VPX3-TL ELMA | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 3
Technical content
Features
W-11865MRE Processor Blade
- Intel Xeon W-11865MRE processor (formerly Tiger Lake-H); up to 8 cores with 45 watt TDP
- SOSA-aligned and VITA 46/47/48/65 compliant for quick deployment
- 32GB DDR4-2666 soldered ECC SDRAM (roadmap to 64GB)
- Supports NVMe and SATA SSD by BOM option, up to 1TB
- One XMC expansion slot with PCIe x8 Gen3 (according to product SKU)
- Ethernet connectivity: 1x 2.5GBASE-T to P2; 2x 10GBASE-KR to P1; optional 2x 1GBASE-KX to P1
- 1x DisplayPort to P2, supports DP++ with resolution up to 8K/60Hz Specifications VPX3-TL Series Processor & System CPU Intel Xeon W-11865MRE processor (formerly Tiger Lake-H) Up to 8 cores (TDP 45W) Chipset Intel RM590E Chipset Memory 32GB DDR4 soldered with ECC (roadmap to 64GB) BIOS Dual 256Mbit SPI flash VITA Standards VITA 46/48/65 compliant SOSA aligned Module Profile MOD3-PAY-1F1F2U1TU1T1U1T-16.2.15-2 Slot Profile SLT3-PAY-1F1F2U1TU1T1U1T- 14.2.16 Connectivity XMC 1x PCIe x8 Gen3 to J15 Rear I/O (X16s+X8d) to P2 and X12d to P1 from J16 Supports +5V or +12V PWR by BOM option (default is +5V) Supports XMC 1.0 & 2.0 connector according to product SKU Dataplane 1x PCIe Gen3.0 x4 to P1 (Lane 0-3) Expansion Plane 1x PCIe Gen3.0 x4 to P1 (Lane 4-7) Control Plane 2x 10GBASE-KR to P1 (default) 2x 1GBASE-KX to P1 (BOM option) Supports IOL/SOL New
www.adlinktech.com Specifications User Defined 1x PCIe Gen3.0 x8 to P1 Lane 0-7 by BIOS menu selection Ethernet 1x 2.5GBASE-T to P2 Supports PXE Supports Wake-On-LAN (WOL) Video 1x DisplayPort to P2 Supports DP++ Resolution up to 8K @60Hz Display mode selection via BIOS USB 2x USB 2.0 to P2 1x USB 3.2 Gen1 to P2 Supports USB 3.0 power to P1/G7 (supply 0.9A) with overcurrent protection Supports USB 2.0 power to P2/G9 (supply 0.5A) with overcurrent protection Serial Ports COM2: RS-232/422/485 to P2 (RS-232 is 2-wire) Max. data rate for RS-232/422/485 is 115200bps RS-485 supports auto flow control RS-232/422/485 mode configuration via BIOS Maintenance COM1: 2-wire TX/RX on P1 Console Port Supports TIA-232 & LVCOMS (3.3V), mode configuration via BIOS PCIe 2x PCIe Gen3.0 x4 co-layout with XMC x8d+X16s (on P2) PCIe NT function not supported GPIO 1x GPIO to P1, 3x GPIO to P2 Supports +3.3V (default) or +5V GPIO by BOM option GPI with edge trigger or level trigger interrupt Storage SATA 1x SATA 6Gb/s to P2 M.2 1x M.2 2242 on top side (M-key) Supports interface: PCIe3.0 x4 and SATA3.0 Supports module height: S1, S2, D1, D2 (D2 is default) Security TPM Discrete TPM 2.0 chip BIOS Dual BIOS support Operating System OS Windows 10 IoT Enterprise LTSC 21H2 Linux (Kernel >5.13, RHEL >8.3) Miscellaneous LEDs Blade status LEDs on front and rear Reset Button Reset Button on front panel Maskrest button reserved on RTM Mechanical & Environmental Form Factor 3U VPX, conduction-cooled construction, 1” pitch (VITA 48.1) Operating Temp. -40°C to +85°C at wedge locks (VITA 47.0, ECC4-CC4) Storage Temp -55°C to +105°C Vibration Random: 12Grms, 5Hz to 2000Hz (VITA 47.0, ECC4-V3) Sinusoidal: 5g, 20Hz to 2000Hz Shock 40g, 11 ms (VITA 47.0, ECC4-OS2) Relative Humidity 95% non-condensing Altitude 60,000 ft. (operating) Safety & EMI Certifications CE (EN555032 / EN55035); FCC Part 15B Class A
All products and company names listed are trademarks or trade names of their respective companies. ©2023 ADLINK Technology, Inc. All Rights Reserved. All pricing and specifications are subject to change without further notice. www.adlinktech.com
Ordering Information
VPX3-TL/W-11865MRE/M32/ 3U VPX CPU blade with Intel Xeon W-11865MRE, DDR4 32GB, XMC 1.0 slot, conformal XMC1.0-R2, ETT, CC coating & ETT, -40°C to +85°C, conduction-cooled VPX3-TL/W-11865MRE/M32/ 3U VPX CPU blade with Intel Xeon W-11865MRE, DDR4 32GB, XMC 2.0 slot, conformal XMC 2.0-R2, ETT, CC coating & ETT, -40°C to +85°C, conduction-cooled VPX3-TL/W-11865MRE/M32/ 3U VPX CPU blade with Intel Xeon W-11865MRE, DDR4 32GB, without XMC slot, conformal P16-R2, ETT, CC coating & ETT, -40°C to +85°C, conduction-cooled Backplane tBP-VPX3-TL/XMC Backplane for VPX3-TL with XMC tBP-VPX3-TL/2xP4 Backplane for VPX3-TL with 2x PCIe x4 VPX3-TL Block Diagram eSPI UARTD (COM4) UARTC (COM3) UARTB (COM2)RS-232/422/485 RS-232 SPI PCIe x4 Gen3 PCIe x8 Gen3 GPIO[2:4] XMC J16 XMC J16 XMC J15 GbE Intel® X710 GbE Intel® I225 EC IPMC IPMC SIO IPMC Transceiver BIOS 1 BIOS 2 M.2 2242 M-key DDR4 3200 16GB max ECC DDR4 3200 16GB max ECCDDR4 Ch A DDR4 Ch B DMI DisplayPort X16s X8d PCIe x4 Gen3 2x USB 2.0 1x USB 3.2 Gen1 2500BASE-T PCIe x1 Gen3 PCIe x4 Gen3 PCIe x4 Gen3 PCIe x4 Gen3 X12d 2x 10GBASE-KR Maintenance Port (COM1) SATA 6GB/s IPMB NVMe GPIO1 DP_CONFIG LPC Intel® RM590E Chipset Intel® Xeon® W-11000E Series (Tiger Lake-H) TPM MUX eSPI to LPC EC