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JMK316ABJ106ML-T TAIYO-YUDEN | Alldatasheet

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⾣5IJTDBUBMPHDPOUBJOTUIFUZQJDBMTQFDJp DBUJPOPOMZEVFUPUIFMJNJUBUJPOPGTQBDF8IFOZPVDPOTJEFSUIFQVSDIBTFPGPVSQSPEVDUT QMFBTFDIFDLPVSQSPEVDUTQFDJp DBUJPOTIFFUT 'PSEFUBJMTPGFBDIQSPEVDU DIBSBDUFSJTUJDTHSBQI SFMJBCJMJUZJOGPSNBUJPO QSFDBVUJPOTGPSVTF BOETPPO TFFPVSXFCTJUF IUUQXXXUZUPQDPN for General Electronic Equipment REMINDERS Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. ˙ Product Information i n this Catalog Product information in this catalog is as of October 2020. All of the contents specified herein and production status of the products listed in this catalog are subject to change without notice due to technical improvement of our products, etc. Therefore, please check for thelatest information carefully before practical application or use of ourproducts. Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or equipment incorporating our products, which are caused under the conditions other than those specified in this catalog or individual product specification sheets. ˙ Approval of Product Specifications Please contact TAIYO YUDEN for further details of product specifications as the individual product specification sheets are available. When using our products, please be sure to approve our product specifications or make a written agreement on the product specification with TAIYO YUDEN in advance. ˙ Pre-Evaluation in the Actual Equipment and Conditions Please conduct validation and verification of our products in actual conditions of mounting and operating environment before using our products. ˙ Limited Application 1. Equipment Intended for Use The products listed in this catalog are intended for general- purpose and standard use in general electronic equipment (e.g., AV equipment, OA equipment, home electric appliances, office equipment, information and communication equipment including, without limitation, mobile phone, and PC) and other equipment specified in this catalog or the individual product specification sheets. TAIYO YUDEN has the line-up of the products intended for use in automotive electronic equipment, telecommunications infrastructure and industrial equipment, or medical devices classified as GHTF Classes A to C (Japan Classes I to III). Therefore, when using our products for these equipment, please check available applications specified in this catalog or the individual product specification sheets and use the corresponding products. 2. Equipment Requiring Inquiry Please be sure to contact TAIYO YUDEN for further information before using the products listed in this catalog for the following equipment (excluding intended equipment as specified in this catalog or the individual product specification sheets) which may cause loss of human life, bodily injury, serious property damage and/or serious public impact due to a failure or defect of the products and/or malfunction attributed thereto. (1) Transportation equipment (automotive powertrain control system, train control system, and ship control system, etc.) (2) Traffic signal equipment (3) Disaster prevention equipment, crime prevention equipment (4) Medical devices classified as GHTF Class C (Japan Class III) (5) Highly public information network equipment, data- processing equipment (telephone exchange, and base station, etc.) (6) Any other equipment requiring high levels of quality and/or reliability equal to the equipment listed above 3. Equipment Prohibited for Use Please do not incorporate our products into the following equipment requiring extremely high levels of safety and/or reliability. (1) Aerospace equipment (artificial satellite, rocket, etc.) (2) Aviation equipment * (3) Medical devices classified as GHTF Class D (Japan Class IV), implantable medical devices * (4) Power generation control equipment (nuclear power, hydroelectric power, thermal power plant control system, etc.) (5) Undersea equipment (submarine repeating equipment, underwater work equipment, etc.) (6) Military equipment (7) Any other equipment requiring extremely high levels of safety and/or reliability equal to the equipment listed above *Notes: 1. There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g., in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN. Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment. 2. Implantable medical devices contain not only internal unit which is implanted in a body, but also external unit which is connected to the internal unit. 4. Limitation of Liability Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog for any equipment that is not intended for use by TAIYO YUDEN, or any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above. ˙ Safety Design When using our products for high safety and/or reliability-required equipment or circuits, please fully perform safety and/or reliability evaluation. In addition, please install (i) systems equipped with a protection circuit and a protection device and/or (ii) systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault for a failsafe design to ensure safety. ˙ Intellectual Property Rights Information contained in this catalog is intended to convey examples of typical performances and/or applications of our products and is not intended to make any warranty with respect to the intellectual property rights or any other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights. ˙ Limited Warranty Please note that the scope of warranty for our products is limited to the delivered our products themselves and TAIYO YUDEN shall not be in any way responsible for any damages resulting from a failure or defect in our products. Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in accordance with such agreement. ˙ TAIYO YUDEN’s Official Sales Channel The contents of this catalog are applicable to our products which are purchased from our sales offices or authorized distributors (hereinafter ʠTAIYO YUDENʟs official sales channelʡ). Please note that the contents of this catalog are not applicable to our products purchased from any seller other than TAIYO YUDENʟs official sales channel. ˙ Caution for Export Some of our products listed in this catalog may require specific procedures for export according to ʠU.S. Export Administration Regulations ʡ, ʠForeign Exchange and Foreign Trade Control Law ʡ of Japan, and other applicable regulations. Should you have any questions on this matter, please contact our sales staff. January 2021. All of the

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . for General Electronic Equipment MULTILAYER CERAMIC CAPACITORS c_mlcc_e-E09R01.doc MULTILAYER CERAMIC CAPACITORS WAVE REFLOW ■PARTS NUMBER J M K 3 1 6 △ B J 1 0 6 M L － T △ △＝Blank space ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ⑫ ①Rated voltage Code Rated voltage［VDC］ P 2.5 A 4 J 6.3 L 10 E 16 T 25 G 35 U 50 H 100 Q 250 S 630 X 2000 ②Series name Code Series name M Multilayer ceramic capacitor V Multilayer ceramic capacitor for high frequency W LW reverse type multilayer capacitor ③End termination Code End termination K Plated S Cu Internal Electrodes (For High Frequency) ④Dimension（L×W） Type Dimensions 021 0.25× 0.125 008004 042 0.4 × 0.2 01005 063 0.6 × 0.3 0201 105 1.0 × 0.5 0402 0.52× 1.0 ※ 0204 107 1.6 × 0.8 0603 0.8 × 1.6 ※ 0306 212 2.0 × 1.25 0805 1.25× 2.0 ※ 0508 316 3.2 × 1.6 1206 325 3.2 × 2.5 1210 432 4.5 × 3.2 1812 Note : ※LW reverse type（□WK） only ⑤Dimension tolerance △ ALL Standard Standard Standard A 0.45±0.05 0.85±0.10 1.25＋0.15/－0.05 1.6±0.20 B 0.8＋0.20/－0 0.45±0.05 0.85±0.10 1.25＋0.20/－0 N o t e : c f . S T A N D A R D E X T E R N A L D I M E N S I O N S △ = B l a n k s p a c e ⑥Temperature characteristics code ■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor） Code Applicable standard Temperature range［℃］ Ref. Temp.［℃］ Capacitance change Capacitance tolerance Tolerance code BJ ±20％ M ±20％ M ±20％ M ±20％ M ±20％ M ±10％ K ±20％ M Note : ※.LD Low distortion high value multilayer cer a m i c c a p a c i t o r △ = B l a n k s p a c e MULTILAYER CERAMIC CAPACITORS CERAMIC CAPACITORS

for General Electronic Equipment ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . MULTILAYER CERAMIC CAPACITORS c_mlcc_e-E09R01.doc ■Temperature compensating type Code Applicable standard Temperature range［℃］ Ref. Temp.［℃］ Capacitance change Capacitance tolerance Tolerance code CG EIA C0G －55～＋125 25 0±30ppm/℃ ±0.05pF A ±0.1pF B ±0.25pF C ±0.5pF D ±5％ J UJ JIS UJ －55～＋125 20 －750±120ppm/℃ ±0.25pF C ±0.5pF D EIA U2J 25 ±5％ J UK JIS UK －55～＋125 20 －750±250ppm/℃ ±0.25pF C EIA U2K －55～＋125 25 ⑥Series code ・Super low distortion multilayer ceramic capacitor Code Series code SD Standard ・Medium-High Voltage Multilayer Ceramic Capacitor Code Series code SD Standard ⑦Nominal capacitance Code （example） Nominal capacitance 0R5 0.5pF 010 1pF 100 10pF 101 100pF 102 1,000pF 103 10,000pF 104 0.1μF 105 1.0μF 106 10μF 107 100μF Note : R＝Decimal point ⑧Capacitance tolerance Code Capacitance tolerance A ±0.05pF B ±0.1pF C ±0.25pF D ±0.5pF F ±1pF G ±2％ J ±5％ K ±10％ M ±20％ Z ＋80/－20％ ⑨Thickness Code Thickness［mm］ K 0.125 H 0.13 E 0.18 C 0.2 D P 0.3 T K 0.45（107type or more） V 0.5 W A 0.8 D 0.85（212type or more） F 1.15 G 1.25 L 1.6 N 1.9 Y 2.0 max M 2.5 ⑩Special code Code Special code － Standard ⑪Packaging Code Packaging F φ178mm Taping （2mm pitch） T φ178mm Taping （4mm pitch） P φ178mm Taping （4mm pitch, 1000 pcs/reel） 325 type（Thickness code M） R φ178mm Taping （2mm pitch）105type only （Thickness code E,H） W φ178mm Taping（1mm pitch）021/042type only ⑫Internal code Code Internal code △ Standard CERAMIC CAPACITORS

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . for General Electronic Equipment MULTILAYER CERAMIC CAPACITORS c_mlcc_e-E09R01.doc ■STANDARD EXTERNAL DIMENSIONS W L e T T L W e ※ LW reverse type Type( EIA ) Dimension [mm] L W T *1 e 0.13±0.02 H 0.25±0.10 0.18±0.02 E 0.2±0.02 C 0.3±0.03 P 0.5±0.05 V 0.45±0.05 K 1.25±0.10 G 0.85±0.10 D 1.6±0.20 L 0.85±0.10 D 0.6±0.3 1.15±0.10 F 1.9±0.20 N 1.9＋0.1/－0.2 Y 2.5±0.20 M 2.5±0.20 M 0.9±0.6 Note : ※. LW reverse type, *1.Thickness code ■STANDARD QUANTITY Type EIA（inch） Dimension Standard quantity［pcs］ ［mm］ Code Paper tape Embossed tape 021 008004 0.125 K － 50000 042 01005 0.2 C － 40000 D 063 0201 0.3 P 15000 － T 105 0402

0.13 H － 20000

0.18 E － 15000

0.2 C 20000 －

0.3 P 15000 －

0.5 V 10000 － W 0204 ※ 0.30 P 107 0603 0.45 K 4000 － 0.8 A 0306 ※ 0.50 V － 4000 212 0805 0.45 K 4000 － 0.85 D

1.25 G － 3000

0508 ※ 0.85 D 4000 － 316 1206

0.85 D 4000 －

1.15 F － 3000

1.6 L － 2000

0.85 D － 2000 1.15 F 1.9 N 2.0 max Y

2.5 M － 1000

432 1812 2.0 max Y － 1000

2.5 M － 500

Note : ※.LW Reverse type（□WK） CERAMIC CAPACITORS

for General Electronic Equipment ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . MULTILAYER CERAMIC CAPACITORS ■PARTS NUMBER Multilayer Ceramic Capacitors（Temperature compensating type）

• 021TYPE 【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】 0.125mm thickness（K） HTLT Rated voltage x ％ TMK021 CG0R2BK-W CG C0G 0.2 p ±0.1pF 404 200 0.125±0.013 R TMK021 CG010[]K-W CG C0G 1 p ±0.1pF, ±0.25pF 420 200 0.125±0.013 R TMK021 CG020[]K-W CG C0G 2 p ±0.1pF, ±0.25pF 440 200 0.125±0.013 R TMK021 CG030[]K-W CG C0G 3 p ±0.1pF, ±0.25pF 460 200 0.125±0.013 R TMK021 CG040[]K-W CG C0G 4 p ±0.1pF, ±0.25pF 480 200 0.125±0.013 R TMK021 CG050[]K-W CG C0G 5 p ±0.1pF, ±0.25pF 500 200 0.125±0.013 R TMK021 CG060[]K-W CG C0G 6 p ±0.25pF, ±0.5pF 520 200 0.125±0.013 R TMK021 CG070[]K-W CG C0G 7 p ±0.25pF, ±0.5pF 540 200 0.125±0.013 R TMK021 CG080[]K-W CG C0G 8 p ±0.25pF, ±0.5pF 560 200 0.125±0.013 R Soldering R:Reflow W:Wave Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance Q (at 1MHz) min Thickness*3 [mm] c_mlcc_e-E09R01.xlsx CERAMIC CAPACITORS

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . for General Electronic Equipment MULTILAYER CERAMIC CAPACITORS ■PARTS NUMBER HTLT Rated voltage x ％ TMK021 CG090[]K-W CG C0G 9 p ±0.25pF, ±0.5pF 580 200 0.125±0.013 R TMK021 CG100DK-W CG C0G 10 p ±0.5pF 600 200 0.125±0.013 R TMK021 CG120JK-W CG C0G 12 p ±5％ 640 200 0.125±0.013 R TMK021 CG150JK-W CG C0G 15 p ±5％ 700 200 0.125±0.013 R TMK021 CG180JK-W CG C0G 18 p ±5％ 760 200 0.125±0.013 R TMK021 CG220JK-W CG C0G 22 p ±5％ 840 200 0.125±0.013 R TMK021 CG270JK-W CG C0G 27 p ±5％ 940 200 0.125±0.013 R EMK021 CG330JK-W CG C0G 33 p ±5％ 1000 150 0.125±0.013 R EMK021 CG390JK-W CG C0G 39 p ±5％ 1000 150 0.125±0.013 R EMK021 CG470JK-W CG C0G 47 p ±5％ 1000 150 0.125±0.013 R EMK021 CG560JK-W CG C0G 56 p ±5％ 1000 150 0.125±0.013 R LMK021 CG680JK-W CG C0G 68 p ±5％ 1000 200 0.125±0.013 R LMK021 CG820JK-W CG C0G 82 p ±5％ 1000 200 0.125±0.013 R LMK021 CG101JK-W CG C0G 100 p ±5％ 1000 200 0.125±0.013 R

• 042TYPE 【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】 0.2mm thickness（C,D） HTLT Rated voltage x ％ TMK042 CG040[]D-W CG C0G 4 p ±0.1pF, ±0.25pF 480 200 0.2±0.02 R TMK042 CG050[]D-W CG C0G 5 p ±0.1pF, ±0.25pF 500 200 0.2±0.02 R Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance Q (at 1MHz) min Thickness*3 [mm] Q (at 1MHz) min Thickness*3 [mm] Soldering R:Reflow W:Wave Soldering R:Reflow W:Wave Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance c_mlcc_e-E09R01.xlsx CERAMIC CAPACITORS

for General Electronic Equipment ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . MULTILAYER CERAMIC CAPACITORS ■PARTS NUMBER HTLT Rated voltage x ％ TMK042 CG100DD-W CG C0G 10 p ±0.5pF 600 200 0.2±0.02 R TMK042 CG110JD-W CG C0G 11 p ±5％ 620 200 0.2±0.02 R TMK042 CG120JD-W CG C0G 12 p ±5％ 640 200 0.2±0.02 R TMK042 CG130JD-W CG C0G 13 p ±5％ 660 200 0.2±0.02 R TMK042 CG150JD-W CG C0G 15 p ±5％ 700 200 0.2±0.02 R TMK042 CG160JC-W CG C0G 16 p ±5％ 720 200 0.2±0.02 R TMK042 CG180JC-W CG C0G 18 p ±5％ 760 200 0.2±0.02 R TMK042 CG200JC-W CG C0G 20 p ±5％ 800 200 0.2±0.02 R TMK042 CG220JC-W CG C0G 22 p ±5％ 840 200 0.2±0.02 R TMK042 CG240JC-W CG C0G 24 p ±5％ 880 200 0.2±0.02 R TMK042 CG270JC-W CG C0G 27 p ±5％ 940 200 0.2±0.02 R TMK042 CG300JC-W CG C0G 30 p ±5％ 1000 200 0.2±0.02 R TMK042 CG330JC-W CG C0G 33 p ±5％ 1000 200 0.2±0.02 R TMK042 CG360JC-W CG C0G 36 p ±5％ 1000 200 0.2±0.02 R TMK042 CG390JC-W CG C0G 39 p ±5％ 1000 200 0.2±0.02 R TMK042 CG430JC-W CG C0G 43 p ±5％ 1000 200 0.2±0.02 R TMK042 CG470JC-W CG C0G 47 p ±5％ 1000 200 0.2±0.02 R TMK042 CG510JC-W CG C0G 51 p ±5％ 1000 200 0.2±0.02 R TMK042 CG560JC-W CG C0G 56 p ±5％ 1000 200 0.2±0.02 R TMK042 CG620JC-W CG C0G 62 p ±5％ 1000 200 0.2±0.02 R TMK042 CG680JC-W CG C0G 68 p ±5％ 1000 200 0.2±0.02 R TMK042 CG750JC-W CG C0G 75 p ±5％ 1000 200 0.2±0.02 R TMK042 CG820JC-W CG C0G 82 p ±5％ 1000 200 0.2±0.02 R TMK042 CG910JC-W CG C0G 91 p ±5％ 1000 200 0.2±0.02 R TMK042 CG101JC-W CG C0G 100 p ±5％ 1000 200 0.2±0.02 R Part number 1 Part number 2 Temperature characteristics Capacitance [F] Capacitance tolerance Q (at 1MHz) min Thickness*3 [mm] Soldering R:Reflow W:Wave Rated voltage [V] c_mlcc_e-E09R01.xlsx CERAMIC CAPACITORS

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . for General Electronic Equipment MULTILAYER CERAMIC CAPACITORS ■PARTS NUMBER 【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】 0.2mm thickness（C,D） HTLT Rated voltage x ％ EMK042 CG040[]D-W CG C0G 4 p ±0.1pF, ±0.25pF 480 200 0.2±0.02 R EMK042 CG050[]D-W CG C0G 5 p ±0.1pF, ±0.25pF 500 200 0.2±0.02 R Q (at 1MHz) min Thickness*3 [mm] Soldering R:Reflow W:Wave Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance c_mlcc_e-E09R01.xlsx CERAMIC CAPACITORS

for General Electronic Equipment ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . MULTILAYER CERAMIC CAPACITORS ■PARTS NUMBER HTLT Rated voltage x ％ EMK042 CG100DD-W CG C0G 10 p ±0.5pF 600 200 0.2±0.02 R EMK042 CG110JD-W CG C0G 11 p ±5％ 620 200 0.2±0.02 R EMK042 CG120JD-W CG C0G 12 p ±5％ 640 200 0.2±0.02 R EMK042 CG130JD-W CG C0G 13 p ±5％ 660 200 0.2±0.02 R EMK042 CG150JD-W CG C0G 15 p ±5％ 700 200 0.2±0.02 R EMK042 CG160JC-W CG C0G 16 p ±5％ 720 200 0.2±0.02 R EMK042 CG180JC-W CG C0G 18 p ±5％ 760 200 0.2±0.02 R EMK042 CG200JC-W CG C0G 20 p ±5％ 800 200 0.2±0.02 R EMK042 CG220JC-W CG C0G 22 p ±5％ 840 200 0.2±0.02 R EMK042 CG240JC-W CG C0G 24 p ±5％ 880 200 0.2±0.02 R EMK042 CG270JC-W CG C0G 27 p ±5％ 940 200 0.2±0.02 R EMK042 CG300JC-W CG C0G 30 p ±5％ 1000 200 0.2±0.02 R EMK042 CG330JC-W CG C0G 33 p ±5％ 1000 200 0.2±0.02 R EMK042 CG360JC-W CG C0G 36 p ±5％ 1000 200 0.2±0.02 R EMK042 CG390JC-W CG C0G 39 p ±5％ 1000 200 0.2±0.02 R EMK042 CG430JC-W CG C0G 43 p ±5％ 1000 200 0.2±0.02 R EMK042 CG470JC-W CG C0G 47 p ±5％ 1000 200 0.2±0.02 R EMK042 CG510JC-W CG C0G 51 p ±5％ 1000 200 0.2±0.02 R EMK042 CG560JC-W CG C0G 56 p ±5％ 1000 200 0.2±0.02 R EMK042 CG620JC-W CG C0G 62 p ±5％ 1000 200 0.2±0.02 R EMK042 CG680JC-W CG C0G 68 p ±5％ 1000 200 0.2±0.02 R EMK042 CG750JC-W CG C0G 75 p ±5％ 1000 200 0.2±0.02 R EMK042 CG820JC-W CG C0G 82 p ±5％ 1000 200 0.2±0.02 R EMK042 CG910JC-W CG C0G 91 p ±5％ 1000 200 0.2±0.02 R EMK042 CG101JC-W CG C0G 100 p ±5％ 1000 200 0.2±0.02 R EMK042 CG221JC-W CG C0G 220 p ±5％ 1000 200 0.2±0.02 R EMK042 CG241JC-W CG C0G 240 p ±5％ 1000 200 0.2±0.02 R EMK042 CG271JC-W CG C0G 270 p ±5％ 1000 200 0.2±0.02 R EMK042 CG331JC-W CG C0G 330 p ±5％ 1000 200 0.2±0.02 R

• 063TYPE 【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】 0.3mm thickness（T） HTLT Rated voltage x ％ UMK063 CG200JT-F CG C0G 20 p ±5％ 800 200 0.3±0.03 R UMK063 CG220JT-F CG C0G 22 p ±5％ 840 200 0.3±0.03 R UMK063 CG240JT-F CG C0G 24 p ±5％ 880 200 0.3±0.03 R UMK063 CG270JT-F CG C0G 27 p ±5％ 940 200 0.3±0.03 R UMK063 CG300JT-F CG C0G 30 p ±5％ 1000 200 0.3±0.03 R UMK063 CG330JT-F CG C0G 33 p ±5％ 1000 200 0.3±0.03 R UMK063 CG360JT-F CG C0G 36 p ±5％ 1000 200 0.3±0.03 R UMK063 CG390JT-F CG C0G 39 p ±5％ 1000 200 0.3±0.03 R UMK063 CG430JT-F CG C0G 43 p ±5％ 1000 200 0.3±0.03 R UMK063 CG470JT-F CG C0G 47 p ±5％ 1000 200 0.3±0.03 R UMK063 CG510JT-F CG C0G 51 p ±5％ 1000 200 0.3±0.03 R UMK063 CG560JT-F CG C0G 56 p ±5％ 1000 200 0.3±0.03 R UMK063 CG620JT-F CG C0G 62 p ±5％ 1000 200 0.3±0.03 R UMK063 CG680JT-F CG C0G 68 p ±5％ 1000 200 0.3±0.03 R UMK063 CG750JT-F CG C0G 75 p ±5％ 1000 200 0.3±0.03 R UMK063 CG820JT-F CG C0G 82 p ±5％ 1000 200 0.3±0.03 R UMK063 CG910JT-F CG C0G 91 p ±5％ 1000 200 0.3±0.03 R UMK063 CG101JT-F CG C0G 100 p ±5％ 1000 200 0.3±0.03 R UMK063 CG111JT-F CG C0G 110 p ±5％ 1000 200 0.3±0.03 R UMK063 CG121JT-F CG C0G 120 p ±5％ 1000 200 0.3±0.03 R UMK063 CG131JT-F CG C0G 130 p ±5％ 1000 200 0.3±0.03 R UMK063 CG151JT-F CG C0G 150 p ±5％ 1000 200 0.3±0.03 R UMK063 CG181JT-F CG C0G 180 p ±5％ 1000 200 0.3±0.03 R UMK063 CG201JT-F CG C0G 200 p ±5％ 1000 200 0.3±0.03 R UMK063 CG221JT-F CG C0G 220 p ±5％ 1000 200 0.3±0.03 R TMK063 CG241JT-F CG C0G 240 p ±5％ 1000 200 0.3±0.03 R TMK063 CG271JT-F CG C0G 270 p ±5％ 1000 200 0.3±0.03 R TMK063 CG301JT-F CG C0G 300 p ±5％ 1000 200 0.3±0.03 R TMK063 CG331JT-F CG C0G 330 p ±5％ 1000 200 0.3±0.03 R TMK063 CG361JT-F CG C0G 360 p ±5％ 1000 200 0.3±0.03 R TMK063 CG391JT-F CG C0G 390 p ±5％ 1000 200 0.3±0.03 R TMK063 CG431JT-F CG C0G 430 p ±5％ 1000 200 0.3±0.03 R TMK063 CG471JT-F CG C0G 470 p ±5％ 1000 200 0.3±0.03 R TMK063 CG511JT-F CG C0G 510 p ±5％ 1000 200 0.3±0.03 R TMK063 CG561JT-F CG C0G 560 p ±5％ 1000 200 0.3±0.03 R TMK063 CG621JT-F CG C0G 620 p ±5％ 1000 200 0.3±0.03 R TMK063 CG681JT-F CG C0G 680 p ±5％ 1000 200 0.3±0.03 R TMK063 CG751JT-F CG C0G 750 p ±5％ 1000 200 0.3±0.03 R TMK063 CG821JT-F CG C0G 820 p ±5％ 1000 200 0.3±0.03 R TMK063 CG911JT-F CG C0G 910 p ±5％ 1000 200 0.3±0.03 R TMK063 CG102JT-F CG C0G 1000 p ±5％ 1000 200 0.3±0.03 R Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance Q (at 1MHz) min Thickness*3 [mm] Soldering R:Reflow W:Wave Q (at 1MHz) min Thickness*3 [mm] Soldering R:Reflow W:Wave Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance c_mlcc_e-E09R01.xlsx CERAMIC CAPACITORS

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . for General Electronic Equipment MULTILAYER CERAMIC CAPACITORS ■PARTS NUMBER

• 105TYPE 【Temperature Characteristic U△ : U△/U2△（－55～＋125℃）】 0.5mm thickness（V） HTLT Rated voltage x ％ UMK105 UK0R5CV-F UK U2K 0.5 p ±0.25pF 410 200 0.5±0.05 R UMK105 UK010CV-F UK U2K 1 p ±0.25pF 420 200 0.5±0.05 R UMK105 UK1R5CV-F UK U2K 1.5 p ±0.25pF 430 200 0.5±0.05 R UMK105 UK020CV-F UK U2K 2 p ±0.25pF 440 200 0.5±0.05 R UMK105 UK030CV-F UK U2K 3 p ±0.25pF 460 200 0.5±0.05 R UMK105 UJ040CV-F UJ U2J 4 p ±0.25pF 480 200 0.5±0.05 R UMK105 UJ050CV-F UJ U2J 5 p ±0.25pF 500 200 0.5±0.05 R UMK105 UJ060DV-F UJ U2J 6 p ±0.5pF 520 200 0.5±0.05 R UMK105 UJ070DV-F UJ U2J 7 p ±0.5pF 540 200 0.5±0.05 R UMK105 UJ080DV-F UJ U2J 8 p ±0.5pF 560 200 0.5±0.05 R UMK105 UJ090DV-F UJ U2J 9 p ±0.5pF 580 200 0.5±0.05 R UMK105 UJ100DV-F UJ U2J 10 p ±0.5pF 600 200 0.5±0.05 R UMK105 UJ120JV-F UJ U2J 12 p ±5％ 640 200 0.5±0.05 R UMK105 UJ150JV-F UJ U2J 15 p ±5％ 700 200 0.5±0.05 R UMK105 UJ180JV-F UJ U2J 18 p ±5％ 760 200 0.5±0.05 R UMK105 UJ220JV-F UJ U2J 22 p ±5％ 840 200 0.5±0.05 R UMK105 UJ270JV-F UJ U2J 27 p ±5％ 940 200 0.5±0.05 R UMK105 UJ330JV-F UJ U2J 33 p ±5％ 1000 200 0.5±0.05 R UMK105 UJ390JV-F UJ U2J 39 p ±5％ 1000 200 0.5±0.05 R UMK105 UJ470JV-F UJ U2J 47 p ±5％ 1000 200 0.5±0.05 R UMK105 UJ560JV-F UJ U2J 56 p ±5％ 1000 200 0.5±0.05 R UMK105 UJ680JV-F UJ U2J 68 p ±5％ 1000 200 0.5±0.05 R UMK105 UJ820JV-F UJ U2J 82 p ±5％ 1000 200 0.5±0.05 R UMK105 UJ101JV-F UJ U2J 100 p ±5％ 1000 200 0.5±0.05 R UMK105 UJ121JV-F UJ U2J 120 p ±5％ 1000 200 0.5±0.05 R UMK105 UJ151JV-F UJ U2J 150 p ±5％ 1000 200 0.5±0.05 R UMK105 UJ181JV-F UJ U2J 180 p ±5％ 1000 200 0.5±0.05 R UMK105 UJ221JV-F UJ U2J 220 p ±5％ 1000 200 0.5±0.05 R UMK105 UJ271JV-F UJ U2J 270 p ±5％ 1000 200 0.5±0.05 R UMK105 UJ331JV-F UJ U2J 330 p ±5％ 1000 200 0.5±0.05 R Soldering R:Reflow W:Wave Part number 1 Part number 2 Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance Q (at 1MHz) min Thickness*3 [mm] c_mlcc_e-E09R01.xlsx CERAMIC CAPACITORS

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01 Multilayer Ceramic Capacitors ■PACKAGING ①Minimum Quantity

• Taped package Type(EIA) Thickness Standard quantity [pcs] mm code Paper tape Embossed tape □MK021(008004) 0.125 K － 50000 □VS021(008004) □MK042(01005) 0.2 C, D － 40000 □VS042(01005) 0.2 C □MK063(0201) 0.3 P,T 15000 － □WK105(0204) ※ 0.3 P 10000 － □MK105(0402) □MF105(0402)

0.5 V 10000 －

□VK105(0402) 0.5 W 10000 － □MK107(0603) □WK107(0306) ※ □MF107(0603)

0.45 K 4000 －

0.5 V － 4000

0.8 A 4000 －

□VS107(0603) 0.7 C 4000 － □MJ107(0603) 0.8 A 3000 3000 □MK212(0805) □WK212(0508) ※ □MF212(0805) 0.85 D □VS212(0805) 0.85 D 4000 － □MJ212(0805) 0.85 D 4000 －

1.25 G － 2000

□MK316(1206) □MF316(1206) □MJ316(1206) 1.15 F － 3000 □MK325(1210) □MF325(1210) 0.85 D － 2000 1.15 F 1.9 N 2.0max. Y □MJ325(1210) 1.9 N － 2000 □MK432(1812) 2.5 M － 500 N o t e : ※ L W R e v e r s e t y p e . ②Taping material ※No bottom tape for pressed carrier tape

• Card board carrier tape Top tape Base tape Sprocket hole Bottom tape Chip cavity
• Embossed tape Top tape Base tape Sprocket hole Chip cavity

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01 Chip filled Chip ※ LW Reverse type. ③Representative taping dimensions

• Paper Tape（8mm wide）
• P r e s s e d c a r r i e r t a p e （ 2 m m p i t c h ） U n i t ： m m （ inch） F 2.0±0.05 (0.079±0.002) 4.0±0.1 (0.157±0.004) 1.75±0.1 (0.138±0.002) 8.0±0.3 (0.315±0.012) φ1.5＋0.1/－0 (φ0.059＋0.004/-0)Sprocket hole A B T Type(EIA) Chip Cavity Insertion Pitch Tape Thickness Ａ Ｂ Ｆ Ｔ T1 □MK063(0201) 0.37 0.67 2.0±0.05 0.45max. 0.42max. □WK105(0204) ※ Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type. Unit：m m
• Punched carrier tape （2mm pitch） Unit：mm（i nch） F 2.0±0.05 (0.079±0.002) 4.0±0.1 (0.157±0.004) 1.75±0.1 (0.138±0.002) 8.0±0.3 (0.315±0.012) φ1.5＋0.1/－0 (φ0.059＋0.004/-0)Sprocket hole A B T Type(EIA) Chip Cavity Insertion Pitch Tape Thickness Ａ Ｂ Ｆ Ｔ □MK105 (0402) □MF105 (0402) □VK105 (0402) Unit：mm
• Punched carrier tape （4mm pitch） Unit：mm（inch） F 2.0±0.1 (0.079±0.004) 4.0±0.1 (0.157±0.004) 1.75±0.1 (0.138±0.002) 8.0±0.3 (0.315±0.012) φ1.5＋0.1/－0 (φ0.059＋0.004/-0)Sprocket hole A B T

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01 Type(EIA) Chip Cavity Insertion Pitch Tape Thickness Ａ Ｂ Ｆ Ｔ □MK107(0603) □WK107(0306) ※ □MF107(0603) 1.0 1.8 4.0±0.1 1.1max. □MK212(0805) □MK316(1206) 2.0 3.6 Note：Taping size might be different depending on the size of the product. ※ LW Reverse type. Unit：mm

• E m b o s s e d t a p e （ 4 m m w i d e ） U n i t ： m m （ i n c h ） F 1.0±0.02 (0.039±0.001) 2.0±0.04 (0.079±0.002) 0.9±0.05 (0.071±0.001) 4.0±0.05 (0.157±0.002) φ0.8±0.04 (φ0.031±0.002)Sprocket hole A B Type(EIA) Chip Cavity Insertion Pitch Tape Thickness Ａ Ｂ Ｆ K T □MK021(008004) 0.135 0.27 □MK042(01005) 0.23 0.43 □VS042(01005) Unit：mm
• E m b o s s e d t a p e （ 8 m m w i d e ） U n i t ： m m （ i n c h ） F 2.0±0.1 (0.079±0.004) 4.0±0.1 (0.157±0.004) 1.75±0.1 (0.138±0.002) 8.0±0.3 (0.315±0.012) φ1.5＋0.1/－0 (φ0.059＋0.004/-0)Sprocket hole A B Type(EIA) Chip Cavity Insertion Pitch Tape Thickness Ａ Ｂ Ｆ K T 4.0±0.1 1.3max. 0.25±0.1 □MK212(0805) □MF212(0805) 1.65 2.4 3.4max. 0.6max. □MK316(1206) □MF316(1206) 2.0 3.6 □MK325(1210) □MF325(1210) 2.8 3.6 Note： ※ LW Reverse type. Unit：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01

• Embossed tape（12mm wide） Unit：mm（inch） F 2.0±0.1 (0.079±0.004) 4.0±0.1 (0.157±0.004) 1.75±0.1 (0.217±0.002) 12.0±0.3 (0.472±0.012) φ1.5＋0.1/－0 (φ0.059＋0.004/-0)Sprocket hole A B Type(EIA) Chip Cavity Insertion Pitch Tape Thickness Ａ Ｂ Ｆ K T Unit：mm ④Trailer and Leader B l a n k p o r t i o n C h i p c a v i t y B l a n k p o r t i o n L e a d e r 160mm or more (6.3inches or more) Direction of tape feed 100mm or more (3.94inches or more) 400mm or more (15.7inches or more) ⑤Reel size E C D R B t A W A B C D E R T W 4mm wide tape 1.5max. 5±1.0 8mm wide tape 2.5max. 10±1.5 12mm wide tape 2.5max. 14±1.5 Unit：mm ⑥Top Tape Strength The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below. 0～20° Top tape Base tape Pull direction

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E09R01 Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and High Reliability Application Multilayer Ceramic Capacitors are noted separately. Multilayer Ceramic Capacitors ■RELIABILITY DATA 1.Operating Temperature Range Specified Value Temperature Compensating（Class1） Standard －55 to ＋125℃ High Frequency Type High Permittivity （Class2） Specification Temperature Range BJ B －25 to ＋85℃ X5R －55 to ＋85℃ B7 X7R －55 to ＋125℃ C6 X6S －55 to ＋105℃ C7 X7S －55 to ＋125℃ LD(※) X5R －55 to ＋85℃ Note: ※LD Low distortion high value multilayer ceramic capacito r 2. Storage Conditions Specified Value Temperature Compensating（Class1） Standard －55 to ＋125℃ High Frequency Type High Permittivity （Class2） Specification Temperature Range BJ B －25 to ＋85℃ X5R －55 to ＋85℃ B7 X7R －55 to ＋125℃ C6 X6S －55 to ＋105℃ C7 X7S －55 to ＋125℃ LD(※) X5R －55 to ＋85℃ Note: ※LD Low distortion high value multilayer ceramic capacito r 3. Rated Voltage Specified Value Temperature Compensating（Class1） Standard 50VDC, 25VDC, 16VDC High Frequency Type 50VDC, 25VDC, 16VDC High Permittivity （Class2） 50VDC , 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC 4. Withstanding Voltage （Between terminals） Specified Value Temperature Compensating（Class1） Standard No breakdown or damage High Frequency Type High Permittivity （Class2） Test Methods and Remarks Class 1 Class 2 Applied voltage Rated voltage×3 Rated voltage×2.5 Duration 1 to 5 sec. Charge/discharge current 50mA max. 5. Insulation Resistance Specified Value Temperature Compensating（Class1） Standard 10000 MΩ min. High Frequency Type High Permittivity （Class2） Note 1 C≦0.047 F : 10000 MΩ m i n . C＞0.047μF : 500MΩ・μF Test Methods and Remarks Applied voltage : Rated voltage Duration : 60±5 sec. Charge/discharge current : 50mA max.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E09R01 6. Capacitance （Tolerance） Specified Value Temperature Compensating（Class1） Standard C□ 0.2pF≦C≦5pF : ±0.25pF 0.2pF≦C≦10pF : ±0.5pF C＞10pF : ±5% or ±10% High Frequency Type CG 0.2pF≦C≦2pF : ±0.1pF C＞2pF : ±5% High Permittivity （Class2） ±10% or ±20% Test Methods and Remarks Class 1 Class 2 Standard High Frequency Type C≦10μF C＞10μF Preconditioning None Thermal treatment （at 150℃ for 1hr） Note 2 Measuring frequency 1ＭHz±10% 1kHz±10% 120±10Hz Measuring voltage Nte 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms Bias application None 7. Q or Dissipation Factor Specified Value Temperature Compensating（Class1） Standard C＜30pF : Q≧400＋20C C≧30pF : Q≧1000 （ C ： N o m i n a l c a p a c i t ance） High Frequency Type Refer to detailed specification High Permittivity （Class2） Note 1 BJ, B7, C6, C7：2.5% max. Test Methods and Remarks Class 1 Class 2 Standard High Frequency Type C≦10μF C＞10μF Preconditioning None Thermal treatment （at 150℃ for 1hr） Note 2 Measuring frequency 1ＭHz±10% 1GHz 1ｋHz±10% 120±10Hz Measuring voltage Note 1 0.5 t o 5Vrms 1±0.2Vrms 0.5±0.1Vrms Bias application None High Frequency Type Measuring equipment : HP4291A Measuring jig : HP16192A 8. Temperature Characteristic （Without voltage application） Specified Value Temperature Compensating（Class1） Standard Temperature Characteristic ［ppm/℃］ Tolerance ［ppm/℃］ C□ : 0 CG G : ±30 U□ : －750 UJ, UK J：±120 K：±250 High Frequency Type Temperature Characteristic ［ppm/℃］ Tolerance ［ppm/℃］ C□ : 0 CG G : ±30 High Permittivity （Class2） Specification Capacitance change Reference temperature Temperature Range BJ B ±10% 20℃ －25 to ＋85℃ B7 X7R ±15% 25℃ －55 to ＋125℃ C6 XS ±22% 25℃ －55 to ＋105℃ C7 X7S ±22% 25℃ －55 to ＋125℃ Note : ※LD Low distortion high value multilayer ceramic capaci tor Test Methods and Remarks Class 1 Capacitance at 20℃ and 85℃ shall be measured in thermal equilib rium, and the temperature characteristic shall be calculated fr om the following equation. C20×△T △T＝65 Class 2 Capacitance at each step shall be measured in thermal equilibri um, and the temperature characteristic shall be calculated from the following equation. Step B X5R、X7R、X6S、X7S

1 Minimum operating temperature

2 20℃ 25℃

3 Maximum operating temperature

（C－C2） ×100（%） C ：Capacitance in Step 1 or Step 3 C2 ：Capacitance in Step 2 C2

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E09R01 9. Deflection Specified Value Temperature Compensating（Class1） Standard Appearance : No abnormality Capacitance change : Within ±5% or ±0.5 pF, whichever is large r. High Frequency Type Appearance : No abnormality Capacitance change : Within±0.5 pF High Permittivity （Class2） Appearance : No abnormality Capacitance change : Within ±12.5% Test Methods and Remarks Multilayer Ceramic Capacitors 021, 042, 063, ※105 Type The other types Board Glass epoxy-resin substrate Thickness 0.8mm 1.6mm Warp 1mm Duration 10 sec. ※105 Type thickness, C： 0.2mm ,P： 0.3mm. Capacitance measurement shall be conducted with the board bent 10. Body Strength Specified Value Temperature Compensating（Class1） Standard － High Frequency Type No m echanical damage. High Permittivity （Class2） － Test Methods and Remarks High Frequency 105Type Applied force : 5N Duraton : 10 sec. 11. Adhesive Strength of Terminal Electrodes Specified Value Temperature Compensating（Class1） Standard No terminal separation or its indication. High Frequency Type High Permittivity （Class2） Test Methods and Remarks Multilayer Ceramic Capacitors 021, 042, 063 Type 105 Type or more Applied force 2N 5N Duration 30±5 sec. 12. Solderability Specified Value Temperature Compensating（Class1） Standard At least 95% of terminal electrode is covered by new solder. High Frequency Type High Permittivity （Class2） Test Methods and Remarks Eutectic solder Lead-free solder Solder type H60A or H63A Sn-3.0Ag-0.5Cu Solder temperature 230±5℃ 245±3℃ Duration 4±1 sec.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E09R01 13. Resistance to Soldering Specified Value Temperature Compensating（Class1） Standard Appearance : No abnormality Capacitance change : Within ±2. 5% or ±0.25pF, whichever is larger. Q : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality High Frequency Type Appearance : No abnormality Capacitance change : Within ±2.5% Q : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality High Permittivity （Class2） Note 1 Appearance : No abnormality Capacitance change : Within ±7.5% Dissipation factor : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals）: No abnormality Test Methods and Remarks Class 1 021, 042, 063 Type 105 Type Preconditioning None Preheating 150℃, 1 to 2 min. 80 to 100℃, 2 to 5 min. 150 to 200℃, 2 to 5 min. Solder temp. 270±5℃ Duration 3±0.5 sec. Recovery 6 to 24 hrs （Standard condition） Note 5 Class 2 021, 042、063 Type 105, 107, 212 Type 316, 325, 432 Type Preconditioning Thermal treatment （at 150℃ for 1 hr） Note 2 Preheating 150℃, 1 to 2 min. 80 to 100℃, 2 to 5 min. 150 to 200℃, 2 to 5 min. 80 to 100℃, 5 to 10 min. 150 to 200℃, 5 to 10 min. Solder temp. 270±5℃ Duration 3±0.5 sec. Recovery 24±2 hrs （Standard condition） Note 5 14. Temperature Cycle (Thermal Shock） Specified Value Temperature Compensating（Class1） Standard Appearance : No abnormality Capacitance change : Within ±2. 5% or ±0.25pF, whichever is larger. Q : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality High Frequency Type Appearance : No abnormality Capacitance change : Within ±0.25pF Q : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality High Permittivity （Class2） Note 1 Appearance : No abnormality Capacitance change : Within ±7.5% Dissipation factor : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Test Methods and Remarks Class 1 Class 2 Preconditioning None Thermal treatment （at 150℃ for 1 hr） Note 2 1 cycle Step Temperature（℃） Time（min.）

1 Minimum operating temperature 30±3

2 Normal temperature 2 to 3

3 Maximum operating temperature 30±3

4 Normal temperature 2 to 3

Recovery 6 to 24 hrs （Standard condition） Note 5 24±2 hrs （Stan dard condition） Note 5

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E09R01 15. Humidity （Steady State） Specified Value Temperature Compensating（Class1） Standard Appearance : No abnormality Capacitance change : Within ±5% or ±0.5pF, whichever is larger. Q : C＜10pF : Q≧200＋10C C≧30pF:Q≧350（C：Nominal capacitance） Insulation resistance : 1000 M Ω min. High Frequency Type Appearance : No abnormality Capacitance change : Within ±0.5pF, Insulation resistance : 1000 M Ω min. High Permittivity （Class2） Note 1 Appearance : No abnormality Capacitance change : Within ±12.5% Dissipation factor : 5.0% max. Insulation resistance : 50 M ΩμF or 1000 MΩ whichever is smaller. Test Methods and Remarks Class 1 Class 2 Standard High Frequency Type All items Preconditioning None Thermal treatment（ at 150℃ for 1 hr） Note 2 Humidity 90 to 95%RH 90 to 95%RH Duration 500＋24/－0 hrs 500＋24/－0 hrs Recovery 6 to 24 hrs （Standard condition） Note 5 24±2 hrs （Stan dard condition） Note 5 16. Humidity Loading Specified Value Temperature Compensating（Class1） Standard Appearance : No abnormality Capacitance change : Within ±7. 5% or ±0.75pF, whichever is larger. Q : C＜30pF：Q≧100＋10C/3 C≧30pF：Q≧200 （C：Nominal capacitance） Insulation resistance : 500 M Ω min. High Frequency Type Appearance : No abnormality Capacitance change : C≦2pF：Within ±0.4 pF C＞2pF：Within ±0.75 pF （ C ： N o m i n a l c a p a c i t ance） Insulation resistance : 500 M Ω min. High Permittivity （Class2） Note 1 Appearance : No abnormality Capacitance change : Within ±12.5% Dissipation factor : 5.0% max. Insulation resistance : 25 M ΩμF or 500 MΩ, whichever is smaller. Test Methods and Remarks Class 1 Class 2 Standard High Frequency Type All items Preconditioning None Voltage treatment （Rated voltage are applied for 1 hour at 40℃） Note 3 Humidity 90 to 95%RH 90 to 95%RH Duration 500＋24/－0 hrs 500＋24/－0 hrs Applied voltage Rated voltage Rated voltage Charge/discharge current 50mA max. 50mA max. Recovery 6 to 24 hrs （Standard condition） Note 5 24±2 hrs（Stan dard condition） Note 5

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-E09R01 17. High Temperature Loading Specified Value Temperature Compensating（Class1） Standard Appearance : No abnormality Capacitance change : Within ±3% or ±0.3pF, whichever is larger. Q : C＜10pF： Q≧200＋10C C≧30pF： Q≧350（C：Nominal capacitance） Insulation resistance : 1000 M Ω min. High Frequency Type Appearance : No abnormality Capacitance change : Within ±3% or ±0.3pF, whichever is larger. Insulation resistance : 1000 M Ω min. High Permittivity （Class2） Note 1 Appearance : No abnormality Capacitance change : Within ±12.5% Dissipation factor : 5.0% max. Insulation resistance : 50 M ΩμF or 1000 MΩ, whichever is smaller. Test Methods and Remarks Class 1 Class 2 Standard High Frequency Type BJ, LD(※) C6 B7, C7 Preconditioning None Voltage treatment（Twice the rated voltage shall be applied for 1 hour at 85℃, 105℃ or 125℃） Note 3, 4 Temperature Maximum operating temperature Maximum operating te mperature Duration 1000＋48/－0 hrs 1000＋48/－0 hrs Applied voltage Rated voltage×2 Note 4 Rated voltage×2 Note 4 Charge/discharge current 50mA max. 50mA max. Recovery 6 to 24hr （Standard condition） Note 5 24±2 hrs （Stand ard condition） Note 5 Note: ※LD Low distortion high value multilayer ceramic capacito r Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail. Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kep t at room temperature for 24±2hours. Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and kept at room temperature for 24±2 hours. Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information. Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning m e a s u r e m e n t r e s u l t s , i n o r d e r t o p r o v i d e c o r r e l a t i o n d a ta, the test shall be conducted under the following condition. Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition".

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01 High Reliability Application Multilayer Ceramic Capacitors are noted separately. Precautions on the use of Multilayer Ceramic Capacitors ■PRECAUTIONS 1. Circuit Design Precautions ◆Verification of operating environment, electrical rating and performance 1. A malfunction of equipment in fields such as medical, aerosp ace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications. Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general purpose applications. ◆Operating Voltage （Verifi cation of Rated voltage） 1. The operating voltage for capacitors must always be their rated voltage or less. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less. For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less. 2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage having rapid rise time is used in a circuit. 2. PCB Design Precautions ◆Pattern configurations （D esign of Land-patterns） 1. When capacitors are mounted on PCBs, the amount of solder us ed （size of fillet） can directly affect the capacitor performan ce. Therefore, the following items must be carefully considered in the design of land patterns: （1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper amount of solder. （2）When more than one component are jointly soldered onto the s ame land, each component's soldering point shall be separated b y solder-resist. ◆Pattern configurations （Capacitor layout on PCBs） After capacitors are mounted on boards, they can be subjected t o mechanical stresses in subsequent manufacturing processes （PC B cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors shall be carefully considered to minimize stresses. Technical considerations ◆Pattern configurations （D esign of Land-patterns） The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts. （1）Recommended land dimensions for typical chip capacitors

• Multilayer Ceramic Capacitors : Recommended land dimensions （unit: mm） Wave-soldering Type 107 212 316 325 Size L 1.6 2.0 3.2 3.2 W 0.8 1.25 1.6 2.5 Land patterns for PCBs C B A B Chip capacitor Land pattern Solder-resist L W Chip capacitor Reflow-soldering Type 021 042 063 105 107 212 316 325 432 Note：Recommended land size might be different according to the allowance of the size of the product.
• LWDC: Recommended land dimensions for reflow-soldering （unit: mm） Type 105 107 212 Size L 0.52 0.8 1.25 W 1.0 1.6 2.0 L W LWDC

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01 （2）Examples of good and bad solder application Item Not recommended Recommended Mixed mounting of SMD and leaded components Lead wire of component Solder-resist Component placement close to the chassis Chassis Solder (for grounding) Electrode pattern Solder-resist Hand-soldering of leaded components near mounted components Soldering iron Lead wire of component Solder-resist Horizontal component placement Solder-resist ◆Pattern configurations （Capacitor layout on PCBs） 1-1. The following is examples of good and bad capacitor layout s ; c a p a c i t o r s s h a l l b e l o c a t e d t o m i n i m i z e a n y p o s s i b l e m e c hanical stresses from board warp or deflection. Items Not recommended Recommended Deflection of board Place the product at a right angle to the direction of the anticipated mechanical stress. 1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below. E D C A B Slit Magnitude of stress A＞B＝C＞D＞E Perforation 1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location. 3. Mounting Precautions ◆Adjustment of mounting machine 1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them. 2. Maintenance and inspection of mounting machines shall be conducted periodically. ◆Selection of Adhesives 1. When chips are attached on PCBs with adhesives prior to sold ering, it may cause capacitor characteristics degradation unles s the following factors are appropriately checked : size of land patt erns, type of adhesive, amount applied, hardening temperature a nd hardening period. Therefore, please contact us for further information.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01 Technical considerations ◆Adjustment of mounting machine 1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points shall be considerable. （1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection. （2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads. （3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins sh all be used on the other side of the PCB. The following diagrams show s o m e t y p i c a l e x a m p l e s o f g o o d a n d b a d p i c k - u p n o z z l e placement: Item Improper method Proper method Single-sided mounting chipping or cracking supporting pins or back-up pins Double-sided mounting chipping or cracking supporting pins or back-up pins 2. As the alignment pin is worn out, adjustment of the nozzle h eight can cause chipping or cracking of capacitors because of m echanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted periodically. ◆Selection of Adhesives Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions shall be noted in the application of adhesives. （1）Required adhesive characteristics a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive shall have sufficient strength at high temperatures. c. The adhesive shall have good coating and thickness consistency. d. The adhesive shall be used during its prescribed shelf life. e. The adhesive shall harden rapidly. f. The adhesive shall have corrosion resistance. g. The adhesive shall have excellent insulation characteristics. h. The adhesive shall have no emission of toxic gasses and no effect on the human body. （2）The recommended amount of adhesives is as follows; ［Recommended condition］ Figure 212/316 case sizes as examples a 0.3mm min b 100 to 120 μm c Adhesives shall not contact land Amount adhesive a a b After capacitor are bonded c c 4. Soldering Precautions ◆Selection of Flux Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; （1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equi valent） of halogenated content. Flux having a strong acidity co ntent shall not be applied. （2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level. （3）When water-soluble flux is used, special care shall be taken to properly clean the boards. ◆Soldering Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions. Sn-Zn solder paste can adversely affect MLCC reliability. Please contact us prior to usage of Sn-Zn solder. Technical considerations ◆Selection of Flux 1-1. When too much halogenated substance（Chlorine, etc.） conten t is used to activate flux, or highly acidic flux is used, it m ay lead to corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors. 1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolve d in moisture in the air, the residues on the surfaces of capac itors in high humidity conditions may cause a degradation of insulation resis tance and reliability of the capacitors. Therefore, the cleanin g methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01 ◆Soldering ･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. ･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive t hermal shock. ･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 130℃. ･ Cooling : The temperature difference between the capacitors a nd cleaning process shall not be greater than 100℃. ［Reflow soldering］ 【Recommended conditions for eutectic soldering】 Preheating 230℃ Within 10sec. Slow cooling 60sec. Min. 60sec Min. 300 200 100 Temperature（℃） 【Recommended condition for Pb-free soldering】 Peak 260℃ Max. Within 10sec. Slow cooling Heating above 230℃ 40sec. Max. 300 200 100 Temperature（℃） Preheating150℃ 60sec. Min. Caution ①The ideal condition is to have solder mass（fillet）controlled t o 1/2 to 1/3 of the thickness of a capacitor. ②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as close to recommended times as possible. soldering for 2 times. 1/2T～1/3T PC board Solder Capacitor T ［Wave soldering］ 【Recommended conditions for eutectic soldering】 230～250℃ Within 3sec. Slow cooling Preheating 120sec. Min. 300 200 100 Temperature（℃） 【Recommended condition for Pb-free soldering】 Peak 260℃ Max. Within 10sec. Slow cooling 120sec. Min. 300 200 100 Temperature（℃） Preheating 150℃ Caution ①Wave soldering must not be applied to capacitors designated as for reflow soldering only. soldering for 1 times. ［Hand soldering］ 【Recommended conditions for eutectic soldering】 230～280℃ Within 3sec. Slow cooling Preheating 60sec. Min. 400 200 100 Temperature（℃） 300 【Recommended condition for Pb-free soldering】 Peak 350℃ Max. Within 3sec. Slow cooling 400 200 100 Temperature（℃） Preheating 150℃ Min. 60sec. Min. 300 316type or less ⊿T≦150℃ Peak 280℃ Max. Within 3sec. Slow cooling⊿T 400 200 100 温度（℃） Preheating 150℃ Min. 60sec. Min. 300 325type or more ⊿T≦130℃ Caution ①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm. ②The soldering iron shall not directly touch capacitors. soldering for 1 times.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-E08R01 5. Cleaning Precautions ◆Cleaning conditions 1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning. （e.g. to remove soldering flux or other materi als from the production process.） 2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics. Technical considerations 1. The use of inappropriate cleaning solutions can cause foreig n substances such as flux residue to adhere to capacitors or de teriorate their outer coating, resulting in a degradation of the capacitor's electrical properties （esp ecially insulation resistance）. 2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the capacito rs. In the case of ultrasonic cleaning, too much power output can c ause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked; U l t r a s o n i c o u t p u t : 2 0 W / ℓ o r l e s U l t r a s o n i c f r e q u e nc y : 4 0 k H z o r l e s s Ultrasonic washing period : 5 min. or less 6. Resin coating and mold Precautions 1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than capacito r's operating temperature, the stresses generated by the excess ive heat may lead to damage or destruction of capacitors. The use of such resins, molding materials etc. is not recommended. 7. Handling Precautions ◆Splitting of PCB 1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board. 2. Board separation shall not be done manually, but by using the appropriate devices. ◆Mechanical considerations Be careful not to subject capacitors to excessive mechanical shocks. （1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used. （2）Please be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Precautions ◆Storage 1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. ・Recommended conditions Ambient temperature : Below 30℃ Humidity : Below 70% RH The ambient temperature must be kept below 40℃. Even under idea l storage conditions, solderability of capacitor is deteriorated as time passes, so capacitors shall be used within 6 months from the time of delivery. ・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air. 2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to design circuits. Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour. Technical considerations If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the capacitors. ※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA. Please check the guide regarding precautions for deflection te st, soldering by spot heat, and so on.