BCR VISHAY | Alldatasheet

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Technical content

www.vishay.com For technical que stions, contact: efi@vishay.com Document Number: 61023 BCR Vishay Electro-Films Thin Film, Back-Contact Resistor The Back Contact Resistor (BCR) series single-value back-contact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space. The BCRs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The BCRs are 100 % electrically tested and visually inspected to MIL-STD-883.

FEATURES

  • Wire bondable
  • Only one wire bond required
  • Small size: 0.020 inches square.
  • Resistance range: 10 Ω to 1 MΩ
  • Oxidized silicon substrate for good power dissipation
  • Resistor material: Tantalum nitride, self-passivating
  • Moisture resistant

APPLICATIONS

Vishay EFI BCR resistor chips are widely used in hybrid pa ckages where space is limited. The bottom connection is made by attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting the resistor to the bottom of the chip.) Product may not be to scale TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES PROCESS CODE CLASS H* CLASS K* 010 056 002 061 027 059 008 052 *MIL-PRF-38534 inspection criteria 0.1 % Tightest Standard Tolerance Available ± 250 ppm/°C ± 50 ppm/°C ± 100 ppm/°C 0.2 % 1 MΩ 100 Ω10 Ω 200 kΩ ± 25 ppm/°C 20 Ω 50 Ω 200 Ω 1 kΩ 360 kΩ 620 kΩ 0.5 %1 %2 %5 % STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Noise, MIL-STD-202, Method 308 100 Ω - 250 kΩ < 100 Ω or > 251 kΩ - 35 dB typ. - 20 dB typ. Moisture resistance, MIL-STD-202 Method 106 ± 0.5 % max. ΔR/R Stability, 1000 h, + 125 °C, 125 mW ± 1.0 % max. ΔR/R Operating Temperature Range - 55 °C to + 125 °C Thermal Shock, MIL-STD-202, Method 107, Test Condition F ± 0.25 % max. ΔR/R High Temperature Exposure, + 150 °C, 100 h ± 0.5 % max. ΔR/R Dielectric Voltage Breakdown 200 V Insulation Resistance 1012 min. Operating Voltage 75 V max. DC Power Rating at + 70 °C (Derated to Zero at + 175 °C) 250 mW 5 x Rated Power Short-Time Overload, + 25 °C, 5 s ± 0.25 % max. ΔR/R

Document Number: 61023 For technica l questions, contact: efi@vishay.com www.vishay.com Revision: 12-Mar-08 55 BCR Thin Film, Back-Contact Resistor Vishay Electro-Films DIMENSIONS in inches Note:  Notched shaded area represents top bonding pad. The backside of the chip constitutes the second resistor connection. SCHEMATIC Options: Gold bonding pads, 15 kÅ minimum thickness Consult Applications Engineer TYPICAL RANGE 1.6 kΩ - 1 MΩ 0.0160.020 0.020 TYPICAL RANGE 180 Ω - 2.2 kΩ TYPICAL RANGE 24 Ω - 220 Ω 0.004 TYPICAL RANGE 10 Ω - 23 Ω Bond Pad Back of Chip MECHANICAL SPECIFICATIONS in inches PARAMETER Chip Thickness 0.010 ± 0.003 (0.253 ± 0.05 mm) Chip Substrate Material Oxidized silicon, 10 kÅ minimum SiO Resistor Material Tantalum nitride, self-passivating Bonding Pad Size 0.004 x 0.004 (0.100 x 0.100 mm) Number of Pads 1 Pad Material 10 kÅ minimum aluminum Backing 3 kÅ minimum gold Recommended Attachment Method Eutectic or conductive epoxy

ORDERING INFORMATION

Example: 100 % visual, 16 kΩ, ± 1 %, ± 250 ppm/°C TCR, aluminum pads, class H visual inspection W INSPECTION/ PACKAGING W = 100 % visually inspected parts in matrix tray per MIL-STD-883 X = Sample, visually inspected parts loaded in matrix trays (4 % AQL) BCR PRODUCT FAMILY 008 PROCESS CODE See Process Code table 1600 RESISTANCE VALUE Use first 4 digits significant digits of the resistance MULTIPLIER CODE B = 0.01 A = 0.1 0 = 1 1 = 10 2 = 100 3 = 1000 F TOLERANCE CODE B = 0.1 % C = 0.2 % D = 0.5 % F = 1.0 % G = 2.0 % H = 2.5 % J = 5.0 % K = 10 %

Document Number: 91000 www.vishay.com Revision: 18-Jul-08 1 Disclaimer Legal Disclaimer Notice Vishay All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all li ability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permit ted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purcha se, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medi cal, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.