WLBD0603 WALSIN | Alldatasheet
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Technical content
Page 1 of 12 ASC_ WLBD0603 P Series_V1.0 JUL – 2018 WLBD0603 Chip Bead P SERIES *Contents in this sheet are subject to change without prior notice.
Page 2 of 12 ASC_ WLBD0603 P Series_V1.0 JUL – 2018
FEATURES
Monolithic inorganic material construction. Closed magnetic circuit avoids crosstalk. S.M.T. type. Suitable for reflow soldering. Shapes and dimensions follow E.I.A. spec. Available in various sizes. Excellent solder ability and heat resistance. High reliability. 100% Lead(Pb) & Halogen- Free and RoHS compliant. SHAPE and DIMENSION
Ordering Information
WL: Inductor BD: Chip Bead. 0.6 * 0.3 mm 0603 :EIA 0201 Refer to characteristic U: 25% 300 =30 OHM 301 =300 OHM 102 =1000OHM T = 7" Paper Tape P:General Chip Size A 0.60±0.03 B 0.30±0.03 C 0.30±0.03 D 0.1~0.2 Units: mm
Page 3 of 12 ASC_ WLBD0603 P Series_V1.0 JUL – 2018 PART NUMBER AND CHARACTERISTICS TABLE WLBD0603 series Walsin Part Number Impedance (Ω) +/-25% Test Frequency (MHz) DC Resistance ( ) max. Rated Current (mA) max. WLBD0603K2U220TP 22 100 0.065 500 WLBD0603K2U330TP 33 100 0.07 500 WLBD0603K2U800TP 80 100 0.40 200 WLBD0603K2U121TP 120 100 0.45 200 WLBD0603K2U241TP 240 100 0.65 200 WLBD0603K2U601TP 600 100 1.20 150 WLBD0603K2U102TP 1000 100 1.15 200 Walsin Part Number Impedance (Ω) +/-25% Test Frequency (MHz) DC Resistance ( ) max. Rated Current (mA) max. WLBD0603B1U600TP 60 100 0.25 200 WLBD0603B1U121TP 120 100 0.40 200 WLBD0603B1U241TP 240 100 0.80 200 WLBD0603B1U471TP 470 100 1.05 100 WLBD0603B1U601TP 600 100 1.20 100 Walsin Part Number Impedance (Ω) +/-25% Test Frequency (MHz) DC Resistance ( ) max. Rated Current (mA) max. WLBD0603H1U100TP 10 100 0.25 200 WLBD0603H1U220TP 22 100 0.45 200 WLBD0603H1U330TP 33 100 0.55 150 WLBD0603H1U471TP 47 100 0.70 150 WLBD0603H1U561TP 56 100 1.00 100 WLBD0603H1U800TP 80 100 1.30 100 WLBD0603H1U121TP 120 100 1.50 100
Page 4 of 12 ASC_ WLBD0603 P Series_V1.0 JUL – 2018 RELIABILITY AND TEST CONDITION Test item Test Condition Performance Operating Temperature -40~+125 (Including self-temperature rise) Transportation Storage Temperature For long storage conditions, please see the Application Notice -40~+125 Impedance (Z) Agilent4291 Agilent E4991 Agilent4287 Agilent16192 Refer to standard electrical characteristics list Inductance (Ls) Q Factor DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk Temperature Rise Test Applied the allowed DC current. Temperature measured by digital surface thermometer. Rated Current < 1A ΔT 20 Max Rated Current 1A ΔT 40 Max Resistance to Soldering Heat Preheat: 150 ,60sec. Solder: Sn99.5%-Cu0.5% Solder temperature: 260±5 Flux for lead free: Rosin. 9.5% Temperature ramp/immersion and immersion rate: 25±6 mm/s Dip time: 10±1sec. Depth: completely cover the termination. Appearance No damage. Impedance within±15% of initial value RDC within ±15% of initial value and shall not exceed the specification value Solderability Preheat: 150 ,60sec. Solder: Sn99.5%-Cu0.5% Solder temperature: 245±5 Flux for lead free: Rosin. 9.5% Depth: completely cover the termination. Dip time: 4±1sec. More than 95% of the terminal electrode should be covered with solder. Terminal strength Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Component mounted on a PCB apply a force (>0805:1kg <=0805:0.5kg)to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to shock the component being tested. Appearance No damage. Impedance within±15% of initial value. RDC within ±15% of initial value and shall not exceed the specification value 150°C second second DippingPreheating coolingNatural 60 4±1 245°C 150° C second second Dipping 260° C Preheating coolingNatural 60 10±1.0
Page 5 of 12 ASC_ WLBD0603 P Series_V1.0 JUL – 2018 Test item Test Condition Performance Bending Shall be mounted on a FR4 substrate of the following dimensions:>=0805:40x100x1.2mm <0805:40x100x0.8mm Bending depth:>=0805:1.2mm <0805:0.8mm Duration of 10 sec for a min Appearance No damage. impedance within±10% of initial value RDC within ±15% of initial value and shall not exceed the specification value Vibration Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Oscillation Frequency: 10 2K 10Hz for 20 minutes Equipment Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations) Appearance No damage. Impedance within±15% of initial value RDC within ±15% of initial value and shall not exceed the specification value Shock Type Peak Value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 1,500 0.5 Half-sine 15.4 Lead 100 6 Half-sine 12.3 Appearance No damage. Impedance within±15% of initial value RDC within ±15% of initial value and shall not exceed the specification value Life test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Temperature: 125±2 (bead), 85±2 (inductor) Applied current: rated current. Duration: 1000±12hrs. Measured at room temperature after placing for 24±2 hrs. Appearance: no damage. Impedance: within±15%of initial value. RDC within ±15% of initial value and shall not exceed the specification value Load Humidity Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Humidity: 85±2%R.H. Temperature: 85±2 Duration: 1000hrs Min. with 100% rated current. Measured at room temperature after placing for 24±2 hrs. Thermal shock Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Condition for 1 cycle Step1: -40±2 30±5 min. Step2: 25±2 0.5min Step3: +125±2 30±5min.(Bead) Number of cycles: 500 Measured at room temperature after placing for 24±2 hrs. Appearance: no damage. Impedance: within±15%of initial value.. RDC within ±15% of initial value and shall not exceed the specification value Insulation Resistance Chip Inductor Only Test Voltage:100±10%V for 30 Sec. IR>1GΩ
Page 6 of 12 ASC_ WLBD0603 P Series_V1.0 JUL – 2018 1.5A 4A4 12585 D erating Environment Tem perature+ Tem perature(°C ) Derating Curve For the ferrite chip bead whichwithstanding current over 1.5A, as the operating temperature over 85 , the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. Storage Conditions Storage Condition : Less than 40 and 60% RH Storage Time : 6 months Max. Soldering and Mounting Recommended PC Board Pattern Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk Lead Free Solder re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C) Chip Size Land Patterns For Reflow Soldering WLBD Type A(mm) B(mm) C(mm) D(mm) E(mm) F(mm) G(mm) 0603 0.6±0.0 0.30±0.0 0.30±0.0 0.15±0.0 5 0.35 0.30 0.40 PC board shold be designed so that products can prevent damage from mechanical stress when warping the board.
Page 7 of 12 ASC_ WLBD0603 P Series_V1.0 JUL – 2018 Soldering Iron: Products attachment with a soldering iron is discou raged due to the inherent process control limitatio ns. If a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. Solder Volume Upper limit Recommendable t Never contact the ceramic with the iron tip 1.0mm tip diameter (max) 60~180s 60~150s 217 150 TIME( sec.) 200 480s m ax. PRE-HEATING Reflow Soldering SO LDERING N ATURAL CO OLING TP(260 / 10s max.) SOLDERING COOLING NATURAL PRE-HEATING within 4~5s Gradual cooling 350 150 TIME(sec.) Iron Soldering Over 60s Reflow times: 3 times max Fig.1 Iron Soldering times 1 times max Preheat circuit and products to 150 350 tip temperature (max) Use a 20 watt soldering iron with tip diameter of 1.0mm Limit soldering time to 4~5sec. Accordingly increasing the solder volume, the mecha nical stress to product is also increased. Exceeding sold er volume may cause the failure of mechanical or electrical p erformance. Solder shall be used not to be exceed as shown in right side: Minimum fillet height = soldering thickness + 25% p roduct height
Page 8 of 12 ASC_ WLBD0603 P Series_V1.0 JUL – 2018 t Ko P A0 P0:4±0.1 Packaging Specification Reel Dimension Type A(mm) B(mm) C(mm) D(mm) 7’’x8mm 10±1.5 50 or more 13±0.2 178±2 TAPE AND REEL SPECIFICATIONS Paper carrier Top cover tape 165° to180° Base tape F Size B0(mm) A0(mm) K0(mm) P(mm) t(mm) 0.05 0.45max Room Temp. (c) Room Humidity (%) Room atm (hPa) Tearing Speed Mm/min 5 ~ 35 45 ~ 85 860 ~ 1060 300 2.0±0.5 EMBOSSED CARRIER A COVER TAPE The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Application Notice Storage Conditions(component level) To maintain the solder ability of terminal electrod es: 1. Temperature and humidity conditions: Less than 4 0 and 60% RH. 2. Recommended products should be used within 12 mo nths from the time of delivery. 3. The packaging material should be kept where no c hlorine or sulfur exists in the air. Transportation 1.Products should be handled with care to avoid dam age or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and me chanical shock are minimized.
Page 9 of 12 ASC_ WLBD0603 P Series_V1.0 JUL – 2018 Impedance Frequency Characteristics(Typical) WLBD0603K2U330TPWLBD0603K2U220TP WLBD0603K2U800TP WLBD0603K2U121TP WLBD0603K2U241TP WLBD0603K2U601TP
Page 10 of 12 ASC_ WLBD0603 P Series_V1.0 JUL – 2018 Impedance Frequency Characteristics(Typical) WLBD0603K2U102TP WLBD0603K2U600TP WLBD0603K2U121TP WLBD0603K2U241TP WLBD0603K2U471TP WLBD0603K2601TP
Page 11 of 12 ASC_ WLBD0603 P Series_V1.0 JUL – 2018 Impedance Frequency Characteristics(Typical) WLBD0603K2U100TP WLBD0603K2U220TP WLBD0603K2U330TP WLBD0603K2U470TP WLBD0603K2U560TP WLBD0603K2U800TP
Page 12 of 12 ASC_ WLBD0603 P Series_V1.0 JUL – 2018 Impedance Frequency Characteristics(Typical) WLBD0603K2U121TP