DS8874_REV07_SEP04.pdf

Document overview

  • Manufacturer or author: STMICROELECTRONICS
  • PDF pages: 28

Technical content

Datasheet sections

  • 1 Block diagrams and pins configurations
  • 2 Electrical specifications
  • 2.1 Absolute maximum ratings
  • 2.2 Thermal data
  • 2.3 Electrical characteristics
  • 2.4 Electrical characteristics curves
  • 3 Application information
  • 3.1 MCU I/O protection
  • 4 Package and PC board thermal data
  • 4.1 PowerSSO-12 thermal data
  • 4.2 SO-8 thermal data
  • 5 Package and packing information
  • 5.1 ECOPACK ®
  • 5.2 PowerSSO-12 mechanical data
  • 5.3 SO-8 mechanical data
  • 5.4 PowerSSO-12 packing information
  • 5.5 SO-8 packing information
  • 6 Revision history

Features

 Automotive qualified  Drain current: 25 A  ESD protection  Overvoltage clamp  Thermal shutdown  Current and power limitation  Very low standby current  Very low electromagnetic susceptibility  Compliant with European directive 2002/95/EC  Open drain status output

Description

The VNL5030J-E and VNL5030S5-E are monolithic devices made using STMicroelectronics® VIPower® technology, intended for driving resistive or inductive loads with one side connected to the battery. Built-in thermal shutdown protects the chip from overtemperature and short-circuit. Output current limitation protects the devices in an overload condition. In case of long duration overload, the device limits the dissipated power to a safe level up to thermal shutdown intervention.Thermal shutdown, with automatic restart, allows the device to recover normal operation as soon as a fault condition disappears. Fast demagnetization of inductive loads is achieved at turn-off. Type V clamp RDS(on) ID VNL5030J-E

41 V 30 m 25 A

Table 1. Devices summary

1 Block diagrams and pins configurations

Figure 1. Block diagram Table 2. Pin function SOURCE PowerMOS source and ground reference for the control section. SUPPLY Supply voltage connected to the signal part (5 V). STATUS Open drain digital diagnostic pin. TAB Exposed pad. PowerMOS drain.

2 Electrical specifications

2.1 Absolute maximum ratings

conditions above those indicated in the operating sections of this specification is not implied.

2.2 Thermal data

Table 4. Absolute maximum ratings Table 5. Thermal data

2.3 Electrical characteristics

Table 6. PowerMOS section Table 7. Source drain diode Table 8. Status pin Table 9. Logic input

Table 10. Open-load detection Table 11. Supply section Table 12. Switching characteristics(1)

  1. See Figure 14: Application schematic.
  2. See Figure 13: Switching characteristics.

Table 9. Logic input (continued)

Table 13. Protection and diagnostics

2.4 Electrical characteristics curves

Figure 4. Source diode forward characteristics Figure 5. Static drain source on-resistance Figure 6. Static drain source on-resistance vs. Figure 7. Static drain source on-resistance

Figure 13. Switching characteristics Table 14. Truth table

3 Application information

Figure 14. Application schematic

3.1 MCU I/O protection

a. In case of negative transient on the drain pin.

4 Package and PC board thermal data

4.1 PowerSSO-12 thermal data

Figure 16. PowerSSO-12 PC board

  1. Layout condition of Rth and Zth measurements (board finish thickness 1.6 mm +/- 10%; board double

footprint dimension 4.1 mm x 6.5 mm). Figure 17. PowerSSO-12 Rthj-amb vs PCB copper area in open box free air condition

Table 15. PowerSSO-12 thermal parameters

4.2 SO-8 thermal data

Figure 20. SO-8 PC board

  1. Layout condition of R th and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm,

Cu thickness = 35 µm (front and back side), Copper areas: from minimum pad lay-out to 2 cm2). Figure 21. SO-8 Rthj-amb vs PCB copper area in open box free air condition

Table 16. SO-8 thermal parameters

5 Package and packing information

5.1 ECOPACK ®

specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

5.2 PowerSSO-12 mechanical data

Figure 24. PowerSSO-12 package dimensions

5.3 SO-8 mechanical data

Figure 25. SO-8 package dimensions Table 17. PowerSSO-12 mechanical data

Table 18. SO-8 mechanical data

  1. Dimensions D does not include mold flash, protrusions or gate burrs. Mold flash, potrusions or gate burrs

shall not exceed 0.15 mm in total (both side).

  1. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not

5.4 PowerSSO-12 packing information

Figure 26. PowerSSO-12 tube shipment (no suffix) Figure 27. PowerSSO-12 tape and reel shipment (suffix “TR”)

5.5 SO-8 packing information

Figure 28. SO-8 tube shipment (no suffix) Figure 29. SO-8 tape and reel shipment (suffix “TR”)

6 Revision history

Table 19. Document revision history 14-Feb-2012 1 Initial release. Removed Table: Input section. 18-Sep-2013 5 Updated disclaimer.