WLFM WALSIN | Alldatasheet
Document overview
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- PDF pages: 10
Technical content
Page 1 of 10 ASC_WLFM Series_V5.0 SEP - 2017 WLFM2012 WLFM2520 Multi-Layer Power Inductors *Contents in this sheet are subject to change without prior notice.
Page 2 of 10 ASC_WLFM Series_V5.0 SEP - 2017
Features
- General purpose chip ferrite power inductor for high integration electronics device. 2. Ceramic structure provides high reliability 、high productivity. 3. Low DC resistance with high current. 4. RoHS compliance.
Applications
- DC line filter, DC/DC inductor. 2. EMI solution for I/O ports. 3. RF choke for DC power supplying to LNA or external antenna. Shape and Dimension Unit: mm (inches) WLFM Series L W T B (Min/Max)
Ordering Information
Tolerance Value Packing Code WL: Inductor Multilayer power inductor. 2012:EIA 0805 2520:EIA 1008 Z0:STD M: ± 20% R47=0.47uH 2R2=2.2uH P=7” Reeled (Embossed tape) B:STD W T L B
Page 3 of 10 ASC_WLFM Series_V5.0 SEP - 2017
Electrical Characteristics
- WLFM2012 series (EIA 0805)
- WLFM2520 series (EIA 1008) TEST INSTRUMENT ：： ：： HP4285A Rated current specifies that self-heat generation is below 40 ℃during DC loaded.(at 20 ℃) Components shall be used within operating temperature. When inductors are mounted, heat dispersion and product surface temperature (including self heating) change much by land pattern Therefore inductors shall be used in condition that self heating temperature is within 40 ℃. Operating temp: -40 ℃ to +85 ℃ Walsin Part Number L(uH) Tolerance Measuring Frequency (MHz) RDC (ΩΩ ΩΩ ) Max. Rated Current [A] (max.) WLFM2012Z0MR47PB 0.47 M 1 0.08 1.2 WLFM2012Z0MR50PB 0.50 M 1 0.08 1.2 WLFM2012Z0M1R0PB 1.0 M 1 0.14 1.0 WLFM2012Z0M1R5PB 1.5 M 1 0.20 0.8 WLFM2012Z0M2R2PB 2.2 M 1 0.20 0.8 WLFM2012Z0M3R3PB 3.3 M 1 0.24 0.7 WLFM2012Z0M4R7PB 4.7 M 1 0.28 0.7 Walsin Part Number L(uH) Tolerance Measuring Frequency (MHz) RDC (ΩΩ ΩΩ ) Max. Rated Current [A] (max.) WLFM2520Z0MR47PB 0.47 M 1 0.05 1.80 WLFM2520Z0M1R0PB 1.0 M 1 0.08 1.40 WLFM2520Z0M1R5PB 1.5 M 1 0.09 1.30 WLFM2520Z0M2R2PB 2.2 M 1 0.09 1.30 WLFM2520Z0M3R3PB 3.3 M 1 0.12 1.20 WLFM2520Z0M4R7PB 4.7 M 1 0.15 1.10
Page 4 of 10 ASC_WLFM Series_V5.0 SEP - 2017 DC Bias Current vs Inductance (Typical) ：： ：： WLFM2012 series WLFM2520 series
Page 5 of 10 ASC_WLFM Series_V5.0 SEP - 2017 Test Condition & Requirements (WLFM2012/2520 series) Test Item Standard Test method RELIABILITY TEST Solderability More than 75% of terminal electrode shall be covered with fresh solder. Test sample shall be immersed into molten solder under the conditions shown in Table 1 after immersed into flux. After this, test samples shall be taken out and visually checked. The speed for immersion and taking out shall be 25 mm/s. Table 1 (Eutectic solder) Solder temperature 230 ℃±5% Immersion time 4s±1s Table 1 (Pb-free solder Sn/3.0Ag/0.5Cu) Solder temperature 245 ℃±3% Immersion time 4s±1s Resistance to soldering heat No mechanical damage. Remaining terminal electrode: 70% min. Inductance change rate: Within±30% Test sample shall be immersed into molten solder after immersed into flux and preheated under the conditions shown in Table 2. After this, test samples shall be taken out and measured after kept at room temperature for 2 to 3 hours.(Note 1) The speed for immersion and taking out shall be 25mm/s. Table 2 Preheating 150 to 180 ℃ 2 to 3min. Resistance to soldering heat 260 ℃±5 ℃ Immersion time 10s±0.5s Thermal shock No mechanical damage. Inductance change rate: Within±30% Steps 1 to4 shown in Table 3 as one cycle shall be repeated 5 times. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to3 hours, then measurement shall be conducted. (Note 1) Table 3 Step Temperature Time 1 -40 ℃± ℃ 30min.±3min. 2 Normal temp 2min. to 3min. 3 +80 ℃± ℃ 30min.±3min. 4 Normal temp 2min. to 3min. Resistance to humidity No mechanical damage. Inductance change rate: Within±30% Test board shall be kept in a thermo hygrostat with temperature of 40 ℃±2 ℃ and relative humidity of 90% to 95% for 500+24/-0 hours. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 3 hours, then measurement shall be conducted. (Note 1) High temperature load life test. No mechanical damage. Inductance change rate: Within±30% Test board shall be kept in a thermostatic oven with temperature of 85 ℃±2 ℃ and the rated current shall be continuously applied for 500+24/-0 hours. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 3 hours, then measurement shall be conducted. (Note 1)
Page 6 of 10 ASC_WLFM Series_V5.0 SEP - 2017 Test Item Standard Test method RELIABILITY TEST Solderability More than 75% of terminal electrode shall be covered with fresh solder. Test sample shall be immersed into molten solder under the conditions shown in Table 1 after immersed into flux. After this, test samples shall be taken out and visually checked. The speed for immersion and taking out shall be 25 mm/s. Table 1 (Eutectic solder) Solder temperature 230 ℃±5% Immersion time 4s±1s Table 1 (Pb-free solder Sn/3.0Ag/0.5Cu) Solder temperature 245 ℃±3% Immersion time 4s±1s Resistance to soldering heat No mechanical damage. Remaining terminal electrode: 70% min. Inductance change rate: Within±30% Test sample shall be immersed into molten solder after immersed into flux and preheated under the conditions shown in Table 2. After this, test samples shall be taken out and measured after kept at room temperature for 2 to 3 hours.(Note 1) The speed for immersion and taking out shall be 25mm/s. Table 2 Preheating 150 to 180 ℃ 2 to 3min. Resistance to soldering heat 260 ℃±5 ℃ Immersion time 10s±0.5s Thermal shock No mechanical damage. Inductance change rate: Within±30% Steps 1 to4 shown in Table 3 as one cycle shall be repeated 5 times. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to3 hours, then measurement shall be conducted. (Note 1) Table 3 Step Temperature Time 1 -40 ℃± ℃ 30min.±3min. 2 Normal temp 2min. to 3min. 3 +80 ℃± ℃ 30min.±3min. 4 Normal temp 2min. to 3min. Resistance to humidity No mechanical damage. Inductance change rate: Within±30% Test board shall be kept in a thermo hygrostat with temperature of 40 ℃±2 ℃ and relative humidity of 90% to 95% for 500+24/-0 hours. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 3 hours, then measurement shall be conducted. (Note 1) High temperature load life test. No mechanical damage. Inductance change rate: Within±30% Test board shall be kept in a thermostatic oven with temperature of 85 ℃±2 ℃ and the rated current shall be continuously applied for 500+24/-0 hours. After the test, keep the test sample at a normal temperature with a normal humidity for 2 to 3 hours, then measurement shall be conducted. (Note 1) (Note 1) If a question is found in the result of measurement, another measurement shall be conducted after test samples shall be kept for 48±2 hours.
Page 7 of 10 ASC_WLFM Series_V5.0 SEP - 2017 Reflow Profile Chart (Reference) The products may be exposed to reflow soldering process of above profile up to two times. *Temperature on surface of circuit board
Page 8 of 10 ASC_WLFM Series_V5.0 SEP - 2017 Packaging Specification External Dimension of Plastics Tape WLFM2012 WLFM2520
Page 9 of 10 ASC_WLFM Series_V5.0 SEP - 2017 Packaging Reel
Page 10 of 10 ASC_WLFM Series_V5.0 SEP - 2017 Top tape strength Top tape requires peeling strength of 0.1N to 0.7N in the arrow direction as shown below. Quantity per reel WLFM2012 ：3K pcs/reel WLFM2520 ：3K pcs/reel