WLPN303010 WALSIN | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 9
Technical content
Page 1 of 9 ASC_WLPN303010 Series_V4.0 Nov. Y2017 WLPN303010 Series SMD Molded Power Choke Inductors *Contents in this sheet are subject to change without prior notice.
Page 2 of 9 ASC_WLPN303010 Series_V4.0 Nov. Y2017
Features
- Close magnetic loop with magnetic resin shielded. 2. Low profile, High inductance.
Applications
- General propose power inductor in DC power system. 2. Inductor in DC/DC converter. 3. Low profile for portable and wearable device. 4. LC filter in Audio D class Amplifier Shape and Dimension Unit: mm
Ordering Information
Series Dimensions Thickness Tolerance Value Packing Code WL: Inductor Shielded SMD Power Inductors 3.0 * 3.0 mm 1.0 mm M: ± 20% N: ± 30% 1R2 = 1.2uH 100 = 10uH P=7” Reeled (Embossed Tape) B:STD Polarity mark
Page 3 of 9 ASC_WLPN303010 Series_V4.0 Nov. Y2017
Electrical Characteristics
(mA) Max WLPN303010 Series L (uH) Inductance Tolerance Test Freq (KHz) DCR (ΩΩ ΩΩ ±± ±± 20%) SRF (MHz)Min Saturation Current Idc1 Temperature Rise Current Idc2 WLPN303010N1R2PB 1.2 N 100 0.065 120 1700 1480 WLPN303010N1R5PB 1.5 N 100 0.075 99 1440 1370 WLPN303010M2R2PB 2.2 M 100 0.083 86 1300 1300 WLPN303010M3R3PB 3.3 M 100 0.130 64 1000 1030 WLPN303010M4R7PB 4.7 M 100 0.170 50 850 900 WLPN303010M6R8PB 6.8 M 100 0.250 44 700 745 WLPN303010M100PB 10 M 100 0.350 34 600 620 WLPN303010M150PB 15 M 100 0.550 25 450 480 WLPN303010M220PB 22 M 100 0.770 22 380 410 1. Test Frequency: 100KHz. 2. Test Equipment: Inductance: Chroma3302+1320+16502 or equivalent. DCR: Chroma16502 or equivalent. SRF: HP4291B or equivalent. 3. Saturation Current Idc1: The value of current causes a 30% inductance reduction from initial value. 4. Temperature rise current Idc2: The value of current causes a 40 temperature rise.℃ 5. Rated Current: Either Idc1 or Idc2 whichever is smaller. 6. Operating Temperature Range:-25 ℃ to +120 ℃ (Including self-temperature rise). 7. Storage Temp. Range ：-40 ℃ to +85 ℃. 8. MSL ：Level 1. Structural Drawing 1 Ferrite core ：Ni-Zn ferrite. 2 Winding wire ：Polyurethane-copper wire. 3 Over-coating resin ：Epoxy resin, containing ferrite powder.
4 Electrode ：External electrode (substrate) Ag
External electrode (base plating) Ni-Sn External electrode (top surface solder coating) Sn-Ag-Cu
Page 4 of 9 ASC_WLPN303010 Series_V4.0 Nov. Y2017 Characteristic Curve Core Chipping: The appearance standard of the chipping size in top side, of bottom side ferrite core is following dimension. L W 0.6mmMax. 0.6mmMax. 2R 2M 4R 7M 100M 220M 0.1 Inductance vs. D C C urrent Inductance (uH) 100 1.000 10.000 100 D C C urrent (m A ) L W
Page 5 of 9 ASC_WLPN303010 Series_V4.0 Nov. Y2017 Exposed wire tolerance limit of coating resin part on product side Size of exposed wire occurring to coating resin is specified below. Reflow Profile Chart (Reference): (Table 1) The products may be exposed to reflow soldering process of above profile up to two times. a b w .. 1 Width direction (dimension a): Acceptable when a<=w/2 Nonconforming when a>w/2 2 Length direction (dimension b): Dimension b is not specified.
3 When total area of exposed wire occurring to each sides is
not greater than 50% of coating resin area, that is acceptable. *Temperature on surface of circuit board 2.2
Page 6 of 9 ASC_WLPN303010 Series_V4.0 Nov. Y2017 Mechanical Performance /Environmental Test Performance Specifications: (WLPN303010 series) No. Item Test condition Requirements Resistance to Deflection. No damage. The test samples shall be soldered to the test board by the reflow soldering conditions show in Table 1. As illustrated below, apply force in the direction of the Arrow indicating until deflection of the test board Reaches to 2 mm. Land dimensions Test board size :100×40×10 Unit: mm Test board material l: glass epoxy-resin Solder cream thickness:0.1 Adhesion of Terminal Electrode. Shall not come off PC board. The test samples shall be soldered to the test board by the reflow soldering conditions shown in Table 1. Applied force: 10 N to X and Y directions Duration: 5 s. Solder cream thickness:0.1 mm. (Refer to recommended Land Pattern Dimensions Defined in “Precaution”) Body strength. No damage. Applied force :20 N. Duration :10 s. Resistance to Vibration. △L/L:within±10% No abnormality observed In appearance. The test samples shall be soldered to the test board by the reflow soldering conditions shown in Table 1.Then It shall be submitted to below test conditions. Frequency range 10Hz~55Hz Total Amplitude 1.5mm(May not exceed acceleration 196 m/S2) Sweeping Method 10Hz to 55Hz to 10 Hz for 1 min. Time For 2 hours on each X, Y, and Z axis. Resistance to Soldering heat (Reflow). △L/L:within±10% No abnormality observed In appearance The test sample shall be exposed to reflow oven at 230±5 deg C for 40 seconds, with peak temperature at 260±5 deg C for 5 seconds, 2 times. Test board thickness: 1.0 mm. Test board material: Glass epoxy-resin. Force Rod Board Test Sample 1.5 1.5 4.0 45±2 45±2 R230
10 N, 5 s
R0.5mm 0.6W
Page 7 of 9 ASC_WLPN303010 Series_V4.0 Nov. Y2017 Solder ability. At least 90% of surface of terminal electrode is covered by new solder. The t est samples shall be dipped in flux, and then Immersed in molten solder as shown in below table. Flux: Methanol solution containing rosin 25%. Solder Temperature 245±deg C Time 5±1.0 S. Immersing Speed 25 mm/s Temperature Characteristics. △L/L:within±20% No abnormality observed in appearance. Measurement of inductance shall be taken at temperature range within -25 deg C to +85 deg C. With reference to inductance value at +20 deg C, change rate shall be calculated. Thermal shock. △L/L:within±10% No abnormality observed in appearance. The test samples shall be soldered to test board by the reflow soldering conditions shown in Table 1. The test samples shall be placed at specified shown in below table in sequence. The temperature cycle shall be repeated 100 cycles. Conditions of steps for 1 cycle. Step Temperature Time(min) 1 -40±3 deg C 30±3
2 Room Temp 3 maximum
3 85±2 deg C 30±3
4 Room Temp 3 maximum
Test. △L/L:within±10% No abnormality observed in appearance. The test samples shall be soldered to the test board by the reflow soldering conditions shown in Table 1. After that, the test samples shall be placed at test conditions as shown in below table. Temperature -40±2 deg C Time 500 +24/-0 h Loading at high temperature life test. △L/L:within±10% No abnormality observed in appearance. The test samples shall be soldered to the test board by the reflow soldering conditions shown in Table 1. The test samples shall be placed in thermostatic oven set at specified temperature and applied the rated current continuously as shown in below table. Temperature 85±2 deg C Applied current Rated current (Refer to Page 3) Time 500+24/-0 h Damp heat life test. △L/L:within±10% No abnormality observed in appearance. The test samples shall be soldered to the test board by the reflow soldering conditions shown in Table 1. The test samples shall be placed in thermostatic oven set at specified temperature and humidity as shown in below table. Temperature 60±2 deg C Humidity 90~95%RH Time 500+24/-0 h Loading under Damp heat life test. △L/L:within±10% No abnormality observed in appearance. The test samples shall be soldered to the test board by the reflow soldering conditions shown in Table 1. The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current continuously as shown in below table. Temperature 60±2 deg C Humidity 90~95%RH Applied current Rated current (Refer to Page 3) Time 500+24/-0 h
Page 8 of 9 ASC_WLPN303010 Series_V4.0 Nov. Y2017 Tape & Reel Packaging Dimensions: Dimensions Unit ：mm Direction of rolling A
0 B 0 W F E P 1 P 2 P 0 D 0 T K
3.2 ±0.1 3.2 ±0.1 8.0 ±0.2 3.5 ±0.1 1.75 ±0.1 4.0 ±0.1 2.0 ±0.05 4.0 ±0.1 Φ1.5 +0.1 0.3 ±0.05 1.4 ±0.1 P1 P2 P0 D0 Direction of production insertion Position of wire
Page 9 of 9 ASC_WLPN303010 Series_V4.0 Nov. Y2017 Reel Top tape strength Quantity per reel ：： ：：2K pcs Label position:on the opposite sie of sprocket holes side of reel Peel-off strength: 0.1N~0.7N Peel-off angle:165 °~180 ° Peel-off speed: 300mm/mm