WW25B_J WALSIN | Alldatasheet

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Page 1 of 8 ASC_WW25B_J_AUTO_V01 JUL- 2016 WW25B_J Metal low ohm current sensing chip resistors Size 2512 (6432) 3W Automotive AEC Q200 Compliant RoHS exemption free and Halogen free Low Thermal EMF *Contents in this sheet are subject to change without prior notice.

Page 2 of 8 ASC_WW25B_J_AUTO_V01 JUL- 2016 FEATURE 1. Metal low ohm and High power low TCR performance 2. Automotive grade AEC Q-200 compliant 3. 100% CCD inspection 4. RoHS exemption free and Halogen free 5. Inductance less than 1.0nH 6. Low thermal EMF APPLICATION

  • Power supply
  • PDA
  • Digital meter
  • Computer
  • Automotives
  • Battery charger
  • DC-DC power converter

DESCRIPTION

The resistors are constructed in a high grade low resistive metal body. The resistive layer is covered with a protective coat and printed a resistance marking code over it. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is Tin (lead-free) soder alloy. Fig 1. Construction of Chip-R

Page 3 of 8 ASC_WW25B_J_AUTO_V01 JUL- 2016 QUICK REFERENCE DATA Item General Specification Series No. WW25B Size code 2512 ( 6432 ) Resistance Tolerance ±5%, ±1% Resistance Range 5, 6, 7, 8, 9, 10, 20mΩ TCR (ppm/ °C) 20m Ω : ≤ ±50 ppm/ °C Max. dissipation at T amb =70 °C 3 W Operation temperature - 55 ~ +170’C MECHANICAL DATA Symbol Dimensions (mm) L 6.20±0.20 W 3.25±0.20 T 0.65±0.20 Tt 0.80 ±0.20 Tb 0.80 ±0.20

Page 4 of 8 ASC_WW25B_J_AUTO_V01 JUL- 2016 MARKING Each resistor is marked with a four-digit code on the protection coat to define resistance value. Example: R020 = 0.020Ω , R050 = 0.05 Ω FUNCTIONAL DESCRIPTION Derating curve The power that the resistor can dissipate depends on the operating temperature; see Fig.2 MOUNTING Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by automatic placement systems. Chip placement can be on ceramic substrates and printed-circuit boards (PCBs). Electrical connection to the circuit is by individual soldering condition. The end terminations guarantee a reliable contact.

Page 5 of 8 ASC_WW25B_J_AUTO_V01 JUL- 2016 SOLDERING CONDITION The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260 °C for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Resistors are tested for solderability at 235°C during 2 seconds. The test condition for no leaching is 260 °C for 30 seconds. Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 3. Fig 3. Infrared soldering profile for Chip Resistors WW25A CATALOGUE NUMBERS The resistors have a catalogue number starting with WW25 B R005 F T L J Size code WW25 : 2512 Type code B : 3W Metal sensing type Low EMF Resistance code 0.005Ω = R005 Tolerance J : ±5% F : ±1% Packaging code T : 7” reeled in tape Termination code L = Sn base (lead free) Special code J = Automotive grade AEC Q-200 compliant Reeled tape packaging : 12mm width plastic emboss taping 4,000pcs per reel.

Page 6 of 8 ASC_WW25B_J_AUTO_V01 JUL- 2016 TEST AND REQUIREMENTS ( AEC Q-200 ) REQUIREMENT TEST PROCEDURE / TEST METHOD Resistor

Electrical Characteristics

JISC5201-1: 1998 Clause 4.8 - DC resistance values measurement - Temperature Coefficient of Resistance (T.C.R) Natural resistance change per change in degree centigrade. ( ) 12 1 12 10 ×− ttR RR (ppm/ °C) t 1 : 20° C+5° C-1° C R 1 : Resistance at reference temperature R 2 : Resistance at test temperature Within the specified tolerance Refer to “QUICK REFERENCE DATA” Resistance to soldering heat (R.S.H) MIL-STD-202 method 210 Un-mounted chips completely immersed for 10 ±1second in a SAC solder bath at 270 ℃±5ºC J: ΔR/R max. ±(1.0%+0.5mΩ ) F: ΔR/R max. ±(0.5%+0.5m Ω ) no visible damage Solderability AEC Q-200 a) Bake the sample for 155 ℃ dwell time 4hrs/ solder dipping 235 ℃/ 5sec. b) Steam the sample dwell time 8 hour/ solder dipping 215 ℃/ 5sec. c) Steam the sample dwell time 8 hour/ solder dipping 260 ℃/ 7sec. 95% coverage min., good tinning and no visible damage Temperature cycling AEC Q-200 7.4 1000 cycles, -55℃ ~ +125℃, dwell time 30min maximum. J: ΔR/R max. ±(1.0%+1m Ω ) F: ΔR/R max. ±(0.5%+1m Ω ) No visible damage Moisture Resistance MIL-STD-202 method 106 65 ±2°C, 80~100% RH, 10 cycles, 24 hours/ cycle J: ΔR/R max. ±(1.0%+0.5m Ω ) F: ΔR/R max. ±(0.5%+0.5m Ω ) No visible damage Bias Humidity MIL-STD-202 method 103 1000+48/-0 hours; 85 °C, 85% RH, 10% of operation power J: ΔR/R max. ±(3.0%+0.5m Ω ) F: ΔR/R max. ±(1.0%+0.5m Ω ) No visible damage Operational Life MIL-STD-202 method 108 1000+48/-0 hours; specified rated power at 125 ±2°C J: ΔR/R max. ±(3.0%+0.5m Ω ) F: ΔR/R max. ±(1.0%+0.5m Ω ) No visible damage High Temperature Exposure MIL-STD-202 Method 108 1000+48/-0 hours; without load in a temperature chamber controlled 125±3°C J: ΔR/R max. ±(3.0%+0.5m Ω ) F: ΔR/R max. ±(1.0%+0.5m Ω ) No visible damage Board Flex AEC-Q200-005 Resistors mounted on a 90mm glass epoxy resin PCB(FR4),bending once 2mm for 60sec. J: ΔR/R max. ±(1.0%+1m Ω ) F: ΔR/R max. ±(0.5%+1m Ω ) No visible damage Terminal strength AEC-Q200-006 Pressurizing force: 1Kg, Test time: 60±1sec. No remarkable damage or removal of the terminations Thermal shock MIL-STD-202 method 107 Test –55 to 155℃/ dwell time 15min/ Max transfer time 20sec 300cycles J: ΔR/R max. ±(1.0%+0.5m Ω ) F: ΔR/R max. ±(0.5%+0.5m Ω ) No visible damage

Page 7 of 8 ASC_WW25B_J_AUTO_V01 JUL- 2016 ESD AEC-Q200-002 Test contact 1KV. ΔR/R max. ±(1%+0.5m Ω ) No visible damage Mechanical Shock MIL-STD-202 method 213 Test ½ Sine Pulse, Peak value: 100g, normal duration: 6ms, Velocity change:12.3ft/sec. Three shocks in each direction, total 18 shocks. Within product specification tolerance and no visible damage. Vibration MIL-STD-202 method 204 Test 5g’s for 20 min., 12 cycles each of 3 orientations. No visible damage. Resistance to Solvents : MIL-STD-202 Method 215 Solvent is Isopropyl alcohol, immersion 3mins at 25 ℃ and brush 10 strokes with a toothbrush with a handle made of a non-reactive material (wet bristle), immersion and brush 3 times and then air blow dry. No superficial defect on marking, encapsulation, coating, appearance. Electrical characteristics within products specification and tolerance. Inspect at 3X max. for marking, inspect at 10X for part damage. External Visual MIL-STD-883 method 2009 Electrical test not required. Inspect device construction, marking and workmanship No visual damage and refer WTC marking code. Physical Dimension JESD22 method JB-100 Verify physical dimensions(L, W, T, Tb, Tt) Within the specified tolerance for WTC.

Page 8 of 8 ASC_WW25B_J_AUTO_V01 JUL- 2016 PACKAGING Plastic Tape specifications (unit :mm) Symbol A B W F E Symbol P1 P0 Φ D T 0 . 050 . 1+ Φ Max. 1.2 Reel dimensions Symbol A B C D Taping quantity - Chip resistors 4,000 pcs per reel.