STFW3N150_10 STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 15
Technical content
Datasheet sections
- 1 Electrical ratings
- 2 Electrical characteristics
- 2.1 Electrical characteristics (curves)
- 3 Test circuits
- 4 Package mechanical data
- 5 Revision history
Features
■ 100% avalanche tested ■ Intrinsic capacitances and Qg minimized ■ High speed switching ■ Fully isolated TO-3PF plastic package ■ Creepage distance path is 5.4 mm (typ.) for TO-3PF Application Switching applications
Description
Using the well consolidated high voltage MESH OVERLAY TM process, STMicroelectronics has designed an advanced family of very high voltage Power MOSFETs with outstanding performances. The strengthened layout coupled with the company’s proprietary edge termination structure, gives the lowest R DS(on) per area, unrivalled gate charge and switching characteristics. Figure 1. Internal schematic diagram
140 W TO-220
Table 1. Device summary
1 Electrical ratings
Table 2. Absolute maximum ratings
- Pulse width limited by safe operating area
Table 3. Thermal data Table 4. Avalanche characteristics
2 Electrical characteristics
Table 5. On /off states Table 6. Dynamic
- Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
- C oss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS
Table 7. Switching times Table 8. Source drain diode
- Pulse width limited by safe operating area
- Pulsed: pulse duration = 300 µs, duty cycle 1.5%
2.1 Electrical characteristi cs (curves)
Figure 2. Safe operating area for TO-3PF Figure 3. Thermal impedance for TO-3PF Figure 4. Safe operating area for TO-220 Figure 5. Thermal impedance for TO-220 Figure 6. Safe operating area for TO-247 Figure 7. Thermal impedance for TO-247
3 Test circuits
Figure 18. Switching times test circuit for Figure 19. Gate charge test circuit Figure 20. Test circuit for inductive load Figure 21. Unclamped inductive load test Figure 22. Unclamped inductive wavefo rm Figure 23. Switching time waveform
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
A 4.40 4.60 0.17 3 0.181 b 0.61 0. 88 0.024 0.0 34 b1 1.14 1.70 0.044 0.066 c0 . 4 8 0.70 0.01 9 0.027 D 15.25 15.75 0.6 0.62 D1 1.27 0.050 E 10 10.40 0. 393 0.409 e 2.40 2.70 0.0 94 0.106 e1 4. 95 5.15 0.1 94 0.202 F1 . 2 3 1.32 0.04 8 0.051 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.0 94 0.107 L1 3 14 0.511 0.551 L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L302 8.90 1.1 37 ∅P 3.75 3.85 0.147 0.151 Q2 . 6 5 2 . 95 0.104 0.116
Dim. mm. Min. Typ Max. A4 . 855 . 1 5 A1 2.20 2.60 b 1.0 1.40 b1 2.0 2.40 b2 3.0 3.40 c0 . 4 0 0 . 80 D1 9.85 20.15 E 15.45 15.75 e5 . 4 5 L 14.20 14. 80 L1 3.70 4. 30 L2 1 8.50 øP 3.55 3.65 øR 4.50 5.50 S 5.50 TO-247 Mechanical data
DIM. mm. min. typ max. A5 . 30 5.70 C2 . 80 3.20 D 3.10 3.50 D1 1. 80 2.20 E0 . 80 1.10 F 0.65 0.95 F2 1. 80 2.20 G 10. 30 11.50 G1 5.45 H 15. 30 15.70 L9 . 80 10 10.20 L2 22. 802 3.20 L3 26.30 26.70 L4 4 3.20 44.40 L5 4. 30 4.70 L6 24. 30 24.70 L7 14.60 15 N1 . 80 2.20 R 3.80 4.20 Dia3 .40 3.80 TO-3PF mechanical data 7627132_C
5 Revision history
Table 9. Document revision history 17-Apr-2007 2 Added new value on Table 6. 29-Jun-2010 9 Corrected unit in Table 3.