WLPN404018 WALSIN | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 11
Technical content
Page 1 of 11 ASC_WLPN404018 Series_V4.0 Nov. Y2017 WLPN404018 Series Shielded SMD Power Inductors *Contents in this sheet are subject to change without prior notice.
Page 2 of 11 ASC_WLPN404018 Series_V4.0 Nov. Y2017
Features
- Close magnetic loop with magnetic resin shielded. 2. Low profile, High inductance.
Applications
- General propose power inductor in DC power system. 2. Inductor in DC/DC converter. 3. Low profile for portable and wearable device. 4. LC filter in Audio D class Amplifier. Shape and Dimension Unit: mm Recommended Land-Pattern
Ordering Information
Series Dimensions Thickness Tolerance Value Packing Code WL: Inductor Shielded SMD Power Inductors 4.0 * 4.0 mm 1.8 mm M: ± 20% N: ± 30% 1R0 = 1.0uH 100 = 10uH L=13” Reeled (Embossed Tape) B:STD Polarity mark Symbol DIM. TOL. M1 4.0 ±± ±±0.2 M2 4.0 ±± ±±0.2 M3 1.8 MAX. M4 1.1 ±± ±±0.2 M5 2.5 ±± ±±0.2 2 .8 1 .2 1 .2 3.7
Page 3 of 11 ASC_WLPN404018 Series_V4.0 Nov. Y2017
Electrical Characteristics
(mA) Max WLPN404018 Series L (uH) Symbol Inductance Tolerance DCR (Ω± Ω± Ω± Ω± 20%) SRF (MHz)Min Saturation Current Idc1 Temperature Rise Current Idc2 WLPN404018N1R0LB 1.0 A ±30% 0.027 90 4000 3200 WLPN404018N1R5LB 1.5 B ±30% 0.037 75 3300 2400 WLPN404018M2R2LB 2.2 C ±20% 0.042 60 3000 2200 WLPN404018M3R3LB 3.3 E ±20% 0.055 45 2300 2000 WLPN404018M4R7LB 4.7 H ±20% 0.070 35 2000 1700 WLPN404018M6R8LB 6.8 I ±20% 0.098 30 1600 1450 WLPN404018M100LB 10 K ±20% 0.150 25 1300 1200 WLPN404018M150LB 15 M ±20% 0.210 18 1100 850 WLPN404018M220LB 22 N ±20% 0.290 15 900 720 WLPN404018M330LB 33 P ±20% 0.460 12 700 550 WLPN404018M470LB 47 S ±20% 0.650 10 600 440 WLPN404018M680LB 68 T ±20% 1.000 8.3 520 320 WLPN404018M101LB 100 V ±20% 1.450 6.5 420 280 WLPN404018M151LB 150 W ±20% 2.300 5.5 340 220 WLPN404018M221LB 220 X ±20% 3.800 4.0 275 170 1. Test Frequency: 100KHz 2. Test Equipment: Inductance: Chroma3302+1320 or equivalent. DCR: Chroma16502 or equivalent. SRF: HP4291B or equivalent. 3. Saturation Current Idc1: The value of current causes a 30% inductance reduction from initial value. 4. Temperature rise current Idc2: The value of current causes a 40 temperature rise.℃ 5. Rated Current: Either Idc1 or Idc2 whichever is smaller. 6. Operating Temperature Range:-25 ℃ to +125℃ (Including self-temperature rise) 7. Storage Temp. Range ：-40 ℃ to +85 ℃. 8. MSL ：Level 1
Page 4 of 11 ASC_WLPN404018 Series_V4.0 Nov. Y2017 Structural Drawing (Magnetic Shielded Type)
1 Ferrite core ：Ni-Zn ferrite
2 Winding wire ：Polyurethane-copper wire
3 Over-coating resin ：Epoxy resin, containing ferrite powder
4 Electrode ：External electrode (substrate) Ag
External electrode (base plating) Ni-Sn External electrode (top surface solder coating) Sn-Ag-Cu
Page 5 of 11 ASC_WLPN404018 Series_V4.0 Nov. Y2017 Characteristic Curve
Page 6 of 11 ASC_WLPN404018 Series_V4.0 Nov. Y2017 Core Chipping: The appearance standard of the chipping size in top side, of bottom side ferrite Core is following dimension. Exposed wire tolerance limit of coating resin part on product side Size of exposed wire occurring to coating resin is specified below. L W 1.0mmMax. 1.0mmMax. L W a b w .. 1 Width direction (dimension a): Acceptable when a<=w/2 Nonconforming when a>w/2 2 Length direction (dimension b): Dimension b is not specified.
3 When total area of exposed wire occurring to each sides is
not greater than 50% of coating resin area, that is acceptable.
Page 7 of 11 ASC_WLPN404018 Series_V4.0 Nov. Y2017 Reflow Profile Chart (Reference): (Table 1) The products may be exposed to reflow soldering process of above profile up to two times. *Temperature on surface of circuit board
Page 8 of 11 ASC_WLPN404018 Series_V4.0 Nov. Y2017 Mechanical Performance /Environmental Test Performance Specifications: (WLPN404018 series) No. Item Test condition Requirements Resistance to Deflection No damage. The test samples shall be soldered to the test board by the reflow soldering conditions show in Table 1. As illustrated below, apply force in the direction of the Arrow indicating until deflection of the test board Reaches to 2 mm. Land dimensions Test board size :100×40×10 Unit: mm Test board material l: glass epoxy-resin Solder cream thickness:0.1 Adhesion of Terminal Electrode Shall not come off PC board The test samples shall be soldered to the test board By the reflow soldering conditions shown in Table 1. Applied force: 10 N to X and Y directions Duration: 5 s. Solder cream thickness:0.1 mm (Refer to recommended Land Pattern Dimensions Defined in “Precaution”) Body strength No damage Applied force :20 N Duration :10 s Resistance to Vibration △L/L:within±10% No abnormality observed In appearance The test samples shall be soldered to the test board by The reflow soldering conditions shown in Table 1.Then It shall be submitted to below test conditions Frequency range 10Hz~55Hz Total Amplitude 1.5mm(May not exceed acceleration 196 m/S2) Sweeping Method 10Hz to 55Hz to 10 Hz for 1 min. Time For 2 hours on each X, Y, and Z axis. Resistance to Soldering heat (Reflow) △L/L:within±10% No abnormality observed In appearance The test sample shall be exposed to reflow oven at 230±5 deg C for 40 seconds, with peak temperature at 260±5 deg C for 5 seconds, 2 times. Test board thickness:1.0 mm Test board material :glass epoxy-resin
10 N, 5 s
R0.5mm 0.6W R230 Force Rod Board Test Sample 0.8 0.8 2.7 45±2 45±2
Page 9 of 11 ASC_WLPN404018 Series_V4.0 Nov. Y2017 Solder ability At least 90% of surface of terminal electrode is covered by new solder. The t est samples shall be dipped in flux, and then Immersed in molten solder as shown in below table. Flux: Methanol solution containing rosin 25% Solder Temperature 245±deg C Time 5±1.0 S. Immersing Speed 25 mm/s Temperature Characteristics △L/L:within±20% No abnormality observed In appearance Measurement of inductance shall be taken at temperature Range within -25 deg C to +85 deg C. With reference to inductance value at +20 deg C, change Rate shall be calculated. Thermal shock △L/L:within±10% No abnormality observed In appearance The test samples shall be soldered to test board By the reflow soldering conditions shown in Table 1. The test samples shall be placed at specified Shown in below table in sequence. The temperature cycle shall be repeated 100 cycles. Conditions of steps for 1 cycle Step Temperature Time(min) 1 -40±3 deg C 30±3
2 Room Temp 3 maximum
3 85±2 deg C 30±3
4 Room Temp 3 maximum
△L/L:within±10% No abnormality observed In appearance The test samples shall be soldered to the test board by The reflow soldering conditions shown in Table 1. After that, the test samples shall be placed at test Conditions as shown in below table. Temperature -40±2 deg C Time 500 +24/-0 h Loading at high temperature life test △L/L:within±10% No abnormality observed in appearance. The test samples shall be soldered to the test board by the reflow soldering conditions shown in Table 1. The test samples shall be placed in thermostatic oven set at specified temperature and applied the rated current continuously as shown in below table. Temperature 85±2 deg C Applied current Rated current (Refer to Page 3) Time 500+24/-0 h Damp heat life test △L/L:within±10% No abnormality observed in appearance. The test samples shall be soldered to the test board by the reflow soldering conditions shown in Table 1. The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table. Temperature 60±2 deg C Humidity 90~95%RH Time 500+24/-0 h Loading under Damp heat life test △L/L:within±10% No abnormality observed in appearance. The test samples shall be soldered to the test board by the reflow soldering conditions shown in Table 1. The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current continuously as shown in below table. Temperature 60±2 deg C Humidity 90~95%RH Applied current Rated current (Refer to Page 3) Time 500+24/-0 h
Page 10 of 11 ASC_WLPN404018 Series_V4.0 Nov. Y2017 Tape & Reel Packaging Dimensions: Dimensions Unit: mm Direction of rolling A
0 B 0 W F E P 1 P 2 P 0 D 0 T K
4.3 ±0.1 4.3 ±0.1 12.0 ±0.3 5.5 ±0.1 1.75 ±0.1 8.0 ±0.1 2.0 ±0.1 4.0 ±0.1 Φ1.5 +0.1 0.3 ±0.05 2.1 ±0.1 P1 P2 P0 D0 Direction of production insertion Position of wire
Page 11 of 11 ASC_WLPN404018 Series_V4.0 Nov. Y2017 Reel Top tape strength Quantity per reel ：： ：：3.5K pcs (3500 pcs) Peel-off strength: 0.1N~1.3N Peel-off angle:165 °~180 ° Peel-off speed: 300mm/mm