WLFI2012 WALSIN | Alldatasheet

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Technical content

Page 1 of 7 ASC_ WLFI2012 Series SEP - 2017 WLFI2012 Ferrite Chip Inductors *Contents in this sheet are subject to change without prior notice.

Page 2 of 7 ASC_ WLFI2012 Series SEP - 2017

FEATURES

  1. General purpose chip ferrite power inductor for high integration electronics device. 2. Ceramic structure provides high reliability 、high productivity. 3. RoHS compliance.

APPLICATIONS

  1. EMI solution for I/O ports. 2. RF choke for DC power supplying to LNA or external antenna. SHAPE and DIMENSION

Ordering Information

WL: Inductor FI : Ferrite Chip Inductor 2.0 * 1.2 mm 2012 :EIA 0805 Z0 :STD M: ±20% R22 = 0.22 uH 2R2 = 2.2 uH 100 = 10 uH T = 7" Paper Tape P = 7” Plastic Tape B:STD Chip Size A 2.00±0.20 B 1.25±0.20 D 0.50±0.30 Units: mm

Page 3 of 7 ASC_ WLFI2012 Series SEP - 2017

Electrical Characteristics

  • WLFI2012 series NOTE :TOLERANCE M= ±20% Characteristic Curve Walsin Part Number Thickness C size (mm) Inductance (uH) Tolerance Q Test Frequency (MHz) SRF (MHz) min. DC Resistance (ΩΩ ΩΩ) max. Rated Current (mA) max. WLFI2012Z0M47NTB 0.85±0.20 0.047 M 15 60mV / 50M 320 0.20 300 WLFI2012Z0M68NTB 0.85±0.20 0.068 M 15 60mV / 50M 280 0.20 300 WLFI2012Z0M82NTB 0.85±0.20 0.082 M 15 60mV / 50M 255 0.20 300 WLFI2012Z0MR10TB 0.85±0.20 0.10 M 20 60mV / 25M 235 0.30 250 WLFI2012Z0MR12TB 0.85±0.20 0.12 M 20 60mV / 25M 220 0.30 250 WLFI2012Z0MR15TB 0.85±0.20 0.15 M 20 60mV / 25M 200 0.40 250 WLFI2012Z0MR18TB 0.85±0.20 0.18 M 20 60mV / 25M 185 0.40 250 WLFI2012Z0MR22TB 0.85±0.20 0.22 M 20 60mV / 25M 170 0.50 250 WLFI2012Z0MR27TB 0.85±0.20 0.27 M 20 60mV / 25M 150 0.50 250 WLFI2012Z0MR33TB 0.85±0.20 0.33 M 20 60mV / 25M 145 0.55 250 WLFI2012Z0MR39TB 0.85±0.20 0.39 M 25 60mV / 25M 135 0.65 200 WLFI2012Z0MR47PB 1.25±0.20 0.47 M 25 60mV / 25M 125 0.65 200 WLFI2012Z0MR56PB 1.25±0.20 0.56 M 25 60mV / 25M 115 0.75 150 WLFI2012Z0MR68PB 1.25±0.20 0.68 M 25 60mV / 25M 105 0.80 150 WLFI2012Z0M1R0TB 0.85±0.20 1.0 M 45 60mV / 10M 75 0.40 50 WLFI2012Z0M1R5TB 0.85±0.20 1.5 M 45 60mV / 10M 60 0.50 50 WLFI2012Z0M1R8TB 0.85±0.20 1.8 M 45 60mV / 10M 55 0.60 50 WLFI2012Z0M2R2TB 0.85±0.20 2.2 M 45 60mV / 10M 50 0.65 30 WLFI2012Z0M2R7PB 1.25±0.20 2.7 M 45 60mV / 10M 45 0.75 30 WLFI2012Z0M3R3PB 1.25±0.20 3.3 M 45 60mV / 10M 41 0.80 30 WLFI2012Z0M4R7PB 1.25±0.20 4.7 M 45 60mV / 10M 35 1.00 30 WLFI2012Z0M100PB 1.25±0.20 10.0 M 45 60mV / 2M 24 1.15 15 Q - Frequency Inductance - Current

Page 4 of 7 ASC_ WLFI2012 Series SEP - 2017 Test condition & Requirements Item Performance Test Condition Operating Temperature -40~+105℃ (Including self-temperature rise) -- Transportation Storage Temperature -40~+105℃ (on board) For long storage conditions, please see the Application Notice Impedance (Z) Inductance (Ls) Q Factor Agilent4291 Agilent E4991 Agilent4287 Agilent 16 192 DC Resistance Agilent 4338 Rated Current Refer to standard electrical characteristics list DC Power Supply Over Rated Current requirements, there will be some risk Temperature Rise Test Rated Current < 1A ∆T 20 Max℃ Rated Current ≧ 1A ∆T 40 Max℃ 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Resistance to Soldering Heat Appearance ：No damage. Impedance ：within±15% of initial value Inductance ：within±10% of initial value Q ：Shall not exceed the specification value. RDC ：within ±15% of initial value and shall not exceed the specification value Preheat: 150 ℃,60sec. Solder: Sn99.5%-Cu0.5% Solder temperature: 260 ±5℃ Flux for lead free: Rosin. 9.5% Temperature ramp/immersion and i mmersion rate: 25±6 mm/s Dip time: 10 ±1sec. Depth: completely cover the termination. Solderability More than 95% of the terminal electrode should be covered with solder. Preheat: 150 ,60sec. ℃ Solder: Sn99.5%-Cu0.5% Solder temperature: 245±5 ℃ Flux for lead free: Rosin. 9.5% Depth: completely cover the termination. Dip time: 4±1sec. Terminal strength Appearance ：No damage. Impedance ：within±15% of initial value Inductance ：within±10% of initial value Q ：Shall not exceed the specification value. RDC ：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) C omponent mounted on a PCB apply a force (>0805:1kg <=0805:0.5kg)to the side of a device being tested . This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to shock the component being tested. Bending Appearance ：No damage. Impedance ：within±10% of initial value Inductance ：within±10% of initial value Q ：Shall not exceed the specification value. RDC ：within ±15% of initial value and shall not exceed the specification value Shall be mounted on a FR4 substrate of the following dimensions:>=0805:40x100x1.2mm <0805:40x100x0.8mm Bending depth:>=0805:1.2mm <0805:0.8mm Duration of 10 sec for a min. Vibration Test Appearance ：No damage. Impedance ：within±15% of initial value Inductance ：within±10% of initial value Q ：Shall not exceed the specification value. RDC ：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Oscillation Frequency: 10 ～2K ～ 10Hz for 20 minutes Equipment ： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations) 。 150°C second second Dipping Preheating cooling Natural 60 4±1 245°C 150°C second second Dipping 260°C Preheating cooling Natural 60 10±1.0

Page 5 of 7 ASC_ WLFI2012 Series SEP - 2017 Shock Appearance ：No damage. Impedance ：within±15% of initial value Inductance ：within±10% of initial value Q ：Shall not exceed the specification value. RDC ：within ±15% of initial value and shall not exceed the specification value Test condition: Item Performance Test Condition Life test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Temperature: 125 ±2℃(bead), 85 ±2℃(inductor) Applied current: rated current. Duration: 1000 ±12hrs. Measured at room temperature after placing for 24 ±2 hrs. Load Humidity Appearance: no damage. Impedance: within ±15%of initial value. Inductance: within ±10%of initial value. Q ：Shall not exceed the specification value. RDC ：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Humidity: 85 ±2%R.H. Temperature: 85 ±2℃. Duration: 1000hrs Min. with 100% rated current. Measured at room temperature after placing for 24 ±2 hrs. Thermal shock Appearance: no damage. Impedance: within ±15%of initial value. Inductance: within ±10%of initial value. Q ：Shall not exceed the specification value. RDC ：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020 D Classification Reflow Profiles) Condition for 1 cycle Step1: -40 ±2℃ 30 ±5 min. Step2: 25±2 ℃ ≦0.5min Step3: +105±2℃ 30 ±5min. Number of cycles: 500 Measured at room temperature after placing for 24 ±2 hrs. Insulation Resistance IR>1G Ω Chip Inductor Only Test Voltage:100±10%V for 30Sec. Derating Curve Soldering and Mounting L (mm) G (mm) H (mm) WLFI2012 3.00 1.00 1.00 Type Peak Value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 1,500 0.5 Half-sine 15.4 Lead 100 6 Half-sine 12.3 1.5A 4A 4 125 85 Derating Derated Current(A) Environment Temperature+ △Temperature(° C) For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85 ℃, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve.

Page 6 of 7 ASC_ WLFI2012 Series SEP - 2017 t Ko E:1.75±0.1 P F:3.5±0.05 D:1.5+0.1-0.0 W:8.0±0.3 P0:4±0.1 t Ko E:1.75±0.1 F:3.5±0.1 P W:8.0±0.1 D:1.56+0.1-0.05 P2:2±0.1 P0:4±0.1 SECTION A-A t Ko E:1.75±0.1 F:3.5±0.05 P2:2±0.05 P W:8.0±0.1 Bo D1:1 ±0.1 A Ao D:1.5+0.1 Po:4±0.1 A Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk Lead Free Solder re-flow Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C) Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. ‧Preheat circuit and products to 150 ℃ ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧350℃ tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 4~5sec . Packaging Specification ■Material of taping is paper ■Material of taping is plastic Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm)

Page 7 of 7 ASC_ WLFI2012 Series SEP - 2017 Top cover tape 165° to180° Base tape F Products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. Quantity per reel ：Thickness C size (mm) - 0.85mm, 4k pcs / reel ；1.25mm, 2k pcs / reel Room Temp. (℃) Room Humidity (%) Room atm (hPa) Tearing Speed mm/min 5~35 45~85 860~1060 300 The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the foll owing conditions