VND5E160AJ-E_V01 STM | Alldatasheet
Document overview
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- PDF pages: 37
Technical content
Datasheet sections
- 1 Block diagram and pin description
- 2 Electrical specifications
- 2.1 Absolute maximum ratings
- 2.2 Thermal data
- 2.3 Electrical characteristics
- 2.4 Waveforms
- 2.5 Electrical characteristics curves
- 3 Application information
- 3.1 GND protection network against reverse battery
- 3.1.1 Solution 1 : resistor in the ground line (RGND only)
- 3.1.2 Solution 2 : diode (DGND) in the ground line
- 3.2 Load dump protection
- 3.3 MCU I/Os protection
- 3.4 Current sense and diagnostic
- 3.4.1 Short to VCC and OFF state open load detection
- 4 Package and PC board thermal data
- 4.1 PowerSSO-12 thermal data
- 5 Package and packing information
- 5.1 ECOPACK ® packages
- 5.2 Package mechanical data
- 5.3 Packing information
- 6 Order codes
- 7 Revision history
Features
■ General – Inrush current active management by power limitation – Very low stand-by current – 3.0 V CMOS compatible inputs – Optimized electromagnetic emissions – Very low electromag netic susceptibility – In compliance with the 2002/95/EC european directive – Very low current sense leakage ■ Diagnostic functions – Proportional load current sense – High current sense precision for wide currents range – Current sense disable – Off state openload detection – Output short to V CC detection – Overload and short to ground (power limitation) indication – Thermal shutdown indication ■ Protections – Undervoltage shutdown – Overvoltage clamp – Load current limitation – Self limiting of fast thermal transients – Protection against loss of ground and loss of V CC – Over-temperature shutdown with autorestart (thermal shutdown) – Reverse battery protected (see Application schematic) – Electrostatic discharge protection Application ■ All types of resistive, inductive and capacitive loads ■ Suitable as LED driver
Description
The VND5E160AJ-E is a single channel high-side driver manufactured in the ST proprietary VIPower M0-5 technology and housed in the tiny PowerSSO-12 package. The VND5E160AJ-E is designed to drive 12V automotive grounded loads delivering protection, diagnostics and easy 3V and 5V CMOS compatible interface with any microcontroller. The device integrates advanced protective functions such as load current limitation, inrush and overload active management by power limitation, over-temperature shut-off with auto-restart and over-voltage active clamp. A dedicated analog current sense pin is associated with every output channel in order to provide Ehnanced diagnostic functions including fast detection of overload and short-circuit to ground through power limitation indication, over- temperature indication, short-circuit to Vcc diagnosis and ON & OFF state open load detection. The current sensing and diagnostic feedback of the whole device can be disabled by pulling the CS_DIS pin high to allow sharing of the external sense resistor with other similar devices. Max transient supply voltage V CC 41 V Operating voltage range V CC 4.5 to 28V Max On-state resistance (per ch.) R ON 160 m Current limitation (typ.) I LIMH 10 A Off state supply current I S 2 µA(1) 1. Typical value with all loads connected. PowerSSO-12
Table 10. Openload detection (8V<V
1 Block diagram and pin description
Figure 1. Block diagram Table 1. Pin function CURRENT SENSEn Analog current sense pin, delivers a current proportional to the load current. CS_DIS Active high CMOS compatible pin, to disable the current sense pin.
Figure 2. Configuration diagram (top view) Table 2. Suggested connections for unused and not connected pins
2 Electrical specifications
Figure 3. Current and voltage conventions Note: V Fn = VOUTn - VCC during reverse battery condition.
2.1 Absolute maximum ratings
and other relevant quality document. Table 3. Absolute maximum ratings
2.2 Thermal data
Table 3. Absolute maximum ratings (continued) Table 4. Thermal data
2.3 Electrical characteristics
Table 5. Power section
- PowerMOS leakage included.
Table 6. Switching (V CC=13V, Tj=25°C) Figure 26. V/µs Figure 28. V/µs
Table 7. Logic inputs Table 8. Protections and diagnostics (1)
- To ensure long term reliability under heavy overload or short circuit conditions, protection and related
abnormal conditions, this software must limit the duration and number of activation cycles.
Table 9. Current sense (8V<VCC<18V)
- Parameter guaranteed by design; it is not tested.
- Fault condition includes: power limitation, ov ertemperature and open load OFF state detection.
Table 10. Openload detection (8V<V CC<18V) Table 9. Current sense (8V<VCC<18V) (continued)
Table 11. Truth table
- If the V CSD is high, the SENSE output is at a high impedance, its potential depends on leakage currents
Table 12. Electrical transient requirements
- The above test levels must be considered referred to V CC = 13.5V except for pulse 5b.
- Valid in case of external load dump clamp: 40V maximum referred to ground.
C All functions of the device performed as designed after exposure to disturbance. disturbance and cannot be returned to proper operation without replacing the device.
2.4 Waveforms
Figure 11. Normal operation Figure 12. Overload or Short to GND
2.5 Electrical characteristics curves
Figure 17. Off state output current Figure 18. High level input current Figure 19. Input clamp voltage Figure 20. Input low level Figure 21. Input high level Figure 22. Input hysteresis voltage
3 Application information
Figure 32. Application schematic Note: Channel 2 has the same internal circuit as channel 1.
3.1 GND protection networ k against reverse battery
3.1.1 Solution 1 : resistor in the ground line (RGND only)
This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. maximum rating section of the device datasheet. maximum On-state currents of the different devices. high side drivers sharing the same RGND.
If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests to utilize Solution 2 (see below).
3.1.2 Solution 2 : diode (D GND) in the ground line
A resistor (RGND=1kshould be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network will produce a shift (600mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network.
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCC max DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transient are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the µC I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of µC and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC I/Os: -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Calculation example: For VCCpeak = - 100V and Ilatchup 20mA; VOHµC 4.5V 5k Rprot 180k Recommended values: Rprot =10k, CEXT=10nF .
3.4 Current sense and diagnostic
- Current mirror of the load current in normal operation, delivering a current proportional to the load one according to a know ratio KX. The current ISENSE can be easily converted to a voltage VSENSE by means of an external resistor RSENSE. Linearity between IOUT and VSENSE is ensured up to 5V minimum (see parameter VSENSE in Table 9: Current sense (8V<VCC<18V)). The current sense accuracy depends on the output current (refer to current sense electrical characteristics Table 9: Current sense (8V<VCC<18V)).
- Diagnostic flag in fault conditions, delivering a fixed voltage VSENSEH up to a maximum current ISENSEH in case of the following fault conditions (refer to Tr uth table): – Power limitation activation – Over-temperature –S h o r t t o V CC in OFF state – Open load in OFF state with additional external components. A logic level high on CS_DIS pin sets at the same time all the current sense pins of the device in a high impedance state, thus disabling the current monitoring and diagnostic detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of sense resistance and ADC line among different devices.
Figure 33. Current sense and diagnostic
3.4.1 Short to V CC and OFF state open load detection
A short circuit between VCC and output is indicated by the relevant current sense pin set to VSENSEH during the device off state. Small or no current is delivered by the current sense during the on state depending on the nature of the short circuit. OFF state open load with external circuitry Detection of an open load in off mode requires an external pull-up resistor RPU connecting the output to a positive supply voltage VPU. It is preferable VPU to be switched off during the module stand-by mode in order to avoid the overall stand-by current consumption to increase in normal conditions, i.e. when load is connected. An external pull down resistor R PD connected between output and GND is mandatory to avoid misdetection in case of floating outputs in off state (see Figure 33: Current sense and diagnostic). RPD must be selected in order to ensure VOUT < VOLmin unless pulled up by the external circuitry: RPD 22Kis recommended. For proper open load detection in off state, the external pull-up resistor must be selected according to the following formula: For the values of VOLmin ,VOLmax, IL(off2)r and IL(off2)f see Table 10: Openload detection (8V<VCC<18V). VVIRV OLfoffLPDOFFupPullOUT 2min)2(_ VVRR IRRVR V OL PDPU roffLPDPUPUPD ONupPullOUT 4max )2( _
Figure 34. Maximum turn-Off current versus inductance (for each channel) must not exceed the temperature specified above for curves A and B.
4 Package and PC board thermal data
4.1 PowerSSO-12 thermal data
Figure 35. PowerSSO-12 PC board Figure 36. Rthj-amb vs. PCB copper area in open box free air condition (one channel ON)
Table 13. Thermal parameters
5 Package and packing information
5.1 ECOPACK ® packages
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
5.2 Package mechanical data
Figure 39. PowerSSO-12 package dimensions
Table 14. PowerSSO-12 mechanical data
5.3 Packing information
Figure 40. PowerSSO-12 tube shipment (no suffix) Figure 41. PowerSSO-12 tape and reel shipment (suffix “TR”)
6 Order codes
Table 15. Device summary
7 Revision history
Table 16. Document revision history 13-Sep-2004 1 Initial release. Document reformatted and restructured. current and rising edge of current sense (CS enabled). Added Figure 9: Iout/ Isense vs. Iout. Added Figure 10: Maximum current sense ratio drift vs load current. III and IV for test pulse 5b and notes. Added Section 2.4: Waveforms. Added Section 2.5: Electrical characteristics curves. free air condition (one channel ON). ambient single pulse (one channel ON). R3 value changed from 7 to 3 °C/W. C3 value changed from 0.05 to 0.0166 W.s/°C. 24-Sep-2013 3 Updated disclaimer.