WF128K32N-070G2UI5

WF128K32-XXX5 WEDC | Alldatasheet

Document overview

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Technical content

1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 I/O8 I/O9 I/O10 A14 A16 A11 NC I/O0 I/O1 I/O2 WE2# CS2# GND I/O A10 A15 VCC CS1# NC I/O I/O15 I/O14 I/O13 I/O12 OE# NC WE I/O7 I/O6 I/O5 I/O4 I/O24 I/O25 I/O26 A12 NC A13 I/O16 I/O17 I/O18 I/O31 I/O30 I/O29 I/O28 I/O23 I/O22 I/O21 I/O20 VCC CS4# WE4# I/O27 WE3# CS3# GND I/O19 128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES

/square6 Access Times of 50**, 60, 70, 90, 120, 150ns /square6 Packaging:

• 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400)
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510)
• 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880 inch) square, 4.06mm (0.160 inch) high (Package 528) /square6 Sector Architecture
• 8 equal size sectors of 16KBytes each
• Any combination of sectors can be concurrently erased. Also supports full chip erase /square6 100,000 Erase/Program Cycles Typical, 0°C to +70°C /square6 Organized as 128Kx32 FIGURE 1 – PIN CONFIGURATION FOR WF128K32N-XH1X5 Pin Description /square6 Commercial, Industrial and Military Temperature Ranges /square6 5 Volt Programming. 5V ± 10% Supply /square6 Low Power CMOS, 1mA Standby Typical /square6 Embedded Erase and Program Algorithms /square6 TTL Compatible Inputs and CMOS Outputs /square6 Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation /square6 Page Program Operation and Internal Program Control Time /square6 Weight WF128K32-XG2LX5 - 8 grams typical WF128K32-XG2UX5 - 8 grams typical WF128K32-XH1X5 - 13 grams typical Note: For programming information refer to Flash Programming 1M5 Application Note. * This product is subject to change without notice. * * The access time of 50ns is available in Industrial and Commercial temperature ranges only. Block Diagram WE1#C S 1#C S 2#C S 3#C S 4#WE4#WE3#WE2# 128K x 8 128K x 8 128K x 8 128K x 8 OE# A0-16 I/O0-7 I/O24-31I/O16-23I/O8-15 8888 Top View I/O0-31 Data Inputs/Outputs A0-16 Address Inputs WE1-4# Write Enables CS1-4# Chip Selects OE# Output Enable V CC Power Supply GND Ground NC Not Connected

2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 PIN DESCRIPTION FIGURE 3 – PIN CONFIGURATION FOR WF128K32-XG2UX5 AND WF128K32-XG2LX5 BLOCK DIAGRAM TOP VIEW WE1#C S 1#C S 2#C S 3#C S 4#WE4#WE3#WE2# 128K x 8 128K x 8 128K x 8 128K x 8 OE# A0-16 I/O0-7 I/O24-31I/O16-23I/O8-15 8888 I/O0-31 Data Inputs/Outputs A0-16 Address Inputs WE1-4# Write Enables CS1-4# Chip Selects OE# Output Enable V CC Power Supply GND Ground NC Not Connected I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 VCC A11 A12 A13 A14 A15 A16 CS1# OE# CS2# NC WE4# WE3# WE2# NC NC NC NC CS3# GND CS4# WE1# A10 VCC 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43

3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 ABSOLUTE MAXIMUM RATINGS (1) NOTES: 1. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may overshoot V SS to -2.0 V for periods of up to 20ns. Maximum DC voltage on output and I/O pins is Vcc + 0.5V. During voltage transitions, outputs may overshoot to V CC + 2.0 V for periods of up to 20ns. 3. Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is +13.5V which may overshoot to 14.0 V for periods up to 20ns. NOTES: 1. The I CC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically is less than 2 mA/MHz, with OE# at V IH. 2. I CC active while Embedded Algorithm (program or erase) is in progress. 3. DC test conditions: V IL = 0.3V, VIH = VCC - 0.3V RECOMMENDED OPERATING CONDITIONS Parameter Symbol Min Max Unit Supply Voltage V CC 4.5 5.5 V Input High Voltage V IH 2.0 V CC + 0.3 V Input Low Voltage V IL -0.5 +0.8 V Operating Temp. (Mil.) T A -55 +125 °C A9 Voltage for Sector Protect V ID 11.5 12.5 V Parameter Unit Operating Temperature -55 to +125 °C Supply Voltage Range (VCC) -2.0 to +7.0 V Signal voltage range (any pin except A9) (2) -2.0 to +7.0 V Storage Temperature Range -65 to +150 °C Lead Temperature (soldering, 10 seconds) +300 °C Data Retention Mil Temp 10 years Endurance (write/erase cycles) Mil Temp 10,000 cycles min. A9 Voltage for sector protect (VID) (3) -2.0 to +14.0 V Parameter Symbol Conditions Min Max Unit Input Leakage Current I LI VCC = 5.5, VIN = GND to VCC 10 µA Output Leakage Current I LOx32 VCC = 5.5, VIN = GND to VCC 10 µA VCC Active Current for Read (1) I CC1 CS# = VIL, OE# = VIH 140 mA VCC Active Current for Program or Erase (2) ICC2 CS# = VIL, OE# = VIH 200 mA VCC Standby Current I CC3 VCC = 5.5, CS# = VIH, f = 5MHz 6.5 mA VCC Static Current I CC4 VCC = 5.5, CS# = VIH 0.6 mA Output Low Voltage V OL IOL = 8.0 mA, VCC = 4.5 0.45 V Output High Voltage V OH1 IOH = -2.5 mA, VCC = 4.5 0.85 x VCC V Output High Voltage V OH2 IOH = -100 µA, VCC = 4.5 VCC -0.4 V Low VCC Lock Out Voltage V LKO 3.2 V CAPACITANCE Ta = +25°C Parameter Symbol Conditions Max Unit OE# capacitance C OE VIN = 0V, f = 1.0 MHz 50 pF WE1-4# capacitance HIP (PGA) H1 CWE VIN = 0V, f = 1.0 MHz pF CQFP G2U/G2L 15 CS1-4# capacitance C CS VIN = 0V, f = 1.0 MHz 20 pF Data# I/O capacitance C I/O VI/O = 0V, f = 1.0 MHz 20 pF Address input capacitance C AD VIN = 0V, f = 1.0 MHz 50 pF This parameter is guaranteed by design but not tested. DC CHARACTERISTICS – CMOS COMPATIBLE VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C

4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, CS# CONTROLLED VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C FIGURE 4 – AC TEST CIRCUIT Parameter Symbol -50 -60 -70 -90 -120 -150 Unit Min Max Min Max Min Max Min Max Min Max Min Max Write Cycle Time t AVAV tWC 50 60 70 90 120 150 ns WE# Setup Time t WLEL tWS 000000 n s CS# Pulse Width t ELEH tCP 25 30 35 45 50 50 ns Address Setup Time t AVEL tAS 000000 n s Data Setup Time t DVEH tDS 25 30 30 45 50 50 ns Data Hold Time t EHDX tDH 000000 n s Address Hold Time t ELAX tAH 40 45 45 45 50 50 ns WE# Hold from WE# High t EHWH tWH 000000 n s CS# Pulse Width High t EHEL tCPH 20 20 20 20 20 20 ns Duration of Programming Operation t WHWH1 14 14 14 14 14 14 µs Read Recovery before Write t GHEL 000000 n s Notes: VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 Ω. VZ is typically the midpoint of V OH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. AC Test Conditions Parameter Typ Unit Input Pulse Levels V IL = 0, VIH = 3.0 V Input Rise and Fall 5 ns Input and Output Reference Level 1.5 V Output Timing Reference Level 1.5 V

5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE# CONTROLLED VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol -50 -60 -70 -90 -120 -150 Unit Min Max Min Max Min Max Min Max Min Max Min Max Write Cycle Time t AVAV tWC 50 60 70 90 120 150 ns Chip Select Setup Time t ELWL tCS 000000 n s Write Enable Pulse Width t WLWH tWP 25 30 35 45 50 50 ns Address Setup Time t AVWL tAS 000000 n s Data Setup Time t DVWH tDS 25 30 30 45 50 50 ns Data Hold Time t WHDX tDH 000000 n s Address Hold Time t WLAX tAH 40 45 45 45 50 50 ns Chip Select Hold Time t WHEH tCH 000000 n s Write Enable Pulse Width High t WHWL tWPH 20 20 20 20 20 20 ns Duration of Byte Programming Operation (min) tWHWH1 14 14 14 14 14 14 µs Read Recovery Time Before Write t GHWL 000000 n s VCC Setup Time t VCS 50 50 50 50 50 50 µs Output Enable Setup Time t OES 000000 n s Output Enable Hold Time (1) t OEH 10 10 10 10 10 10 ns 1. For Toggle and Data Polling. AC CHARACTERISTICS – READ ONLY OPERATIONS VCC = 5.0V, VSS = 0V, -55°C ≤ TA ≤ +125°C Parameter Symbol -50 -60 -70 -90 -120 -150 Unit Min Max Min Max Min Max Min Max Min Max Min Max Read Cycle Time t AVAV tRC 50 60 70 90 120 150 ns Address Access Time t AVQV tACC 50 60 70 90 120 150 ns Chip Select Access Time t ELQV tCE 50 60 70 90 120 150 ns OE# to Output Valid t GLQV tOE 25 30 35 40 50 55 ns Chip Select to Output High Z (1) t EHQZ tDF 20 20 20 25 30 35 ns OE# High to Output High Z (1) t GHQZ tDF 20 20 20 25 30 35 ns Output Hold from Address, CS# or OE# Change, whichever is fi rst tAXQX tOH 000000 n s 1. Guaranteed by design, not tested.

6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 FIGURE 5 – AC WAVEFORMS FOR READ OPERATIONS Addresses Addresses Stable Output Valid DX DX High Z High Z tACC tOE tOH tDF tCE tRC Outputs CS1#/CS2# OE# WE#

7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 FIGURE 6 – WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED NOTES: 1. PA is the address of the memory location to be programmed. 2. PD is the data to be programmed at byte address. 3. D 7# is the output of the complement of the data written to the device (for each chip). 4. D OUT is the output of the data written to the device. 5. Figure indicates last two bus cycles of four bus cycle sequence. Addresses 5555H PA PA Data# Polling tAS tAHtWC tGHWL tCS tDS tWP tWPH tWHWH1 tDH AOH PD D 7# tRC tOE tDF tOH tCE DOUT CS# OE# WE# Data 5.0 V

8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 FIGURE 7 – AC WAVEFORMS CHIP/SECTOR ERASE OPERATIONS Notes: 1. SA is the sector address for Sector Erase. Addresses 5555H 5555H 5555H2AAAH 2AAAH SA tAS tAH tGHWL tWP tWPH tDH AAH 55H 80H AAH 55H 10H/30H tCS tDS tVDS CS# OE# WE# Data VCC

9 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 FIGURE 8 – AC WAVEFORMS FOR DATA# POLLING DURING EMBEDDED ALGORITHM OPERATIONS CS# OE# WE# D0-D6 D7 D7# D0-D6 = Invalid D7 = Valid Data High Z D0-D7 Valid Data Data tCH tOEH tOE tOE tOH tDF tCE tWHWH 1 or 2

10 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 FIGURE 9 – WRITE/ERASE/PROGRAM OPERATION, CS# CONTROLLED NOTES: 1. PA represents the address of the memory location to be programmed. 2. PD represents the data to be programmed at byte address. 3. D 7# is the output of the complement of the data written to the device (for each chip). 4. D OUT is the output of the data written to the device. 5. Figure indicates the last two bus cycles of a four bus cycle sequence. Addresses 5555H PA PA Data# Polling tAS tAHtWC tGHEL tWS tDS tCP tCPH tWHWH1 tDH AOH PD D7# DOUT WE# OE# CS# Data 5.0 V

11 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1) 4.60 (0.181) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

12 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U) The White 68 lead G2U CQFP fi lls the same fi t and function as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2U has the TCE and lead inspection advantage of the CQFP form. ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES oo

13 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 20.31 (0.800) REF 1.27 (0.050) TYP 5.10 (0.200) MAX 24.0 (0.946) ± 0.25 (0.010) 0.23 (0.009) REF R 0.127 (0.005) 2O / 9O 0.89 (0.035) ± 1.14 (0.045) 1.37 (0.054) MIN 0.004 0.940" TYP PACKAGE 528 : 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

14 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 LEAD FINISH: Blank = Gold plated leads A = Solder dip leads V PP PROGRAMMING VOLTAGE 5 = 5V DEVICE GRADE: Q = MIL - STD 833 Compliant M = Military Screened -55°C to +125°C I = Industrial -40°C to +85°C C = Commercial 0°C to + 70°C PACKAGE TYPE: H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400) G2U = 22.4mm Ceramic Quad Flat Pack, Low Profi le CQFP (Package 510) G2L = 22.4mm Ceramic Quad Flat Pack, Low Profi le CQFP (Package 528) ACCESS TIME (ns) IMPROVEMENT MARK N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrade ORGANIZATION, 128K x 32 User confi gurable as 256K x 16 or 512K x 8 Flash WHITE ELECTRONIC DESIGNS CORP.

ORDERING INFORMATION

W F 128K32 X - XXX X X 5 X

15 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WF128K32-XXX5 March 2006 Rev. 8 Note 1: Package Not Recommended For New Design DEVICE TYPE SPEED PACKAGE SMD NO. 128K x 32 Flash 150ns 66 pin HIP (H1) 5962-94716 01H8X 128K x 32 Flash 120ns 66 pin HIP (H1) 5962-94716 02H8X 128K x 32 Flash 90ns 66 pin HIP (H1) 5962-94716 03H8X 128K x 32 Flash 70ns 66 pin HIP (H1) 5962-94716 04H8X 128K x 32 Flash 60ns 66 pin HIP (H1) 5962-94716 05H8X 128K x 32 Flash 150ns 68 lead CQFP (G2U) 5962-94716 01HNX 128K x 32 Flash 120ns 68 lead CQFP (G2U) 5962-94716 02HNX 128K x 32 Flash 90ns 68 lead CQFP (G2U) 5962-94716 03HNX 128K x 32 Flash 70ns 68 lead CQFP (G2U) 5962-94716 04HNX 128K x 32 Flash 60ns 68 lead CQFP (G2U) 5962-94716 05HNX 128K x 32 Flash 150ns 68 lead CQFP (G2L) 5962-94716 01HAX 128K x 32 Flash 120ns 68 lead CQFP (G2L) 5962-94716 02HAX 128K x 32 Flash 90ns 68 lead CQFP (G2L) 5962-94716 03HAX 128K x 32 Flash 70ns 68 lead CQFP (G2L) 5962-94716 04HAX 128K x 32 Flash 60ns 68 lead CQFP (G2L) 5962-94716 05HAX