WF1M32B-100G2TC3

WF1M32B-XXX3 WEDC | Alldatasheet

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1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. 1Mx32 3.3V Flash Module

FEATURES

/square6 Access Times of 100, 120, 150ns ■ Packaging

• 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401)
• 68 lead, Low Profi le CQFP (G2T), 4.6mm (0.180") square (Package 509) ■ 1,000,000 Erase/Program Cycles ■ Sector Architecture
• One 16KByte, two 8KBytes, one 32KByte, and fi fteen 64kBytes in byte mode
• Any combination of sectors can be concurrently erased. Also supports full chip erase ■ Organized as 1Mx32 ■ Commercial, Industrial and Military Temperature Ranges ■ 3.3 Volt for Read and Write Operations ■ Boot Code Sector Architecture (Bottom) ■ Low Power CMOS, 1.0mA Standby ■ Embedded Erase and Program Algorithms ■ Built-in Decoupling Caps for Low Noise Operation ■ Erase Suspend/Resume
• Supports reading data from or programing data to a sector not being erased ■ Low Current Consumption Typical values at 5MHz:
• 40mA Active Read Current
• 80mA Program/Erase Current ■ Weight WF1M32B-XG2TX3 -8 grams typical WF1M32B-XHX3 -13 grams typical Note: For programming information refer to Flash Programming 8M3 Application Note. I/O8 I/O9 I/O10 A14 A16 A11 A18 I/O0 I/O1 I/O2 RESET# CS2# GND I/O A10 A15 VCC CS1# A19 I/O3 I/O15 I/O14 I/O13 I/O12 OE# A WE# I/O I/O6 I/O5 I/O4 I/O24 I/O25 I/O26 A12 NC A13 I/O16 I/O17 I/O18 VCC CS4# NC I/O27 NC CS3# GND I/O19 I/O31 I/O30 I/O29 I/O28 I/O23 I/O22 I/O21 I/O20 11 22 33 44 55 66 1 12 23 34 45 56 PIN CONFIGURATION FOR WF1M32B-XHX3 Top View Pin Description I/O0-31 Data Inputs/Outputs A0-19 Address Inputs WE# Write Enable CS1-4# Chip Selects OE# Output Enable RESET# Reset V CC Power Supply GND Ground NC Not Connected Block Diagram 1M x 8 I/O0-7 CS1# 1M x 8 I/O8-15 CS2# 1M x 8 I/O16-23 CS3# 1M x 8 I/O24-31 CS4# A0-19 OE# WE# RESET#

2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. Pin Confi guration for WF1M32B-XG2TX3 Top View Pin Description I/O0-31 Data Inputs/Outputs A0-19 Address Inputs WE1-4 Write Enables CS1-4 Chip Selects OE Output Enable RESET Reset/Powerdown V CC Power Supply GND GroundThe White 68 lead G2T CQFP fi lls the same fi t and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2T has the TCE and lead inspection advantage of the CQFP form. 1M x 8 I/O0-7 1M x 8 I/O8-15 1M x 8 I/O16-23 1M x 8 I/O24-31 A0-19 OE# RESET# Block Diagram I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 VCC A11 A12 A13 A14 A15 A16 CS1# OE# CS2# A17 WE2# WE3# WE4# A18 A19 NC I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 RESET# CS3# GND CS4# WE1# A10 V CC 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43

3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. ABSOLUTE MAXIMUM RATINGS Parameter Unit Operating Temperature -55 to +125 °C Supply Voltage Range (V CC) -0.5 to +4.0 V Signal Voltage Range -0.5 to Vcc +0.5 V Storage Temperature Range -65 to +150 °C Lead Temperature (soldering, 10 seconds) +300 °C Endurance (write/erase cycles) 1,000,000 min. cycles NOTES: 1. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Min Max Unit Supply Voltage V CC 3.0 3.6 V Input High Voltage V IH 0.7 x VCC VCC + 0.3 V Input Low Voltage V IL -0.5 +0.8 V Operating Temp. (Mil.) T A -55 +125 °C Operating Temp. (Ind.) T A -40 +85 °C CAPACITANCE TA = +25°C Parameter Symbol Conditions Max Unit OE# capacitance C OE VIN = 0 V, f = 1.0 MHz 50 pF WE#1-4 capacitance C WE VIN = 0 V, f = 1.0 MHz 20 pF CS1-4 capacitance C CS VIN = 0 V, f = 1.0 MHz 20 pF Data I/O capacitance C I/O VI/O = 0 V, f = 1.0 MHz 20 pF Address input capacitance C AD VIN = 0 V, f = 1.0 MHz 50 pF This parameter is guaranteed by design but not tested. DC CHARACTERISTICS – CMOS COMPATIBLE VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol Conditions Min Max Unit Input Leakage Current I LI VCC = 3.6, VIN = GND or VCC 10 µA Output Leakage Current I LOx32 VCC = 3.6, VIN = GND or VCC 10 µA VCC Active Current for Read (1) I CC1 CS# = VIL, OE# = VIH, f = 5MHz 120 mA VCC Active Current for Program or Erase (2) I CC2 CS# = VIL, OE# = VIH 140 mA VCC Standby Current I CC3 VCC = 3.6, CS = VIH, f = 5MHz 200 µA Output Low Voltage V OL IOL = 5.8 mA, VCC = 3.0 0.45 V Output High Voltage V OH1 IOH = -2.0 mA, VCC = 3.0 0.85 X VCC V Low VCC Lock-Out Voltage (4) V LKO 2.3 2.5 V NOTES: 1. The I CC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically is less than 8 mA/MHz, with OE# at VIH. 2. I CC active while Embedded Algorithm (program or erase) is in progress. 3. DC test conditions: V IL = 0.3V, VIH = VCC - 0.3V 4. Guaranteed by design, but not tested. DATA RETENTION Parameter Test Conditions Min Unit Minimum Pattern Data 150°C 10 Years Retention Time 125°C 20 Years

4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS – CS# CONTROLLED VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol -100 -120 -150 Unit Min Max Min Max Min Max Write Cycle Time t AVAV tWC 100 120 150 ns Write Enable Setup Time t WLEL tWS 000 n s Chip Select Pulse Width t ELEH tCP 45 50 50 ns Address Setup Time t AVEL tAS 000 n s Data Setup Time t DVEH tDS 45 50 50 ns Data Hold Time t EHDX tDH 000 n s Address Hold Time t ELAX tAH 45 50 50 ns Chip Select Pulse Width High t EHEL tCPH 20 20 20 ns Duration of Byte Programming Operation (1) t WHWH1 300 300 300 µs Sector Erase Time t WHWH2 15 15 15 sec Read Recovery Time (2) t GHEL 000 µ s Chip Programming Time 50 50 50 sec 1. Typical value for t WHWH1 is 9µs. 2. Guaranteed by design, but not tested. AC TEST CIRCUIT AC TEST CONDITIONS Parameter Typ Unit Input Pulse Levels V IL = 0, VIH = 2.5 V Input Rise and Fall 5 ns Input and Output Reference Level 1.5 V Output Timing Reference Level 1.5 V NOTES: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 Ω. V Z is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. I Current Source D.U.T. C = 50 pfeff IOL V ≈ 1.5V (Bipolar Supply) Z Current Source OH

5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS – WE# CONTROLLED VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol -100 -120 -150 Unit Min Max Min Max Min Max Write Cycle Time t AVAV tWC 100 120 150 ns Chip Select Setup Time t ELWL tCS 000 n s Write Enable Pulse Width t WLWH tWP 50 50 65 ns Address Setup Time t AVWL tAS 000 n s Data Setup Time t DVWH tDS 50 50 65 ns Data Hold Time t WHDX tDH 000 n s Address Hold Time t WLAX tAH 50 50 65 ns Write Enable Pulse Width High t WHWL tWPH 30 30 35 ns Duration of Byte Programming Operation (1) t WHWH1 300 300 300 µs Sector Erase t WHWH2 15 15 15 sec Read Recovery Time before Write (3) t GHWL 000 µ s VCC Setup Time t VCS 50 50 50 µs Chip Programming Time 50 50 50 sec Output Enable Setup Time t OES 000 n s Output Enable Hold Time (2) t OEH 10 10 10 ns 1. Typical value for t WHWH1 is 9µs. 2. For Toggle and Data Polling. 3. Guaranteed by design, but not tested. AC CHARACTERISTICS – READ-ONLY OPERATIONS VCC = 3.3V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol -100 -120 -150 Unit Min Max Min Max Min Max Read Cycle Time t AVAV tRC 100 120 150 ns Address Access Time t AVQV tACC 100 120 150 ns Chip Select Access Time t ELQV tCE 100 120 150 ns Output Enable to Output Valid t GLQV tOE 40 50 55 ns Chip Select High to Output High Z (1) t EHQZ tDF 30 30 40 ns Output Enable High to Output High Z (1) t GHQZ tDF 30 30 40 ns Output Hold from Addresses, CS# or OE# Change, whichever is First tAXQX tOH 000 n s 1. Guaranteed by design, not tested.

6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. AC WAVEFORMS FOR READ OPERATIONS sesserddA CS# OE# WE# stuptuO Z hgiH elbatS sesserddA t EO t CR dilaV tuptuO t EC t CCA t HO Z hgiH t FD

7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. NOTES: 1. PA is the address of the memory location to be programmed. 2. PD is the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to each chip. 4. D OUT is the output of the data written to the device. 5. Figure indicates last two bus cycles of four bus cycle sequence. WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED sesserddA CS# E#O E#W ataD V 0.5 APAPH5555 t CW t SC DP D#7 D TUO t HA t HPW t HD t SD Data# Polling t SA t CR t PW H0A0A t EO t FD t HO t EC t LWHG t 1HWHW

8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS NOTE: 1. SA is the sector address for Sector Erase. Addresses CS# OE# WE# Data VCC 5555H 2AAAH 2AAAH SA 5555H 5555H tWP tCS tVCS 1010H/3030H5555H8080H5555H AAAAHAAAAH tAH tAS tGHWL tWPH tDH tDS

9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS S#C E#O E#W t EO t EO t EC t HC t HO O# #/I 7 O/I dna 51 O/I 7 O/I dna 51 ataD dilaV Z hgiH O/I 6-0 O/I dna 41-8 dilavnI O/I 51-0 ataD dilaV t FD O/I 7 dna O/I 51 O/I 6-0 dna O/I 41-8 t HEO t 2 ro 1 HWHWataD

10 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. NOTES: 1. PA represents the address of the memory location to be programmed. 2. PD represents the data to be programmed at byte address. 3. D7# is the output of the complement of the data written to each chip. 4. DOUT is the output of the data written to the device. 5. Figure indicates the last two bus cycles of a four bus cycle sequence. ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS sesserddA E#W E#O S#C ataD V 0.5 APAPH5555 t CW t SW DP D#7 D TUO t HA t HPC t PC t HD t SD Data# Polling t SA t LEHG H0A t 1HWHW

11 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. PACKAGE 509: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2T) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES 1.27 (0.050) TYP 24.03 (0.946) ± 0.26 (0.010) 20.3 (0.800) REF 4.57 (0.180) MAX 0.19 (0.007) ± 0.06 (0.002) 23.87 (0.940) REF 1.0 (0.040) ± 0.127 (0.005) 0.25 (0.010) REF 1° / 7° R 0.25 (0.010) DETAIL A SEE DETAIL "A" Pin 1 The WEDC 68 lead G2T CQFP fi lls the same fi t and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2T has the TCE and lead inspection advan- tage of the CQFP form. 0.940"

12 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. PACKAGE 401: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1) 25.4 (1.0) TYP 15.24 (0.600) TYP 3.81 (0.150) ± 0.1 (0.005) 2.54 (0.100) TYP 25.4 (1.0) TYP 1.27 (0.050) TYP DIA PIN 1 IDENTIFIER SQUARE PAD ON BOTTOM ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

13 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF1M32B-XXX3 March 2006 Rev. 5 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.

ORDERING INFORMATION

LEAD FINISH: Blank = Gold plated leads A = Solder dip leads PROGRAMMING VOLTAGE 3 = 3.3V DEVICE GRADE: M = Military Screened -55°C to +125°C I = Industrial -40°C to +85°C C = Commercial 0°C to +70°C PACKAGE TYPE: H = Ceramic Hex In line Package, HIP (Package 401) G2T = 22mm Ceramic Quad Flat Pack, Low Profi le CQFP (Package 509) ACCESS TIME (ns) IMPROVEMENT MARK B = Boot Block (Bottom Sector) ORGANIZATION, 1M x 32 User confi gurable as 2M x 16 or 4M x 8 Flash WHITE ELECTRONIC DESIGNS CORP. W F 1M32 B - XXX X X 3 X