VND830MSP_V01 STM | Alldatasheet
Document overview
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- PDF pages: 27
Technical content
Datasheet sections
- 1 Block diagram and pin description
- 2 Electrical specifications
- 2.1 Absolute maximum ratings
- 2.2 Thermal data
- 2.3 Electrical characteristics
- 2.4 Electrical characteristics curves
- 3 Application information
- 3.1 GND protection network against reverse battery
- 3.1.1 Solution 1: a resistor in the ground line (RGND only)
- 3.1.2 Solution 2: a diode (D GND) in the ground line
- 3.2 Load dump protection
- 3.3 MCU I/O protection
- 3.4 Open-load detection in off-state
- 3.5 Maximum demagnetization energy (V
- 4 Package and PCB thermal data
- 4.1 PowerSO-10 thermal data
- 5 Package and packing information
- 5.1 ECOPACK ® packages
- 5.2 PowerSO-10 mechanical data
- 5.3 PowerSO-10 packing information
- 6 Revision history
Features
■ CMOS compatible inputs ■ Open drain status outputs ■ On-state open-load detection ■ Off-state open-load detection ■ Shorted load protection ■ Undervoltage and overvoltage shutdown ■ Loss of ground protection ■ Very low standby current ■ Reverse battery protection
Description
The VND830MSP is a monolithic device designed in| STMicroelectronics™ VIPower™ M0-3 Technology. The VND830MSP is intended for driving any type of multiple load with one side connected to ground. The Active V CC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table). Active current limitation combined with thermal shutdown and automatic restart protects the device against overload. The current limitation threshold is aimed at detecting the 21 W / 12 V standard bulb as an overload fault. The device detects the open-load condition in both the on and off-state. In the off-state the device detects if the output is shorted to V CC. The device automatically turns off in the case where the ground pin becomes disconnected. Type R DS(on) IOUT VCC VND830MSP 60 m Ω(1) 1. Per each channel. 6A (1) 36 V PowerSO-10 Table 1. Device summary
Table 7. V
1 Block diagram and pin description
Figure 1. Block diagram Figure 2. Configuration diagram (top view) Table 2. Suggested connections for unused and not connected pins
2 Electrical specifications
2.1 Absolute maximum ratings
Program and other relevant quality document. Table 3. Absolute maximum ratings
2.2 Thermal data
2.3 Electrical characteristics
Figure 3. Current and voltage conventions Table 4. Thermal data (per island)
- When mounted on a standard single-sided FR-4 board with 0.5 cm 2 of Cu (at least 35 µm thick) connected
to all VCC pins. Horizontal mounting and no artificial air flow.
- When mounted on a standard single-sided FR-4 board with 6 cm 2 of Cu (at least 35 µm thick) connected to
all VCC pins. Horizontal mounting and no artificial air flow. VFn = VCCn - VOUTn during reverse battery condition.
Table 5. Power output Table 6. Protections
5.5 V < VCC < 36 V 15 A
Table 7. V CC - output diode Table 8. Switching (V CC = 13 V; Tj = 25 °C)
0.15 See
0.1 See
Table 9. Logic inputs Table 10. Status pin
Table 12. Truth table Table 13. Electrical transient requirements
- All functions of the device are performed as designed after exposure to disturbance.
- One or more functions of the device is not perfo rmed as designed after exposure and cannot be returned to
proper operation without replacing the device.
Figure 6. Waveforms
2.4 Electrical characteristics curves
Figure 7. Off-state output current Figure 8. High level input current Figure 9. Input clamp voltage Figure 10. Turn-on voltage slope Figure 11. Overvoltage shutdown Figure 12. Turn-off voltage slope
3 Application information
Figure 24. Application schematic
3.1 GND protection network against reverse battery
3.1.1 Solution 1: a resistor in the ground line (R GND only)
This can be used with any type of load. maximum rating section of the device datasheet. maximum on-state currents of the different devices.
Please note that, if the microprocessor ground is not shared by the device ground, then the RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift varies depending on how many devices are ON in the case of several high- side drivers sharing the same R GND . If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using solution 2 below.
3.1.2 Solution 2: a diode (D GND) in the ground line
A resistor (RGND = 1 kΩ) should be inserted in parallel to DGND if the device is driving an inductive load. This small signal diode can be safely shared amongst several different HSD. Also in this case, the presence of the ground network produces a shift (≈600 mV) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. This shift not varies if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the Absolute Maximum Rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected.
3.2 Load dump protection
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the VCC maximum DC rating. The same applies if the device is subject to transients on the VCC line that are greater than those shown in the ISO T/R 7637/1 table.
3.3 MCU I/O protection
If a ground protection network is used and negative transients are present on the VCC line, the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the microcontroller I/O pins from latching up. The value of these resistors is a compromise between the leakage current of microcontroller and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of microcontroller I/Os: - V CCpeak / Ilatchup ≤ Rprot ≤ (VOHμC - VIH - VGND) / IIHmax Example For the following conditions: VCCpeak = -100 V Ilatchup ≥ 20 mA VOHμC ≥ 4.5 V 5k Ω ≤ Rprot ≤ 65 kΩ. Recommended values are: Rprot = 10 kΩ Obsolete Product(s) - Obsolete Product(s)
3.4 Open-load detection in off-state
- no false open-load indication when load is connected: in this case we have to avoid
VOUT = (VPU / (RL + RPU))RL < VOlmin.
- no misdetection when load is disconnected: in this case the V OUT has to be higher than
VOLmax; this results in the following condition RPU < (VPU - VOLmax) / IL(off2). Figure 25. Open-load detection in off-state
Figure 26. Maximum turn-off current versus load inductance Values are generated with RL = 0Ω. specified above for curves B and C.
4 Package and PCB thermal data
4.1 PowerSO-10 thermal data
Figure 27. PowerSO-10 PC board Figure 28. R thj-amb vs PCB copper area in open box free air condition 35 µm, Copper areas: from minimum pad lay-out to 8 cm 2).
Table 14. Thermal parameters
5 Package and packing information
5.1 ECOPACK ® packages
specifications, grade definitions and product status are available at: www.st.com.
5.2 PowerSO-10 mechanical data
Figure 31. PowerSO-10 package dimensions
Table 15. PowerSO-10 mechanical data
5.3 PowerSO-10 packing information
Figure 34. PowerSO-10 tape and reel shipment (suffix “TR”) Figure 32. PowerSO-10 suggested Figure 33. PowerSO-10 tube shipment
6 Revision history
Table 16. Document revision history 09-Sep-2004 1 Initial release. Current and voltage convention update (page 2). and n.c. pins insertion (page 2). 4 cm2 Cu condition insertion in thermal data table (page 3). CC - output diode section update (page 4). Protections note insertion (page 4). Revision history table insertion (page 18). Disclaimers update (page 19). Document reformatted and restructured. Added contents, list of tables and figures. 20-Sep-2013 5 Updated Disclaimer.