VNQ660SP STMICROELECTRONICS | Alldatasheet
Document overview
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- PDF pages: 26
Technical content
Datasheet sections
- 1 Block diagram and pin description
- 2 Electrical specifications
- 2.1 Absolute maximum ratings
- 2.2 Thermal data
- 2.3 Electrical characteristics
- 2.4 Electrical characteristics curves
- 3 Application information
- 3.1 GND protection network against reverse battery
- 3.1.1 Solution 1: a resistor in the ground line (RGND only)
- 3.1.2 Solution 2: a diode (D GND) in the ground line
- 3.2 Load dump protection
- 3.3 MCU I/O protection
- 4 Package and PCB thermal data
- 4.1 PowerSO-10 thermal data
- 5 Package and packing information
- 5.1 ECOPACK® packages
- 5.2 PowerSO-10 mechanical data
- 5.3 PowerSO-10 packing information
- 6 Revision history
Features
■ CMOS compatible inputs ■ Off state open load detection ■ Undervoltage and overvoltage shutdown ■ Overvoltage clamp ■ Thermal shutdown ■ Current limitation ■ Very low standby power dissipation ■ Protection against loss of ground and loss of VCC ■ Reverse battery protection(a)
Description
The VNQ660SP is a monolithic device made by using| STMicroelectronics VIPower M0-3 Technology, intended for driving resistive or inductive loads with one side connected to ground. This device has four independent channels. Built- in thermal shutdown and output current limitation protect the chip from over temperature and short circuit. Type R DS(on) IOUT VCC VNQ660SP 50m Ω(1) 1. Per each channel. 6A 36V a. See Application schematic on page 16 PowerSO-10 Table 1. Device summary
1 Block diagram and pin description
Figure 1. Block diagram Figure 2. Configuration diagram (top view) Table 2. Suggested connections for unused and not connected pins
2 Electrical specifications
2.1 Absolute maximum ratings
Program and other relevant quality document.
2.2 Thermal data
Table 3. Absolute maximum ratings Table 4. Thermal data (per island)
- When mounted on a standard single-sided FR-4 board with 1cm 2 of Cu (at least 35 µm thick).
- When mounted on a standard single-sided FR-4 board with 6cm 2 of Cu (at least 35 µm thick).
2.3 Electrical characteristics
Figure 3. Current and voltage conventions Note: V Fn = VCCn - VOUTn during reverse battery condition. Table 5. Power
Table 6. Protections Table 5. Power (continued) Table 7. V CC - output diode
Figure 5. Switching characteristics Table 11. Truth table
Table 12. Electrical transient requirements and cannot be returned to proper operation without replacing the device.
Figure 6. Waveforms
2.4 Electrical characteristics curves
Figure 7. Off state output current Figure 8. High level input current Figure 9. Input clamp voltage Figure 10. Turn-on voltage slope Figure 11. Overvoltage shutdown Figure 12. Turn-off voltage slope
3 Application information
Figure 23. Application schematic Note: Channels 3 & 4 have the same internal circuit as channel 1 & 2.
3.1 GND protection networ k against reverse battery
3.1.1 Solution 1: a resist or in the ground line (RGND only)
This can be used with any type of load. maximum rating section of the device datasheet.
This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that, if the microprocessor ground is not shared by the device ground, then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on how many devices are ON in the case of several high side drivers sharing the same RGND . If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using solution 2 below.
3.1.2 Solution 2: a diode (D GND) in the ground line
A resistor (RGND = 1kΩ) should be inserted in parallel to DGND if the device will be driving an inductive load. This small signal diode can be safely shared amongst several different HSD. Also in this case, the presence of the ground network will produce a shift (j600mV) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the Absolute Maximum Rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected.
3.2 Load dump protection
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the VCC maximum DC rating. The same applies if the device is subject to transients on the VCC line that are greater than those shown in the ISO T/R 7637/1 table.
3.3 MCU I/O protection
If a ground protection network is used and negative transients are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the µC I/O pins from latching up. The value of these resistors is a compromise between the leakage current of µC and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC I/Os: - VCCpeak / Ilatchup ≤ Rprot ≤ (VOHµC - VIH - VGND) / IIHmax Example For the following conditions: VCCpeak = - 100V Ilatchup ≥ 20mA VOHµC ≥ 4.5V 5kΩ ≤ Rprot ≤ 65kΩ. Recommended values are: Rprot = 10kΩ
Figure 24. Maximum turn-off current versus load inductance Note: Values are generated with R L = 0Ω. must not exceed the temperature specified above for curves B and C.
4 Package and PCB thermal data
4.1 PowerSO-10 thermal data
Figure 25. PowerSO-10 PC board thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad lay-out to 8 cm2). Figure 26. R thj-amb Vs PCB copper area in open box free air condition
Table 13. Thermal parameters
5 Package and packing information
5.1 ECOPACK® packages
ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com.
5.2 PowerSO-10 mechanical data
Figure 29. PowerSO-10 package dimensions
Table 14. PowerSO-10 mechanical data
5.3 PowerSO-10 packing information
Figure 32. SO-28 tape and reel shipment (suffix “TR”) Figure 30. PowerSO-10 suggested Figure 31. PowerSO-10 tube shipment
6 Revision history
Table 15. Document revision history 22-Jun-2004 1 Initial release. Current and voltage convention update (page 2). and not connected pins insertion (page 3). 6 cm2 Cu condition insertion in thermal data table (page 3). VCC - output diode section update (page 3). Revision history table insertion (page 18). 28-Jul-2004 4 Disclaimers Update (page 19). Document reformatted and restructured. Added contents, list of tables and figures. Added ECOPACK® packages information.