W1049B030

Microchip Technology

low power consuming IC containing a 2.4 GHz IEEE 802.11b/g/n-compliant radio 03/2025

Manufacturer: Microchip Technology

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WINCS02 MICROCHIP | Alldatasheet

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© 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 1 In tr oduction The WINCS02IC is a low power consuming IC containing a 2.4 GHz IEEE 802.11b/g/n-compliant radio with integrated High Power Amplifier (HPA), Low Noise Amplifier (LNA), Radio Frequency (RF) switches for TX/RX control and hardware-based security accelerator. The WINCS02IC is designed to execute Microchip-provided Wi-Fi® and Networking stack components accessible through a Serial Peripheral Interface (SPI). The WINCS02 is a fully-integrated module based on WINCS02IC. It contains all necessary external components and antenna to simplify a new board design. The module is interoperable with various vendors' 802.11 b/g/n The WINCS02IC and WINCS02 Module operates at a single supply voltage VDD, VDDIO (3.3V typical). The WINCS02 Module is available with an on-board Printed Circuit Board (PCB) antenna or U.FL connector for an external antenna and with or without integrated Microchip Trust&Go CryptoAuthentication™ device. Note: The WINCS02IC must be programmed with the appropriate Network Controller firmware version to meet the specification described in the data sheet. WINCS02IC and WINCS02 Module Features

IEEE 802.11 b/g/n, Single Stream (1x1) 20 MHz Bandwidth WLAN Link – Compatible with Wi-Fi ® 6/7 2.4 GHz band
Transmission Control Protocol/Internet Protocol (TCP/IP)-Based Connectivity Protocols along with SSL and MQTT Capabilities
Supports STA Mode and Soft AP Functionality in IEEE 802.11 Infrastructure and IBSS Networks
Protected Management Frame (PMF) Handled in Hardware, WPA3 Support
Integrated Power Amplifier (PA), TX/RX Switch and Power Management
Internal Flash Memory (Up to 2 MB) to Store Firmware
Immutable Secure Boot with Hardware Root of Trust
Supports Host Assisted Over-the-Air (OTA) Firmware Update
Supports Extreme Deep Sleep (XDS) Mode (1)
On-Chip Network Stack to Offload MCU(3) – Network features – TCP, UDP, DHCP, ARP, HTTP, MQTT, IPv6, TLS 1.2 and DNS – Hardware accelerators for Wi-Fi and TLS security to improve connection time
Hardware-Based IEEE 802.15.2 Compliant Three-Wire Packet Traffic Arbitration (PTA) Interface for Wi-Fi/ Bluetooth® Coexistence(2)
SPI (SDIO based SPI; SDIO-SPI) Host Interface
Secure Device Firmware Upgrade (DFU) www.microchip.com Product Pages: WINCS02IC, WINCS02PC, WINCS02PE, WINCS02UC, WINCS02UE WINCS02 Family Data Sheet WINCS02IC and WINCS02 Family

WINCS02 Module with Integrated Microchip Trust&Go Secure Device (Optional) Security
Hardware Accelerated Security Modes (CryptoMaster) with Built-in DMA Support – Encryption engines (AES and TDES with different NIST modes of operation)
Modes – Electronic Code Book (ECB), Cypher Block Chaining (CBC), Counter Mode (CTR), Cypher Feedback Mode (CFB) and Output Feedback Mode (OFB)
AES key sizes: 128b, 192b and 256b – Authentication engines:
SHA-1 and SHA-2
AES GCM (Galois/Counter mode)
HMAC and AES CMAC – On-chip oscillator for NDRNG generation
Multi-Purpose Public Key Crypto Engine Supporting the Following Algorithms: – ECC/ECDH/ECDSA with standard NIST prime curves up to 521-bit, Curve25519 and Ed25519 – RSA up to 2048-bit keys Oper ating Conditions
WINCS02IC – Operating Voltage V DD and VDDIO: 3.0-3.6V (3.3V Typical) – Operating Temperature: -40°C to 105°C
AEC-Q100 Grade 2 qualified
WINCS02 Module – Operating Voltage V DD and VDDIO: 3.0-3.6V (3.3V Typical) – Operating Temperature: -40°C to 85°C Module Variants
PCB Antenna: – WINCS02PE – WINCS02PC
U.FL Connector for External Antenna: – WINCS02UE – WINCS02UC Package
WINCS02IC – 48-pin VQFN – Size: 7 mm x 7 mm x 0.9 mm
WINCS02 Module – 28-pin SMD Package with RF Shield Can on Top – Size: 21.7 mm x 14.7 mm x 2.1 mm Applic ations
Smart Factories/Control Devices
Security Systems, CCTV
Smart Homes/Lighting, Smart Locks

Computing, Wi-Fi Dongles, Protocol Bridging
Internet of Things (IoT) Sensor Tag
Remote Control
Wearable Smart Devices
Industrial Control Certific ations
WINCS02 Module Certified to FCC, ISED, CE, UKCA, MIC, KCC and NCC Radio Regulations
RoHS and REACH Compliant Example Block Diagram Host MCU with BLE* MQTT, DNS, TLS File System TCP/IP Stack WINCS02 Secure Element* *Optional SPI PTA* I2C* WPA2/3, Wi-Fi R Notes: 1. For more details on the Extreme Deep Sleep (XDS) mode, refer to Extreme Deep Sleep (XDS) Current Consumption and MPLAB® Harmony WINCS02 WLAN Library. 2. Either the PTA functionality or the RTCC oscillator can be used. For more details, refer to Pin Details of WINCS02 Module. 3. For more details about the latest supported features, refer to the MPLAB® Harmony WINCS02 WLAN Library and WINCS02 Application Developer's Guide.

WINCS02IC and WINCS02 Family Ordering In f ormation Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 5 1. Ordering In f ormation This chapter provides the ordering information of the WINCS02IC and the WINCS02 Module.

1.1 WINCS02IC Ordering In f ormation

This section provides the ordering information of the WINCS02IC. Table 1-1. WINCS02IC Ordering Details SoC Name Pin and Package Description Ordering Code WINCS02IC 48-pin VQFN (7 mm x 7 mm x 0.9 mm) 32-bit Network Controller IC with WLAN connectivity and hardware-based security accelerator with 2 MB stacked Flash WINCS02IC-I/ZZX WINCS02ICT-I/ZZX WINCS02IC-V/ZZX WINCS02ICT-V/ZZX The following figure illustrates the details of the WINCS02IC ordering information. Figure 1-1. WINCS02IC Ordering In f ormation WI NC S 02 Flash Memory Size Network Controller Wi-Fi ® Chip IC I/V /ZZX Stacked Flash Temperature Range I = Industrial (-40°C to 85°C) V = Various (-40°C to 105°C) Package Code Packing T - 02 = 2 MB Flash T = Tape & Reel (1) Notes: 1. By default, the WINCS02IC comes with Tray packing. 2. The WINCS02IC must be programmed with the appropriate Network Controller firmware version to meet the specification described in the data sheet.

1.2 Module Ordering In f ormation

This chapter provides the ordering information of the WINCS02 Module. Table 1-2. WINCS02 Module Ordering Details Module Name Description Ordering Code WINCS02PE Wi-Fi® Network Controller Module with PCB Antenna WINCS02PE-I/XXX WINCS02PC Wi-Fi Network Controller Module with PCB Antenna and Trust&Go WINCS02PC-I/XXX WINCS02UE Wi-Fi Network Controller Module with U.FL connector for external Antenna WINCS02UE-I/XXX WINCS02UC Wi-Fi Network Controller Module with U.FL connector for external Antenna and Trust&Go WINCS02UC-I/XXX The following figure illustrates the details of the WINCS02 Module ordering information. Figure 1-2. WINCS02 Module Ordering In f ormation WI NC S 02 Flash Memory Size Network Controller Wi-Fi ® Antenna P/U Stacked Flash Temperature Range I = Industrial (-40°C to 85°C) Firmware Version Packing 02 = 2 MB Flash T = Tape & Reel P = PCB Antenna U = U.FL Connector /XXX-ITE/C Encryption E – No Encryption C – Trust&Go (1) Note: 1. By default, the WINCS02 Module comes with Tray packing.

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 7 2. Device Overview The WINCS02IC is a single chip 2.4 GHz and IEEE® 802.11b/g/n-compliant solution with integrated HPA, LNA and RF switches for TX/RX control. The WINCS02 is a fully RF-certified module based on WINCS02IC available with the following antenna variants:

PCB antenna (WINCS02PE/WINCS02PC)
U.FL connector (WINCS02UE/WINCS02UC) for external antenna The following figure illustrates the WINCS02IC and the WINCS02 Module block diagram and various peripherals supported by these devices. Figure 2-1. WINCS02 Module Block Diagram MCLR UART2_TX (Debug Log) VDD VDDIO INTOUT DFU_RX/STRAP1 DFU_TX/STRAP2 PTA/RTCC OSC UART1 SPI Host Interface WINCS02IC PCB Antenna or U.FL Connector System Bus Interfaces SPI, UART1 PTA POSCPMU VDD, VDDIO RFADC/ DAC Baseband Phy WLAN MACMemory FLASH RAMCRYPTO CPU WINCS02 Module RF Matching Circuit Trust&GO Crypto Authentication TM Device (Optional)

40 MHz

2.1 Pin Details of WINCS02IC

This section provides details on pin diagrams and the pinout table of WINCS02IC. Figure 2-2. WINCS02IC Pin Diagram PMU_BK_LX PMU_VDDP PMU_MLDO_OUT VDD33 PTA_BT_PRIO VDD33 PTA_WLAN_ACTIVE RTCC_OSC_IN/PTA_BT_ACTIVE RTCC_OSC_OUT AVDD 3746 45 44 43 42 41 40 39 384748 Reserved WINCS02IC RXR_LNA1_VDD15 TRS_RF TXR_HPA_VDD33 TXR_HPA_VDD33 TXR_PPA_VDD33 BB_VDD15 MSB_EXTRA_48K DFU_RX/STRAP1 DFU_TX/STRAP2 RXR_LNA2_VDD15 TXR_UMX_VDD15 MCLR RXR_RIQ_VDD15 SPI_FE_VDD15 SYN_VCO_VDD15 SYN_PLL_VDD15 SYN_SD_VDD15 XTL_OUT XTL_IN XTL_VDD15 AFE_VDD15 SPI_VDD15 VDD33 I2C_SDA1 13 2423222120191817161514 SDI1 VDDIO SDO1 CS1 PMU_VDDIO/PMU_VDDC I2C_SCL1 UART2_TX VDD15 INTOUT SCK1 UART1_RX (1) Reserved UART1_TX Table 2-1. WINCS02IC Pinout Table Pin Number Pin Name Pin Type Description

1 PMU_VDDIO/ PMU_VDDC P Input power supply to the on-chip PMU I/O and PMU Core

section (3.0V-3.6V, 3.3V typical) 2 VDD15 P 1.5V input supply voltage Connect to 1.5V on-chip PMU output

3 SCK1 I SPI1, Serial Clock

Connect to the Serial Clock of the host device

4 UART1_RX(6) I Used for external antenna calibration

Connect this signal to a test point or a pin header

5 SDO1 O SPI1, Serial Data Out

Connect to the Serial Data In of the host device

6 CS1 I SPI1, Chip Select (Active low)

Connect to the Chip Select of the host device 7 VDDIO P Input supply voltage to I/O Port (3.0-3.6V, 3.3V typical)

8 SDI1 I SPI1, Serial Data In

Connect to Serial Data Out of the host device

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 9 Table 2-1. WINCS02IC Pinout Table (c ontinued) Pin Number Pin Name Pin Type Description

9 UART1_TX(6) O Used for external antenna calibration

Connect this signal to a test point or a pin header

10 INTOUT O Interrupt request (Active-low) from the Wi-Fi® module

11 UART2_TX O UART2 Transmit signal to print the firmware debug log

12 I2C_SCL1 I I2C Clock to connect Trust&Go Authentication Secure device. Connect an external Pull up resistor, if used

13 I2C_SDA1 I/O I2C Data to connect Trust&Go Authentication Secure device

Connect an external Pull up resistor, if used 14 VDD33 P Input supply voltage for the Main Power Domain (3.0-3.6V, 3.3V typical) 15 SPI_VDD15 P 1.5V input supply voltage to internal SPI Block Connect to 1.5V on-chip PMU output 16 AFE_VDD15 P 1.5V input supply voltage to RF Analog Front-End Connect to 1.5V on-chip PMU output 17 XTL_VDD15 P 1.5V input supply voltage to primary oscillator section Connect to 1.5V on-chip PMU output

18 XTL_IN I 40 MHz primary oscillator crystal input

19 XTL_OUT O 40 MHz primary oscillator crystal output

20 SYN_SD_VDD15 P 1.5V input supply voltage to RF Synthesizer/SD Connect to 1.5V on-chip PMU output 21 SYN_PLL_VDD15 P 1.5V Input supply voltage to Synthesizer/PLL Connect to 1.5V on-chip PMU output 22 SYN_VCO_VDD15 P 1.5V input supply voltage to RF Synthesizer/VCO Connect to 1.5V on-chip PMU output 23 SPI_FE_VDD15 P 1.5V input supply voltage to RF Front-End/SPI Connect to 1.5V on-chip PMU output 24 RXR_RIQ_VDD15 P 1.5V input supply voltage to RF IQ Mixer/RXR Connect to 1.5V on-chip PMU output 25 RXR_LNA2_VDD15 P 1.5V input supply voltage to LNA stage-2 Connect to 1.5V on-chip PMU output 26 RXR_LNA1_VDD15 P 1.5V input supply voltage to LNA stage-1 Connect to 1.5V on-chip PMU output

27 TRS_RF I/O RF transmit/receive

28 TXR_HPA_VDD33 P Input power supply to High-Power Amplifier (HPA) on the

Transmitter (3.0-3.6V, 3.3V typical)29 TXR_HPA_VDD33 P

30 TXR_PPA_VDD33 P Input power supply to Pre-Power Amplifier (PPA) on the

Transmitter (3.0-3.6V, 3.3V typical) 31 TXR_UMX_VDD15 P 1.5V input supply voltage to RF Upconvertor Mixer/TXR Connect to 1.5V on-chip PMU output 32 BB_VDD15 P 1.5V input supply voltage to RF Base Band section Connect to 1.5V on-chip PMU output 33 MSB_EXTRA_48K O Connect a pull-down resistor of 48.7K with 1% tolerance to create a constant current reference for internal analog/RF blocks.

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 10 Table 2-1. WINCS02IC Pinout Table (c ontinued) Pin Number Pin Name Pin Type Description

34 DFU_RX/STRAP1 I Device Firmware Update, receive signal

Host interface configuration strapping1 pin. Connecting to a pull-up resistor of 10K is recommended.

35 DFU_TX/STRAP2 O Device Firmware Update, transmit signal

I Host interface configuration strapping2 pin. Connecting to a pull-up resistor of 10K is recommended.

36 MCLR I Master Clear Reset Input (Active low)

37 AVDD P Input power supply to Analog Block (3.0-3.6V, 3.3V typical)

38 Reserved(7) I/O Reserved pin

Connect to an I/O pin (tri-stated) of a host device or to an external switch for future use 39 RTCC_OSC_OUT(5) O 32.768 KHz RTCC oscillator output

40 RTCC_OSC_IN/

PTA_BT_ACTIVE(4)(5) I 32.768 KHz RTCC Oscillator input PTA interface, Bluetooth® Coexistence device active indication input to WINCS02IC 41 VDD33 P Input supply voltage for the Main Power Domain (3.0-3.6V, 3.3V typical)

42 PTA_BT_PRIO I PTA interface, Bluetooth Coexistence device priority

indication input to WINCS02IC.

43 PTA_WLAN_ACTIVE O PTA interface, WINCS02IC WLAN active indication output to

Bluetooth Coexistence device

44 Reserved I/O Reserved pin

Do not connect. 45 VDD33 P Input supply voltage for the Main Power Domain (3.0-3.6V, 3.3V typical) 46 PMU_MLDO_OUT(3) P 1.5V output of on-chip PMU MLDO 47 PMU_VDDP P Input power supply to the on-chip PMU (3.0-3.6V, 3.3V typical) 48 PMU_BK_LX P 1.5V output of on-chip PMU Buck Regulator Connect to an external LC filter (L = 4.7 uH and C = 10 uF)

49 GND P Thermal ground paddle

Notes: 1. Refer to the reference design package for exact pin mapping and signal connection. 2. WINCS02IC does not support GPIO functionality. All the pins are reserved. 3. Do not connect any external 1.5V supply. 4. This pin can be used either as an oscillator input pin or as PTA BT_ACTIVE. Both functionalities cannot be supported simultaneously. 5. Current firmware does not support the RTCC oscillator function; it is recommended to have an option to mount the RTCC oscillator in the design to upgrade with the future version of firmware releases. 6. For more details, refer to the WINCS02 Module External Antenna Calibration Guide ( DS50003753). 7. Do not leave this pin unconnected. Follow the directions in the Pin Description column for future upgrades.

2.2 Pin Details of WINCS02 Module

This section provides details on pin diagrams and pinout table of WINCS02 Module. Figure 2-3. WINCS02 Module Pin Diagram GND RTCC_OSC_IN/PTA_BT_ACTIVE RTCC_OSC_OUT VDDIO TP DFU_TX/STRAP2 UART2_TX VDD NC DFU_RX/STRAP1 Reserved GND INTOUT SDO1 SCK1 NC I2C_SDA PTA_WLAN_ACTIVE PTA_BT_PRIO Reserved NC GND MCLR 20 21 22 23 24 25 26 27 28 WINCS02 (1) CS1 SDI1 UART1_TX UART1_RX I2C_SCL Table 2-2. WINCS02 Module Pinout Table Pin Number Pin Name Pin Type Pin Description

1 NC — No connection

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 12 Table 2-2. WINCS02 Module Pinout Table (c ontinued) Pin Number Pin Name Pin Type Pin Description 2 I2C_SCL I I2C clock connected to Trust&GO device. Recommended to connect external pull-up resistor of 1.2K on the host board for WINCS02PC and WINCS02UC devices. 3 I2C_SDA I/O I2C data connected to Trust&GO device. Recommended to connect external pull-up resistor of 1.2K on the host board for WINCS02PC and WINCS02UC devices.

4 MCLR I Master Clear Reset Input (Active low)

5 PTA_WLAN_ACTIVE O PTA interface, WLAN Active indication output to Bluetooth®

6 PTA_BT_PRIO I PTA interface, Bluetooth Coexistence device priority

indication input to WINCS02

7 Reserved I/O Reserved pin

Do not connect.

8 NC — No connection

9 GND P Ground

10 DFU_RX/STRAP1 I Device Firmware Update, receive signal

Host interface configuration, Strapping1 pin. For more details on exact configuration, refer to Table 2-3.

11 Reserved(5) — Reserved pin

Connect to an I/O pin (tri-stated) of a host device or to an external switch for future use.

12 GND P Ground

13 INTOUT O Interrupt request (Active low) from the Wi-Fi® module

14 UART1_TX(4) O Used for external antenna calibration

Connect this signal to a test point or a pin header.

15 SDI1 I SPI1, Serial Data In

Connect to Serial Data Out of the host device

16 CS1 I SPI1, Chip Select (Active low)

Connect to the Chip Select of host device

17 SDO1 O SPI1, Serial Data Out

Connect to the Serial Data In of the host device

18 SCK1 I SPI1, Serial Clock

Connect to the Serial Clock of the host device

19 UART1_RX(4) I Used for external antenna calibration

Connect this signal to a test point or a pin header. 20 VDD P VDD power supply (3.0-3.6V)

21 RTCC_OSC_IN/

PTA_BT_ACTIVE(1)(3) I 32.768 KHz RTCC Oscillator input PTA interface, Bluetooth Coexistence device active indication input to WINCS02 22 RTCC_OSC_OUT(3) O 32.768 KHz RTCC Oscillator output 23 VDDIO P I/O power supply (3.0-3.3V) 24 TP P PMU Output Test point: 1.5V(2)

25 NC — No connection

26 DFU_TX/STRAP2 O Device Firmware Update, transmit signal

I Host interface configuration, Strapping2 pin. For more details on exact configuration, refer to the Table 2-3.

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 13 Table 2-2. WINCS02 Module Pinout Table (c ontinued) Pin Number Pin Name Pin Type Pin Description 27 UART2_TX O UART2 transmit signal for the firmware log. UART setting: 460,800 baud, 8N1 and no flow control

28 GND P Ground

29 GND Paddle P Thermal ground paddle

Notes: 1. This pin can be used either as an oscillator input pin or as PTA BT_ACTIVE. The WINCS02 Module does not support both the functionality together. 2. Do not connect any external 1.5V supply. 3. Current firmware does not support RTCC Oscillator function; it is recommended to have an option to mount RTCC Oscillator in the design to upgrade with the future version of firmware releases. 4. For more details, refer to the WINCS02 Module External Antenna Calibration Guide ( DS50003753). 5. Do not leave this pin unconnected. Follow the directions in the Pin Description column for future upgrades.

2.3 Basic Connection Requirement

The WINCS02 Module requires attention to a minimal set of device pin connections before proceeding with development. Figure 2-4. WINCS02 Module Basic Connection and Interface Diagram 10K D N P 100K GND VDD 10K D N P 100K GND VDD 10 k VDD 0.1uF GND RESET INTOUT PTA_BT_ACTIVE GND PTA_WLAN_ACTIVE PTA_BT_PRIO 1V5 TP1 UART2_TX VDD 0.1uF 4.7uF GND GND 0RR11 GND 32.768kH z GND 18p F 18p F DNP DNP 0RR10 SPI_SDI U1_RX TP3 U1_TX TP2 GND RESET 1x6_Header DFU_RX/STRAP1 DFU_TX/STRAP2 RESET VDD VDD I2C_SCL I2C_SDA I/O UART1_TX UART1_RX SPI_CS SPI_SDO DNP DNP DNP WINCS02_MODULE NC 1 I2C_SCL 2 I2C_SDA 3 MCLR4 PTA_WLAN_ACTIVE 5 PTA_BT_PRIO 6 RESERVED 7 NC 8 GND9 DFU_RX/STRAP110 RESERVED11 GND12 INTOUT13 UART1_TX14 SDI115 CS116 SDO117 SCK118 UART1_RX19 VDD 20 RTCC_OSC_IN/PTA_BT_ACTIVE21 RTCC_OSC_OUT22 VDDIO 23 TP 24 NC 25 DFU_TX/STRAP226 UART2_TX 27 GND28 GND PADDLE29 SPI_SCK 1 2 SW1 0.1uF 10 k R13 0RR12 VDD GND GND DNP DNP DNP DNP NOTE on UART1: U1_TX and U1_RX will be required for External antenna calibration for some antennas NOTE on DFU: For Device Firmware Update. Add a 2.54mm pitch 1x6 male header to use with a standard USB to UART converter cable for DFU; Otherwise, Add test points only for the 4 required signals NOTE on Strap pins for host interface selection: Strap1: Pulled high for future upgrades Strap2: Pulled high for SPI as a host interface NOTE on UART2: For printing Firmware Debug Logs NOTE on PTA: For coexistance with a Bluetooth Device NOTE on I2C: For communication with Crypto Authentication security device. Placeholder for Pull-ups recommended NOTE on Host Interface: SPI is the host interface NOTE on Supply Pins: 2 supply pins VDD & VDDIO (3 - 3.6V) NOTE on TP Test Point: 1.5V Output from PMU; To confirm internal PMU is working fine NOTE on RTCC OSC: RTCC OSC can be used if coexistance with Bluetooth device is not a requirement for end applicationNOTE on User Button: Placeholder for User Button recommended for future use Table 2-3. Con figur ation Details Configuration Details Module Pin10/Strap1 Module Pin26/Strap2(1) Host Interface Selection Description

1 X (Pulled High) SPI WINCS02 Module with SPI

Notes: 1. The recommendation is to provide an option to mount the pulled-high resistor in the host board design for future upgrades. 2. The mentioned resistance values are only guidelines. For details on the application schematics, refer to the WINCS02 Add On Board User's Guide (DS50003721).

2.3.1 Power Supply Pin

It is recommended to add a bulk and a decoupling capacitor at the input supply Pin 20 (VDD), Pin 23 (VDDIO) and GND of the WINCS02 Module.

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 15 Figure 2-5. Recommended Module Power Supply Connections VDD V DDIO WINCS02 0.1 µF4.7 µF GNDGND C1 C2 The value of the C1 and C2 capacitors may vary based on the application requirements and source of supply voltage. The C1 and C2 capacitors must be placed close to the pin.

2.3.2 Master Clear (MCLR) Pin

The MCLR pin works as a device Reset. Pulling the MCLR pin low generates a device Reset. The basic connection and interface diagram of the module illustrates a typical MCLR circuit. See the Module Basic Connection and Interface Diagram in the Basic Connection Requirement from Related Links. Figure 2-6. Example of MCLR Pin Connections (1) 10k V DD MCLR 0 0.1 µF R C WINCS02 Note: 1. The capacitor can be sized to prevent unintentional Resets from brief glitches or to extend the device Reset period during POR. Related Links Basic Connection Requirement

2.3.3 Device Firmware Update

The WINCS02 Module is available for purchase with pre-programmed firmware. Microchip periodically releases the firmware to fix reported issues or to implement the latest feature support. There are two ways to perform a regular firmware update: 1. Serial DFU command-based update over UART 2. Host-assisted Over-the-Air (OTA) update Note: For the serial DFU and OTA programming guidance, refer to the WINCS02 Application Developer’s Guide.

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 16 Figure 2-7. Basic Connection Diagram of DFU 1234 0RR12 GND 0RR11 WINCS02 DFU_TX/STRAP2 DFU_RX/STRAP1 M C L R

2.3.4 Interface with Host Microcontroller

The WINCS02 Module can be interfaced with the host microcontroller through the SPI. Figure 2-8. WINCS02 Module Host Interface Diagram WINCS02 HOST MCU MCLR SDI1 SDO SDI SDO1 CS CS1 SCK SCK1 User Button (Optional) INTOUT Pin11 Reserved I/O Tristate I/O GPIO INTIN

2.4 WINCS02 Module Placement Guidelines

For any Wi-Fi ® product, the antenna placement affects the performance of the whole system. The antenna requires free space to radiate RF signals, and it must not be surrounded by the ground plane. Thus, for the best PCB antenna performance, it is recommended that the WINCS02PC/E Module is placed at the edge of the host board.
The WINCS02PC/WINCS02PE Module ground outline edge must be aligned with the edge of the host board ground plane as shown in the following figure.
A low-impedance ground plane for the WINCS02 Module ensures the best radio performance (best range and lowest noise). The ground plane can be extended beyond the minimum recommendation as required for the host board EMC and noise reduction.
For the best performance, keep metal structures and components (such as mechanical spacers, bump-on and so on) at least 31.75 mm away from the PCB trace antenna as illustrated in the following figure.
The antenna on the WINCS02 Module must not be placed in direct contact with or in close proximity to plastic casing or objects. Keep a minimum clearance of 10 mm in all directions around the PCB antenna as shown in the following figure. Keeping metallic and plastic objects close to the antenna can detune the antenna and reduce the performance of the device.

Exposed GND pads on the bottom of the WINCS02 Module must be soldered to the host board (see the Example of Host Board on Top Layer figure in the WINCS02 Module Routing Guidelines from Related Links).
A PCB cutout or a copper keepout is required under the RF test point (see WINCS02 Module Packaging Information from Related Links).
Copper keepout areas are required on the top layer under voltage test points (see WINCS02 Module Packaging Information from Related Links).
Alternatively, the entire region, except the exposed ground paddle, can be solder-masked. The following figure illustrates the examples of WINCS02 Module placement on a host board with a ground plane. Refer to the following figure for placement-specific guidance. Figure 2-9. Module Placement Guidelines 5.3 mm 15.73 mm Host PCB Ground Plane No Copper Region Edge of Host PCB Ground Plane Module PCB Edge 31.75 mm (keepout clearance region) for all metallic and plastic structures around the antenna. Refer to antenna- specific details of the respective antenna. The following figure illustrates the examples of the WINCS02 Module placement on a host board with a ground plane. Refer to Figure 2-9 for placement-specific guidance.

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 18 Figure 2-10. WINCS02 Module Placement Related Links WINCS02 Module Routing Guidelines WINCS02 Module Packaging Information

2.5 WINCS02 Module R outing Guidelines

Use the multi-layer host board for routing signals on the inner layer and the bottom layer.
The top layer (underneath the module) of the host board must be ground with as many GND vias as possible as shown in the following figure.
Avoid fan-out of the signals under the module or antenna area. Use a via to fan-out signals to the edge of the WINCS02 Module.
For a better GND connection to the WINCS02 Module, solder the exposed GND pads of the WINCS02 Module on the host board.
For the module GND pad, use a GND via of a minimum 10 mil (hole diameter) for good ground to all the layers and thermal conduction path.
Having a series resistor on the host board for all reserved pins and digital interface pins is recommended. These resistors must be placed close to the WINCS02 Module.
The RTCC Oscillator (32.768 kHz) on the host board must be placed close to the WINCS02 Module and follow the shortest trace routing length with no vias (see the following figure).

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 19 Figure 2-11. Example of WINCS02 Module Placement on Host Board (Top Layer) Host Board Outline Module Outline Copper Keepout Copper Keepout Module Footprint Exposed GND Pad Underneath Module GND Plane on Host Board RTCC Oscillator Placement

2.6 WINCS02 Module RF Consider ations

The overall performance of the system is significantly affected by the product design, environment and application. The product designer must ensure system-level shielding (if required) and verify the performance of the product features and applications. Consider the following guidelines for optimal RF performance:

The WINCS02 Module must be positioned in a noise-free RF environment and must be kept far away from high-frequency clock signals and any other sources of RF energy.
The antenna must not be shielded by any metal objects.
The power supply must be clean and noise-free.
Make sure that the width of the traces routed to GND, VDD rails are sufficiently large for handling peak TX current consumption. Note: The WINCS02 Module includes RF shielding on top of the board as a standard feature.

2.7 WINCS02 Module Antenna Consider ations

2.7.1 PCB Antenna

For the WINCS02PE/PC Module, the PCB antenna is fabricated on the top copper layer. The layers below the antenna do not have copper trace. It is recommended that the module to be mounted on the edge of the host board and to have no PCB material below the antenna structure of the module and no copper traces or planes on the host board in that area. The following table lists the technical specification of the PCB antenna when tested with the WINCS02 Module mounted on the WINCS02 Add-On Board.

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 20 Table 2-4. PCB Antenna Specific ation for WINCS02 Module Parameter Specification Operating frequency 2400-2485 MHz Peak gain 1.18 dBi at 2410 MHz Efficiency (average) 45%(1) Note: 1. The size of the WINCS02 Add-On Board is 25.4 mm x 57.2 mm. The antenna efficiency will improve with larger ground plane base boards. The same antenna achieved an average efficiency of 69% with a base board size of 85 mm x 40 mm. If the best case routing guidelines are followed on a larger ground plane application board, the efficiency will be better. PCB Antenna Radiation Pattern The following figure illustrates the module orientation in the measurement system for the PCB antenna radiation pattern. Figure 2-12. Module Orien t ation for Radiation P attern Measurement Vertical Cut at Phi = +90° Vertical Cut at Phi = 0° Horizontal Cut at Theta = 90° PCB Antenna Radiation Pattern The following figure illustrates the module orientation in the measurement system for the PCB antenna radiation pattern.

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 21 Figure 2-13. Module Orien t ation for Radiation P attern Measurement Vertical Cut at Phi = +90° Vertical Cut at Phi = 0° Horizontal Cut at Theta = 90° 3D Antenna Radiation Pattern The following figures illustrate the 3D cross section of the antenna radiation pattern.

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 25 Figure 2-20. Antenna Radiation Elevated Plane P attern when Phi = 90° Elevation (°) 90° 2400.00 MHz Polar H 90° 2400.00 MHz Polar V

2.7.2 External Antenna Placement R ec ommendations

The user must ensure the following for the placement of the antenna and its cable:

Do not route the antenna cable over circuits generating electrical noise on the host board or alongside or underneath the module. The recommendation is to route the cable straight out of the module.
Do not place the antenna in direct contact or in close proximity of the plastic casing/objects.
Do not enclose the antenna within a metal shield.
The user must keep any components capable of radiating noise, signals or harmonics in the 2.4-2.5 GHz frequency range away from the antenna and, if feasible, provide shielding for such components. Any noise radiated from the host board in this frequency band degrades the sensitivity of the module.
Place the antenna at a distance greater than 5 cm away from the module. The following figure illustrates the antenna keepout area (do not place the antenna in this area). This recommendation is based on an open-air measurement and does not take into account any metal shielding of the customer end product. When a metal enclosure is used, the antenna can be located closer to the WINCS02 Module. The following figure illustrates how the antenna cable must be routed depending on the location of the antenna with respect to the WINCS02 PCB. There are two possible options for the optimum routing of the cable.

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 26 Figure 2-21. WINCS02 Module Antenna Placement Guidelines 5 cm from Board Edge 5 cm from Board Edge Preferred Antenna Cable Routing Direction Note: These are generic guidelines and the recommendation is that customers can check and fine-tune the antenna positioning in the final host product based on RF performance.

2.7.2.1 External Antennas

The WINCS02/UE/UC Modules have a small surface mount U.FL connector for an external antenna connection. The choice of antenna is limited to the antenna types that the module is tested and approved for regulatory certification. The WINCS02/UE/UC Modules are approved to use with the antennas listed in the following table. It is permissible to use a different antenna, provided it is the same antenna type, has the same antenna gain (equal or less than) and similar in-band and out-of-band characteristics are present (refer to antenna specification sheet for cutoff frequencies). If other antenna types are used, the OEM installer must conduct the necessary assessments and authorize the antenna with the respective regulatory agencies and ensure compliance. Table 2-5. Approved External Antenna List with Antenna Gain for WINCS02 Module Antenna No. Part Number Manufacturer Antenna Gain (dBi) Antenna Type Regulatory Certification FCC/ISED(2) (3) CE

1 WXE2400 TE Connectivity/Laird External

3 Dipole x x

2 ANT-2.4-CW-RCL-RPS TE Connectivity/Linx Technologies

2.3 Dipole x x

3 RFA-02-C2M2-D034 Alead 2 Dipole x x

4 RFA-02-L2H1 Aristotle 2 Dipole x x

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 27 Table 2-5. Approved External Antenna List with Antenna Gain for WINCS02 Module (c ontinued) Antenna No. Part Number Manufacturer Antenna Gain (dBi) Antenna Type Regulatory Certification FCC/ISED(2) (3) CE

5 RFA-02-C2H1-D034 Alead 2 Dipole x x

6 RFA-02-D3 Aristotle 2 Dipole x x

7 RFDPA870920IMLB301 Walsin 1.84 Dipole x x 8 RFDPA870920IMAB302(5) Walsin 1.82 Dipole x x 9 RFDPA870920IMAB305 Walsin 1.82 Dipole x x

10 RFDPA870910IMAB308(5) Walsin 2 Dipole x x

11 RFA-02-C2M2 Aristotle 2 Dipole x x

12 RN-SMA-S-RP(5) Microchip 0.56 Dipole x x

13 W1049B030(5) Pulse 2 Dipole x x

14 RN-SMA4-RP Microchip 2.2 Dipole x x Notes: 1. ‘x’ denotes the antennas covered under the certification. 2. If the end product using the module is designed to have an antenna port that is accessible to the end user, a unique (non-standard) antenna connector (as permissible by FCC) must be used (for example, RP (Reverse Polarity)-SMA socket). 3. If an RF coaxial cable is used between the module RF output and the enclosure, a unique (non-standard) antenna connector must be used in the enclosure wall to interface with the antenna. 4. Contact the antenna vendor for detailed antenna specifications to review the suitability to the end product operating environment and to identify alternatives. 5. If any of these antennas are used, an additional post-calibration step is required on the customer's application board. For more details, refer to the WINCS02 Module External Antenna Calibration Guide (DS50003753).

2.8 WINCS02 Module R e flo w Pr ofile In f ormation

The WINCS02 Module was assembled using the IPC/JEDEC J-STD-020 standard lead-free reflow profile. The WINCS02 Module can be soldered to the host board using standard leaded or lead-free solder reflow profiles. To avoid damaging the module, adhere to the following recommendations:

For solder reflow recommendations, refer to the AN233 Solder Reflow Recommendation Application Note (DS00233).
Do not exceed a peak temperature (TP) of 250°C.
For specific reflow profile recommendations from the vendor, refer to the Solder Paste Data Sheet.
Use no-clean flux solder paste.
Do not wash as moisture can be trapped under the shield.
Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.

2.8.1 Cleaning

The exposed GND pad helps to self-align the module, avoiding pad misalignment. The recommendation is to use the no clean solder pastes. Ensure full drying of no-clean paste fluxes as a result of the reflow process. As per the recommendation by the solder paste vendor, this requires longer reflow profiles and/or peak temperatures toward the high end of the process window. The uncured flux residues can lead to corrosion and/or shorting in accelerated testing and possibly the field.

2.9 WINCS02 Module Assembly Consider ations

The WINCS02 Module is assembled with an Electro-Magnetic Interference (EMI) shield to ensure compliance with EMI emission and immunity rules. The EMI shield is made of a tin-plated steel

WINCS02IC and WINCS02 Family Device Overview Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 28 (SPTE) and is not hermetically sealed. Solutions like IPA and similar solvents can be used to clean the WINCS02 Module. However, do not use the cleaning solutions that contain acid on the module.

2.9.1 Conformal Coating

The modules are not intended for use with a conformal coating, and the customer assumes all risks (such as the module reliability, performance degradation and so on) if a conformal coating is applied to the modules.

WINCS02IC and WINCS02 Family Electrical Specific ations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 29 3. Electrical Specific ations This chapter provides the electrical specifications and the characteristics of the WINCS02IC and the WINCS02 Module across the operating temperature range of the product.

3.1 WINCS02IC Electrical Specific ations

This chapter provides the electrical specifications and the characteristics of the WINCS02IC.

3.1.1 WINCS02IC Absolute Maximum Ratings

The following table provides details about the list of absolute maximum ratings for the WINCS02IC device. Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Table 3-1. Absolute Maximum Ratings Parameter Value Ambient temperature under bias(1,2) -40°C to +105°C Storage temperature -65°C to +150°C Voltage on VDD with respect to GND -0.3V to +4.0V Voltage on any pin(s), with respect to GND(3) -0.3V to (VDD+0.3V) Voltage on any pin, with respect to GND -0.3V to (VDDIO+0.3V) Maximum current out of GND pins 300 mA Maximum current into VDD pins(2) 300 mA Maximum output current sourced/sunk by any I/O pin 25 mA Maximum current sunk by all ports 150 mA Maximum current sourced by all ports(2) 150 mA ESD Qualification Human Body Model (HBM) per JESD22-A114 ±2000V Charged Device Model (CDM) (ANSI/ESD STM 5.3.1) (All pins / Corner pins) ±500V Notes: 1. The preceding table provides the list of stresses that can cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. 2. Maximum allowable current is a function of the device's maximum power dissipation.

3.1.2 Thermal Specific ations

Table 3-2. Thermal Oper ating Conditions Rating Symbol Min. Typ Max. Unit Industrial Temperature Devices: Operating ambient temperature range TA -40 — +85 °C Operating junction temperature range TJ -40 — +125 °C V-Temp Temperature Devices: Operating ambient temperature range TA -40 — +105 °C Operating junction temperature range(1) TJ -40 — +125 °C Power Dissipation: Internal chip power dissipation: PINT = (VDDIOx x (IDD –∑ IOH)) + (VDD x IDD) PD PINT + PI/O W Maximum allowed power dissipation PDMAX (TJ – TA)/ϴJA W

WINCS02IC and WINCS02 Family Electrical Specific ations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 30 Table 3-2. Thermal Oper ating Conditions (c ontinued) Rating Symbol Min. Typ Max. Unit Note: 1. Junction temperature can exceed 125°C under these ambient conditions. Table 3-3. Thermal Packaging Char act eristics Characteristics Symbol Typ Max. Unit Thermal resistance, 48-pin VQFN (7 mm x 7 mm x 0.9 mm) package ϴJA 21 — °C/W Note: Junction-to-ambient thermal resistance, ϴJA numbers are based on JEDEC 2S2P achieved by package simulations. Table 3-4. Recommended Oper ating Voltages Param. No. Symbol Characteristics Min. Typ. Max. Unit Conditions DC_1 VDD VDD voltage range 3 3.3 3.6 V — DC_4 VDDIO VDDIO voltage range 3 3.3 3.6 V — DC_7 GNDDB Common EDP ground reference VSS VSS VSS V —

3.1.3 Maximum Clock Frequencies AC Electrical Specific ations

Table 3-5. Maximum Clock Frequencies AC Electrical Specific ations AC Characteristics Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Param. No. Symbol Characteristics Max. Units FCLK_1 FCY Frequency of system clock

80 MHz

Note: By default, the device runs at its maximum clock frequency.

3.1.4 WINCS02IC DC Char act eristics

3.1.4.1 I/O Pin DC Electrical Specific ations

Table 3-6. I/O Pin DC Electrical Specific ations DC Characteristics Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Param. No. Symbol Characteristics Min. Typ. (1) Max. Units Conditions DI_1 VIL Input low voltage I/O pins GND — 0.2*VDDIO V — DI_3 VIH Input high voltage non-5V tolerant I/O pins 0.8*VDDIO — VDDIO V — DI_5 VOL Output low voltage — — 0.4 V VDDIO = 3.3V at IOL ≦ 10 mA DI_9 VOH Output high voltage 2.4 — — V VDDIO = 3.3V at IOH ≦ 10 mA

WINCS02IC and WINCS02 Family Electrical Specific ations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 31 Table 3-6. I/O Pin DC Electrical Specific ations (c ontinued) DC Characteristics Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Param. No. Symbol Characteristics Min. Typ. (1) Max. Units Conditions DI_13 IIL Input pin leakage current -1 — +1 µA — Note: 1. This parameter is characterized but not tested in manufacturing.

3.1.4.2 WINCS02IC Wi-Fi® Current Consumption

Table 3-7. Wi-Fi® Current Consumption DC Electrical Specific ations DC Characteristics(1)(2) Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Param. No. Symbol Device States Code Rate Output Power (Typ.) (dBm) Current (Typ.) (mA) Max. Units Conditions IWF_TX IDD On_Transmit 802.11b 1 Mbps 19 288 — mA VDD = VDDIO = 3.3V 802.11b 1 Mbps 13 263 — 802.11b 11 Mbps 20 289 — 802.11g 6 Mbps 19 287 — 802.11g 54 Mbps 17 263 — 802.11n MCS0 18 279 — 802.11n MCS7 17 262 — 802.11n MCS7 11 249 — IWF_RX IDD On_Receive 802.11b 1 Mbps — 88 — 802.11n MCS7 — 94 Notes: 1. Tested on channel 7 using an internal test firmware that provides manual control of the data rate. In the Application mode firmware, the data rate is selected automatically based on the RSSI and other variables. 2. Data in the “Typ.” column is at 3.3V, 25°C unless otherwise stated. 3. These parameters are characterized but not tested in manufacturing.

3.1.4.3 Extreme Deep Sleep (XDS) Current Consumption

The WINCS02 Module supports Extreme Deep Sleep (XDS) mode, which can be enabled using the appropriate API. For details, refer to MPLAB® Harmony WINCS02 WLAN Library. To exit XDS mode, asset the MCLR pin and complete the full driver initialization.

WINCS02IC and WINCS02 Family Electrical Specific ations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 32 Table 3-8. Extreme Deep Sleep (XDS) Current Consumption DC Characteristics Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Param. No. Symbol Characteristics Typ(1) Max. Units Conditions XDSPWR_1 IDD_XDS(2) IDD in XDS mode 0.7 — µA VDD = VDDIO = 3.3V Notes: 1. Typical values at 25°C only 2. Conditions: – All peripherals inactive – All IO configured as input and pulled down internally

3.1.5 WINCS02IC AC Char act eristics

3.1.5.1 External XTAL POSC 40 MHz AC Electrical Specific ations

Table 3-9. External XTAL POSC 40 MHz AC Electrical Specific ations AC Characteristics Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Param. No. Symbol(2) Characteristics Min. Typ Max. Units Conditions(1) XOSC_1 FOSC_XOSC XOSC crystal frequency — 40 — MHz XIN, XOUT primary oscillator XOSC_1A TOSC TOSC = 1/FOSC_XOSC — — — ns See parameter XOSC_1 for FOSC_XOSC value XOSC_34 gm XOSC transconductance GAIN = 0 — 16 — mA/V XOSC auto gain control disabled XOSC_39 XCLK_FST Primary XIN clock fail safe time-out period — 2 — ms — Notes: 1. Crystal oscillator requirements: – ESR = 50Ω – Maximum drive level = 200 µW 2. This parameter is characterized but not tested in manufacturing.

3.1.5.2 XOSC32 RTCC Oscillator AC Electrical Specific ations

Table 3-10. XOSC32 RTCC Oscillator AC Electrical Specific ations AC Characteristics Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp XOSC32_1 FOSC_XOSC32 XOSC32 oscillator crystal frequency — 32.768 — kHz RTCC oscillator

WINCS02IC and WINCS02 Family Electrical Specific ations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 33 Table 3-10. XOSC32 RTCC Oscillator AC Electrical Specific ations (c ontinued) AC Characteristics Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp XOSC32_15 TOSC32 TOSC32 = 1/FOSC_XOSC32 — — — µs See parameter XOSC32_1 for FOSC_XOSC32 value XOSC32_21 XCLK32_DC Ext clock oscillator duty cycle — 50 — % — Note: 1. This parameter is characterized but not tested in manufacturing.

3.1.5.3 SDIO-SPI AC Timing Specific ations

Figure 3-1. SDIO-SPI AC Timing Diagram SCK1SDI1SDO1 Table 3-11. SDIO Controller AC Timing Specific ations AC Characteristics Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Param. No. Symbol Characteristics Min. Typ Max. Units Conditions(1) SD_5 tSDCK Clock frequency 0 — 50 MHz — SD_7 tDUTY Duty cycle — 50 — % — SD_9 tHIGH Clock high time 8.5 — — ns — SD_11 tLOW Clock low time 8.5 — — ns — SD_13 tRISE Clock rise time — — 5 — — SD_15 tFALL Clock fall time — — 5 — — SD_17 tIN_SETUP Input setup time 6 — — ns — SD_19 tIN_HOLD Input hold time 1 — — ns — SD_21 tOUT_DLY Output delay time 3 — 13 ns VDDIO = 3.3V, CLOAD = 15 pF (Max)

WINCS02IC and WINCS02 Family Electrical Specific ations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 34 Table 3-11. SDIO Controller AC Timing Specific ations (c ontinued) AC Characteristics Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Param. No. Symbol Characteristics Min. Typ Max. Units Conditions(1) Notes: 1. All output pins with 15 pF load 2. The maximum clock frequency specified is limited by the SDIO Host interface internal design; actual maximum clock frequency can be lower and depends on the specific PCB layout.

3.1.5.4 Power-on Reset AC Electrical Specific ations

Table 3-12. Power-on Reset AC Electrical Specific ations AC Characteristics Standard Operating Conditions: VDD = VDDIO = 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp DC_11 VPOR VDD start voltage to ensure internal POR signal 1.45 — 1.65 V — DC_12 SVDD VDD rise rate to ensure internal POR signal 0.03 — 0.115 V/ms 0-3.0V in 0.1s DC_13 T(nRST) External Reset valid active pulse width 3 — — us —

3.1.6 WINCS02IC Radio Specific ations

Table 3-13. WINCS02IC Radio Specific ations Feature Description WLAN standards IEEE® 802.11b, IEEE 802.11g and IEEE 802.11n Frequency range 2.412 GHz ~ 2.472 GHz (2400 ~ 2483.5 MHz ISM band) Number of channels 11 for North America and 13 for Europe and Japan

3.1.6.1 WINCS02IC Receiver Performance

Table 3-14. WINCS02IC Receiver Performance Char act eristics (1) RF Characteristics Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Temp Param. No. Characteristics Description(5) Min. Typ Max. Units WF_RX_1 Frequency — 2412 — 2472 MHz WF_RX_2 Sensitivity 802.11b 1 Mbps DSSS — -97 — dBm

2 Mbps DSSS — -94 —

5.5 Mbps CCK — -93 —

11 Mbps CCK(6) — -89 —

WINCS02IC and WINCS02 Family Electrical Specific ations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 35 Table 3-14. WINCS02IC Receiver Performance Char act eristics (1) (c ontinued) RF Characteristics Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Temp Param. No. Characteristics Description(5) Min. Typ Max. Units WF_RX_3 Sensitivity 802.11g 6 Mbps OFDM — -92 — dBm

9 Mbps OFDM — -91 —

12 Mbps OFDM — -89 —

18 Mbps OFDM — -87 —

24 Mbps OFDM — -84 —

36 Mbps OFDM — -81 —

48 Mbps OFDM — -76 —

54 Mbps OFDM(6) — -75 —

WF_RX_4 Sensitivity 802.11n (Bandwidth at

20 MHz) (Both long GI and short

GI) MCS 0 — -90 — dBm MCS 1 — -87 — MCS 2 — -85 — MCS 3 — -82 — MCS 4 — -79 — MCS 5 — -74 — MCS 6 — -73 — MCS 7(6) — -71 — WF_RX_5 Maximum receive signal level 1, 2 Mbps DSSS -3 — — dBm 5.5, 11 Mbps CCK -3 — —

6 Mbps OFDM -3 — —

54 Mbps OFDM -7.2 — — MCS 0 -3 — — MCS 7 -7 — — WF_RX_6 Adjacent channel rejection 1 Mbps DSSS (30 MHz offset) 43.5 — — dB 11 Mbps CCK (25 MHz offset) 39.5 — — 6 Mbps OFDM (25 MHz offset) 39.5 — — 54 Mbps OFDM (25 MHz offset) 21.5 — — MCS 0 – 20 MHz Bandwidth (25 MHz offset) 38.5 — — MCS 7 – 20 MHz Bandwidth (25 MHz offset) 19.5 — — WF_RX_7 RSSI accuracy — -5 — 5 dB

WINCS02IC and WINCS02 Family Electrical Specific ations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 36 Table 3-14. WINCS02IC Receiver Performance Char act eristics (1) (c ontinued) RF Characteristics Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Temp Param. No. Characteristics Description(5) Min. Typ Max. Units Notes: 1. Measured after RF matching network (assume 50Ω impedance). 2. RF performance is ensured at 3.3V, 25°C, with a 2-3 dB change at boundary conditions. 3. The availability of some specific channels and/or operational frequency bands are country-dependent and must be pro- grammed in the host product at the factory to match the intended destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement needs to be taken care of via host implementation. 4. The host product manufacturer must ensure that the RF behavior adheres to the certification (for example, FCC, ISED) requirements when the module is installed in the final host product. 5. This parameter is characterized but not tested in manufacturing. 6. This parameter is characterized and tested in manufacturing.

3.1.6.2 WINCS02IC T r ansmitter Performance

Table 3-15. WINCS02IC T r ansmitter Performance Char act eristics RF Characteristics Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Param. No. Characteristics Description(8) Min. Typ(3) Max. Units WF_TX_1 Frequency — 2412 — 2472 MHz WF_TX_2 Output power(1)(2) 802.11b 1 Mbps DSSS(9) — 19 — dBm

2 Mbps DSSS — 19 —

5.5 Mbps CCK — 20 —

11 Mbps CCK — 20 —

WF_TX_3 Output power(1)(2) 802.11g 6 Mbps OFDM — 19 — dBm

9 Mbps OFDM — 19 —

12 Mbps OFDM — 19 —

18 Mbps OFDM — 19 —

24 Mbps OFDM — 19 —

36 Mbps OFDM — 18 —

48 Mbps OFDM — 17.5 —

54 Mbps OFDM(9) — 17 —

WINCS02IC and WINCS02 Family Electrical Specific ations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 37 Table 3-15. WINCS02IC T r ansmitter Performance Char act eristics (c ontinued) RF Characteristics Standard Operating Conditions: VDD=VDDIO= 3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial -40°C ≤ TA ≤ +105°C for V-temp Param. No. Characteristics Description(8) Min. Typ(3) Max. Units WF_TX_4 Output power(1)(2) 802.11n (Bandwidth at 20 MHz) MCS 0 — 18 — dBm MCS 1 — 18 — MCS 2 — 18 — MCS 3 — 17.5 — MCS 4 — 17.5 — MCS 5 — 17 — MCS 6 — 17 — MCS 7(9) — 17 — WF_TX_5 Transmit Power Control (TPC) accuracy — — ±2(2) — dB WF_TX_6 Harmonic output power (Radiated, Regulatory mode) 2nd — 42 74(7) dBuV/m 3rd — Below noise floor 74(7) Notes: 1. Measured at IEEE ® 802.11 specification compliant EVM/Spectral mask 2. Measured after RF matching network (assume 50Ω impedance) 3. RF performance is ensured at 3.3V, 25°C, with a 2-3 dB change at boundary conditions. 4. With respect to TX power, different (higher/lower) RF output power settings can be used for specific antennas and/or enclosures, in which case, re-certification can be required. Program the custom gain table to control the transmit power using the MCHPRT3 tool. 5. The availability of some specific channels and/or operational frequency bands are country-dependent and must be programmed in the host product at the factory to match the intended destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement needs to be taken care of via host implementation. 6. The host product manufacturer must ensure that the RF behavior adheres to the certification (for example, FCC, ISED) requirements when the module is installed in the final host product. 7. FCC Radiated Emission limits (Restricted Band) 8. This parameter is characterized but not tested in manufacturing. 9. This parameter is characterized and tested in manufacturing.

3.1.6.3 WINCS02IC Receiver and T r ansmitter Char act eristics Graphs

Figure 3-2. Receive Current vs Temperature, MCS7, Channel 7, 3.3V 100 120 -40 -20 0 25 45 65 85 Receive Current (mA) Temperature (°C) Figure 3-3. Receive Current vs Receive Signal Power, MCS7, Channel 7, 3.3V, 25℃ 100 110 Current (mA) Receive Signal Power (dBm)

3.2 WINCS02 Module Electrical Specific ations

This chapter provides the electrical specifications and the characteristics of the WINCS02 Module across the operating temperature range of the product.

3.2.1 WINCS02 Module Absolute Maximum Ratings

The following table provides details about the list of absolute maximum ratings for the WINCS02 Module. Exposure to these maximum rating conditions for extended periods can affect the device’s reliability. Functional operation of the device at these or any other conditions above the parameters indicated in the operation listings of this specification is not implied. Table 3-16. Absolute Maximum Ratings Parameter Value Ambient temperature under bias(1) -40°C to +85°C Storage temperature -65°C to +150°C Voltage on VDD with respect to GND -0.3V to +4.0V Voltage on any pin(s) with respect to GND -0.3V to (VDD+0.3V) Voltage with respect to GND -0.3V to (VDDIO+0.3V) Maximum current out of GND pins(2) 500 mA Maximum current into VDD pins(2) 500 mA ESD Qualification Human Body Model (HBM) per JESD22-A114 ±2000V Charged Device Model (CDM) (ANSI/ESD STM 5.3.1) ±500V Notes: 1. The preceding table provides the list of stresses that can cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. 2. Maximum allowable current is a function of the device's maximum power dissipation.

3.2.2 Thermal Specific ations

Table 3-17. Thermal Oper ating Conditions Rating Symbol Min. Typ Max. Unit Industrial Temperature Devices: Operating ambient temperature range TA -40 — +85 °C Operating junction temperature range TJ -40 — +125 °C Table 3-18. Recommended Oper ating Voltages Param. No. Symbol Characteristics Min. Typ. Max. Unit Conditions DC_1 VDD VDD voltage range 3 3.3 3.6 V — DC_4 VDDIO VDDIO voltage range 3 3.3 3.6 V — DC_7 GND Common EDP ground reference VSS VSS VSS V —

3.2.3 WINCS02 Module AC and DC Char act eristics

For WINCS02 Module AC and DC Electrical Characteristics, refer to WINCS02IC Electrical Specifications.

3.2.3.1 Wi-Fi® Current Consumption

Table 3-19. Wi-Fi® Current Consumption DC Electrical Specific ations DC Characteristics(1)(2) Standard Operating Conditions: VDD=VDDIO=3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial Param. No. Symbol Device States Code Rate Output Power (Typ.) (dBm) Current (Typ.) (mA)(2) Max. Units Conditions IWF_TX IDD On_Transmit 802.11b 1 Mbps(4) 19 304 — mA VDD = VDDIO = 3.3V 802.11b 1 Mbps(4) 13 270 — 802.11b 11 Mbps(3) 20 311 — 802.11g 6 Mbps(4) 19 310 — 802.11g 54 Mbps(3) 17 274 — 802.11n MCS0(4) 18 300 — 802.11n MCS7(3) 17 273 — 802.11n MCS7(4) 11 252 — IWF_RX IDD On_Receive 802.11b 1 Mbps(4) — 92 — 802.11n MCS7(3) — 98 Notes: 1. Tested on channel 7 using an internal test firmware that provides manual control of data rate. In the Application mode firmware, the data rate is selected automatically based on the RSSI and other variables. 2. Data in the “Typ.” column is at 3.3V, 25°C unless otherwise stated. 3. These parameters are tested in manufacturing. 4. These parameters are characterized but not tested in manufacturing.

3.2.4 WINCS02 Module Radio Specific ations

Table 3-20. WINCS02 Module Radio Specific ations Feature Description WLAN standards IEEE® 802.11b, IEEE 802.11g, and IEEE 802.11n Frequency range 2.412 GHz ~ 2.472 GHz (2400 ~ 2483.5 MHz ISM band) Number of channels 11 for North America and 13 for Europe and Japan

3.2.4.1 WINCS02 Module Receiver Performance

Table 3-21. WINCS02 Module Receiver Performance Char act eristics (1) RF Characteristics Standard Operating Conditions: VDD=VDDIO=3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial Param. No. Characteristics Description(5) Min. Typ Max. Units WF_RX_1 Frequency — 2412 — 2472 MHz WF_RX_2 Sensitivity 802.11b 1 Mbps DSSS — -97 — dBm

2 Mbps DSSS — -93 —

5.5 Mbps DSSS — -92 —

11 Mbps DSSS(6) — -88 —

WINCS02IC and WINCS02 Family Electrical Specific ations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 45 Table 3-21. WINCS02 Module Receiver Performance Char act eristics (1) (c ontinued) RF Characteristics Standard Operating Conditions: VDD=VDDIO=3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial Param. No. Characteristics Description(5) Min. Typ Max. Units WF_RX_3 Sensitivity 802.11g 6 Mbps OFDM — -91 — dBm

9 Mbps OFDM — -90 —

12 Mbps OFDM — -88 —

18 Mbps OFDM — -86 —

24 Mbps OFDM — -83 —

36 Mbps OFDM — -80 —

48 Mbps OFDM — -75 —

54 Mbps OFDM(6) — -74 —

WF_RX_4 Sensitivity 802.11n (Bandwidth at 20 MHz) (Both long GI and short GI) MCS 0 — -89 — dBm MCS 1 — -86 — MCS 2 — -84 — MCS 3 — -81 — MCS 4 — -78 — MCS 5 — -74 — MCS 6 — -72 — MCS 7(6) — -70 — WF_RX_5 Maximum receive signal level 1, 2 Mbps DSSS -3 — — dBm 5.5, 11 Mbps CCK -3 — — 54 Mbps OFDM -8.5 — — MCS 0 -3 — — MCS 7 -8.5 — — WF_RX_6 Adjacent channel rejection 1 Mbps DSSS 43.5 — — dB (30 MHz offset) 11 Mbps CCK 38.5 — — (25 MHz offset) 6 Mbps OFDM 46.5 — — (25 MHz offset) 54 Mbps OFDM 28.5 — — (25 MHz offset) MCS 0 – 20 MHz Bandwidth (25 MHz offset) 45.5 — — MCS 7 – 20 MHz Bandwidth (25 MHz offset) 25.5 — — WF_RX_7 RSSI accuracy — -5 — 5 dB

WINCS02IC and WINCS02 Family Electrical Specific ations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 46 Table 3-21. WINCS02 Module Receiver Performance Char act eristics (1) (c ontinued) RF Characteristics Standard Operating Conditions: VDD=VDDIO=3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial Param. No. Characteristics Description(5) Min. Typ Max. Units Notes: 1. Measured after RF matching network (assume 50Ω impedance) 2. RF performance is ensured at 3.3V, 25°C, with a 2-3 dB change at boundary conditions. 3. The availability of some specific channels and/or operational frequency bands are country-dependent and must be programmed in the host product at the factory to match the intended destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement needs to be taken care of via host implementation. 4. The host product manufacturer must ensure that the RF behavior adheres to the certification (for example, FCC, ISED) requirements when the module is installed in the final host product. 5. This parameter is characterized but not tested in manufacturing. 6. This parameter is characterized and tested in manufacturing.

3.2.4.2 WINCS02 Module T r ansmitter Performance

Table 3-22. WINCS02 Module T r ansmitter Performance Char act eristics RF Characteristics Standard Operating Conditions: VDD=VDDIO=3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial Param. No. Characteristics Description(8) Min. Typ(3) Max. Units WF_TX_1 Frequency — 2412 — 2472 MHz WF_TX_2 Output power(1)(2) 802.11b 1 Mbps DSSS(9) — 19 — dBm WF_TX_3 Output power(1)(2) 802.11g 6 Mbps OFDM — 19 — dBm 48 Mbps OFDM — 17.5 — WF_TX_4 Output power(1)(2) 802.11n (Bandwidth at 20 MHz) MCS 0 — 18 — dBm MCS 1 — 18 — MCS 2 — 18 — MCS 3 — 17.5 — MCS 4 — 17.5 — MCS 5 — 17 — MCS 6 — 17 — MCS 7(9) — 17 — WF_TX_5 Transmit Power Control (TPC) accuracy — — ±2(2) — dB

WINCS02IC and WINCS02 Family Electrical Specific ations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 47 Table 3-22. WINCS02 Module T r ansmitter Performance Char act eristics (c ontinued) RF Characteristics Standard Operating Conditions: VDD=VDDIO=3.0V to 3.6V (unless otherwise stated) Operating Temperature: -40°C ≤ TA ≤ +85°C for Industrial Param. No. Characteristics Description(8) Min. Typ(3) Max. Units WF_TX_6 Harmonic output power (Radiated, Regulatory mode) 2nd — 42 74(7) dBuV/m 3rd — Below noise floor 74(7) Notes: 1. Measured at IEEE ® 802.11 specification compliant EVM/Spectral mask 2. Measured after RF matching network (assume 50Ω impedance) 3. RF performance is ensured at 3.3V, 25°C, with a 2-3 dB change at boundary conditions. 4. With respect to TX power, different (higher/lower) RF output power settings can be used for specific antennas and/or enclosures, in which case, re-certification can be required. Program the custom gain table to control the transmit power using the MCHPRT3 tool. 5. The availability of some specific channels and/or operational frequency bands are country-dependent and must be programmed in the host product at the factory to match the intended destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement needs to be taken care of via host implementation. 6. The host product manufacturer must ensure that the RF behavior adheres to the certification (for example, FCC, ISED) requirements when the module is installed in the final host product. 7. FCC Radiated Emission limits (Restricted Band) 8. This parameter is characterized but not tested in manufacturing. 9. This parameter is characterized and tested in manufacturing.

3.2.4.3 WINCS02 Module Receiver and T r ansmitter Char act eristics Graphs

Figure 3-12. Receive Current vs Temperature, MCS7, Channel 7, 3.3V 100 120 -40 -20 0 25 45 65 85 Receive Current (mA) Temperature (°C)

WINCS02IC and WINCS02 Family Packaging In f ormation Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 53 4. Packaging In f ormation This chapter provides information on package markings, dimension and footprint of the WINCS02IC and the WINCS02 Module.

4.1 WINCS02IC Packaging In f ormation

For the most current package drawings, see the Microchip Packaging Specification available at www.microchip.com/en-us/support/package-drawings.

4.1.1 WINCS02IC Package Marking

Figure 4-1. WINCS02IC Package Marking 48L VQFN 7x7x0.9 mm Example Legend: XX...X Customer-specific information Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week '01') NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.

4.1.2 WINCS02IC Packaging Dimension

This section provides the package dimension details of WINCS02IC.

0.10 C A B

0.05 C C 2X TOP VIEW SIDE VIEW BOTTOM VIEW N 0.10 C 0.08 C Sheet 1 of 2 48X For the most current package drawings, please see t he Microchip Packaging Specification located at Note: http://www.microchip.com/packaging 48-Lead Very Thin Plastic Quad Flat, No Lead Package (ZZX) - 7x7 mm Body [VQFN] With 5.3 mm Exposed Pad © 2021 Microchip Technology Inc. Microchip Technology Drawing C04-535 Rev A NOTE1 (DATUM B) (DATUM A) NOTE 1 SEATING PLANE D E E E (K) e 48X b L e N (A3) A 0.45

WINCS02IC and WINCS02 Family Packaging In f ormation Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 55 For the most current package drawings, please see t he Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2021 Microchip Technology Inc. REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located wi thin the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Sheet 2 of 2 Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Thickness Pitch Standoff Units Dimension Limits A b e L E N

0.50 BSC

0.203 REF

0.30 0.20 0.80 0.00 0.25 0.40 0.85 0.035 MILLIMETERS MIN NOM 0.50 0.30 0.90 0.05 MAX K 0.45 REF Terminal-to-Exposed-Pad Overall Length Exposed Pad Length D D2 5.20

7.00 BSC

5.30 5.40 5.20 5.30 5.40 48-Lead Very Thin Plastic Quad Flat, No Lead Package (ZZX) - 7x7 mm Body [VQFN] With 5.3 mm Exposed Pad Microchip Technology Drawing C04-535 Rev A

WINCS02IC and WINCS02 Family Packaging In f ormation Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 56 RECOMMENDED LAND PATTERN Dimension Limits Units Center Pad Width Contact Pad Spacing Center Pad Length Contact Pitch 5.40 5.40 MILLIMETERS E MAX 6.90 Contact Pad Length (X48) Contact Pad Width (X48) 0.85 0.30 NOM C1 Contact Pad Spacing 6.90 Contact Pad to Contact Pad (X44) G2 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should b e filled or tented to avoid solder loss during reflow process For the most current package drawings, please see t he Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2021 Microchip Technology Inc. Contact Pad to Center Pad (X48) G1 0.33 EV EV E ØV SILK SCREEN 48-Lead Very Thin Plastic Quad Flat, No Lead Package (ZZX) - 7x7 mm Body [VQFN] With 5.3 mm Exposed Pad Microchip Technology Drawing C04-2535 Rev A

4.2 WINCS02 Module Packaging In f ormation

4.2.1 WINCS02 Module Packaging Marking

Figure 4-2. WINCS02 Module Packaging Marking Legend: YY: Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week "01") NNN Alphanumeric traceability code XX....X Module part number and version and regulatory designator FCC ID: 2ADHKWIXCS02 WINCS02PC IC: 20266-WIXCS02 YYWWNNN WINCS02UC IC: 20266-WIXCS02U XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN XX XX WINCS02PE FCC ID: 2ADHKWIXCS02 IC: 20266-WIXCS02 YYWWNNN YYWWNNN FCC ID: 2ADHKWIXCS02U WINCS02UE IC: 20266-WIXCS02U YYWWNNN FCC ID: 2ADHKWIXCS02U

4.2.2 WINCS02 Module Packaging Dimension

This section provides the package dimension details of the WINCS02 Module.

WINCS02IC and WINCS02 Family Packaging In f ormation Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 58 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: 28-Lead PCB Module (TEC) - 14.73x21.72x2.1 mm Body [MODULE] With Metal Shield and Coaxial Connector © 2024 Microchip Technology Inc. Sheet 1 of 2Microchip Technology Drawing C04-21567 Rev C SIDE VIEW 21 22 23 24 25 26 27 28 9 E D 1.64 METAL SHIELD COAXIAL CONNECTOR A 0.65 0.80 5.95 28X 0.60 28X 0.80 Ø2.7 O.D. Ø1.7 I.D. 0.80 0.80 9X 0.90 1.30 0.90 1.30 5.992 5.06 6.95 5.82 1.91 8.86 0.20 6.88 6.27 1.016 21 22 23 24 25 26 27 28 THERMAL RELIEF HOLES 10X Ø 0.80 10X CSEATING PLANE R

WINCS02IC and WINCS02 Family Packaging In f ormation Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 59 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2024 Microchip Technology Inc. Notes: 1. All dimensions are in millimeters. Sheet 2 of 2 28-Lead PCB Module (TEC) - 14.73x21.72x2.1 mm Body [MODULE] With Metal Shield and Coaxial Connector Microchip Technology Drawing C04-21567 Rev C Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Shield Height PCB Thickness Units Dimension Limits A b L E N

1.30 REF

1.90 0.70 0.60 0.80 2.10 0.80

21.72 BSC

2.30 0.90 MAX Overall Length D 14.73 BSC UFL Connector Height A4 1.25 REF 0.50 0.70 0.70 0.90 Shield Width 15.46 Shield Length D1 13.63 15.36 15.56 13.53 13.73 Shield Width 2 12.30 12.40 12.50 R

WINCS02IC and WINCS02 Family Packaging In f ormation Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 60 RECOMMENDED LAND PATTERN 28-Lead PCB Module (TEC) - 14.73x21.72x2.1 mm Body [MODULE] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: With Metal Shield and Coaxial Connector © 2024 Microchip Technology Inc. R Notes: Keep these areas free from routes and exposed copper. Ground fill with solder mask may be placed here.2. All dimensions are in millimeters.1. Microchip Technology Drawing C04-23567 Rev C COPPER KEEPOUT ZONE 21 2223 24 25 26 27 28 28x 0.80 SILKSCREEN PCB EDGE Ø2.80 9.67 5.992 1.016 6.27 6.882 28X 1.90 2.667 2.667 2.032 3.70 3.70 1.905 3.68 0.216 14.73 21.72 6.861 4.064

WINCS02IC and WINCS02 Family Appendix A: Regulatory Approval Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 61 5. Appendix A: Regulatory Approval The WINCS02PC Module has received regulatory approval for the following countries:

United States/FCC ID: 2ADHKWIXCS02
Canada/ISED: – IC: 20266-WIXCS02 – HVIN: WINCS02PC – PMN:Wireless MCU Module with IEEE ®802.11 b/g/n
Europe/CE
Great Britain/UKCA
Japan/MIC: 020-240380
Korea/KCC: R-R-mcp-WIXCS02
Taiwan/NCC: CCAN24Y11100T5 The WINCS02PE Module has received regulatory approval for the following countries:
United States/FCC ID: 2ADHKWIXCS02
Canada/ISED: – IC: 20266-WIXCS02 – HVIN: WINCS02PE – PMN:Wireless MCU Module with IEEE ®802.11 b/g/n
Europe/CE
Great Britain/UKCA
Japan/MIC: 020-240380
Korea/KCC: R-R-mcp-WIXCS02
Taiwan/NCC: CCAN24Y11101T7 The WINCS02UC Module has received regulatory approval for the following countries:
United States/FCC ID: 2ADHKWIXCS02U
Canada/ISED: – IC: 20266-WIXCS02U – HVIN: WINCS02UC – PMN:Wireless MCU Module with IEEE ®802.11 b/g/n
Europe/CE
Great Britain/UKCA
Japan/MIC: 020-240380
Korea/KCC: R-R-mcp-WIXCS02
Taiwan/NCC: CCAN24Y11110T8 The WINCS02UE Module has received regulatory approval for the following countries:
United States/FCC ID: 2ADHKWIXCS02U
Canada/ISED: – IC: 20266-WIXCS02U – HVIN: WINCS02UE

Europe/CE
Great Britain/UKCA
Japan/MIC: 020-240380
Korea/KCC: R-R-mcp-WIXCS02
Taiwan/NCC: CCAN24Y11111T0

5.1 United States

The WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Modules have received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” single-modular approval in accordance with Part 15.212 Modular Transmitter approval. Single-modular transmitter approval is defined as a complete RF transmission sub-assembly, designed to be incorporated into another device, that must demonstrate compliance with FCC rules and policies independent of any host. A transmitter with a modular grant can be installed in different end-use products (referred to as a host, host product or host device) by the grantee or other equipment manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter function provided by that specific module or limited module device. The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. A host product itself is required to comply with all other applicable FCC equipment authorization regulations, requirements, and equipment functions that are not associated with the transmitter module portion. For example, compliance must be demonstrated: to regulations for other transmitter components within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Suppliers Declaration of Conformity (SDoC) or certification) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic functions).

5.1.1 Labeling and User In f ormation Requirements

The WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Modules have been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must display a label referring to the enclosed module. This exterior label must use the following wording: For the WINCS02PC/PE Module Contains Transmitter Module FCC ID: 2ADHKWIXCS02 or Contains FCC ID: 2ADHKWIXCS02 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For the WINCS02UC/UE Module Contains Transmitter Module FCC ID: 2ADHKWIXCS02U or Contains FCC ID: 2ADHKWIXCS02U This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The user's manual for the finished product must include the following statement:

WINCS02IC and WINCS02 Family Appendix A: Regulatory Approval Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 63 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna
Increase the separation between the equipment and receiver
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
Consult the dealer or an experienced radio/TV technician for help Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748, which is available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) apps.fcc.gov/oetcf/kdb/index.cfm.

5.1.2 RF Exposure

All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE: These modules are approved for installation into mobile or/and portable host platforms.

5.1.3 Approved Antenna Types

To maintain modular approval in the United States, only the tested antenna types are used. It is permissible to use different antenna, provided the same antenna type, antenna gain (equal to or less than), with similar in-band and out-of band characteristics (refer to specification sheet for cutoff frequencies). For the WINCS02PC/PE, the approval is received using the integral PCB antenna. For the WINCS02UC/UE, approved antennas are listed in the WINCS02 Module Approved External Antenna.

5.1.4 Helpful Web Sites

Federal Communications Commission (FCC): www.fcc.gov.
FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) apps.fcc.gov/oetcf/kdb/index.cfm.

5.2 Canada

The WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Modules have been certified for use in Canada under Innovation, Science and Economic Development Canada (ISED, formerly Industry Canada) Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits the installation of a module in a host device without the need to recertify the device.

5.2.1 Labeling and User In f ormation Requirements

Labeling Requirements (from RSP-100 - Issue 12, Section 5): The host product shall be properly labeled to identify the module within the host device. The Innovation, Science and Economic Development Canada certification label of a Module shall be clearly visible at all times when installed in the host device; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number of the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: For the WINCS02PC/WINCS02PE Module Contains IC: 20266-WIXCS02 For the WINCS02UC/WINCS02UE Module Contains IC: 20266-WIXCS02U User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 5, February 2021): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: This device contains license-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s license-exempt RSS(s). Operation is subject to the following two conditions: (1) This device may not cause interference; (2) This device must accept any interference, including interference that may cause undesired operation of the device. L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: 1. L’appareil ne doit pas produire de brouillage; 2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement. Transmitter Antenna (From Section 6.8 RSS-GEN, Issue 5, February 2021): User manuals, for transmitters shall display the following notice in a conspicuous location: This radio transmitter IC: 20266-20266-WIXCS02 and IC: 20266-20266-WIXCS02U have been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Le présent émetteur radio IC: 20266-20266-WIXCS02 and IC: 20266-20266-WIXCS02U a été approuvé par Innovation, Sciences et Développement économique Canada pour fonctionner avec les types d'antenne énumérés cidessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué pour tout type figurant sur la liste, sont strictement interdits pour l'exploitation de l'émetteur. Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each.

5.2.2 RF Exposure

All transmitters regulated by Innovation, Science and Economic Development Canada (ISED) must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). This transmitter is restricted for use with a specific antenna tested in this application for certification, and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with Canada multi-transmitter product procedures. WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE: The device operates at an output power level which is within the ISED SAR test exemption limits at any user distance.

WINCS02IC and WINCS02 Family Appendix A: Regulatory Approval Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 65 Exposition aux RF Tous les émetteurs réglementés par Innovation, Sciences et Développement économique Canada (ISDE) doivent se conformer à l'exposition aux RF. exigences énumérées dans RSS-102 - Conformité à l'exposition aux radiofréquences (RF) des appareils de radiocommunication (toutes les bandes de fréquences). Cet émetteur est limité à une utilisation avec une antenne spécifique testée dans cette application pour la certification, et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou émetteur au sein d'un appareil hôte, sauf conformément avec les procédures canadiennes relatives aux produits multi-transmetteurs. Les appareils fonctionnent à un niveau de puissance de sortie qui se situe dans les limites du DAS ISED. tester les limites d’exemption à toute distance d’utilisateur supérieure à 20 cm.

5.2.3 Approved Antenna Types

For the WINCS02PC/PE, approval was received using the integral PCB antenna. For the WINCS02UC/UE, approved antennas are listed in the WINCS02 Module Approved External Antenna.

5.2.4 Helpful Web Sites

Innovation, Science and Economic Development Canada (ISED): www.ic.gc.ca/.

5.3 Europe

The WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Modules are a Radio Equipment Directive (RED) assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Modules have been tested to RED 2014/53/EU Essential Requirements mentioned in the following European Compliance table. Table 5-1. European Compliance In f ormation Certification Standard Article Safety EN 62368 3.1a Health EN 62311 EMC EN 301 489-1 3.1b EN 301 489-17 Radio EN 300 328 3.2 The ETSI provides guidance on modular devices in the “Guide to the application of harmonised standards covering articles 3.1b and 3.2 of the RED 2014/53/EU (RED) to multi-radio and combined radio and non-radio equipment” document available at http://www.etsi.org/deliver/etsi_eg/ 203300_203399/20 3367/01.01.01_60/eg_203367v010101p.pdf. Note: To maintain conformance to the standards listed in the preceding European Compliance table, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product, the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements against the RED.

5.3.1 Labeling and User In f ormation Requirements

The label on the final product that contains the WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Modules must follow CE marking requirements.

5.3.2 Conformity Assessment

From ETSI Guidance Note EG 203367, section 6.1, when non-radio products are combined with a radio product: If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equivalent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to the installation instructions for the radio product, then no additional assessment of the combined equipment against article 3.2 of the RED is required.

5.3.2.1 Simplified EU Declar ation of Conformity

Hereby, Microchip Technology Inc. declares that the radio equipment type WINCS02PC/WINCS02PE/ WINCS02UC/WINCS02UE Modules are in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity, for this product, is available at www.microchip.com/ design-centers/wireless-connectivity/.

5.3.3 Approved Antenna Types

For the WINCS02PC/PE, approval was received using the integral PCB antenna. For the WINCS02UC/UE, approved antennas are listed in the WINCS02 Module Approved External Antenna.

5.3.4 Helpful Websites

A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Communications Committee (ECC) at: docdb.cept.org/. Additional helpful web sites are:

Radio Equipment Directive (2014/53/EU): https://ec.europa.eu/growth/single-market/european-standards/harmonised-standards/red_en
European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org
European Telecommunications Standards Institute (ETSI): http://www.etsi.org
The Radio Equipment Directive Compliance Association (REDCA): http://www.redca.eu/

5.4 Japan

The WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Modules have received type certification and is required to be labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required:

If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required
There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: www.vcci.jp/vcci_e/index.html

5.4.1 Labeling and User In f ormation Requirements

The label on the final product which contains the WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE module(s) must follow Japan marking requirements. The integrator of the module should refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. For the WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Modules, due to a limited Module size, the technical conformity logo and ID is displayed in the data sheet and/or packaging and cannot be displayed on the Module label. The final product in which this Module is being used must have a label referring to the type certified Module inside: WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Module 020-240380

5.4.2 Helpful Web Sites

Association of Radio Industries and Businesses (ARIB): www.arib.or.jp/english/.

5.5 Korea

The WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Modules have received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed.

5.5.1 Labeling and User In f ormation Requirements

The label on the final product which contains the WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE module(s) must follow KC marking requirements. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Modules are labeled with its own KC mark. The final product requires the KC mark and certificate number of the Module: WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Module R-R-mcp-WIXCS02

5.5.2 Helpful Websites

Korea Communications Commission (KCC): www.kcc.go.kr.
National Radio Research Agency (RRA): rra.go.kr.

5.6 Taiwan

The WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Modules have received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product should contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed.

5.6.1 Labeling and User In f ormation Requirements

For the WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Modules, due to the limited Module size, the NCC mark and ID are displayed in the data sheet only and cannot be displayed on the Module label: WINCS02PC Module CCAN24Y11100T5 WINCS02PE Module CCAN24Y11101T7 WINCS02UC Module CCAN24Y11110T8 WINCS02UE Module CCAN24Y11111T0 The user's manual should contain following warning (for RF device) in traditional Chinese: 根據 NCC LP0002 低功率射頻器材技術規範_章節 3.8.2：取得審驗證明之低功率射頻器材，非經核准，公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計之特性及功能。低功率射頻器材之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。前述合法通信，指依電信管理法規定作業之無線電通信。低功率射頻器材須忍受合法通信或工業、科學及醫療用電波輻射性電機設備之干擾。此模組於取得認證後將依規定於模組本體標示審驗合格標籤，並要求平台廠商於平台上標示本產品內含發射器模組

5.6.2 Helpful Web Sites

National Communications Commission (NCC): www.ncc.gov.tw

5.7 UKCA (UK Conformity Assessed)

The WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Module is a UK conformity assessed radio module that meets all the essential requirements according to CE RED requirements.

5.7.1 Labeling Requirements for Module and User’s Requirements

The label on the final product that contains the WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Module must follow UKCA marking requirements. The UKCA mark above is printed on the module itself or on the packing label. Additional details for the label requirement are available at: https://www.gov.uk/guidance/using-the-ukca-marking#check-whether-you-need-to-use-the-new- ukca-marking.

5.7.2 UKCA Declar ation of Conformity

Hereby, Microchip Technology Inc. declares that the radio equipment type the WINCS02PC/ WINCS02PE/WINCS02UC/WINCS02UE Modules are in compliance with the Radio Equipment Regulations 2017. The full text of the UKCA declaration of conformity for this product is available (under Documents > Certifications) at: www.microchip.com/en-us/product/WINCS02.

5.7.3 Approved Antennas

The testing of the WINCS02PC/WINCS02PE/WINCS02UC/WINCS02UE Module was performed with the antennas listed in WINCS02 Module Approved External Antenna.

5.7.4 Helpful Websites

For more information on the UKCA regulatory approvals, refer to the www.gov.uk/guidance/placing- manufactured-goods-on-the-market-in-great-britain.

5.8 Other Regulatory In f ormation

For information about other countries' jurisdictions not covered here, refer to the www.microchip.com/design-centers/wireless-connectivity/certifications.
Should other regulatory jurisdiction certification be required by the customer, or the customer needs to recertify the module for other reasons, contact Microchip for the required utilities and documentation.

WINCS02IC and WINCS02 Family Appendix B: Acronyms and Abbr e viations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 70 6. Appendix B: Acronyms and Abbr e viations Table 6-1. Acronyms and Abbr e viations Acronyms Abbreviations ADC Analog-to-Digital Converter AES Advanced Encryption Standard ASCII American Standard Code for Information Interchange CBC Cypher Block Chaining CDM Charged Device Model CFB Cypher Feedback Mode CLK Clock CMD Command CPU Central Processing Unit CTR Counter Mode CTS Clear-to-Send DAC Digital-to-Analog Converter DC Direct Current DES Data Encryption Standard DFU Device Firmware Update DNP Do Not Populate ECB Electronic Code Book ECC Elliptic-Curve Cryptography EMC Electro-Magnetic Compatibility EMI Electro-Magnetic Interference ESD Electrostatic Discharge ESR Effective Series Resistance EVM Error Vector Magnitude FCC Federal Communications Commission GND Ground GPIO General Purpose I/O HBM Human Body Model HPA High Power Amplifier HTTP Hypertext Transfer Protocol I2C Inter-Integrated Circuit IP Internet Protocol I/O Input Output IPWR Idle Current ISED Innovation, Science and Economic Development ISM International Safety Management Certification LNA Low Noise Amplifier MCLR Master Clear Reset Active Low MSB Most Significant Bit NC No Connection NDRNG Non Deterministic Random Number Generator NIST National Institute of Standards and Technology OEM Original Equipment Manufacturer

WINCS02IC and WINCS02 Family Appendix B: Acronyms and Abbr e viations Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 71 Table 6-1. Acronyms and Abbr e viations (c ontinued) Acronyms Abbreviations OFB Output Feedback Mode OFDM Orthogonal Frequency Division Multiplexing OSC Oscillator OTA Over-the-Air OTP One Time Programmable PA Power Amplifier PCB Printed Circuit Board PMF Protected Management Frame PMU Power Management Unit POR Power-on Reset POSC Primary Oscillator PRIO Priority PTA Packet Traffic Arbitration PWM Pulse Width Modulation RF Radio Frequency ROM Read Only Memory RP Reverse Polarity RSSI Receive Signal Strength Indication RTCC Real Time Clock Calendar RTS Request-to-Send RX Receive SMA SubMiniature Connector SMD Surface Mount Device SRAM Static Random Access Memory SSL Secure Sockets Layer STM Standard Test Method TCP Transmission Control Protocol TLS Transport Layer Security TP Test Point TPC Transmit Power Control TX Transmit UART Universal Asynchronous Receiver/Transmitter UDP Unified Data Packet VQFN Very Thin Quad Flat No-lead WLAN Wireless Local Area Network WPA Wi-Fi® Protected Access XOSC Crystal Oscillator

WINCS02IC and WINCS02 Family Document Revision History Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 72 7. Document Revision History The revision history describes the changes that were implemented in the document. The changes are listed by revision, starting with the most current publication. Table 7-1. Document Revision History Revision Date Section Description B 03/2025 WINCS02IC and WINCS02 Module Features • Added compatibility for Wi-Fi ® 6/7 2.4 GHz band

Added support for Extreme Deep Sleep (XDS) mode
Added “Example Block Diagram” Device Overview Updated “WINCS02 Module Block Diagram” Pin Details of WINCS02IC Updated “WINCS02IC Pinout Table” Pin Details of WINCS02 Module Updated “WINCS02 Module Pinout Table” Basic Connection Requirement Updated “WINCS02 Module Basic Connection and Interface Diagram” Interface with Host Microcontroller Updated “WINCS02 Module Host Interface Diagram” PCB Antenna Added “3D Antenna Radiation Patterns” and updated “2D Antenna Radiation Patterns” External Antennas Updated “Approved External Antenna List with Antenna Gain for WINCS02 Module” table Extreme Deep Sleep (XDS) Current Consumption Added this section SDIO-SPI AC Timing Specifications “SPI Electrical Specifications” section was replaced with “SDIO-SPI AC Timing Specifications” Appendix A: Regulatory Approval, Japan, Korea, Taiwan Added regulatory approval details for Japan, Korea and Taiwan A 09/2024 Document Initial Revision

WINCS02IC and WINCS02 Family Data Sheet © 2024-2025 Microchip Technology Inc. and its subsidiaries DS70005577B - 73 Microchip In f ormation Trademarks The “Microchip” name and logo, the “M” logo, and other names, logos, and brands are registered and unregistered trademarks of Microchip Technology Incorporated or its affiliates and/or subsidiaries in the United States and/or other countries (“Microchip Trademarks”). Information regarding Microchip Trademarks can be found at https://www.microchip.com/en-us/about/legal- information/microchip-trademarks. ISBN: 979-8-3371-0823-0 Legal Notice This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at www.microchip.com/en-us/support/design-help/ client-support-services. THIS INFORMATION IS PROVIDED BY MICROCHIP “AS IS”. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP’S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip Devices Code Pr ot ection Feature Note the following details of the code protection feature on Microchip products:

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Product Information

W1049B030 specifications and overview.

Summary

low power consuming IC containing a 2.4 GHz IEEE 802.11b/g/n-compliant radio 03/2025

Description

low power consuming IC containing a 2.4 GHz IEEE 802.11b/g/n-compliant radio 03/2025

Source title W1049B030 Datasheet(PDF) - Microchip Technology

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