VP3225K101R030

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 14

Technical content

1© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 One world. One KEMET Benefits

• S urface mount form factor
• Operating ambient temperature of −40°C to +85°C O perating voltage range of 14 to 385 VDC O perating voltage (Vrms) of 11 V to 300 V A vailable case sizes: 3255 and 4032 D imensional and weight savings on the board
• Non-flammable thermoplastic encapsulation according to th e standard UL 94 V-0 U L 1449, 3rd edition and CSA C22.2. File E326499 Section 3 R oHS 2 2011/65/EC, REACH compliant Overview KEMET's VP series of low and medium voltage plastic- encapsulated varistors are designed to protect electronic equipment against high voltage surges in the low and medium voltage region. They offer direct surface mount equivalents to leaded disc varistors of 5 and 7 mm sizes. The thermoplastic encapsulation is non-flammable accor ding to the standard UL 94 V-0. Contacts are made of tinned copper sheet. These transient voltage suppressors cover an operating voltage Vrms from 11 V to 300 V , featuring maximum surge currents from 100 A to 1,200 A.

Applications

Typical applications include medical instruments, integrated circuits and transistors, mobile communication, white goods, entertainment electronics, lighting ballast, as well as protection of low and medium voltage boards, remote control and electrical counters and applications that are exposed to humidity. Surface Mount Varistors VP Series Plastic Encapsulated 85°C

2© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C

Ordering Information

Size Code Tolerances Rated Peak Single Pulse Transient Current (A) Packaging/ Termination Maximum Continuous Working Voltage (Vrms AC) Varistor SMD 85°C Plastic Encapsulated 3225 = 3225 4032 = 4032 K = 10% 101 = 100 251 = 250 401 = 400 122 = 1,200 (First two digits represent significant figures. Third digit s pecifies number of zeros.) R = Reel 330 mm 011 = 11 014 = 14 017 = 17 020 = 20 025 = 25 030 = 30 035 = 35 040 = 40 050 = 50 060 = 60 075 = 75 095 = 95 115 = 115 130 = 130 140 = 140 150 = 150 175 = 175 230 = 230 250 = 250 275 = 275 300 = 300 Dimensions – Millimeters t WL 1.5±0.3 3.0±0.3 h Size Code Voltage range V L ±0.5 mm W ±0.4 mm h ±0.3 mm t ±0.3 mm 3225 11 – 150 8.0 6.3 1.7 3.4 3225 175 – 300 8.0 6.3 2.3 4.7 4032 11 – 300 10.0 8.0 2.3 4.7

3© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C Environmental Compliance RoHS 2 2011/65/EC, REACH Performance Characteristics Continuous Units Value Steady State Applied Voltage DC Voltage Range (V dc) V 14 to 385 AC Voltage Range (V rms) V 11 to 300 Transient Non-Repetitive Surge Current, 8/20 µs Waveform (I max) A 100 to 1200 Non-Repetitive Surge Energy, 10/1000 µs Waveform (W max) J 0.6 to 30 Operating Ambient Temperature °C −40 to +85 Storage Temperature °C −40 to +125 Threshold Voltage Temperature Coefficient %/°C < 0.05 Response Time ns < 5 Climatic Category 40/85/56 Qualifications Reliability Parameter Test Tested According to Condition to be Satisfied after Testing AC/DC Bias Reliability AC/DC Life Test CECC 42200, Test 4.20 or IEC 1051–1, Test 4.20. AEC–Q200 Test 8 – 1,000 hours at UCT |δVn (1 mA)| < 10 % Pulse Current Capability Imax 8/20 µs CECC 42200, Test C 2.1 or IEC 1051–1, Test 4.5. 10 pulses in the same direction at 2 pulses per minute at maximum peak current for 10 pulses Vn (1 mA)| < 10 % no visible damage Pulse Energy Capability Wmax 10/1,000 µs CECC 42200, Test C 2.1 or IEC 1051–1, Test 4.5. 10 pulses in the same direction at 1 pulses every 2 minutes at maximum peak current for 10 pulses Vn (1 mA)| < 10 % no visible damage WLD Capability WLD x 10 ISO 7637, Test pulse 5, 10 pulses at rate 1 per minute |δVn (1 mA)| < 15 % no visible damage Vjump Capability Vjump 5 min Increase of supply voltage to V ≥ Vjump for 1 minute |δVn (1 mA)| < 15 % no visible damage

4© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C Qualifications cont'd Reliability Parameter Test Tested According to Condition to be Satisfied after Testing Environmental and Storage Reliability Climatic Sequence CECC 42200, Test 4.16 or IEC 1051–1, Test 4.17. a) Dry heat, 16 hours, UCT, Test Ba, IEC 68–2–2 Damp heat, cyclic, the first cycle: 55°C, RH, 4 hours, Test Db 68–2–4 c) Cold, LCT, 2 hours Test Aa IEC 68–2–1 Damp heat cyclic, remaining cycles: 55°C, R H, 24 hour/cycle, Test Bd, IEC 68–2–30 |δVn (1 mA)| < 10 % Thermal Shock CECC 42200, Test 4.12, Test Na, IEC 68–2–14, AEC–Q200 Test 16, 5 cycles UCT/LCT, 30 minutes |δVn (1 mA)| < 10 % no visible damage Steady State Damp Heat CECC 42200, Test 4.17, Test Ca, IEC 68–2–3, AEC–Q200 Test days, 40°C, 93% RH. AEC–Q200 T est7: Bias, Rh, T all at 85. |δVn (1 mA)| < 10 % Storage Test IEC 68–2–2, Test Ba, AEC–Q200 Test 3, 1,000 hours at maximum storage temperature Vn (1 mA)| < 5 % Mechanical Reliability Solderability CECC 42200, Test 4.10.1, Test Ta IEC 68–2–20 solder bath and reflow method Solderable at shipment and after 2 year of storage, criteria > 95% must be covered by solder for reflow m eniscus Resistance to Soldering Heat CECC 42200, Test 4.10.2, Test Tb, IEC 68–2–20 solder bath and reflow method |δVn (1 mA)| < 5 % Terminal Strength JIS–C–6429, App. 1, 18N for 60 seconds – same for AEC–Q200 Test 22 no visual damage Board Flex JIS–C–6429, App. 2, 2 mm minimum AEC–Q200 test Board flex: mm flex minimum |δVn (1 mA)| < 2 % no visible damage Vibration CECC 42200, Test 4.15, Test Fc, IEC 68–2–6, AEC– Q200 Test 14. Frequency range 10 to 55 Hz (AEC: 10 – 2,000 Hz) Amplitude 0.75 m/s2 or 98 m/s2 (AEC: 5 g's for 20 minutes) Total duration 6 hours (3x2h) (AEC: 12 cycles each of 3 directions) Waveshape – half sine Vn (1 mA)| < 10 % no visible damage Mechanical Shock CECC 42200, Test 4.14, Test Ea, IEC 68–2–27, AEC–Q200 Test 13. Acceleration = 490 m/s2 (AEC: MIL-STD–202–Method 213), Pulse duration = 11 ms, Waveshape – half sine; Number of shocks = 3x6 Vn (1 mA)| < 10 % no visible damage Electrical Transient Conduction ISO–7637–1 Pulses AEC–Q200 Test 30: Test pulses 1 to 3. Also other pulses – freestyle. Vn (1 mA)| < 10 % no visible damage

5© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C Table 1 – Ratings & Part Number Reference KEMET Part Number h ±0.3 (mm) L ±0.5 (mm) W ±0.4 (mm) t ±0.3 (mm) Vrms VDC Vn 1 mA Vc Ic Wmax 10/1,000 µs (J) Pmax (W) Imax 8/20 µs (A) Ctyp at 1 kHz (pF) KEMET Part Number h ±0.3 mm L ±0.5 mm W ±0.4 mm t ±0.3 mm Vrms V Vdc V Vn 1 mA V Vc V Ic A Wmax 10/1,000 µs J P max W Imax 8/20 µs A Ctyp @ 1 kHz pF

6© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C Soldering Popular soldering techniques used for surface mounted components are Wave and Infrared Reflow processes. Both processes can be per formed with Pb-containing or Pb-free solders. The termination option available for these soldering techniques is Barrier Type End Terminations. End Termination Designation Recommended and Suitable for Component RoHS Compliant Ni Sn Barrier Type End Termination Ni R1 Pb-containing and Pb-free soldering Yes Wave Soldering – this process is generally associated with discrete components mounted on the underside of printed circuit boards, or for large top-side components with bottom-side mounting tabs to be attached, such as the frames of transformers, relays, connectors, etc. SMD varistors to be wave soldered are first glued to the circuit board, usually with an epoxy adhesive. When all components on the PCB ha ve been positioned and an appropriate time is allowed for adhesive curing, the completed assembly is then placed on a conveyor and run through a single, double wave process. Infrared Reflow Soldering these reflow processes are typically associated with top-side component placement. This technique utilizes a mixture of adhesive and solder compounds (and sometimes fluxes) that are blended into a paste. The paste is then screened onto PCB soldering pads specifically designed to accept a particular sized SMD component. The recommended solder paste wet layer thickness is 100 to 300 µm. Once the circuit board is fully populated with MD components, it is placed in a reflow environment, where the paste is heated to slightly above its eutectic temperature. When the solder paste reflows, the SMD components are attached to the solder pads. Solder Fluxes solder fluxes are generally applied to populated circuit boards to clean oxides forming during the heating process and to facilitate the flowing of the solder. Solder fluxes can be either a part of the solder paste compound or can be separate materials, usually fluids. Recommended fluxes are: non-activated (R) fluxes, whenever possible mildly activated (RMA) fluxes of class L3CN

• class ORL O Activ ated (RA), water soluble or strong acidic fluxes with a chlorine content 0.2 wt. are NOT RECOMMENDED. The use of such fluxes could cr eate high leakage current paths along the body of the varistor components. When a flux is applied prior to wave soldering, it is important to completely dry any residual flux solvents prior to the soldering process. Thermal Shock – to avoid the possibility of generating stresses in the varistor chip due to thermal shock, a preheat stage to within 100 of the peak soldering process temperature is recommended. Additionally, SMD varistors should not be subjected to a temperature gr adient greater than °C/sec., with an ideal gradient being °C/sec. Peak temperatures should be controlled. Wave and Reflow soldering conditions for SMD varistors with Pb-containing solders ar e shown in Fig. and r espectively, while W ave and Reflow soldering conditions for SMD v aristors with Pb-free solders are shown in Fig, 1 and 3

7© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C Soldering cont'd Whenever several different types of SMD components are being soldered, each having a specific soldering profile, the soldering profile with the least heat and the minimum amount of heating time is r ecommended. Once soldering has been completed, it is necessary to minimize the possibility of thermal shock by allowing the hot PCB to cool to less than before cleaning. Inspection Criteria the inspection criteria to determine acceptable solder joints, when Wave or Infrared Reflow processes are used, will depend on several key variables, principally termination material process profiles. Pb-contining Wave and IR Reflow Soldering – typical “before” and “after” soldering results for Barrier Type End Terminations can be seen in Fig. 4. Barrier type terminated varistors form a reliable electrical contact and metallurgical bond between the end terminations and the solder pads. The bond between these two metallic surfaces is exceptionally strong and has been tested by both vertical pull and lateral (horizontal) push tests. The results exceed established industry standards for adhesion. The solder joint appearance of a barrier type terminated varistor shows that solder forms a metallurgical junction with the thin tin-alloy (over the barrier layer), and due to its small volume “climbs” the outer surface of the terminations, the meniscus will be slightly lower. This optical appearance should be taken into consideration when programming visual inspection of the PCB after soldering. Ni Sn Barrier Type End Terminations Fig. 4 – Soldering Criterion in case of Wave and IR Reflow Pb-containing Soldering Pb-fr ee Wave and IR Reflow Soldering – typical “before” and “after” soldering results for Barrier Type End Terminations are given in a phenomenon knows as “mirror” or “negative” meniscus. Solder forms a metallurgical junction with the entire volume of the end termination, i.e. it diffuses from pad to end termination across the inner side, forming a “mirror” or “negative” meniscus. The height of the solder penetration can be clearly seen on the end termination and is always 30% higher than the chip height.

8© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C Soldering cont'd Solder Test and Retained Samples – reflow soldering test based on J-STD-020D.1 and soldering test by dipping based on IEC 60068- 2 for Pb-free solders are preformed on each production lot as shown in the following chart. Test results and accompanying samples are retained for a minimum of two (2) years. The solderability of a specific lot can be checked at any time within this period should a cust omer require this information. Test Resistance to Flux Solderability Static leaching (Simulation of Reflow Soldering) Dynamic Leaching (Simulation of Wave Soldering) Parameter Soldering method dipping dipping dipping dipping with agitation Flux L3CN, ORL0 L3CN, ORL0, R L3CN, ORL0, R L3CN, ORL0, R Pb Solder 62Sn/36Pb/2 Ag Pb S oldering t emperature ( °C) 235±5 235±5 260±5 235±5 Pb-FREE Solder Sn96/Cu0,4–0,8/3–4Ag Pb-FREE Soldering Temperature (°C) 250±5 250±5 280±5 250±5 Soldering Time (s) 2 210 10 > 15 Burn-in Conditions VDCmax, 48 h Acceptance Criterion dVn < 5 %, idc must stay unchanged > 95 % of end termination must be covered by solder > 95 % of end termination must be intact and covered by solder > 95 % of end termination must be intact and covered by solder Rework Criteria Soldering Iron – unless absolutely necessary, the use of soldering irons is NOT recommended for reworking varistor chips. If no other means of rework is available, the following criteria must be strictly followed:

• Do not allow the tip of the iron to directly contact the top of the chip Do not exceed the following soldering iron specifications: Output P ower: 30 W atts maximum Temperature of Soldering Iron Tip: 280°C maximum Soldering Time:

10 Seconds maximum

orage Conditions – SMD varistors should be used within 1 year of purchase to avoid possible soldering problems caused by oxidized terminals. The storage environment should be controlled, with humidity less than 40% and temperature between -25 and °C. Varistor chips should alwa ys be stored in their original packaged unit.

9© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C Soldering Pad Configuration t WL 1.5±0.3 3.0±0.3 h B C B A D A Size Voltage range V L ±0.5 mm W ±0.4 mm h ±0.3 mm t ±0.3 mm A (mm) B (mm) C (mm) D (mm) Packaging Voltage Range (V) Chip Size 3225 4032 Reel Size 330 330 < 175 1500 1000 > 175 1000 1000

10© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C Construction Current Below 50 V Detailed Cross SectionMolded Epoxy Case Molded Epoxy Case Ag Electrode Ag Electrode ZnO Layer Glass Passivation Termination (Ag/Pd, Ni/Sn) Termination (Ag/Pd, Ni/Sn) Current Equal or Greater than 50 V Molded Epoxy Case Molded Epoxy Case Glass Passivation Termination (Ag/Pd, Ni/Sn)

11© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C Marking Tradename Series Name Model Size Vn Tolerance Vrms

12© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C Taping & Reel Specifications Tape Size (mm) 16 mm 3225 4032 Ao 7.8 10.8 Bo 3.7 3.7 Ko Maximum 12.1 12.1 B1 Maximum 1.5 1.5 D1 Minimum 14.25 14.25 E2 Minimum 12 12 P1 7.5 7.5 F 16.0 16.0 W 9.5 9.5 T2 Maximum 16.4+2 16.4+2 W1 12.4+2 12.4+2 W2 Maximum 22.4 22.4 A 330 330

13© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C Terms and Definitions Term Symbol Definition Rated AC Voltage Vrms Maximum continuous sinusoidal AC voltage (<5% total harmonic distortion) which may be applied to the component under continuous operation conditions at 25°C Rated DC Voltage Vdc Maximum continuous DC voltage (<5% ripple) which may be applied to the component under continuous operating conditions at 25°C Supply Voltage V The voltage by which the system is designated and to which certain operating characteristics of the system are referred; V rms = 1,1 x V Leakage Current Idc The current passing through the varistor at Vdc and at 25°C or at any other specified temperature Varistor Voltage Vn Voltage across the varistor measured at a given reference current In Reference Current In Reference current = 1 mA DC Clamping Voltage Protection Level Vc The peak voltage developed across the varistor under standard atmospheric conditions, when passing an 8/20 μs class current pulse Class Current Ic A peak value of current which is 1/10 of the maximum peak current for 100 pulses at two per minute for the 8/20 μs pulse Voltage Clamping Ratio Vc/Vapp A figure of merit measure of the varistor clamping effectiveness as defined by the symbols Vc/Vapp, where (Vapp = Vrms or Vdc) Jump Start Transient Vjump The jump start transient resulting from the temporary application of an overvoltage in excess of the rated battery voltage. The circuit power supply may be subjected to a temporary overvoltage condition due to the voltage regulation failing or it may be deliberately generated when it becomes necessary to boost start the car Rated Single Pulse Transient Energy Wmax Energy which may be dissipated for a single 10/1000 μs pulse of a maximum rated current, with rated AC voltage or rated DC voltage also applied, without causing device failure Load Dump Transient WLD Load Dump is a transient which occurs in an automotive environment. It is an exponentially decaying positive voltage which occurs in the event of a battery disconect while the alternator is still generating charging current with other loads remaining on the alternator circuit at the time of battery disconect Rated Peak Single Pulse Transient Current Imax Maximum peak current which may be applied for a single 8/20 μs pulse, with, rated line vo ltage also applies, without causing device failure Rated Transient Average Power Dissipation P Maximum average power which may be dissipated due to a group of pulses occurring within a specified isolated time period, without causing device failure at 25°C Capacitance C Capacitance between two terminals of the varistor measured at at 1 kHz Response Time tr The time lag between application of a surge and varistor's "turn-on" conduction action Varistor Voltage Temperature Coefficient TC (Vn at 85°C – Vn at 25°C)/(Vn at 25°C) x 60°C) x 100 I nsulation Resistance IR Minimum resistance between shorted terminals and varistor surface Isolation Voltage The maximum peak voltage which may be applied under continuous operating conditions between the varistor terminations and any conducting mounting surface Operating Temperature The range of ambient temperature for which the varistor is designed to operate continuously as defined by the temperature limits of its climatic category Climatic Category LCT/UCT/DHD UCT = Upper Category Temperature – the maximum ambient temperature for which a varistor has been designed to operate continuously, LCT = Lower Category Temperature – the minimum ambient temperature at which a varistor has been designed to operate continuously DHD = Dump Heat Test Duration Storage Temperature Storage temperature range without voltage applied

14© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com V 0005_VP • 11/3/2016 Surface Mount Varistors VP Series Plastic Encapsulated 85°C KEMET Electronic Corporation Sales Offi ces For a complete list of our global sales offi ces, please visit www.kemet.com/sales. Disclaimer All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation.