L H E E c v M A X A y 1.5 3 mm0 scale TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 1.1
XC7SH125_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 4 September 2009 9 of 14 NXP Semiconductors XC7SH125 Bus buffer/line driver; 3-state Fig 11. Package outline SOT753 (SC-74A) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT753 SC-74A wB Mbp D e A Lp Q detail X H E E v M A AB y 0 1 2 mm scale c X 13 2 Plastic surface-mounted package; 5 leads SOT753 UNIT A 1 bp cD E H E Lp Qy wv mm 0.100 0.013 0.40 0.25 3.1 2.7 0.26 0.10 1.7 1.3 e 0.95 3.0 2.5 0.2 0.10.2 DIMENSIONS (mm are the original dimensions) 0.6 0.2 0.33 0.23 A 1.1 0.9 02-04-16 06-03-16
XC7SH125_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 4 September 2009 10 of 14 NXP Semiconductors XC7SH125 Bus buffer/line driver; 3-state Fig 12. Package outline SOT886 (XSON6) terminal 1 index area REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT886 MO-252 SOT886 04-07-15 04-07-22 DIMENSIONS (mm are the original dimensions) XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm D E e A 1 b LL1 0 1 2 mm scale Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. UNIT mm 0.25 0.17 1.5 1.4 0.35 0.27 A max b E 1.05 0.95 D ee 1 L 0.40 0.32 0.50.6 A (1) max 0.5 0.04 (2) (2) A
XC7SH125_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 4 September 2009 11 of 14 NXP Semiconductors XC7SH125 Bus buffer/line driver; 3-state Fig 13. Package outline SOT891 (XSON6) terminal 1 index area REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT891 SOT891 05-04-06 07-05-15 XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm D E e A 1 b LL1 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm 0.20 0.12 1.05 0.95 0.35 0.27 A 1 max b E 1.05 0.95 D ee 1 L 0.40 0.32 0.350.55 A max 0.5 0.04 A6× (1) (1) Note 1. Can be visible in some manufacturing processes.
XC7SH125_1 © NXP B.V. 2009. All rights reserved. Table 11. Abbreviations Table 12. Revision history
XC7SH125_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 4 September 2009 13 of 14 NXP Semiconductors XC7SH125 Bus buffer/line driver; 3-state 16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control —This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors XC7SH125 Bus buffer/line driver; 3-state © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 4 September 2009 Document identifier: XC7SH125_1 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents