WW12M WALSIN | Alldatasheet

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Page 1 of 7 ASC_WW12MN_V05 Jul.2010 WW12M, WW12N Ultra low ohmic power chip resistors Size 1206 (3216) Sensing Type *Contents in this sheet are subject to change without prior notice.

Page 2 of 7 ASC_WW12MN_V05 Jul.2010 FEATURE 1. Ultra low and stable TCR performance 2. High power rating and compact size 3. High reliability and stability 4. Reduced size of final equipment 5. RoHS compliant and Lead free product APPLICATION

  • Power supply
  • PDA
  • Digital meter
  • Computer
  • Automotives
  • Battery charger
  • DC-DC power converter

DESCRIPTION

The resistors are constructed in a high grade low resistive metal body. The resistive layer is covered with a protective coat and printed a resistance marking code over it. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is a lead-free soder. Fig 1. Consctruction of Chip-R

Page 3 of 7 ASC_WW12MN_V05 Jul.2010 QUICK REFERENCE DATA Item General Specification Series No. WW12M WW12N Size code 1206 ( 3216 ) Resistance Tolerance ±5%; ±1% TCR (ppm/ °C) ≤ 70 ppm/ °C Max. dissipation at T amb =70 °C 1/2W 1 W Max. Operation Voltage (DC or RMS) 200V Max. Overload Voltage (DC or RMS) 400V Climatic category (IEC 60068) 55/155/56 Note : 1. This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication 60115-8” 2. Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by Value Resistance Power Rated RCWV ×= or Max. RCWV listed above, whichever is lower. 3. 1 W loading with total solder-pad size of 300 mm 2 MECHANICAL DATA Symbol Dimensions (mm) L 3.10±0.20 W 1.60±0.20 T 0.60 ±0.25 Tt 0.60 ±0.20 Tb 0.60 ±0.20 R010

Page 4 of 7 ASC_WW12MN_V05 Jul.2010 MARKING Each resistor is marked with a four-digit code on the protective coating to designate the nominal resistance value. R020 R020 = 20m ΩΩ ΩΩ FUNCTIONAL DESCRIPTION Derating curve The power that the resistor can dissipate depends on the operating temperature; see Fig.2 MOUNTING Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by automatic placement systems. Chip placement can be on ceramic substrates and printed-circuit boards (PCBs). Electrical connection to the circuit is by individual soldering condition. The end terminations guarantee a reliable contact.

Page 5 of 7 ASC_WW12MN_V05 Jul.2010 SOLDERING CONDITION The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260 °C for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Resistors are tested for solderability at 235°C during 2 seconds. The test condition for no leaching is 260 °C for 30 seconds. Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 3. Fig 3. Infrared soldering profile for Chip Resistors WW25 CATALOGUE NUMBERS The resistors have a catalogue number starting with . WW12 N R002 J T L Size code WW12 : 1206 Type code M : 1/2W N : 1W Sensing type Resistance code R is first digit followed by 3 significant digits. 0.010Ω = R010 Tolerance J : ±5% F : ±1% Packaging code T : 7” reeled in tape Termination code L = Sn base (lead free) Chip resistors 4,000 pcs per Paper Tape reel.

Page 6 of 7 ASC_WW12MN_V05 Jul.2010 TEST AND REQUIREMENTS (JIS C 5201-1 : 1998) Essentially all tests are carried out according to the schedule of IEC publication 115-8, category LCT /UCT /56(rated temperature range : Lower C ategory Temperature, U pper C ategory Temperature; damp heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS. The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical robustness testing procedure for electronic components" and under standard atmospheric conditions according to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied : Temperature: 15 °C to 35 °C. Relative humidity: 45% to 75%. Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar). All soldering tests are performed with midly activated flux. TEST PROCEDURE REQUIREMENT Temperature Coefficient of Resistance(T.C.R) Clause 4.8 Natural resistance change per change in degree centigrade. ( ) 121 12 10 ×− ttR RR (ppm/ °C) t 1 : 20° C+5° C-1° C R 1 : Resistance at reference temperature R 2 : Resistance at test temperature Refer to “QUICK REFERENCE DATA” Short time overload (S.T.O.L) Clause 4.13 Permanent resistance change after a 5 second application of 5 times rated power specified in the above list, no visible damage ΔR/R max. ±(1%+0.0001 Ω ) Resistance to soldering heat(R.S.H) Clause 4.18 Un-mounted chips completely immersed for 10 ±1second in a SAC solder bath at 260 ℃±5ºC no visible damage ΔR/R max. ±(1%+0.0001 Ω ) Solderability Clause 4.17 Un-mounted chips completely immersed for 2±0.5 second in a SAC solder bath at 235 ℃±5 ℃ good tinning (>95% covered) no visible damage Temperature cycling Clause 4.19 30 minutes at -55 °C ±3°C, 2~3 minutes at 20° C+5° C-1° C, 30 minutes at +155 °C ±3°C, 2~3 minutes at 20° C+5° C-1° C, total 5 continuous cycles no visible damage ΔR/R max. ±(1%+0.0001 Ω ) Load life (endurance) Clause 4.25 70 ±2ºC, 1000 hours, loaded with RCWV or Vmax,1.5 hours on and 0.5 hours off no visible damage ΔR/R max. ±(2%+0.0001 Ω ) Load life in Humidity Clause 4.24 1000 hours, at rated continuous working voltage in humidity chamber controller at 40 °C ±2°C and 90~95% relative humidity, 1.5hours on and 0.5 hours off no visible damage ΔR/R max. ±(2%+0.0001 Ω ) Adhesion Clause 4.32 Pressurizing force: 5N, Test time: 10 ±1sec. No remarkable damage or removal of the terminations

Page 7 of 7 ASC_WW12MN_V05 Jul.2010 PACKAGING Paper Tape specifications (unit :mm) Series No. A B W F E Series No. P1 P0 Φ D T 0 . 050 . 1+ Φ Max. 1.2 Reel dimensions Symbol A B C D Taping qty: 4000pcs per reel