WWXXC WALSIN | Alldatasheet

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Technical content

Page 1 of 8 ASC_WWxxC_V07 Jan 2014 WW12C, WW 08C, WW06C, WW04C , WW02C Low ohm chip resistors ( power ) Size 1206, 0805, 0603, 0402, 0201 *Contents in this sheet are subject to change without prior notice.

Page 2 of 8 ASC_WWxxC_V07 Jan 2014 FEATURE 1. High power rating and low range 2. High reliability and stability 3. Suitable for current sensing of small mobile devices 4. RoHS compliant & Lead free 5. Up side down mounting to minimize resistance drift after soldering APPLICATION

  • Game equipment
  • Mobile phone
  • Battery pack
  • Power supply
  • DSC
  • HDD

DESCRIPTION

The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to nominated value within tolerance which controlled by laser trimming of this resistive layer. The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is a Tin (lead free) alloy. Fig 1. Construction of Chip-R

Page 3 of 8 ASC_WWxxC_V07 Jan 2014 QUICK REFERENCE DATA Item General Specification Series No. WW12C WW08C WW06C WW04C WW02C Size code 1206 (3216) 0805 ( 2012 ) 0603 ( 1608 ) 04 02 ( 1005 ) 0201 ( 0603 ) Resistance Tolerance ±5%, ±1% ±5% Resistance Range 0.020 Ω ~ 0.100 Ω ( E24 +E96 ) 0.010Ω ~ 0.100 Ω ( E24 +E96 ) 0.010Ω ~ 0.100 Ω ( E24 +E96 ) 0.025Ω ~ 0.100 Ω ( E24 +E96 ) 0.020 Ω ~ 0.100 Ω ( E24 +E96 ) TCR (ppm/ °C) 0.010 Ω ~ 0.019 Ω 0.020Ω ~ 0.030 Ω 0.033 Ω ~ 0.050 Ω 0.051Ω ~ 0.100 Ω N/A 0 ~ +250 ppm ±100 ppm ±100 ppm 0 ~ +250 ppm 0 ~ +250 ppm ±150 ppm ±100 ppm 0 ~ +350 ppm 0 ~ +350 ppm 0 ~ +250 ppm ±150 ppm N/A 0 ~ +350 ppm 0 ~ +350 ppm ±150 ppm N/A 0 ~ +350 ppm 0 ~ +350 ppm 0 ~ +350 ppm Max. dissipation at T amb =70 °C 1/2W 1/3 W 1/4 W 1/8 W 1/10 W Max. Operation Current (DC or RMS) Operation temperature -55 ~ +125’C Note : 1. This is the maximum current that may be continuously supplied to the resistor element, see “IEC publication 60115-8” 2. Max. Operation current : So called RCWC (Rated Conti nuous Working Current) is determined by Value Resistance Power / Rated RCWC = MECHANICAL DATA(unit: mm) Symbol WW12C WW08C WW06C WW04C WW02C -0.05 -0.10 0.23 + 0.03 - 0.10 -0.10 0.15 +0.05 -0.10 d 0.50 ± 0.25 0.40 ± 0.20 0.60 ± 0.20 (< 0.02 Ω ) 0.30 ± 0.10 0.55 ± 0.10 (< 0.02 Ω ) 0.25 +0.05 -0.10 0.15 ± 0.05 L c c

Page 4 of 8 ASC_WWxxC_V07 Jan 2014 MARKING Each resistor is marked with a three-digit code on the substrate to designate the nominal resistance value. Please refer below table list! 0603, 0402 and 0201 sizes are no marking! Example: R10 = 0.100 Ω 050 = 0.050 Ω FUNCTIONAL DESCRIPTION Product characterization Standard values of nominal resistance are taken from the E96 & E24 series for resistors with a tolerance of ±5% & ±1%. The values of the E24/E96 series are in accordance with “IEC publication 60063”. De-rating curve The power that the resistor can dissipate depends on the operating temperature; see Fig.2 MOUNTING Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by automatic placement systems. Chip placement can be on ceramic substrates and printed-circuit boards (PCBs). Electrical connection to the circuit is by individual soldering condition. The end terminations guarantee a reliable contact. Resistive layer is on the bottom side as below !

Page 5 of 8 ASC_WWxxC_V07 Jan 2014 SOLDERING CONDITION The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260 °C for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Resistors are tested for solderability at 245 °C during 3 seconds within lead-free solder bath. The test condition for no leaching is 260 °C for 30 seconds. Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 3. Fig 3. Infrared soldering profile for chip resistor CATALOGUE NUMBERS The resistors have a catalogue number starting with . WW04 C R050 F T L Size code WW02 : 0201 WW04 : 0402 WW06 : 0603 WW08 : 0805 WW12 : 1206 Type code 0201, 1/10W 0402, 1/8W 0603, 1/4W 0805, 1/3W 1206, 1/2W Resistance code E96 +E24: R is first digit followed by 3 significant digits. 0.020 Ω = R020 0.100Ω = R100 0.025 Ω = R025 Tolerance J : ±5% F : ±1% Packaging code T : 7” Reel taping A : 7” Reel taping 15Kpcs/reel Termination code L = Sn base (lead free) /circle4 Reeled tape packaging WW02C: 8mm width paper taping 2mm pitch, 15,000pcs per reel. /circle4 Reeled tape packaging WW04C: 8mm width paper taping 2mm pitch, 10,000pcs per reel. /circle4 Reeled tape packaging WW06C: 8mm width paper taping 4mm pitch, 5,000pcs per reel. /circle4 Reeled tape packaging WW08C: 8mm width paper taping 4mm pitch, 5,000pcs per reel. /circle4 Reeled tape packaging WW12C: 8mm width paper taping 4mm pitch, 5,000pcs per reel.

Page 6 of 8 ASC_WWxxC_V07 Jan 2014 TEST AND REQUIREMENTS TEST PROCEDURE REQUIREMENT Temperature Coefficient of Resistance ( TCR ) Natural resistance change per change in degree centigrade. ( ) 12 1 12 10 ×− ttR RR (ppm/ °C) R 1 : Resistance at reference temperature R 2 : Resistance at test temperature t1 : 25 °C Test temperature –55 ~ +125°C As defined in P.3 Short time overload ( STOL ) Sub-Clause 4.13 Permanent resistance change after 2 second application of a current 2.5 times RCWC specified. ΔR/R max. ±1% no visible damage Resistance to soldering heat Sub-clause 4.18 Un-mounted chips 10 ±0.5 seconds, 260 ±5ºC no visible damage Δ R/R max. ±1% Solderability Sub-clause 4.17 Termination Sn base (lead free) : Un-mounted chip completely immersed in a lead free solder bath, good tinning (>95% covered) no visible damage Temperature cycling Sub-clause 4.19 1. 30 minutes at -55 °C ±3°C, 2. 2~3 minutes at room temperature, 3. 30 minutes at +125°±3°C, 4. 2~3 minutes at room temperature, Total 5 continuous cycles no visible damage ΔR/R max. ±1% Load life (endurance) Sub-clause 4.25.1 70 ±2ºC, 1000 hours, loaded with rated current, 1.5 hours on and 0.5 hours off ΔR/R max. ±5% no visible damage Steady state in Humidity Sub-clause 4.24 1000hrs without current applied in humidity chamber controller at 40 °C ±2°C and 90~95% relative humidity ΔR/R max. ±5% no visible damage Bending strength Sub-clause 4.33 Resistors mounted on a 90mm glass epoxy resin PCB(FR4); bending : 3 mm, ΔR/R max. ±1% no visible damage Adhesion Sub-clause 4.32 5N, 10 ±1s ( WW02C: 3N) No visible damage

Page 7 of 8 ASC_WWxxC_V07 Jan 2014 Test substrate Unit: mm WW04C TEST SUBSTRATE Figure −3 Remarks: 1). Material: Epoxy woven glass Thickness: 1.6mm Thickness of copper clad: 0.035mm 2). In the case of connection by connector, the connecting terminals are gold plated. However, the plating is not necessary when the connection is made by soldering. Unit: mm Style ａ b c WW04C 0.6 0.5 0.7 WW04C BOUND STRENGTH OF THE END FACE PLATING TEST S UBSTRATE Figure −4 Remark 1). Material: Epoxy woven glass Thickness: 1.6mm Thickness of copper clad: 0.035mm R0.5mm Metal block measurement Point A Insulation plate Metal plate Measurement point B Insulation surface Component Pressure by spring (1±0.2N ) 0.6 27.6 9 1.6 0.7 0.5 0.5 6 6 6.5 6.5 1.6 :Copper clad :Solder resist 100 c a b b :Copper clad :Solder resist

Page 8 of 8 ASC_WWxxC_V07 Jan 2014 PACKAGING Paper Tape specifications (unit :mm) Series No. A B W F E Series No. P1 P0 Φ D T 0 . 050 . 1+ Φ 0.45 ±0.05 0 . 050 . 1+ Φ Max. 0.5 0 . 050 . 1+ Φ Max. 0.8 0 . 050 . 1+ Φ Max. 1.0 0 . 050 . 1+ Φ Max. 1.0 Reel dimensions Symbol A B C D