VNQ860-E STMICROELECTRONICS | Alldatasheet

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QUAD CHANNEL HIGH SIDE DRIVER General Features Note: 1 Per each channel. ■ CMOS COMPATIBLE I/Os ■ UNDERVOLTAGE & OVERVOLTAGE __-SHUT-DOWN ■ SHORTED LOAD PROTECTION ■ THERMAL SHUT-DOWN ■ VERY LOW STAND-BY CURRENT ■ PROTECTION AGAINST LOSS OF GROUND

Description

The VNQ860-E, VNQ860SP-E are monolithic devices made using STMicroelectronics VIPower M0-3 Technology, intended for driving any kind load with one side connected to ground. Active current limitation combined with thermal shut- down and automatic restart protect the device against overload. Device automatically turns OFF in case of ground pin disconnection. This device is especially suitable for industrial applications in norms conformity with IEC 61131, (Programmable Controllers International Standard). Type RDS(ON) (1) Iout VCC VNQ860-E VNQ860SP-E 270mΩ 0.25A 36V SO- 20 PowerSO-10 TM Order Codes Package Tube Tape and Reel SO-20 VNQ860 VNQ86013TR-E PowerSO-10TM VNQ860SP VNQ860SP13TR-E Block Diagram

Table 1. Absolute Maximum Rating Figure 1. Configuration Diagram(Top View) & Suggested Connections for Unused and N.C. Pins

Figure 2. Current and Voltage Conventions Table 2. Thermal data 1.When mounted on FR4 printed circuit board with 0.5cm 2 of copper area ( at least 35µ thick ) connected to all VCC pins. 2.When mounted on FR4 printed circuit board with 6cm 2 of copper area ( at least 35µ thick ) connected to all VCC pins.

Table 3. Power Section Table 4. Switching ( VCC = 24V) Table 5. Protections ( Per channel )

Table 6. Logical Input ( Per channel ) Table 7. Status Pin Table 8. V CC - Output Diode Table 9. Truth Table

Figure 5. Waveforms

In order to meet environmental requirements, ST offers these devices in ECOPACK ® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com

Table 10. PowerSO-10 TM Mechanical Data Figure 8. PowerSO-10 TM Package Dimensions

Table 11. SO-20 Mechanical Data

Table 12. Revision History 14-Jul-2005 1 Updates , New template.

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the con sequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publicatio n are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics produ cts are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectron ics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Ital y - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America