X8G

X8G YAGEO | Alldatasheet

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Product Specification – May 01, 2022 V.2 DATA SHEET SURFACE MOUNT MULTILAYER CERAMIC CAPACITORS Automotive grade High Temperature Application X8G / X8R

16 V TO 100 V

RoHS compliant & Halogen Free

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification ORDERING INFORMATION - GLOBAL PART NUMBER All part numbers are identified by the series, size, tolerance, TC material, packing style, voltage, process code, termination and capacitance value. GLOBAL PART NUMBER AC XXXX X X XXX X B X XXX (1) SIZE – INCH BASED (METRIC) 0603 (1608) 0805 (2012) (2) TOLERANCE X8G X8R J = ± 5% K = ± 10% G = ± 2% M = ± 20% F = ± 1% J = ± 5% (3) PACKING STYLE (SEE TABLE 6) R = Paper/PE taping reel; Reel 7 inch K = Blister taping reel; Reel 7 inch P = Paper/PE taping reel; Reel 13 inch F = Blister taping reel; Reel 13 inch (4) TC MATERIAL X8G : 0± 30 ppm/°C X8R : ± 15% (5) RATED VOLTAGE 7 = 16 V 8 = 25 V 9 = 50 V 0 = 100 V (6) PROCESS N = Class I MLCC (X8G) B = Class II MLCC (X8R) (7) CAPACITANCE VALUE 2 significant digits+number of zeros The 3rd digit signifies the multiplying factor, and letter R is decimal point Example: 121 = 12 x 101 = 120 pF SCOPE This specification describes Automotive grade X8G / X8R series chip capacitors with lead - free terminations and used for automotive equipment s.

APPLICATIONS

All general-purpose applications under normal operation and usage conditions for automotive equipment’s .

FEATURES

 AEC-Q200 qualified  Operating temperature range: -55 to 150 °C  MSL class: MSL 1  Soldering is compliant with J-STD-020D  RoHS compliant  High component and equipmen t reliability  The capacitors are 100% performed by automatic optical inspection prior to taping.

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification CONSTRUCTION The capacitor consists of a rectangular block of ceramic dielectric in which a number of interleaved metal electrodes are contained. This structure gives rise to a high capacitance per unit volume. The inner electrodes are connected to the two end terminat ions and finally covered with a layer of plated tin ( Matte Sn). The terminations are lead - free. A cross section of the structure is shown in Fig.1. MLB457 terminations electrodes ceramic material Fig. 1 Surface mounted multilayer ceramic capacitor construction TYPE L1 (mm) W (mm) T (MM) L2 / L3 (mm) L4 (mm) min. max. min. 0805 Table 1 For outlines see fig. 2 DIMENSION MBB211 T L2 L3 W OOUUTTLLIINNEESS For dimension see Table 1 Fig. 2 Surface mounted multilayer ceramic capacitor dimension

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification CAPACITANCE RANGE & THICKNESS FOR X8G CAP. 0603 0805

25 V 50 V 50 V 100 V

680 pF 0.8± 0.1 0.8± 0.1 NOTE 1. Values in shaded cells indicate thickness class in mm 2. Capacitance value of non E-12 series is on request Table 2-1 Size from 0603 to 0805 CAPACITANCE RANGE & THICKNESS FOR X8R CAP. 0805

16 V 25 V 50 V

1. Values in shaded cells indicate thickness class in mm 2. Capacitance value of non E-6 series is on request Table 2-2 Size 0805

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification

ELECTRICAL CHARACTERISTICS

XX88GG // XX88RR DDIIEELLEECCTTRRIICC CCAAPPAACCIITTOORRSS;; NNII//SSIINN TTEERRMMIINNAATTIIOONNSS Unless otherwise specified, all test and measurements shall be made under standard atmospheric conditions for testing as given in 5.3 of IEC 60068 -1: - Temperature: 15 °C to 35 °C - Relative humidity: 25% to 75% - Air pressure: 86 kPa to 106 kPa Before the measurements are made, the capacitor shall be stored at the measuring temperature for a time sufficient to allow the entire capacitor to reach this temperature. The period as prescrib ed for recovery at the end of a test is normally sufficient for this purpose. DESCRIPTION VALUE Capacitance range 680pF to 100 nF Dissipation factor (D.F.) X8G C < 30 pF ≤ 1 / ( 400 + 20C ) C ≥ 30 pF ≤ 0.1 % X8R 0805 16V 22 nF to 100 nF ≤ 2.5% 25V 22 nF to 100 nF ≤ 2.5% 50V 22 nF to 100 nF ≤ 2.5% Insulation resistance after 1 minute at Ur (DC) I.R. ≥ 10 GΩ or I.R. × C ≥ 500 seconds whichever is less Maximum capacitance change as a function of temperature (temperature characteristic/coefficient): X8G ± 30 ppm/°C X8R ± 15% Operating temperature range: X8G / X8R –55 °C to +150 °C Table 3

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification SOLDERING CONDITIONS The lead free MLCCs are able to stand the reflow soldering conditions as below:  Temperature: above 220 °C  Endurance: 95 to 120 seconds  Cycles: 3 times The test of “soldering heat resistance" is carried out in accordance with the schedule of "MIL-STD-202G-method 210F", "The robust construction of chip capacitors allows them to be completely immersed in a solder bath of 260 °C for 10 seconds". Therefore, it is possible to mount MLCCs on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Capacitors are tested for solderability at 245 °C during 2 seconds. The test condition for no leaching is 260°C for 30 seconds. TEST TEST METHOD PROCEDURE REQUIREMENTS Mounting IEC 60384-

4.3 The capacitors may be mounted on printed-circuit boards or

4.5.1 X8G:

At 20 °C, 24 hours after annealing f = 1 MHz for C ≤ 1nF, measuring at voltage 1 Vrms at 20 °C f = 1 KHz for C > 1nF, measuring at voltage 1 Vrms at 20 °C X8R At 20 °C, 24 hours after annealing f = 1 KHz, measuring at voltage 1 Vrms at 20 °C Within specified tolerance Dissipation Factor (D.F.) IEC 60384-

4.5.2 X8G:

At 20 °C, 24 hours after annealing f = 1 MHz for C ≤ 1nF, measuring at voltage 1 Vrms at 20 °C f = 1 KHz for C > 1nF, measuring at voltage 1 Vrms at 20 °C X8R: At 20 °C, 24 hours after annealing f = 1 KHz, measuring at voltage 1 Vrms at 20 °C In accordance with specification on Table 3 Insulation Resistance IEC 60384-

4.5.3 At Ur (DC) for 1 minute In accordance with

0402 0603 0805 1206 ≥ 1210 Reflow ≥ 0.1 µF ≥ 1.0 µF ≥ 2.2 µF ≥ 4.7 µF Reflow only Reflow/Wave < 0.1 µF < 1.0 µF < 2.2 µF < 4.7 µF --- TESTS AND REQUIREMENTS Table 5 Test procedures and requirements

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification TEST TEST METHOD PROCEDURE REQUIREMENTS High Temperature Exposure AEC-Q200 3 Unpowered ; 1000hours @ T=150°C Measurement at 24± 2 hours after test conclusion. No visual damage ∆C/C： X8G: within ± 0.5% or 0.5 pF whichever is greater X8R: ± 10% D.F.: within initial specified value I.R.: within initial specified value Temperature Cycling AEC-Q200 4 Preconditioning; 150 +0/–10 °C for 1 hour, then keep for 24 ± 1 hours at room temperature 1000 cycles with following detail: 30 minutes at lower category temperature 30 minutes at upper category temperature Recovery time 24 ± 2 hours No visual damage ∆C/C X8G: Within ± 1% or 0.5pF, whichever is greater. X8R: ± 10% D.F. meet initial specified value I.R. meet initial specified value Destructive Physical Analysis AEC-Q200 5 Only applies to SMD ceramics. Electrical test not required. Moisture Resistance AEC-Q200 6 T=24 hrs/per cycle; 10 continuous cycles unpowered. Measurement at 24 ± 2 hours after test condition. No visual damage ∆C/C X8G: Within ± 3% or 3 pF, whichever is greater X8R: ± 15% D.F. Within initial specified value I.R. X8G: ≥ 10,000 MΩ X8R: Meet initial specified value Fig. 3 Moisture resistant

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification TEST TEST METHOD PROCEDURE REQUIREMENTS Biased Humidity AEC-Q200 7 1. Preconditioning, class 2 only: 150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour at room temp 2. Initial measure: Parameter: I.R. Measuring voltage: 1.5V ± 0.1 VDC Note: Series with 100 KΩ 3. Test condition: 85 °C, 85% R.H. connected with 100 KΩ resistor, applied 1.5V/Ur for 1,000 hours. 4. Recovery: X8G: 6 to 24 hours X8R: 24 ± 2 hours 5. Final measure: I.R. No visual damage after recovery X8R The insulation resistance shall be greater than 10% of initial spec. Operational Life AEC-Q200 8 1. Preconditioning, X8R only: 150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour at room temp 2. Initial measure: Spec: refer to initial spec C, D, I.R. 3. Endurance test: Temperature: X8R: 150 °C Specified stress voltage applied for 1,000 hours: Applied 2.0 x Ur for ≤ 100V series Applied 1.5 x Ur for 200V, 250V series 4. Recovery time: 24 ± 2 hours 5. Final measure: C, D, I.R. Note: If the capacitance value is less than the minimum value permitted, then after the other measurements have been made the capacitor shall be preconditioned according to “IEC 60384 4.1” and then the requirement shall be met. No visual damage ∆C/C X8G: Within ± 2% or 1 pF, whichever is greater X8R: ± 15% D.F. X8G: ≤ 0.2% X8R: within initial specified value I.R. X8G: ≥ 4,000 MΩ or I.R. x Cr ≥ 40Ω.F whichever is less X8R: ≥ 1,000 MΩ or I.R. x Cr ≥ 50Ω.F whichever is less External Visual AEC-Q200 9 Any applicable method using × 10 magnification In accordance with specification Physical Dimension AEC-Q200 10 Verify physical dimensions to the applicable device specification. In accordance with specification

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification TEST TEST METHOD PROCEDURE REQUIREMENTS Mechanical Shock AEC-Q200 13 Three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks) Peak value: 1,500 g’s Duration: 0.5 ms Velocity change: 15.4 ft/s Waveform: Half-sin ∆C/C X8G: Within ± 0.5% or 0.5 pF, whichever is greater X8R: ± 10% D.F. Within initial specified value I.R. Within initial specified value Vibration AEC-Q200 14 5 g’s for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8” x 5” PCB. 0.31” thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2” from any secure point. Test from 10-2000 Hz. ∆C/C X8G: Within ± 0.5% or 0.5 pF, whichever is greater X8R: ± 10% D.F: meet initial specified value I.R. meet initial specified value Resistance to Soldering Heat AEC-Q200 15 Precondition: 150 +0/–10 °C for 1 hour, then keep for 24 ± 1 hours at room temperature Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute Preheating: for size >1206: 100 °C to 120 °C for 1 minute and 170 °C to 200 °C for 1 minute Solder bath temperature: 260 ± 5 °C Dipping time: 10 ± 0.5 seconds Recovery time: 24 ±2 hours Dissolution of the end face plating shall not exceed 25% of the length of the edge concerned ∆C/C X8G: Within ± 1% or 0.5 pF, whichever is greater X8R: ± 10% D.F. within initial specified value I.R. within initial specified value Thermal Shock AEC-Q200 16 1. Preconditioning, X8R only: 150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour at room temp 2. Initial measure: Spec: refer to initial spec C, D, I.R. 3. Rapid change of temperature test: X8G / X8R: -55 °C to +150 °C; 300 cycles 15 minutes at lower category temperature; 15 minutes at upper category temperature. 4. Recovery time: X8G: 6 to 24 hours X8R: 24 ± 2 hours 5. Final measure: C, D, I.R. No visual damage ∆C/C X8G: Within ± 1% or 1 pF, whichever is greater X8R: ± 15% D.F: meet initial specified value I.R. meet initial specified value

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification TEST TEST METHOD PROCEDURE REQUIREMENTS ESD AEC-Q200 17 Per AEC-Q200-002 A component passes a voltage level if all components stressed at that voltage level pass. Solderability AEC-Q200

18 Preheated to a temperature of 80 °C to 140 °C and maintained

for 30 seconds to 60 seconds. Test conditions for lead containing solder alloy Temperature: 235 ± 5 °C Dipping time: 2 ± 0.2 seconds Depth of immersion: 10 mm Alloy Composition: 60/40 Sn/Pb Number of immersions: 1 Test conditions for lead-free containing solder alloy Temperature: 245 ± 5 °C Dipping time: 3 ± 0.3 seconds Depth of immersion: 10 mm Alloy Composition: SAC305 Number of immersions: 1 The solder should cover over 95% of the critical area of each termination. Electrical Characterization AEC-Q200 19 Parametrically test per lot and sample size requirements, summary to show Min, Max, Mean and Standard deviation at room as well as Min and Max operating temperatures. ∆C/C X8G: ± 30 ppm/°C X8R: ± 15% X8G / X8R: -55 °C to +150 °C Normal temperature: 25 °C YNM0053-1 6 kV DC FAIL PASS 2 kV DC 1 kV DC 4 kV DC FAIL PASS 500 V DC 1 kV DC FAIL PASS < 500 V DC 500 V DC FAIL PASS 16 kV AD 25 kV AD FAIL PASS 2 kV DC 4 kV DC FAIL PASS 12 kV AD 8 kV DC 16 kV AD FAIL PASS 6 kV DC 8 kV DC FAIL PASS 12 kV AD 25 kV AD FAIL PASS Note: Classify the components according to the highest ESD voltage level survived during ESD testing. Fig. 4 Passive component HBM ESD test flow diagram (DC = Direct Contact Discharge, AD = Air Discharge)

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification TEST TEST METHOD PROCEDURE REQUIREMENTS Board Flex AEC-Q200 21 Part mounted on a 100 mm X 40 mm FR4 PCB board, which is 1.6 ± 0.2 mm thick and has a layer-thickness 35 µm ± 10 µm. Part should be mounted using the following soldering reflow profile. Conditions: X8G: Bending 3 mm at a rate of 1 mm/s, radius jig 340 mm X8R: Bending 2 mm at a rate of 1 mm/s, radius jig 340 mm Test Substrate: 100 b C a 4.5 YNSC147 unit: mm No visible damage ∆C/C X8G: Within ± 1% or 0.5 pF, whichever is greater X8R: ± 10% Dimension(mm) Type a b c 0201 0.3 0.9 0.3 0402 0.4 1.5 0.5 0603 1.0 3.0 1.2 0805 1.2 4.0 1.65 1206 2.2 5.0 1.65 1210 2.2 5.0 2.0 1808 3.5 7.0 3.7 Terminal Strength AEC-Q200 22 With the component mounted on a PCB obtained with the device to be tested, apply a 17.7N (1.8Kg) force to the side of a device being tested. This force shall be applied for 60+1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested. * Apply 2N force for 0402 size. Magnification of 20X or greater may be employed for inspection of the mechanical integrity of the device body, terminals and body/terminal junction. Before, during and after the test, the device shall comply with all electrical requirements stated in this specification. Beam Load Test AEC-Q200 23 Place the part in the beam load fixture. Apply a force until the part breaks or the minimum acceptable force level required in the user specification(s) is attained. ≤ 0805 Thickness > 0.5mm: 20N Thickness ≤ 0.5mm: 8N ≥ 1206 Thickness ≥1.25 mm: 54N Thickness < 1.25 mm: 15N Voltage Proof 1. Specified stress voltage applied for 1~5 seconds 2. Ur ≤ 100 V: series applied 2.5 Ur 3. 100 V < Ur ≤ 200 V series applied (1.5 Ur + 100) 4. 200 V < Ur ≤ 500 V series applied (1.3 Ur + 100) 5. Ur > 500 V: 1.3 Ur 6. Ur ≥ 1000 V: 1.2 Ur Charge/Discharge current is less than 50 mA No breakdown or flashover

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification PPAAPPEERR//PPEE TTAAPPEE SSPPEECCIIFFIICCAATTIIOONN Table 7 Dimensions of paper/PE tape for relevant chip size; see Fig.5 SIZE CODE SYMBOL Unit: mm A0 B0 W E F P0 (1) P1 P2 Ø D0 K0 T NOTE 1. P0 pitch tolerance over any 10 pitches is 0.2 mm MBG251-1 E F W T cover tape Fig. 5 Paper/PE tape SIZE CODE THICKNESS CLASSIFICATION PACKING CODE TAPE WIDTH QUANTITY PER REEL Ø 180 MM / 7 INCH Ø 330 MM / 13 INCH

7 INCH 13 INCH Paper Blister Paper Blister

0603 0.80 ± 0.1 mm R P 8 mm 4,000 --- 15,000 --- 0805 THICKNESS CLASSES AND PACKING QUANTITY Table 6

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification BBLLIISSTTEERR TTAAPPEE SSPPEECCIIFFIICCAATTIIOONN Table 8 Dimensions of blister tape for relevant chip size; see Fig.6 SCM015 E F W A0 D 1 direction of unreeling K 0 cover tape Fig. 6 SIZE CODE SYMBOL Unit: mm A0 B0 K0 W E F Ø D0 Ø D1 P0 (2) P1 P2 T2 NOTE 1. Typical capacitor displacement in pocket 2. P0 pitch tolerance over any 10 pitches is ±0.2 mm

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification RREEEELL SSPPEECCIIFFIICCAATTIIOONN NC A HBK039 Table 9 Reel dimensions; see Fig.7 TAPE WIDTH SYMBOL Unit: mm A N C W1 W2max. PROPERTIES OF REEL Material: polystyrene Surface resistance: <10 10 X/sq. Fig. 7

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification SSOOLLDDEERRIINNGG CCOONNDDIITTIIOONNSS For normal use the capacitors may be mounted on printed -circuit boards or ceramic substrates by applying wave soldering, reflow soldering or conductive adhesive in accordance with IEC 61760 -1 (Standard method for the specification of surface mounting com ponents). For advised soldering profiles see Figs 8, 9, 10. An improper combination of soldering, substrate and chip size can lead to a damaging of the component. The risk increases with the chip size and with temperature fluctuations (>100 °C). Therefore, it is advised to use the smallest possible size and follow the dimensional recommendations given in Tables 8, 9 and 1 0 for reflow and wave soldering. More detailed information is available on request. 0 50 100 150 200 250 300 250 200 150 100 (°C) t (s) YNM0015 T 130 °C 150 °C 160 °C 180 °C Typical Ramp up rate < 3 °C/s Preheating Ramp down rate < 6 °C/s ca. 60 s > 180 °C 215 °C 230 °C 240 °C 10 s max. Fig. 8 Infrared soldering, forced gas convection reflow soldering - Temperature/time profile for SnPb solders Solid line: Typical process (terminal temperature) Dotted lines: Process limits - bottom process limit (terminal temperature) & upper process limit (top surface temperature). SIZE Temp(ºC) DURATION (SEC.) PREHEATING TEMP(º C) ATMOSPHERE 0201/0402/0603/0805/1206 350 max. 3 max. 150 min. air 1210/1808/1812/2220 280 max. 3 max. 150 min. air Table 10 Recommended soldering iron condition MOUNTING SSOOLLDDEERR RREEPPAAIIRRSS Conventional solder repairs are carried out with a soldering iron as shown as Tab le 10. The tip of the soldering iron should not directly touch the chip component to avoid thermal shock on the interface between termination and body during mounting, repairing or de -mounting processes. Ensure the termination solder has melted befo re removing the chip component.

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification 0 50 100 150 200 250 300 250 200 150 100 (C) t (s) T YNM001710 s max., max. contact time 5 s per wave

235 C to 260 C (SnPb)

250 C to 260 C (SnAgCu) second wave

ca. 5 C/s ca. 3.5 C/s typical ca. 2 C/s DT < 150 C Fig. 10 Double wave soldering for SnPb and lead -free SnAgCu solder - Temperature/time profile (terminal temperature) 0 50 100 150 200 250 300 350 400 300 250 200 150 100 (C) t (s) YNM0016 T 180 C 150 C 220 C 260 C 245 C Typical Ramp up rate < 3 C/s Preheating Ramp down rate < 6 C/s ca. 45~90 s > 220 C 10 s max. 255 C Fig. 9 Infrared soldering, forced gas convection reflow soldering - Temperature/time profile for lead -free SnAgCu solders Solid line: Typical process (terminal temperature) Dotted lines: Process limits - bottom process limit (terminal temperature) & upper process limit (top surface temperature). Solid line: Typical process Dotted lines: Process limits

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification MBG628-1 B A F C D G preferred direction during wave soldering solder land / solder paste pattern solder resist pattern occupied area Fig. 11 D iscrete capacitors recommended dimensions of footprint FFOOOOTTPPRRIINNTT DDIIMMEENNSSIIOONNSS Table 11 Reflow soldering; for footprint dimensions see Fig.11 SIZE CODE FOOTPRINT DIMENSIONS Unit: mm A B C D F G Processing remarks IR or hot plate soldering

Automotive grade X8G / X8R 16 V to 100 V www.yageo.com May 01, 2022 V .2 Surface-Mount Ceramic Multilayer Capacitors Product specification

REVISION HISTORY

REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 2 May 01, 2022 - - Add X8G 0603, 680pF to 10nF, 25V to 50V Version 1 Oct, 2, 2019 - - Add X8G product range, 0805, 1nF to 10nF, 50V to 100V Version 0 Dec. 12, 2018 - - New

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