WT04X WALSIN | Alldatasheet
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Page 1 of 7 ASC_WT04X_V14 Apr.2010 WT04X ±± ±±5%, Convex Type 10p8R Chip resistors network Size 1206 *Contents in this sheet are subject to change without prior notice.
Page 2 of 7 ASC_WT04X_V14 Apr.2010 FEATURE 1. Small size and light weight 2. Reduced size of final equipment 3. Lower surface mounted assembly costs 4. Higher component and equipment reliability 5. RoHS compliant and Lead free products APPLICATION
- Consumer electrical equipment
- EDP, Computer application
DESCRIPTION
The resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to within tolerance by laser cutting of this resistive layer. The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is Tin (Pb free) alloy. Fig 1. Consctruction of a Chip-R network WT04X
Page 3 of 7 ASC_WT04X_V14 Apr.2010 QUICK REFERENCE DATA Item General Specification Series No. WT04X(Convex type) Size 1206 (3216) Resistance Tolerance ±5% (E24 series) Resistance Range 10 Ω ~ 100K Ω TCR (ppm/ °C) ≤ ± 200 ppm/ °C Max. dissipation at T amb =70 °C 1/16 W Max. Operation Voltage (DC or RMS) 25V Max. overload voltage 50V Climatic category 55/155/56 Note : 1. This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication 60115-8” 2. Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by Value Resistance Power Rated RCWV ×= or Max. RCWV listed above, whichever is lower. DIMENSIONS(unit : mm) WT04X L 3.30 ± 0.20 W 1.60 ± 0.15 T 0.55 ± 0.10 P 0.64 ± 0.05 A 0.50 ± 0.05 B 0.40 ± 0.15 C 0.40 ± 0.15 G 0.40 ± 0.15
apply to the resistance value and third indicate the number of zeros to follow. Figure 2. Maximum dissipation in percentage of rated power
Page 5 of 7 ASC_WT04X_V14 Apr.2010 MOUNTING Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by automatic placement systems. Chip placement can be on ceramic substrates and printed-circuit boards (PCBs). Electrical connection to the circuit is by individual soldering condition. The end terminations guarantee a reliable contact. SOLDERING CONDITION The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260 °C for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Resistors are tested for solderability at 235°C during 2 seconds. The test condition for no leaching is 260 °C for 30 seconds. Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 3. Fig 3. Infrared soldering profile for Chip Resistors network CATALOGUE NUMBERS The resistors have a catalogue number starting with . WT04 X 472_ J T L Size code WT04 : 0402 per element Type code X : 8 elements, convex terminations, common pin p5/p10 Resistance code E24 : 2 significant digits followed by no. of zeros and a blank 4.7 Ω =4R7_ 10 Ω =100_ 220 Ω =221_ Jumper =000_ (“_” means a blank) Tolerance J : ±5% Packaging code T : 7” Reel taping Termination code L = Sn base (lead free) Reeled tape packaging : 8mm width paper taping 5000pcs per reel.
Page 6 of 7 ASC_WT04X_V14 Apr.2010 TEST AND REQUIREMENTS(JIS C 5201-1 : 1998) TEST PROCEDURE REQUIREMENT DC resistance Clause 4.5 DC resistance values measured at the test voltages specified below : <10K Ω @3V, <100K Ω @10V, <1M Ω @25V, <10M Ω @30V Within the specified tolerance Temperature Coefficient of Resistance(T.C.R) Clause 4.8 Natural resistance change per change in degree centigrade. ( ) 121 12 10 ×− ttR RR (ppm/ °C) t 1 : 20° C+5° C-1° C R 1 : Resistance at reference temperature R 2 : Resistance at test temperature Refer to “QUICK REFERENCE DATA” Short time overload (S.T.O.L) Clause 4.13 Permanent resistance change after a 5second application of a voltage 2.5 times RCWV or the maximum overload voltage specified in the above list, whichever is less. ΔR/R max. ±(2%+0.10 Ω ) Resistance to soldering heat(R.S.H) Clause 4.18 Un-mounted chips completely immersed for 10 ±1second in a SAC solder bath at 260 ℃±5ºC no visible damage Δ R/R max. ±(1.0% +0.05Ω ) Solderability Clause 4.17 Un-mounted chips completely immersed for 2±0.5 second in a SAC solder bath at 235℃±5 ℃ good tinning (>95% covered) no visible damage Temperature cycling Clause 4.19 30 minutes at -55 °C ±3°C, 2~3 minutes at 20° C+5° C-1° C, 30 minutes at +155 °C ±3°C, 2~3 minutes at 20° C+5° C-1° C, total 5 continuous cycles no visible damage ΔR/R max. ±(1% +0.05 Ω ) Load life (endurance) Clause 4.25 1000 +48/-0 hours, loaded with RCWV or Vmax in chamber controller 70 ±2ºC, 1.5 hours on and 0.5 hours off 10 Ω ~ 1M Ω : ΔR/R max. ±(3% +0.1 Ω ) R<10 Ω , R ≥1M Ω : ΔR/R max. ±(5%+0.1 Ω ) Load life in Humidity Clause 4.24 1000 +48/-0 hours, loaded with RCWV or Vmax in humidity chamber controller at 40 °C ±2°C and 90~95% relative humidity, 1.5hours on and 0.5 hours off 10 Ω ~ 1M Ω : ΔR/R max. ±(3% +0.1 Ω ) R<10 Ω , R ≥1M Ω : ΔR/R max. ±(5%+0.1 Ω ) Adhesion Clause 4.32 Pressurizing force: 5N, Test time: 10 ±1sec. No remarkable damage or removal of the terminations Insulation Resistance Clause 4.6 Apply the maximum overload voltage (DC) for 1minute R ≧10G Ω Dielectric Withstand Voltage Clause 4.7 Apply the maximum overload voltage (AC) for 1 minute No breakdown or flashover
Page 7 of 7 ASC_WT04X_V14 Apr.2010 PACKAGING Paper Tape specifications (unit :mm) Series No. A B W F E Series No. P1 P0 Φ D T 0 . 050 . 1+ Φ 0.85 ±0.05 Reel dimensions Symbol A B C D