WLFI1608 WALSIN | Alldatasheet
Document overview
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Technical content
Page 1 of 7 ASC_ WLFI1608 Series_V1.0 SEP - 2017 WLFI1608 Ferrite Chip Inductors *Contents in this sheet are subject to change without prior notice.
Page 2 of 7 ASC_ WLFI1608 Series_V1.0 SEP - 2017
FEATURES
- General purpose chip ferrite power inductor for high integration electronics device. 2. Ceramic structure provides high reliability、high productivity. 3. RoHS compliance.
APPLICATIONS
- EMI solution for I/O ports. 2. RF choke for DC power supplying to LNA or external antenna. SHAPE and DIMENSION
Ordering Information
WL: Inductor FI : Ferrite Chip Inductor 1.6 * 0.8 mm 1608 :EIA 0603 Z0 :STD M: 20% R22 = 0.22 uH 2R2 = 2.2 uH 100 = 10 uH T = 7" Paper Tape P = 7” Plastic Tape B:STD Chip Size A 1.60±0.15 B 0.80±0.15 C 0.80±0.15 D 0.30±0.20 Units: mm
Page 3 of 7 ASC_ WLFI1608 Series_V1.0 SEP - 2017
Electrical Characteristics
- WLFI1608 series NOTE :TOLERANCE M= ±20% Characteristic Curve Walsin Part Number Inductance (uH) Tolerance Q Test Frequency (MHz) SRF (MHz) min. DC Resistance (Ω) max. Rated Current (mA) max. WLFI1608Z0M47NTB 0.047 M 10 60mV / 50MHz 260 0.30 50 WLFI1608Z0M68NTB 0.068 M 10 60mV / 50MHz 250 0.30 50 WLFI1608Z0M82NTB 0.082 M 10 60mV / 50MHz 245 0.30 50 WLFI1608Z0MR10TB 0.10 M 15 60mV / 25MHz 240 0.50 50 WLFI1608Z0MR12TB 0.12 M 15 60mV / 25MHz 205 0.50 50 WLFI1608Z0MR15TB 0.15 M 15 60mV / 25MHz 180 0.60 50 WLFI1608Z0MR18TB 0.18 M 15 60mV / 25MHz 165 0.60 50 WLFI1608Z0MR22TB 0.22 M 15 60mV / 25MHz 150 0.80 50 WLFI1608Z0MR27TB 0.27 M 15 60mV / 25MHz 136 0.80 50 WLFI1608Z0MR33TB 0.33 M 15 60mV / 25MHz 125 0.85 35 WLFI1608Z0MR39TB 0.39 M 15 60mV / 25MHz 110 1.00 35 WLFI1608Z0MR47TB 0.47 M 15 60mV / 25MHz 105 1.35 35 WLFI1608Z0MR56TB 0.56 M 15 60mV / 25MHz 95 1.55 35 WLFI1608Z0MR68TB 0.68 M 15 60mV / 25MHz 80 1.70 35 WLFI1608Z0MR82TB 0.82 M 15 60mV / 25MHz 75 2.10 35 WLFI1608Z0M1R0TB 1.0 M 30 60mV / 10MHz 70 0.60 25 WLFI1608Z0M1R5TB 1.5 M 30 60mV / 10MHz 55 0.80 25 WLFI1608Z0M1R8TB 1.8 M 30 60mV / 10MHz 50 0.95 25 WLFI1608Z0M2R2TB 2.2 M 30 60mV / 10MHz 45 1.15 15 WLFI1608Z0M3R3TB 3.3 M 30 60mV / 10MHz 38 1.55 15 WLFI1608Z0M4R7TB 4.7 M 30 60mV / 10MHz 33 2.10 15 WLFI1608Z0M100TB 10 M 30 60mV / 2MHz 17 2.55 15 Q - Frequency Inductance - Current
Page 4 of 7 ASC_ WLFI1608 Series_V1.0 SEP - 2017 Test condition & Requirements Item Performance Test Condition Operating Temperature -40~+105℃ (Including self-temperature rise) -- Transportation Storage Temperature -40~+105℃ (on board) For l ong storage conditions, please see the Application Notice Impedance (Z) Refer to standard electrical characteristics list Agilent4291 Agilent E4991 Agilent4287 Agilent16192 Inductance (Ls) Q Factor DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk Temperature Rise Test Rated Current < 1A ΔT 20℃Max Rated Current ≧ 1A ΔT 40℃Max 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Resistance to Soldering Heat Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preheat: 150℃,60sec. Solder: Sn99.5%-Cu0.5% Solder temperature: 260±5℃ Flux for lead free: Rosin. 9.5% Temperature ramp/immersion and immersion rate: 25±6 mm/s Dip time: 10±1sec. Depth: completely cover the termination. Solderability More than 95% of the terminal electrode should be covered with solder. Preheat: 150℃,60sec. Solder: Sn99.5%-Cu0.5% Solder temperature: 245±5℃ Flux for lead free: Rosin. 9.5% Depth: completely cover the termination. Dip time: 4±1sec. Terminal strength Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Component mounted on a PCB apply a forc e (>0805:1kg <=0805:0.5kg)to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to shock the component being tested. Bending Appearance：No damage. Impedance：within±10% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Shall be mounted on a FR4 substrate of the following dimensions:>=0805:40x100x1.2mm <0805:40x100x0.8mm Bending depth:>=0805:1.2mm <0805:0.8mm Duration of 10 sec for a min. Vibration Test Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Oscillation Frequency: 10 ～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 150°C second second D ippingPreheating coolingN atural 60 4±1 245°C 150°C second second D ipping 260°C P reheating coolingN atural 60 10 ±1.0
Page 5 of 7 ASC_ WLFI1608 Series_V1.0 SEP - 2017 Shock Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Test condition: Item Performance Test Condition Life test Appearance: no damage. Impedance: within±15%of initial value. Inductance: within±10%of initial value. Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J -STD-020D Classification Reflow Profiles) Temperature: 125±2℃(bead), 85±2℃(inductor) Applied current: rated current. Duration: 1000±12hrs. Measured at room temperature after placing for 24±2 hrs. Load Humidity Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J -STD-020D Classification Reflow Profiles) Humidity: 85±2%R.H. Temperature: 85±2℃. Duration: 1000hrs Min. with 100% rated current. Measured at room temperature after placing for 24±2 hrs. Thermal shock Appearance: no damage. Impedance: within±15%of initial value. Inductance: within±10%of initial value. Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J -STD-020D Classification Reflow Profiles) Condition for 1 cycle Step1: -40±2℃ 30±5 min. Step2: 25±2℃ ≦0.5min Step3: +105±2℃ 30±5min. Number of cycles: 500 Measured at room temperature after placing for 24±2 hrs. Insulation Resistance IR>1GΩ Chip Inductor Only Test Voltage:100±10%V for 30Sec. **Derating Curve Soldering and Mounting L (mm) G (mm) H (mm) WLFI1608 2.60 0.60 0.80 Type Peak Value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 1,500 0.5 Half-sine 15.4 Lead 100 6 Half-sine 12.3 1.5A 12585 D erating D erated C urrent(A) E nvironm ent Tem perature+ △ Tem perature(°C ) For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85℃, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve.
Page 6 of 7 ASC_ WLFI1608 Series_V1.0 SEP - 2017 t Ko E :1.75 ±0.1 P F:3.5 ±0.05 D :1.5+0.1-0.0 W :8.0 ±0.3 P0:4 ±0.1 t Ko E :1.75 ±0.1 F:3.5 ±0.1 P W :8.0 ±0.1 D :1.56+0.1-0.05 S EC TIO N A-A t Ko E:1.75 ± 0.1 F:3.5 ± 0.05 P2:2 ± 0.05 P W :8.0 ± 0.1 Bo D 1:1 ±0.1 A Ao D :1.5+0.1 Po:4 ± 0.1 A Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk Lead Free Solder re-flow Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C) Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. ‧Preheat circuit and products to 150℃ ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧350℃ tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 4~5sec. Packaging Specification ■Material of taping is paper ■Material of taping is plastic Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm)
Page 7 of 7 ASC_ WLFI1608 Series_V1.0 SEP - 2017 Top cover tape 165° to180° B ase tape F Products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. Quantity per reel ： 4k pcs / reel Room Temp. (℃) Room Humidity (%) Room atm (hPa) Tearing Speed mm/min 5~35 45~85 860~1060 300 The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions