STW13009 STMICROELECTRONICS | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 11

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 2 Electrical characteristics
  • 2.1 Electrical characteristics (curves)
  • 3 Test circuit
  • 4 Package mechanical data
  • 5 Revision history

Features

■ Low spread of dynamic parameters ■ High voltage capability ■ Minimum lot-to-lot spread for reliable operation ■ Very high switching speed Application ■ Switch mode power supplies

Description

The device is manufactured using high voltage multi-epitaxial planar technology for high switching speeds and medium voltage capability. It uses a Hollow emitter structure to enhance switching speeds. Figure 1. Internal schematic diagram Table 1. Device summary

  1. Product is pre-selected in DC current gain (group L and group H). STMicroelectronics reserves the right to ship either

groups according to production availability. Please contact your nearest STMicroelectronics sales office for delivery details.

1 Electrical ratings

Table 2. Absolute maximum rating Table 3. Thermal data

2 Electrical characteristics

Table 4. Electrical characteristics

  1. Pulsed duration = 300 ms, duty cycle ≤ 1.5 %
  2. Product is pre-selected in DC current gain (group L and group H). STMicroelectronics reserves the right to

sales office for delivery details.

2.1 Electrical characteristics (curves)

Figure 2. Safe operating area Figure 3. Derating curve Figure 4. DC current gain Figure 5. DC current gain Figure 6. Collector-emitter saturation Figure 7. Base-emitter saturation

Figure 8. Reverse biased operating

3 Test circuit

Figure 9. Inductive load switching test circuit

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

Dim. mm. Min. Typ Max. A4 . 855 . 1 5 A1 2.20 2.60 b 1.0 1.40 b1 2.0 2.40 b2 3.0 3.40 c0 . 4 0 0 . 80 D1 9.85 20.15 E 15.45 15.75 e5 . 4 5 L 14.20 14. 80 L1 3.70 4. 30 L2 1 8.50 øP 3.55 3.65 øR 4.50 5.50 S 5.50 TO-247 Mechanical data

5 Revision history

Table 5. Document revision history