W3H32M64E-XSBX WEDC | Alldatasheet
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Technical content
ADVANCED* 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs October 2005 Rev. 3 White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
FEATURES
/square6 Data rate = 667*, 533, 400 /square6 Package:
- 208 Plastic Ball Grid Array (PBGA), 16 x 20mm
- 1.0mm pitch /square6 DDR2 Data Rate = 667*, 533, 400 /square6 Supply Voltage = 1.8V ± 0.1V /square6 Differential data strobe (DQS, DQS#) per byte /square6 Internal, pipelined, double data rate architecture /square6 4-bit prefetch architecture /square6 DLL for alignment of DQ and DQS transitions with clock signal /square6 Four internal banks for concurrent operation (Per DDR2 SDRAM Die) /square6 Programmable Burst lengths: 4 or 8 /square6 Auto Refresh and Self Refresh Modes /square6 On Die Termination (ODT) /square6 Adjustable data – output drive strength /square6 Programmable CAS latency: 3, 4 or 5 /square6 Posted CAS additive latency: 0, 1, 2, 3 or 4 /square6 Write latency = Read latency - 1* tCK /square6 Commercial, Industrial and Military Temperature Rang es /square6 Organized as 32M x 64, user confi gurable as 2 x 32M x 32 /square6 Weight: W3H32M64E-XSBX - 2.5 grams typical BENEFITS /square6 62% SPACE SAVINGS vs. FPBGA /square6 Re duced part count /square6 42% I/O reduction vs FPBGA /square6 Re duced trace lengths for low er par a sit ic ca pac i tance /square6 Suit able for hi-re li abil i ty ap pli ca tions /square6 Upgradeable to 64M x 64 den si ty (con tact fac to ry for information) * This product is under development, is not qualifi ed or characterized and is subject to change or cancellation without notice. Area 4 x 209mm 2 = 836mm2 320mm 2 62% 4 x 90 balls = 360 balls 208 Balls 42% S A V I N G S I/O Count Actual Size W3H32M64E-XSBXCSP Approach (mm) FBGA 11.0 19.0 FBGA 11.0 FBGA 11.0 FBGA 11.0 FIGURE 1 – DENSITY COMPARISONS White Electronic Designs W3H32M64E-XSBX
2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs October 2005 Rev. 3 ADVANCED White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. RASB# WEB# CASB# CSB# A0-12 BA0-1 CAS# DQ0 DQ15 DQ0 DQ15 IC2 DQ16 DQ31 RASA# WEA# CASA# DQ0 DQ15 WE# IC1 RAS# CSA# DQ0 DQ15 IC3 DQ32 DQ47 DQ0 DQ15 IC4 DQ48 DQ63 A0-12 BA0-1 CK0# CK# CKE LDM0 LDM UDM0 UDM LDQS0 LDQS# UDQS0 LDQS0# UDQS0# UDQS# LDQS UDQS CK0 CK A0-12 BA0-1 CK1# CK# CKE LDM1 LDM UDM1 UDM LDQS1 LDQS# UDQS1 LDQS1# UDQS1# UDQS# LDQS UDQS ODT CDT CK1 CK A0-12 BA0-1 CK2# CK# CKEB CKE LDM2 LDM UDM2 UDM LDQS2 LDQS# UDQS2 LDQS2# UDQS2# UDQS# LDQS UDQS ODT CK2 CK A0-12 BA0-1 CK3# CK# CKE CKEA LDM3 LDM UDM3 UDM LDQS3 LDQS# UDQS3 LDQS3# UDQS3# UDQS# LDQS UDQS ODT CK3 CK ODT CS# CAS#WE# RAS# CS# CAS#WE# RAS# CS# CAS#WE# RAS# CS# FIGURE 2 – FUNCTIONAL BLOCK DIAGRAM
3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs October 2005 Rev. 3 ADVANCED White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. TOP VIEW FIGURE 1 - PIN CONFIGURATION 1 2 3 4 5 6 7 8 9 10 11 A B C D E F G H J K L M N P R T U V W VCC VSS DQ35 DQ52 LDM3 DQ38 UMD3 VCC VSS VCC UDQS1# DQ13 LDQS1# DQ0 CK0 VSS VCC VSS VCC VSS NC DQ51 DQ36 LDM2 DQ54 DQ44 UDQS1 DQ29 LDQS0# DQ16 CK0# CK1# V SS VCC VSS NC NC WEB# DQ33 DQ49 DQ60 DQ41 A10 A11 UDQS0 DQ8 DQ10 LDQS1 DQ5 CK1 NC VSS VCC NC NC CKEB NC DQ43 DQ57 DQ46 V CC DQ15 DQ24 DQ26 LDQS0 DQ21 DQ2 NC V CC VCC NC NC NC DNU DQ59 UMD2 DQ62 VCC VSS VCC UDQS0# DQ31 DQ23 DQ7 DQ18 RASA# CSA# VCC VCC CSB# RASB# DQ50 DQ39 DQ55 DQ63 UDQS2# VCC VSS VCC DQ30 UDM0 DQ27 NC NC NC NC V CC VCC VSS CK3# CK2# DQ48 LDQS2# DQ61 UDQS3 DNU* BA1 DQ12 DQ22 LDM0 DQ4 DQ19 NC VSS VCC VCC NC DQ34 DQ53 LDQS2 DQ58 DQ56 DQ47 V CC BA0 DQ14 DQ25 DQ11 NC CKEA NC NC V CC VSS NC CK3 DQ37 LDQS3 DQ42 DQ40 UDQS2 A12 DQ9 DQ28 DQ17 DQ1 WEA# NC NC V SS VSS NC CASB# NC DNU DNU VSS VCC VSS VREF VSS VCC VSS ODT NC NC CASA# NC VSS VSS VCC VSS CK2 DQ32 LDQS3# DQ45 UDQS3# VCC VSS VCC UMD1 DQ6 LDM1 DQ20 DQ3 VSS VCC VSS * Pin J10 is reserved for signal A13 on future upgrades.
4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs October 2005 Rev. 3 ADVANCED White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. All linear dimensions are millimeters and parenthetically in inches BOTTOM VIEW PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA) A B C D E F G H J K L M N P R T U V W 11 10 9 8 7 6 5 4 3 2 1 208 x Ø 0.60 (0.024) NOM 1.0 (0.039)NOM 10.0 (0.394) NOM 16.15 (0.636) MAX 20.15 (0.793) MAX 18.0 (0.709) NOM 1.0 (0.039) NOM 2.56 (0.100) MAX 0.50 (0.020) NOM
5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs October 2005 Rev. 3 ADVANCED White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP. DDR2 SDRAM CONFIGURATION, 32M x 64 1.8V Power Supply DATA RATE (Mbs) 400 = 400Mbs 533 = 533Mbs 667 = 667Mbs Blank = No datarate specifi ed for ES product (1) PACKAGE: ES = Non Qualifi ed Product (1) SB = 208 Plastic Ball Grid Array (PBGA) DEVICE GRADE: M = Military -55°C to +125°C I = In dus tri al -40°C to +85°C C = Com mer cial 0°C to +70°C Blank = No temperature specifi ed for ES product (1) W 3H 32M 64 E - XXX SB X Note 1: W3H32M64E-ESSB is the only available product until completion of qualifi cation.
6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs October 2005 Rev. 3 ADVANCED White Electronic Designs Corp. reserves the right to change products or specifi cations without notice. Document Title 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
Revision History
Rev # History Release Date Status Rev 0 Initial Release June 2005 Advanced Rev 1 Rev 2 Rev 3 Changes (Pg. 1, 3, 5)
1.1 Change max package width to 16mm
Changes (pg. 1, 3, 6)
2.1 Pinout added
Changes (Pg. 1, 3, 6)