W005G VISHAY | Alldatasheet
Document overview
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- PDF pages: 2
Technical content
Features
- Plastic package has Underwriters Laboratory Flammability Classification 94V-0
- This series is UL listed under the Recognized Component Index, file number E54214
- Glass passivated chip junction
- High case dielectric strength
- Typical I R less than 0.1µA
- High overload surge current
- Ideal for printed circuit boards
- High temperature soldering guaranteed: 260°C/10 seconds, 0.375 (9.5mm) lead length, 5lbs. (2.3kg) tension Mechanical Data Case: Molded plastic body over passivated junctions Terminals:Plated leads solderable per MIL-STD-750, Method 2026 Mounting Position:Any Weight:0.04 oz., 1.1 g Packaging codes/options:1/100 EA. per Bulk Bag Case Style WOG
formerly General Semiconductor www.vishay.com Document Number 88769 2 19-Feb-02 Ratings and Characteristic Curves(TA = 25°C unless otherwise noted) Ambient Temperature (°C) Fig. 1 — Derating Curve Output Rectified Current Average Forward Output Current (A) Fig. 3 — Typical Forward Characteristics Per Leg Instantaneous Forward Voltage (V) Instantaneous Forward Current (A) Percent of Rated Peak Reverse Voltage (%) Instantaneous Reverse Current (µA) Fig. 4 — Typical Reverse Leakage Characteristics Per Leg Fig. 6 — Typical Transient Thermal Impedance Number of Cycles at 60 HZ t, Heating Time (sec.) Fig. 2 — Maximum Non-Repetitive Peak Forward Surge Current Per Leg Peak Forward Surge Current (A) Reverse Voltage (V) Junction Capacitance (pF) Transient Thermal Impedance (°C/W) Fig. 5 — Typical Junction Capacitance Per Leg 20 40 60 80 100 120 140 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 150 Capacitive Load 5.0 I(pk) I(AV) 10 100 TA = 25°C Single Sine-Wave (JEDEC Method)
1.0 Cycle
0.01 0.1 TJ = 25°C Pulse Width = 300µs 1% Duty Cycle 0 20 40 60 80 100 0.01 0.1 0.1 1 10 100 100 TJ = 25°C f = 1.0MHZ Vsig = 50mVp-p 0.10.01 1 10 100 100 0.1 TJ = 100°C TJ = 25°C P.C.B. 0.375" (9.5mm) Copper Pads 0.22 x 0.22" (5.5 x 5.5mm) 60 H Z Resistive or Inductive Load