WMF128K8-120DEC5A

WMF128K8-XXX5 WEDC | Alldatasheet

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1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. 128Kx8 MONOLITHIC FLASH, SMD 5962-96690

FEATURES

/square6 Access Times of 50*, 60, 70, 90, 120, 150ns /square6 Packaging

• 32 lead, Hermetic Ceramic, 0.400" SOJ (Package 101)
• 32 pin, Hermetic Ceramic, 0.600" DIP (Package 300)
• 32 lead, Flatpack (Package 220)
• 32 lead, Formed Flatpack (Package 221)
• 32 pin, Rectangular Ceramic Leadless Chip Carrier (Package 601) /square6 100,000 Erase/Program Cycles Minimum /square6 Sector Erase Architecture
• 8 equal size sectors of 16KBytes each
• Any combination of sectors can be concurrently erased. Also supports full chip erase /square6 Organized as 128Kx8 /square6 Commercial, Industrial and Military Temperature Ranges /square6 5 Volt Programming. 5V ± 10% Supply. /square6 Low Power CMOS /square6 Embedded Erase and Program Algorithms /square6 TTL Compatible Inputs and CMOS Outputs /square6 Page Program Operation and Internal Program Control Time. This product is subject to change without notice. Note: For programming information refer to Flash Programming 1M5 Application Note. * The access time of 50ns is available in Industrial and Commercial temperature ranges only. Pin Confi guration For WMF128K8-XXX5 Pin Description A0-16 Address Inputs I/O0-7 Data Input/Output CS# Chip Select OE# Output Enable WE# Write Enable VCC +5.0V Power VSS Ground NC A16 A15 A12 I/O0 I/O1 I/O2 V SS VCC WE# NC A14 A13 A11 OE# A10 CS# I/O7 I/O6 I/O5 I/O4 I/O3 Top View

32 DIP

32 CSOJ

32 Flatpack

OE# A10 CS# I/O7 A12 A15 A16 NC V CC WE# NC Pin Confi guration For WMF128K8-XCLX5 Top View

32 CLCC

2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. ABSOLUTE MAXIMUM RATINGS (1) Parameter Unit Operating Temperature -55 to +125 °C Supply Voltage (V CC) -2.0 to +7.0 V Signal Voltage Range (any pin except A9) (2) -2.0 to +7.0 V Storage Temperature Range -65 to +150 °C Lead Temperature (soldering, 10 seconds) +300 °C Data Retention Mil Temp 10 years Endurance (write/erase cycles) (Mil Temp) 10,000 min cycles A9 Voltage for sector protect (V NOTES: 1. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may overshoot V SS to -2.0 V for periods of up to 20ns. Maximum DC voltage on output and I/O pins is VCC + 0.5V. During voltage transitions, outputs may overshoot to Vcc + 2.0 V for periods of up to 20ns. 3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is +13.5V which may overshoot to 14.0 V for periods up to 20ns. DC CHARACTERISTICS — CMOS COMPATIBLE VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol Conditions Min Max Unit Input Leakage Current I LI VCC = 5.5, VIN = GND to VCC 10 µA Output Leakage Current I LO VCC = 5.5, VIN = GND to VCC 10 µA VCC Active Current for Read (1) I CC1 CS# = VIL, OE# = VIH 35 mA VCC Active Current for Program or Erase (2) I CC2 CS# = VIL, OE# = VIH 50 mA VCC Standby Current I CC3 VCC = 5.5, CS# = VIH, f = 5MHz 1.6 mA Output Low Voltage V OL IOL = 8.0 mA, VCC = 4.5 0.45 V Output High Voltage V OH1 IOH = -2.5 mA, VCC = 4.5 0.85 x V CC V Output High Voltage V OH2 IOH = -100 µA, VCC = 4.5 V CC - 0.4 V Low VCC Lock-Out Voltage V LKO 3.2 V NOTES: 1. The I CC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically is less than 2 mA/MHz, with OE# at VIH. 2. I CC active while Embedded Algorithm (program or erase) is in progress. 3. DC test conditions: V IL = 0.3V, VIH = VCC - 0.3V RECOMMENDED OPERATING CONDITIONS Parameter Symbol Min Max Unit Supply Voltage V CC 4.5 5.5 V Input High Voltage V IH 2.0 V CC + 0.5 V Input Low Voltage V IL -0.5 +0.8 V Operating Temp. (Mil.) T A -55 +125 °C Operating Temp. (Ind.) T A -40 +85 °C A9 Voltage for Sector Protect V ID 11.5 12.5 V CAPACITANCE TA = +25°C Parameter Symbol Conditions Max Unit Address Input capacitance C AD VI/O = 0 V, f = 1.0 MHz 15 pF Output Enable capacitance C OE VIN = 0 V, f = 1.0 MHz 15 pF Write Enable capacitance C WE VIN = 0 V, f = 1.0 MHz 15 pF Chip Select capacitance C CS VIN = 0 V, f = 1.0 MHz 15 pF Data I/O capacitance C I/O VI/O = 0 V, f = 1.0 MHz 15 pF This parameter is guaranteed by design but not tested. AC TEST CIRCUIT AC TEST CONDITIONS Parameter Typ Unit Input Pulse Levels VIL = 0, VIH = 3.0 V Input Rise and Fall 5 ns Input and Output Reference Level 1.5 V Output Timing Reference Level 1.5 V Notes: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 Ω. V Z is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. I Current Source D.U.T. C = 50 pfeff IOL V 1.5V (Bipolar Supply) Z Current Source OH

3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. AC CHARACTERISTICS – READ ONLY OPERATIONS VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol -50 -60 -70 -90 -120 -150 Unit Min Max Min Max Min Max Min Max Min Max Min Max Read Cycle Time t AVAV tRC 50 60 70 90 120 150 ns Address Access Time t AVQV tACC 50 60 70 90 120 150 ns Chip Select Access Time t ELQV tCE 50 60 70 90 120 150 ns OE# to Output Valid t GLQV tOE 25 30 35 40 50 55 ns Chip Select to Output High Z (1) t EHQZ tDF 20 20 20 25 30 35 ns OE# High to Output High Z (1) t GHQZ tDF 20 20 20 25 30 35 ns Output Hold from Address, CS# or OE# Change, whichever is First tAXQX tOH 000000 n s NOTES: 1. Guaranteed by design, but not tested AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE# CONTROLLED VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol -50 -60 -70 -90 -120 -150 Unit Min Max Min Max Min Max Min Max Min Max Min Max Write Cycle Time t AVAV tWC 50 60 70 90 120 150 ns Chip Select Setup Time t ELWL tCS 000000 n s Write Enable Pulse Width t WLWH tWP 25 30 35 45 50 50 ns Address Setup Time t AVWH tAS 000000 n s Data Setup Time t DVWH tDS 25 30 30 45 50 50 ns Data Hold Time t WHDX tDH 000000 n s Address Hold Time t WHAX tAH 40 45 45 45 50 50 ns Chip Select Hold Time t WHEH tCH 000000 n s Write Enable Pulse Width High t WHWL tWPH 20 20 20 20 20 20 ns Duration of Byte Programming Operation (min) tWHWH1 14 14 14 14 14 14 µs Read Recovery Time before Write t GHWL 000000 m s VCC Set-up Time t VCS 50 50 50 50 50 50 µs Output Enable Setup Time t OES 000000 n s Output Enable Hold Time (1) t OEH 10 10 10 10 10 10 ns NOTES: 1. For Toggle and Data# Polling.

4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,CS# CONTROLLED VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol -50 -60 -70 -90 -120 -150 Unit Min Max Min Max Min Max Min Max Min Max Min Max Write Cycle Time tAVAV tWC 50 60 70 90 120 150 ns WE# Setup Time tWLEL tWS 000000 n s CS# Pulse Width tELEH tCP 25 30 35 45 50 50 ns Address Setup Time tAVEL tAS 000000 n s Data Setup Time tDVEH tDS 25 30 30 45 50 50 ns Data Hold Time tEHDX tDH 000000 n s Address Hold Time tELAX tAH 40 45 45 45 50 50 ns WE# Hold from WE# High tEHWH tWH 0000 00 n s CS# Pulse Width High tEHEL tCPH 20 20 20 20 20 20 ns Duration of Programming Operation tWHWH1 14 14 14 14 14 14 µs Read Recovery before Write tGHEL 000000 n s

5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. AC WAVEFORMS FOR READ OPERATIONS sesserddA S#C E#O E#W stuptuO Z hgiH elbatS sesserddA t EO t CR dilaV tuptuO t EC t CCA t HO Z hgiH t FD

6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. NOTES: 1. PA is the address of the memory location to be programmed. 2. PD is the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to each chip. 4. D OUT is the output of the data written to the device. 5. Figure indicates last two bus cycles of four bus cycle sequence. WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED sesserddA CS# E#O E#W ataD V 0.5 APAPH5555 t CW t SC DP D#7 D TUO t HA t HPW t HD t SD Data# Polling t SA t CR t PW H0A0A t EO t FD t HO t EC t LWHG t 1HWHW

7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS NOTE: 1. SA is the sector address for Sector Erase. Addresses CS# OE# WE# Data VCC 5555H 2AAAH 2AAAH SA 5555H 5555H tWP tCS tVCS 1010H/3030H5555H8080H5555H AAAAHAAAAH tAH tAS tGHWL tWPH tDH tDS

8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS S#C E#O E#W t EO t EO t EC t HC t HO O# #/I 7 O/I dna 51 O/I 7 O/I dna 51 ataD dilaV Z hgiH O/I 6-0 O/I dna 41-8 dilavnI O/I 51-0 ataD dilaV t FD O/I 7 dna O/I 51 O/I 6-0 dna O/I 41-8 t HEO t 2 ro 1 HWHWataD

9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. NOTES: 1. PA represents the address of the memory location to be programmed. 2. PD represents the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to each chip. 4. DOUT is the output of the data written to the device. 5. Figure indicates the last two bus cycles of a four bus cycle sequence. ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS sesserddA E#W E#O S#C ataD V 0.5 APAPH5555 t CW t SW DP D#7 D TUO t HA t HPC t PC t HD t SD Data# Polling t SA t LEHG H0A t 1HWHW

10 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES PACKAGE 101: 32 LEAD, CERAMIC SOJ 1.27 (0.050) TYP 19.1 (0.750) TYP 11.3 (0.442) ± 0.30 (0.012) 3.96 (0.156) MAX 0.2 (0.008) ± 0.05 (0.002) 0.89 (0.035) Radius TYP PIN 1 IDENTIFIER PACKAGE 220: 32 LEAD, CERAMIC FLATPACK ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES 10.41 (0.410) ± 0.13 (0.005) 2.60 (0.102) MAX 0.127 (0.005) + 0.05 (0.002) 0.025 (0.001) PIN 1 IDENTIFIER 1.27 (0.050) TYP 19.05 (0.750) TYP 10.16 (0.400) ± 0.51 (0.020) 0.43 (0.017) ± 0.05 (0.002) 20.83 (0.820) ± 0.25 (0.010)

11 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. PACKAGE 300: 32 PIN, CERAMIC DIP, SINGLE CAVITY SIDE BRAZED 2.5 (0.100) TYP 1.27 (0.050) ± 0.1 (0.005) 0.46 (0.018) ± 0.05 (0.002) 0.84 (0.033) ± 0.4 (0.014) 3.2 (0.125) MIN 15.04 (0.592) ± 0.3 (0.012) 0.25 (0.010) ± 0.05 (0.002) 15.25 (0.600) ± 0.25 (0.010) PIN 1 IDENTIFIER ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES PACKAGE 221: 32 LEAD, FORMED CERAMIC FLATPACK ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES 10.41 (0.410) ±0.13 (0.005) 1.27 (0.050) TYP 19.05 (0.750) TYP 1.52 (0.060) TYP 0.43 (0.017) ±0.05 (0.002) 20.83 (0.820) ±0.25 (0.010) 3.35 (0.132) MAX TYP 13.47 (0.530) ±0.13 (0.005)

12 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES PACKAGE 601: 32 PIN, RECTANGULAR CERAMIC LEADLESS CHIP CARRIER 7.62 (0.300) TYP 5.08 (0.200) TYP 3.81 (0.150) TYP 10.16 (0.400) TYP 0.38 (0.015) x 45° PIN 1 IDENTIFIER 0.56 (0.022) 0.71 (0.028) 11.25 (0.443) 11.60 (0.457) 13.79 (0.543) 14.15 (0.557) 1.63 (0.064) 2.54 (0.100) PIN 1 1.02 (0.040) x 45°

3 PLACES

32PinCLCCpkgdim.eps

13 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. LEAD FINISH: Blank = Gold plated leads A = Solder dip leads V PP PROGRAMMING VOLTAGE 5 = 5V DEVICE GRADE: Q = MIL-STD-883 Compliant M = Military Screened -55°C to +125°C I = Industrial -40°C to +85°C C = Commercial 0°C to +70°C PACKAGE TYPE: DE = 32 Lead Ceramic SOJ (Package 101) C = 32 Pin Ceramic DIP (Package 300) FE = 32 Lead Ceramic Flatpack (Package 220) FF = 32 Lead Formed Ceramic Flatpack (Package 221) CL = 32 Pin rectangular Ceramic Leadless Chip Carrier (Package 601) ACCESS TIME (ns) ORGANIZATION, 128K x 8 Flash MONOLITHIC WHITE ELECTRONIC DESIGNS CORP.

ORDERING INFORMATION

14 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WMF128K8-XXX5 April 2001 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. DEVICE TYPE SECTOR SIZE SPEED PACKAGE SMD NO. 128K x 8 Flash Monolithic 16KByte 150ns 32 pin DIP (C) 5962-96690 01HYX 128K x 8 Flash Monolithic 16KByte 120ns 32 pin DIP (C) 5962-96690 02HYX 128K x 8 Flash Monolithic 16KByte 90ns 32 pin DIP (C) 5962-96690 03HYX 128K x 8 Flash Monolithic 16KByte 70ns 32 pin DIP (C) 5962-96690 04HYX 128K x 8 Flash Monolithic 16KByte 60ns 32 pin DIP (C) 5962-96690 05HYX 128K x 8 Flash Monolithic 16KByte 150ns 32 lead SOJ (DE) 5962-96690 01HXX 128K x 8 Flash Monolithic 16KByte 120ns 32 lead SOJ (DE) 5962-96690 02HXX 128K x 8 Flash Monolithic 16KByte 90ns 32 lead SOJ (DE) 5962-96690 03HXX 128K x 8 Flash Monolithic 16KByte 70ns 32 lead SOJ (DE) 5962-96690 04HXX 128K x 8 Flash Monolithic 16KByte 60ns 32 lead SOJ (DE) 5962-96690 05HXX 128K x 8 Flash Monolithic 16KByte 150ns 32 lead Flatpack (FE) 5962-96690 01HTX 128K x 8 Flash Monolithic 16KByte 120ns 32 lead Flatpack (FE) 5962-96690 02HTX 128K x 8 Flash Monolithic 16KByte 90ns 32 lead Flatpack (FE) 5962-96690 03HTX 128K x 8 Flash Monolithic 16KByte 70ns 32 lead Flatpack (FE) 5962-96690 04HTX 128K x 8 Flash Monolithic 16KByte 60ns 32 lead Flatpack (FE) 5962-96690 05HTX 128K x 8 Flash Monolithic 16KByte 150ns 32 lead Formed Flatpack (FF) 5962-96690 01HUX 128K x 8 Flash Monolithic 16KByte 120ns 32 lead Formed Flatpack (FF) 5962-96690 02HUX 128K x 8 Flash Monolithic 16KByte 90ns 32 lead Formed Flatpack (FF) 5962-96690 03HUX 128K x 8 Flash Monolithic 16KByte 70ns 32 lead Formed Flatpack (FF) 5962-96690 04HUX 128K x 8 Flash Monolithic 16KByte 60ns 32 lead Formed Flatpack (FF) 5962-96690 05HUX