WPN252010H1R0MT

TPS61299 TI | Alldatasheet

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Technical content

TPS61299X 100 nA Quiescent Current, 5.5 V Boost Converter with Input Current Limit and Fast Transient Performance

1 Features

• Input voltage range: 0.5 V to 5.5 V
• 0.7-V minimum input voltage for start-up
• Input operating voltage down to 150 mV with signal Vin > 0.7 V
• Output voltage range: 1.8 V to 5.5 V (VSEL pin select output voltage)
• Average input current limit: 5 mA; 25 mA; 50 mA; 100 mA; 250 mA, 500 mA, 1.2 A, 1.5 A (different versions)
• 100 nA typical quiescent current from VOUT
• 60 nA typical shutdown current from VIN and SW
• Up to 91 % efficiency at Vin = 3.6 V, Vout = 5 V, and Iout =10 μA
• Up to 94 % efficiency at Vin = 3.6 V, Vout = 5 V, and Iout =200 mA
• Fast transient performance: setting time ~8 μs at Vin = 3.6 V, Vout = 5 V, Iout = 0 A -> 200 mA
• True disconnection at EN low
• Automatic PFM/PWM mode transition
• Auto pass-through at Vin > Vout
• Output SCP and thermal shutdown protections
• 6-Pin WCSP (1.2 x 0.8) / SOT563 package (1.6 x 1.6)

2 Applications

• Smart watch, Smart band
• Portable medical equipment
• TWS

3 Description

The TPS61299X is a synchronous boost converter with 100-nA ultra-low quiescent current and average input current limit. The device provides a power solution for portable equipment with alkaline battery and coin cell battery. This device has high efficiency under light load condition to achieve long operation time and average input current limit can avoid battery discharging with high current. The TPS61299X has wide input voltage range from 0.5 V to 5.5 V and output voltage range from 1.8 V to 5.5 V. The device has different versions for average input current limit from 5 mA to 1.5 A. The TPS61299X with 1.2 A current limit can support up to 500 mA output current from 3 V to 5 V conversion and achieve approximately 94% efficiency at 200 mA load. The TPS61299X has optional fast load transient performance at output voltage is 4.5 V, 5 V or 5.5 V. In fast load transient, the typical setting time is 8 us when output current transient from 0 A to 200 mA. The TPS61299X supports optional force pass through or true shutdown function when it is disabled, which is flexible for always-on system. The TPS61299X offers a very small solution size with 6-ball 1.2-mm x 0.8-mm WCSP package and 6-pin 1.6-mm x 0.6-mm SOT583 package. Device Information PART NUMBER PACKAGE (1) BODY SIZE (NOM) TPS61299XYBHR WCSP 1.2-mm x 0.8-mm TPS61299XDRLR SOT563 1.6-mm x 1.6-mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application ADVANCE INFORMATION TPS61299 SLVSGS9 – MARCH 2023 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change without notice.

9.2 Typical Application-Li-ion Battery to 5V Boost

9.3 Typical Application-Li-ion Battery to 5V Boost

11.3 Receiving Notification of Documentation Updates.. 25

12 Mechanical, Packaging, and Orderable

4 Revision History

March 2023 * Advance Information TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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5 Device Comparison Table

PART NUMBER INPUT CURRENT LIMIT EN_LOW TPS61299 1.2 A True shutdown TPS61299Q 1.2 A True shutdown TPS61299A(1) 1.2 A Force pass through TPS612991(1) 5 mA True shutdown TPS612991A(1) 5 mA Force pass through TPS612992(1) 25 mA True shutdown TPS612992A(1) 25 mA Force pass through TPS612993 50 mA True shutdown TPS612993A(1) 50 mA Force pass through TPS612994(1) 100 mA True shutdown TPS612994A(1) 100 mA Force pass through TPS612995(1) 250 mA True shutdown TPS612995A(1) 250 mA Force pass through TPS612996(1) 500 mA True shutdown TPS612996A(1) 500 mA Force pass through TPS612997(1) 1.5 A True shutdown TPS612997A(1) 1.5 A Force pass through (1) Product Preview. Contact TI factory for more information. www.ti.com TPS61299 SLVSGS9 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TPS61299

6 Pin Configuration and Functions

Figure 6-1. YFF 6-Pin Package Top View Figure 6-2. DRV 6-Pin Package Top View Table 6-1. Pin Functions TERMINAL I/O DESCRIPTION NAME YBH DRL VIN A1 1 PWR IC power supply input SW B1 2 I The switch pin of the converter. It is connected to the drain of the internal low-side power MOSFET and source of the internal high-side power MOSFET. EN C1 3 I Enable logic input. Logic high voltage enables the device. Logic low voltage disables the device. VSEL C2 4 I Boost output voltage selection pin. Connect a resistor between this pin and ground to select one of 21 output voltages. VOUT B2 5 PWR Boost converter output GND A2 6 PWR Ground TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Voltage VIN, VOUT, SW, EN, VSEL –0.3 6.5 V SW spike at 10 ns -0.7 8 V SW spike at 1 ns -0.7 10 V TJ Operating Junction Temperature –40 125 °C Tstg Storage temperature –65 150 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

7.2 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001, all pins((1)) ±2000 V Charged device model (CDM), per JEDEC specificationJESD22-C101, all pins(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. [Following sentence optional; see the wiki.] Manufacturing with less than 500-V HBM is possible with the necessary precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. [Following sentence optional; see the wiki.] Manufacturing with less than 250-V CDM is possible with the necessary precautions.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 0.5 5.5 V VOUT Boost output voltage 1.8 5.5 V TJ Junction temperature –40 125 °C COUT Effective Output Capacitance at the OUT pin 5*0.8 10 µF CIN Effective Input Capacitance at the VIN pin 2.2 µF

7.4 Thermal Information

THERMAL METRIC(1) TPS61299 TPS61299 UNITYFF 6-BALLS YFF 6-BALLS Standard EVM RθJA Junction-to-ambient thermal resistance 130.0 107.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.9 N/A °C/W RθJB Junction-to-board thermal resistance 39.4 N/A °C/W ΨJT Junction-to-top characterization parameter 0.2 4.1 °C/W ΨJB Junction-to-board characterization parameter 39.4 62.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. www.ti.com TPS61299 SLVSGS9 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: TPS61299

7.5 Electrical Characteristics

TJ = -40°C to 125°C, VIN = 3.6V and VOUT = 5.0V. Typical values are at TJ = 25°C, unless otherwise noted. PARAMETER Version TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLY VIN Input voltage range All 0.5 5.5 V VIN_UVLO Under-voltage lockout threshold TPS61299, TPS61299X VIN rising 0.7 V VIN_UVLO Under-voltage lockout threshold All VIN falling 0.5 V IQ Quiescent current into VIN pin All IC enabled, No load, No switching, TJ up to 85°C 1 nA IQ Quiescent current into VOUT pin All IC enabled, No load, No switching, TJ up to 85°C 100 300 nA ISD Shutdown current into VIN pin TPS61299, TPS61299X EN = LOW, VIN = 3.6 V, VOUT = 0 V 60 nA IBY Quiescent current into VIN pin at force pass through mode TPS61299A, TPS61299XA EN = LOW 60 nA ILKG_SW Leakage current into SW pin (from SW pin to VOUT pin) All TJ = 25°C 1 4 nA TJ up to 85°C 1 20 nA Leakage current into SW pin (from SW pin to GND pin) TJ = 25°C 1 15 nA TJ up to 85°C 1 200 nA OUTPUT VOUT Output voltage setting range All 1.8 5.5 V VOUT_PWM_ACY Output voltage accuracy All PWM, PFM mode -2 2 % VOUT_SNOOZE_ ACY Output voltage accuracy All normal mode VOUT_PWM_ ACY+37.5m V V fast mode VOUT_PWM_ ACY+15mV V POWER SWITCH RDS(on) High-side MOSFET on resistance TPS61299X, TPS61299XA VOUT = 5.0 V 150 mOh m RDS(on) Low-side MOSFET on resistance TPS61299X, TPS61299XA VOUT = 5.0 V 88 mOh m ILIM Input current limit TPS61299, ILIM Input current limit TPS612991, TPS612991A VIN = 3.6 V, VOUT = 5.0 V 3 5 7 mA ILIM Input current limit TPS612992, TPS612992A VIN = 3.6 V, VOUT = 5.0 V 20 25 30 mA ILIM Input current limit TPS612993, TPS612993A VIN = 3.6 V, VOUT = 5.0 V 40 50 60 mA ILIM Input current limit TPS612994, TPS612994A VIN = 3.6 V, VOUT = 5.0 V 80 100 120 mA ILH Inductor current ripple All PWM 350 mA APPLICATION LOGIC INTERFACE VEN_H EN logic high threshold All VIN >= 1.05 V 0.84 V VEN_L EN logic low threshold All VIN >= 1.05 V 0.36 V VEN_H EN logic high threshold All VIN < 1.05 V 0.8*VIN V VEN_L EN logic low threshold All VIN < 1.05 V 0.2*VIN V IEN_LKG Leakage current into EN pin All VEN=5V 1 50 nA TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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TJ = -40°C to 125°C, VIN = 3.6V and VOUT = 5.0V. Typical values are at TJ = 25°C, unless otherwise noted. PARAMETER Version TEST CONDITIONS MIN TYP MAX UNIT REN EN pin pulldown resistor All EN=low 800 kOhm PROTECTION TSD Thermal shutdown threshold TJ rising 150 °C TSD_HYS Thermal shutdown hysteresis TJ falling below TSD 20 °C www.ti.com TPS61299 SLVSGS9 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: TPS61299

7.6 Typical Characteristics

VIN = 3.6 V, VOUT = 5 V, Normal Mode, TJ = 25°C, unless otherwise noted Output Current (A) Efficiency (%) 100 V IN =0.7V V IN =1.8 V V IN =2.7 V V IN =3.6 V V IN =4.3 V V IN =5.0 V Figure 7-1. 5.0-V VOUT Efficiency with Different Inputs under Normal Mode Output Current (A) Output Voltage (V) 4.95 5.05 5.1 V IN =0.7V V IN =1.8V V IN =2.7V V IN =3.6V V IN =4.3V V IN =5.0V Figure 7-2. 5.0-V VOUT Load Regulation under Normal Mode Output Current (A) Efficiency (%) 100 V IN =0.7V V IN =1.9 V V IN =3.0 V VIN = 0.7 V, 1.9 V, 3.0 V VOUT = 3.3 V Figure 7-3. 3.3-V VOUT Efficiency with Different Inputs under Normal Mode Output Current (A) Output Voltage (V) 3.25 3.3 3.35 V IN =0.7V V IN =1.9V V IN =3.0V VIN =0.7 V, 1.9 V, 3.0V VOUT= 3.3 V Figure 7-4. 3.3-V VOUT Load Regulation under Normal Mode Output Current (A) Efficiency (%) 82.5 87.5 92.5 97.5 V IN =3.0 V V IN =3.6 V V IN =4.3 V VIN = 3.0 V, 3.6 V, 4.3 V VOUT = 3.3 V Figure 7-5. 5.0-V VOUT Efficiency with Different Inputs under Fast Mode Output Current (A) Output Voltage (V) 4.9 4.95 5.05 5.1 V IN =3.0V V IN =3.6V V IN =4.3V VIN =3.0 V, 3.6 V, 4.3 V VOUT= 5 V Figure 7-6. 5-V VOUT Load Regulation under Fast Mode TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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8 Detailed Description

8.1 Overview

The TPS61299X is a synchronous step-up converter and operates in a hysteretic control scheme. The TPS61299X has a wide input voltage supply range between 0.5 V and 5.5 V ( 0.7V rising voltage for start-up). It only consumes 100 nA quiescent current and can achieve up high efficiency under light load condition. The TPS61299X family provide wide input current limit from 5 mA to 1.5 A and support optional true shutdown function or force pass through function at EN is low. TPS61299X provides a fast transient performance mode and accurate load regulation mode for different system.

8.2 Functional Block Diagram

Figure 8-1. Functional Block Diagram

8.3 Feature Description

8.3.1 Boost Control Operation

The TPS61299X boost converter is controlled by a hysteretic current mode controller. This controller regulates the output voltage by keeping the inductor ripple current constant in the range of 350 mA and adjusting the valley current of this inductor depending on the output load. Since the input voltage, output voltage and inductor value all affect the rising and falling slopes of inductor ripple current, the switching frequency is not fixed and is determined by the operation condition. If the required average input current is lower than the average inductor current defined by this constant ripple, the inductor current goes discontinuously to keep the efficiency high under light load condition. If the load current is reduced further, the boost converter enters into Burst mode. In Burst mode, the boost converter ramps up the output voltage with several switching cycles. Once the output voltage exceeds a setting threshold (Vout_target + 50 mV in normal mode and Vout_target + 25 mV in fast load TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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transient mode), the device stops switching and goes into a sleep status. In sleep status, the device consumes less quiescent current, 100 nA. The boost converter resumes switching when the output voltage is below the setting threshold ( Vout_target + 25 mV). The device exits the Burst mode when the output current can no longer be supported in this mode. Figure 8-2. Control Modes under Different Load

8.3.2 Version Detection

The TPS61299X supports 21 internal output voltage setting options by connecting a resistor between the VSEL pin and ground. During start-up, when output voltage reaches close to 1.8V, the device starts to detect the configuration conditions of the VSEL pin. The TPS61299X checks the VSEL pin by lowering resistance setting options to higher setting options until the user finds the setting configuration by a 10- μs clock. After detecting the configuration, the TPS61299X latches the setting output regulation voltage. The TPS61299X does not detect the VSEL pins during operation, so changing the resistor during operation does not change the VSEL setting. Toggling the EN pin during operation is one way to refresh the it. For proper operation, TI suggests that the setting resistance accuracy must be 1% and the parasitic capacity of the VSEL pin be less than 10 pF. Table 8-1. VSEL Pin Configuration Resistance (kΩ) VOUT_REG (V) Resistance (kΩ) VOUT_REG (V) Resistance (kΩ) VOUT_REG (V) Resistance (kΩ) VOUT_REG (V) 6.19 5.2 22.6 4 124 3 365 1.8 7.87 5 28.7 3.8 154 2.8 442/ Vout pin 5(fast) 9.76 4.8

8.3.3 Under-voltage Lockout

The TPS61299X has a built-in under-voltage lockout (UVLO) circuit to ensure the device working properly. When the input voltage is above the UVLO rising threshold of 0.7 V, the TPS61299X can be enabled to boost the output voltage. After the TPS61299X starts up and the output voltage is above 1.8 V, the TPS61299X can work with the input voltage as low as 0.5 V. www.ti.com TPS61299 SLVSGS9 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: TPS61299

8.3.4 Switching Frequency

The TPS61299X boost converter does not have fixed frequency and it keeps the inductor ripple current constant in the range of 350 mA, so the frequency is determined by the operation condition. E.g. the frequency is approximately 3MHz for the input is 3.6V, output is 5V, inductor is 1uH.

8.3.5 Input Current Limit

The TPS61299X employs the input average current protection (OCP) function. If the inductor average current reaches the current limit threshold ILIM, the control loop can limit the inductor average current. In this case the output voltage decreases until the power balance between input and output is achieved. If the output drops below the input voltage, the TPS61299X enters into Down Mode. If the output drops below 1.6 V, the TPS61299X enters into startup process again. In Pass-Through operation, input current limit function is not enabled.

8.3.6 Enable and Disable

When the input voltage is above UVLO rising threshold and the EN pin is pulled to high voltage, the TPS61299X is enabled. When the EN pin is pulled to low voltage, the TPS61299X goes into shutdown mode. In shutdown mode, TPS61299X has two versions, true shutdown version and force pass through version. In true shutdown version, the device stops switching and the high-side MOSFET fully turns off, providing the completed disconnection between input and output. And in force pass through version, the high-side MOSFET turns on and output connects with input. Less than 100-nA input current is consumed in shutdown mode.

8.3.7 Soft Start

After the EN pin is tied to high voltage, the TPS61299X begins to startup. For the high input current limit is 250 mA, 500 mA, 1.2 A and 1.5 A version, at the beginning, when output voltage is lower than 0.5V, device limits the output power for the short protection. As output voltage is higher than 0.5V, the device operates at the boundary of Discontinuous Conduction Mode (DCM) and Continuous Conduction Mode (CCM), and the inductor peak current is limited to around 350 mA during this stage. After the output voltage reaches close to 1.8 V, the TPS61299X starts to detect the output voltage configuration of the VSEL pins, then latches the configuration. The version detection time depends on the resistance at VSEL pin, the higher resistance, the longer version detection time. Eg. for 5V normal version, the TPS61299X needs approximately 170 us for version detection. After version detection, TPS61299X continues switching and output ramps up further. The internal soft-start time is approximately 1.3ms, and the output soft start time varies with the different output capacitance, load condition, and configuration conditions. The TPS61299X limits the inductor average current lower than 500mA, (input current limit to 250mA for 250mA version) when output voltage is lower than 2.5V. In this way, the soft start function reduces the inrush current during startup. For the low input current limit 5 mA, 25 mA, 50 mA and 100 mA version, the device limits the input current limit to 25 mA during the soft start. The device works at DCM during start up. TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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Figure 8-3. Soft Start Procedure

8.3.8 Down Mode

During the start-up, when the input voltage is higher than the output voltage, the TPS61299X works at the down mode to keep the switching. In the Down Mode, the behavior of the rectifying PMOS by pulling its gate to input voltage instead of to ground. In this way, the voltage drop across the PMOS is increasing as high as to regulate the output voltage. The power loss also increases in this mode, which needs to be taken into account for thermal consideration.

8.3.9 Pass-Through Operation

The TPS61299X features down mode and pass-through operation when input voltage is close to or higher than output voltage. In the down mode, output is regulated at target voltage even when input voltage is higher than output voltage. The control circuit changes the behavior of the rectifying PMOS by pulling its gate to input voltage instead of to ground. In this way, the voltage drop across the PMOS is increasing as high as to regulate the output voltage. In pass through mode, the TPS61299X stops switching and turns on the high side PMOS FET. The output voltage is the input voltage minus the voltage drop across the DCR of the inductor and the Rdson of the PMOS FET. In pass though operation, the input current limit function, reverse current protection and thermal shutdown are not enable. For the input current limit is equal or higher than 250mA version, TPS61299, TPS612995, TPS612996 and TPS612997. With input voltage ramping up, the TPS61299X goes into down mode when Vin >Vout-35mV. The device stays in down mode until Vin >Vout+100mV and then goes automatically into pass through operation. In the pass through operation, output voltage follows input voltage. The TPS61299X exits pass though operation and goes back to boost mode when the output voltage drops below the setting target voltage minus 75mV. www.ti.com TPS61299 SLVSGS9 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: TPS61299

Figure 8-4. Mode Transition for 250mA and Higher Input Current Limit Version For the input current limit is equal or lower than 100mA version, TPS612991, TPS612992, TPS612993 and TPS612994. With input voltage ramping up, the TPS61299X goes into down mode when Vin >Vout-35mV(Vboost_down). It stays in down mode until Vin >Vout+23mV(V down_pass) and then goes automatically into pass through operation. In the pass through operation, output voltage follows input voltage. The TPS61299X exits pass though operation and goes back to boost mode when the output voltage drops below the setting target voltage minus 75mV(Vpass_boost). Figure 8-5. Mode Transition for 100mA and Lower Input Current Limit Version

8.3.10 Output Short-to-ground Protection

When the VOUT pin is short to ground and the output voltage becomes less than 0.5 V, the TPS61299X starts to limit the inductor current, the same with soft start operation. The TPS61299X works at the boundary of Discontinuous Conduction Mode (DCM) and Continuous Conduction Mode (CCM) when the input voltage is lower than 1.8V and works at DCM at input voltage is higher than 1.8V. TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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Once the short circuit is released, the TPS61299X goes through the soft startup again to the regulated output voltage.

8.3.11 Thermal Shutdown

The TPS61299X goes into thermal shutdown once the junction temperature exceeds 150°C. When the junction temperature drops below the thermal shutdown temperature threshold less the hysteresis, typically 130°C, the device starts operating again. www.ti.com TPS61299 SLVSGS9 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: TPS61299

8.4 Device Functional Modes

8.4.1 Fast Load transient Mode and Normal Mode

The TPS61299X has two modes, fast load transient mode and normal mode, which is selected by VSEL pin. In the fast load transient mode, the loop response speed is fast. Eg the load transient settling time is about 8 us when output current transient from 0A to 200mA at 3.6V to 5V condition. But the trade-off is the load regulation. Normal mode has the better load regulation. Figure 8-6. Transient performance comparison under Fast Mode and Normal Mode TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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9 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

9.1 Application Information

The TPS61299X is a synchronous step-up converter and operates in a hysteretic control scheme. The TPS61299X has a wide input voltage supply range between 0.5 V and 5.5 V(0.7V rising voltage for start up). The device only consumes 100 nA quiescent current and can achieve up high efficiency under light load condition. The TPS61299X family provide wide input current limit from 5mA to 1.5A and support optional true shutdown function or force pass through function at EN is low. TPS61299X provides a fast transient performance mode and accurate load regulation mode for different system.

9.2 Typical Application-Li-ion Battery to 5V Boost Converter under Fast Mode

The TPS61299X can operate under fast transient mode with 8us settling time under 0-200mA load step. Set the VSEL according to table 8-1 to select different target VOUT under fast mode. Figure 9-1. 3.6-V Input Source to 5-V Boost Converter under Fast Mode

9.2.1 Design Requirements

The design parameters are listed in Table 9-1. Table 9-1. Design Requirements PARAMETERS VALUES Input Voltage 2.7 V ~ 4.3 V Output Voltage 5 V ( fast mode ) Output Current 500 mA Output Voltage Ripple ± 50 mV

9.2.2 Detailed Design Procedure

9.2.2.1 Maximum Output Current

The maximum output capability of the TPS61299X is determined by the input-to-output ratio and the current limit of the boost converter. The maximum output current can be estimated by Equation 1. IOUT (max )= VIN ILIM VOUT η (1) www.ti.com TPS61299 SLVSGS9 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: TPS61299

• η is the conversion efficiency, use 85% for estimation.
• ILIM is the average switch current limit. Minimum input voltage, maximum boost output voltage, and minimum current limit I LIM are used as the worst case condition for the estimation.

9.2.2.2 Inductor Selection

The TPS61299X boost converter does not have fixed frequency and it keeps the inductor ripple current constant in the range of 350 mA, so the frequency is determined by the inductance and working voltage. The TPS61299X is designed to work with inductor value of 1 uH. Table 9-2. Recommended Inductors for the TPS61299X PART NUMBER L (µH) DCR MAX (mΩ) SATURATION CURRENT (A) SIZE (LxWxH) VENDOR(1) HTTH16080H-1R0MSR-99 1 110 2.3 1.6 × 0.8 × 0.8 Cyntec WIP252010P-1R0ML 1 54 3.5 2.5 x 2.0 x 1.0 INPAQ WPN252010H1R0MT 1 76 3.5 2.5 x 2.0 x 1.0 Sunlord (1) See the Third-Party Products disclaimer

9.2.2.3 Output Capacitor Selection

The output capacitor is mainly selected to meet the requirements for output ripple and loop stability. The ripple voltage is related to capacitor capacitance and its equivalent series resistance (ESR). Assuming a ceramic capacitor with zero ESR, the minimum capacitance needed for a given ripple voltage can be calculated by Equation 2. OUT MAX OUT SW RIPPLE I D C f V u u (2) where

• DMAX is the maximum switching duty cycle.
• VRIPPLE is the peak-to-peak output ripple voltage.
• IOUT is the maximum output current.
• fSW is the switching frequency. The ESR impact on the output ripple must be considered if tantalum or aluminum electrolytic capacitors are used. The output peak-to-peak ripple voltage caused by the ESR of the output capacitors can be calculated by Equation 3. RIPPLE(ESR) L(P) ESRV I R u (3) Take care when evaluating the derating of a ceramic capacitor under DC bias voltage, aging, and AC signal. For example, the DC bias voltage can significantly reduce capacitance. A ceramic capacitor can lose more than 50% of its capacitance at its rated voltage. Therefore, always leave margin on the voltage rating to make sure there is adequate capacitance at the required output voltage. Increasing the output capacitor makes the output ripple voltage smaller in PWM mode. TI recommends using the X5R or X7R ceramic output capacitor in the range of 4- μF to 1000- μF effective capacitance. The output capacitor affects the small signal control loop stability of the boost regulator. If the output capacitor is below the range, the boost regulator can potentially become unstable. Increasing the output capacitor makes the output ripple voltage smaller in PWM mode. TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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9.2.2.4 Input Capacitor Selection

Multilayer X5R or X7R ceramic capacitors are excellent choices for the input decoupling of the step-up converter as they have extremely low ESR and are available in small footprints. Input capacitors must be located as close as possible to the device. While a 10- μF input capacitor is sufficient for most applications, larger values can be used to reduce input current ripple without limitations. Take care when using only ceramic input capacitors. When a ceramic capacitor is used at the input and the power is being supplied through long wires, a load step at the output can induce ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop instability or can even damage the part. In this circumstance, place additional bulk capacitance (tantalum or aluminum electrolytic capacitor) between ceramic input capacitor and the power source to reduce ringing that can occur between the inductance of the power source leads and ceramic input capacitor.

9.2.3 Application Curves

Vout(5V o set) 20mV/div SW 5V/div Time scale: 20ms/div VIN = 3.6 V IOUT = 0A Figure 9-2. Switching Waveform at Open Load Inductor Current 200mA/div Vout(5V o set) 10mV/div SW 5V/div Time scale: 10us/div VIN = 3.6 V IOUT = 1 mA Figure 9-3. Switching Waveform at Light Load Inductor Current 200mA/div Vout(5V o set) 10mV/div SW 5V/div Time scale: 200ns/div VIN = 3.6 V IOUT = 50mA Figure 9-4. Switching Waveform at Medium Load Vout (5V o set) 20mV/div Time scale: 200ns/div Inductor current 200mA /div SW 5V/div VIN = 3.6 V IOUT = 300 mA Figure 9-5. Switching Waveform at Heavy Load www.ti.com TPS61299 SLVSGS9 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: TPS61299

Time scale: 500us/div VIN = 3.6 V VOUT =5 V Rload = 500 Ω Figure 9-6. Start-Up by EN Inductor Current 200mA/div Vout 2V/div EN 2V/div Time scale: 2ms/div VIN = 3.6 V VOUT =5 V Rload = 500 Ω Figure 9-7. Shutdown by EN Output Current 100mA/div Vout (5V o set) 100mV/div Time scale: 50us/div VIN = 3.6V, VOUT =5V, IOUT = 0 to 200mA with 20-μs slew rate Figure 9-8. Load Transient Vin 2V /div Vout (5V o set) 100mV/div Time scale: 200us/div VIN= 2.0V to 4.5V with 20-μs slew rate,VOUT =5V,Rload = 25 Ω Figure 9-9. Line Transient Vout (5V o set) 200mV/div Time scale: 200us/div Output current 100mA /div VIN = 3.6 V, VOUT = 5 V, IOUT = 0 A to 400 mA Sweep Figure 9-10. Load Sweep Vin 1V /div Vout (5V o set) 100mV/div Time scale: 10ms/div Inductor current 500mA /div VIN = 2 V to 4.5 V Sweep, VOUT = 5 V, 25-Ω resistance load Figure 9-11. Line Sweep

9.3 Typical Application-Li-ion Battery to 5V Boost Converter under Normal Mode

The TPS61299X can also operate under normal mode with slightly slower transient performance than fast mode. Set the VSEL according to Table 8-1 to select different target VOUT under normal mode. The design parameters are listed in Table 9-3. The recommended schematic is shown in Figure 9-12. TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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Figure 9-12. 3.6-V Input Source to 5-V Boost Converter under Normal Mode Table 9-3. Design Requirements PARAMETERS VALUES Input Voltage 2.7 V ~ 4.3 V Output Voltage 5 V ( normal mode ) Output Current 500 mA Output Voltage Ripple ± 50 mV

9.3.1 Application Curves

Vout(5V o set) 10mV/div SW 5V/div Time scale: 100ms/div VIN = 3.6 V IOUT = 0A Figure 9-13. Switching Waveform at Open Load Inductor Current 200mA/div Vout(5V o set) 10mV/div SW 5V/div Time scale: 50us/div VIN = 5 V IOUT = 1 mA Figure 9-14. Switching Waveform at Light Load Inductor Current 200mA/div Vout(5V o set) 20mV/div SW 5V/div Time scale: 200ns/div VIN = 5 V IOUT = 50mA Figure 9-15. Switching Waveform at Medium Load Vout (5V o set) 20mV/div Time scale: 200ns/div Inductor current 200mA /div SW 5V/div VIN = 5 V IOUT = 400 mA Figure 9-16. Switching Waveform at Heavy Load www.ti.com TPS61299 SLVSGS9 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: TPS61299

Time scale: 500us/div VIN = 3.6 V VOUT =5 V Rload = 500 Ω Figure 9-17. Start-Up by EN Inductor Current 200mA/div Vout 2V/div EN 2V/div Time scale: 2ms/div VIN = 3.6 V VOUT =5 V Rload = 500 Ω Figure 9-18. Shutdown by EN Output Current 100mA/div Vout (5V o set) 100mV/div Time scale: 50us/div VIN = 3.6V, VOUT =5V, IOUT = 0 to 200mA with 20-μs slew rate Figure 9-19. Load Transient Vin 2V /div Vout (5V o set) 100mV/div Time scale: 200us/div VIN = 2.0V to 4.5V with 20-μs slew rate,VOUT =5V,Rload =25Ω Figure 9-20. Line Transient Vout (5V o set) 200mV/div Time scale: 200us/div Output current 100mA /div VIN = 3.6 V, VOUT = 5 V, IOUT = 0 A to 400 mA Sweep Figure 9-21. Load Sweep Vin 1V /div Vout (5V o set) 100mV/div Time scale: 10ms/div Inductor current 500mA /div VIN = 2 V to 4.5 V Sweep, VOUT = 5 V, 25-Ω resistance load Figure 9-22. Line Sweep TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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9.4 Power Supply Recommendations

The device is designed to operate from an input voltage supply range between 0.7 V to 5.5 V. This input supply must be well regulated. If the input supply is located more than a few inches from the converter, additional bulk capacitance can be required in addition to the ceramic bypass capacitors. A typical choice is a tantalum or aluminum electrolytic capacitor with a value of 100 µF. Output current of the input power supply must be rated according to the supply voltage, output voltage, and output current of the TPS61299X.

9.5 Layout

9.5.1 Layout Guidelines

As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator can show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground paths. The input and output capacitors , as well as the inductor are placed as close as possible to the IC.

9.5.2 Layout Example

The bottom layer is a large GND plane connected by vias. Figure 9-23. Layout Example www.ti.com TPS61299 SLVSGS9 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: TPS61299

10 Thermal Information

The maximum IC junction temperature is restricted to 125°C under normal operating conditions. Calculate the maximum allowable dissipation, P D(max) , and keep the actual power dissipation less than or equal to PD(max) . The maximum-power-dissipation limit is determined using equation (10)Section 9.5. A D max JA

125 TP RT

(4) Where

• TA is the maximum ambient temperature for the application
• ƟJA is the junction-to-ambient thermal resistance given in the Thermal Information table. The TPS61299X comes in a WCSP or SOT583 package. The real junction-to-ambient thermal resistance of the package greatly depends on the PCB type and layout. Using thick PCB copper and soldering GND pin to a large ground plate enhances the thermal performance. Using more vias connects the ground plate on the top layer and bottom layer around the IC without solder mask also improves the thermal capability. TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

• Texas Instruments, Performing Accurate PFM Mode Efficiency Measurements Application Report
• Texas Instruments, Accurately Measuring Efficiency of Ultra-low-IQ Devices Technical Brief
• Texas Instruments, IQ: What it is, What it isn’t, and How to Use it Techanical Brief

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

11.5 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions. www.ti.com TPS61299 SLVSGS9 – MARCH 2023 ADVANCE INFORMATION Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 25 Product Folder Links: TPS61299

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. TPS61299 SLVSGS9 – MARCH 2023 www.ti.com ADVANCE INFORMATION

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www.ti.com 31-Mar-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples XTPS61299YBHR ACTIVE DSBGA YBH 6 6000 TBD Call TI Call TI -40 to 125 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

www.ti.com PACKAGE OUTLINE C0.4 MAX 0.16 0.10 0.8 TYP 0.4 TYP 6X 0.225 0.185 0.4 TYP B E A D 4224514/A 08/2018 DSBGA - 0.4 mm max heightYBH0006 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. BALL A1 CORNER SEATING PLANE BALL TYP 0.05 C A 1 2

0.015 C A B

B C SCALE 12.000

www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN0.05 MAX 6X ( 0.2) (0.4) TYP (0.4) TYP ( 0.2) SOLDER MASK OPENING ( 0.2) METAL 4224514/A 08/2018 DSBGA - 0.4 mm max heightYBH0006 DIE SIZE BALL GRID ARRAY NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM 1 2 A B LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 50X C NON-SOLDER MASK DEFINED EXPOSED METAL SOLDER MASK OPENING SOLDER MASK DEFINED (PREFERRED) METAL UNDER SOLDER MASK EXPOSED METAL

www.ti.com EXAMPLE STENCIL DESIGN (0.4) TYP (0.4) TYP 4224514/A 08/2018 DSBGA - 0.4 mm max heightYBH0006 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. SYMM SYMM 1 2 A B SOLDER PASTE EXAMPLE BASED ON 0.075 mm THICK STENCIL SCALE: 50X METAL TYP C

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