VPB7XMSD

VPB7XMSD ELMA | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 2

Technical content

Concurrent Technologies Plc 4 Gilberd Court, Colchester, Essex, CO4 9WN, UK Tel: +44 (0)1206 752626 Concurrent Technologies Inc. 400 West Cummings Park, Suite 1300, Woburn, MA 01801, USA Tel: (781) 933 5900 email:info@gocct.com www.gocct.com All companies and product names are trademarks of their respective organizations. Specification subject to change; E and OE. VME VP B7x/msd N, E, K - Series VME board based on Intel® Xeon® processor Bat PMC/XMC2 Front I/O 1 x RS232 2 x RS232/ RS422/485 x8 or 2 x4 1 x Gigabit Ethernet 2 x SATA 300 TPM 2 x Gigabit Ethernet (VITA 31.1 or via RTM) 1 x USB 2.0 Intel I350-AM4 8 x GPIO up to 2 x Ethernet 10/100/1000Mbps P14:P64s Board Logic 2 x USB2.0 1 x DVI-D 4 x GPIO 2 x USB

2.0 Optional

(Option 0 CoDeC Line In Line Out Mic In Hph Out 1 x USB 3.1 1 x USB 2.0 1 x USB3.1/2.0 USB3.1 USB2.0 1 x DVI-D 1 x DisplayPort DDR4 ECC DRAM Build Option P16:X12d+X8d+X10s XMC PMC PCI-X 100 2 x SATA 300 XMC PMC/XMC1 Front I/O PMC P16 P14 Universe II VME Universe II Byte Swap PCIe to PCI Bridge PCIe to PCI-X Bridge 2 x SATA600 2 x UEFI BIOS 8 4 Build option for Busless VME 1 x VGA D SPI DeDP to VGA LPC PMC\\XMC2 or 2xUSB, 1xDP, 1xGigE Optional P0 Option 1 Option 2()Option 0 or or Option 1 = Analog Audio, 1x DVI-D, 2x USB 2.0, 2x SATA300 Option 2 = a (Dual PMC/XMC)Analog Audio, 1x DVI-D, 1x DVI-D, 4x GPIO, 1x GigE Option 2 = b Analog Audio, 1x DVI-D, 1x DVI-D, 4x GPIO (Single PMC/XMC) Option = 0 P16: X12d + X8d x X10s or Option 1 Option 2or ) DMI 3.0 Key Features VP B7x/msd is a high performance, flexible VMEbus board based on a 6 -core Intel ® Xeon® processor E -2176M (formerly known as Coffee Lake-H). It is designed for long life-cycle applications in the defense, industrial, scientific and aerospace markets.  Six-core processor and up to 32 Gbytes DDR4 DRAM for high performance applications  Dual or single PMC/XMC sites for local expansion  Wide variety of I/O interfaces including SATA, USB, Ethernet, graphics and serial  Direct attached storage options suitable for operating system, application and data use  Board support packages for Linux®, Windows® and VxWorks®  Option to exclude VMEbus interface is available

Please contact your local Concurrent Technologies sales office for further details on board build options and accessories. Datasheet Code 1801/0720 © Concurrent Technologies 2020 VME Embedded Computer Board  air-cooled 6U VME computing board utilizing an Intel® Xeon® processor (coded Coffee Lake)  single or dual XMC sites (build options)  optional Rear Transition Module (RTM)  rugged conduction-cooled (RCx-Series) versions:  see VP B7x/msd-RC datasheet Central Processor  6-core Intel® Xeon® processor E-2176M:  12 Mbytes Smart Cache, 2.7 GHz (45W)  Intel® UHD Graphics 630  range of performance/power factory build options  utilizes the Intel® CM246 Platform Controller Hub DRAM  16 or 32 Gbytes soldered DDR4 ECC DRAM:  single bit error correction  dual channel architecture  accessible from processor or VME bus PMC/XMC Interfaces  single or dual PMC/XMC interfaces  PMC/XMC I/O site 1:  front panel I/O  PMC P14 rear I/O (P64s) via P2  XMC P16 rear I/O (X12d+X8d+X10s) via optional P0 (build option 0)  PMC/XMC I/O site 2 (or additional front I/O):  front panel I/O: option for PMC/XMC site or extra front panel I/O connectors (USB 3.1/2.0 and Gigabit Ethernet interfaces)  rear I/O: none  PMC PCI/PCI-X interfaces:  32/64-bit, 33/66 MHz PCI bus  64-bit PCI-X bus up to 100 MHz  5V and 3.3V signaling  XMC PCI Express interfaces:  both support x8 PCI Express (Gen 1, Gen 2)  XMC site 1 can also support 2 x4 PCI Express  both powered from 5V supply Ethernet Interfaces  up to 4 x Gigabit Ethernet interfaces:  implemented by an Intel® I350-AM4 LAN controller via a x2 PCI Express® port (Gen 2)  1 x Gigabit Ethernet interface via front panel RJ45  2 x Gigabit Ethernet interfaces via optional P0:  via P0 to optional RTM or utilize VITA 31.1 (Gigabit Ethernet for VME64x backplanes)  1 x Gigabit Ethernet interface as a build option:  via P0 (build option 2a only)  or via front panel RJ45 (build option 2b only) (disables PMC/XMC site 2):  on-board magnetics (50V isolation via P0) Serial Interfaces  3 x serial channel interfaces:  1 x RS232 accessed via 60-way high density connector on front panel  2 x RS232/422/485 accessed via P2  16550 compatible UARTs Mass Storage Interfaces  up to 4 x external SATA300 interfaces:  2 x SATA via P2  2 x SATA (build option 1) via optional P0  1 x M.2 SSD site for optional on-board supporting:  Type 2242, 2260 or 2280 device  x4 PCIe interface (M-key)  NVM Express® (NVMe™) logical device interface  NVMe 1.3 compatible  device can be fitted simultaneously with PMC/XMC modules fitted  2242 device can be fitted with 2.5-inch SATA drive fitted  2 x SATA600 interfaces for optional on-board:  SATA Flash Drive Module  2.5-inch SATA drive (disables PMC/XMC Site 2) Stereo Audio  Intel® High Definition Audio interface with CoDeC (build options 1 & 2) via optional P0:  line level stereo input and output  line level microphone input  headphone output Graphics Interfaces  1 x DVI-D interface (build option 1) or 2 x DVI-D interfaces (build option 2) via optional P0:  up to 1920 x 1200 @ 16M colors  1 x DisplayPort® V1.2 interface via 60-way high density connector on front panel:  up to 1920 x 1200 @ 60Hz  resolution is dependent on the device driver  1 x VGA interface (build option) via P2:  up to 1920 x 1200 @ 16M colors  embedded DisplayPort to VGA converter  support for Microsoft® DirectX 12, OpenGL 4.5 under Windows® and Linux® and OpenCL 2.1 Other Peripheral Interfaces  PC Real Time Clock  watchdog timer; 32-bit Long Duration Timer with processor interrupt ability; chipset timer  3 x USB 2.0 ports:  2 x USB 2.0 via 60-way connector on front panel  1 x USB 2.0 via P2  up to 4 x USB ports accessed via optional P0  1 x USB 2.0 port and 1 x USB 3.1 (Gen 1) port  2 x USB 2.0 ports (build option 1)  option for 1 x USB 3.1 (Gen 1) and USB 2.0 ports accessed via USB connector on front panel (disables PMC/XMC site 2)  8 x GPIO signals via P2 plus 4 x GPIO signals (build option 2) via optional P0:  supports processor interrupt capability  Write Protect (build option 2) and External Reset (build option 2) via optional P0 Flash EPROM  32 Mbytes of BIOS Flash EPROM, dual devices:  main/backup device enabled via switch Software Support  support for Linux®, Windows® and VxWorks® Board Security Packages  Trusted Platform Module (TPM 2.0)  option for Sanitization Utility Software Package  option for proprietary board-level security features Firmware Support  UEFI 2.7 boot firmware (BIOS):  implements Secure Boot  implements Intel® Boot Guard  optional Fast Boot solution using the Intel® Firmware Support Package (FSP)  LAN boot firmware included Optional Built-In Test (BIT) Support  Power-on BIT (PBIT), Initiated BIT (IBIT), Continuous BIT (CBIT) Safety  PCB (PWB) manufactured with flammability rating of UL94V-0 VME Interface  P1 and P2 connectors compatible with VME64x  implemented using IDT® Universe™ II device  VME Master/Slave  A32/A24/A16/D64/D32/D16/D8(EO)/MBLT  fast hardware byte swapping  auto system controller detect  full interrupter / interrupt handler support  bus error interrupt support  build option for busless VME interface:  SYSRESET, SYSFAIL, ACFAIL, GAx  VMEbus daisy chain Electrical Specification  typical current figure for processor (45W) with 16 Gbytes DRAM:  +5V @ 6.7A  +12V @ 0.0A; -12V @ 0.0A; 3.3V not required  +12V and -12V routed to both PMC/XMC sites Environmental Specification  operating temperature:  0°C to +55°C (N-Series)  extended operating temperatures based upon processor’s performance/power factory build option:  -25°C to +70°C (E-Series)  -40°C to +70°C (K-Series)  -40°C to +85°C (K-Series)  non-operating temperature: -40°C to +85°C  5% to 95% Relative Humidity, non-condensing:  K-Series includes humidity sealant Mechanical Specification  6U form-factor  single slot, width 0.8-inch (20.3mm)  utilizes 160-way connectors for P1 and P2  optional P0 connector  IEEE 1101.10 VME64x handles, alternatively with option for VME32 handles  shock: 20g, 11ms, ½ sine  vibration: 5Hz-2000Hz at 2g, 0.38mm peak displacement Legacy Board Compatibility  VP B7x/msd rear plug compatibility with the popular VP B1x/msd and VP 92x/x1x families Note: unless otherwise stated I/O interface references to “build option 2” means both build option 2a and build option 2b are supported. See block diagram for details.