VND5E004C30_V01 STM | Alldatasheet
Document overview
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- PDF pages: 35
Technical content
Datasheet sections
- 1 Block diagram and pin co nfigurations
- 2 Electrical specifications
- 2.1 Absolute maximum ratings
- 2.2 Thermal data
- 2.3 Electrical characteristics
- 2.4 Waveforms
- 2.5 Electrical characteristics curves
- 3 Application information
- 3.1 MCU I/Os protection
- 3.2 Load dump protection
- 3.3 Current sense and diagnostic
- 3.3.1 Short to VCC and off-state open-load detection
- 4 Package and PC board thermal da ta
- 4.1 MultiPowerSO-30 thermal data
- 5 Package information
- 5.1 MultiPowerSO-30 package information
- 5.2 MultiPowerSO-30 packing information
- 6 Order codes
- 7 Revision history
Features
AEC-Q100 qualified General – Very low standby current – 3.0 V CMOS compatible inputs – Optimized electromagnetic emissions – Very low electromagnetic susceptibility – Compliant with European directive 2002/95/EC – Very low current sense leakage Diagnostic functions – Proportional load current sense – High current sense precision for wide currents range – Diagnostic enable pin – Off-state open-load detection – Output short to V CC detection – Overload and short to ground (power limitation) indication – Thermal shutdown indication Protection – Undervoltage shutdown – Overvoltage clamp – Load current limitation – Self limiting of fast thermal transients – Protection against loss of ground and loss of V CC – Overtemperature shutdown with auto restart (thermal shutdown) – Inrush current active management by power limitation – Reverse battery protection with self switch- on of the Power MOSFET – Electrostatic discharge protection
Applications
All types of resistive, inductive and capacitive loads Suitable for power management applications
Description
The device is a double channel high-side driver manufactured using ST proprietary VIPower® M0-5 technology and housed in a MultiPowerSO-30 package. The device is designed to drive 12 V automotive grounded loads, and to provide protection and diagnostics. It also implements a 3 V and 5 V CMOS- compatible interface for use with any microcontroller. The device integrates advanced protective functions such as load current limitation, inrush and overload active management by power limitation, overtemperature shut-off with auto- restart and overvoltage active clamp. A dedicated analog current sense pin is associated with every output channel providing enhanced diagnostic functions including fast detection of overload and short-circuit to ground through power limitation indication, overtemperature indication, short- circuit to V CC diagnosis and on-state and off-state open-load detection. The current sensing and diagnostic feedback of the whole device can be disabled by pulling the DE pin low to share the external sense resistor with similar devices. Max transient supply voltage V CC 41 V Operating voltage range V CC 4.5 to 28 V Max on-state resistance (per ch.) R ON 4 m Current limitation (typ) I LIMH 90 A Off-state supply current I S 2 µA(1) 1. Typical value with all loads connected 0XOWL3RZHU6 *$3*&)7
1 Block diagram and pin configurations
Figure 1. Block diagram Table 1. Pin functions
Figure 2. Configuration diagram (not to scale) Table 2. Suggested connections for unused and non connected pins
2 Electrical specifications
Figure 3. Current and voltage conventions
2.1 Absolute maximum ratings
section for extended periods may affect device reliability. Table 3. Absolute maximum ratings
2.2 Thermal data
2.3 Electrical characteristics
Table 3. Absolute maximum ratings (continued) Table 4. Thermal data
- PCB FR4 area 58 mm x 58 mm, PCB thickness 2 mm, Cu thickness 35 µm, minimum pad layout
Table 5. Power section
Table 8. Protections and diagnostics
5 V < VCC < 24 V 130 A
Table 9. Current sense (8 V < VCC < 18 V)
- Parameter guaranteed by design; not tested.
- Fault condition includes: power limitation, overtemperature and open-load off-state detection.
Table 10. Open-load detection (8 V < VCC < 18 V; VDE = 5 V) Table 9. Current sense (8 V < VCC < 18 V) (continued)
Figure 10. Maximum current sense ratio drift vs load current
- Parameter guaranteed by design; not tested.
Table 11. Truth table
- If the V DE is low, the SENSE output is at a high impedance; its potential depends on leakage currents and
Table 12. Electrical transient requirements (part 1/3)
- The above test levels must be considered referred to V CC = 13.5V except for pulse 5b.
- Valid in case of external load dump clamp: 40V maximum referred to ground. The protection strategy
along the time and to transfer a part of it to the load. Table 13. Electrical transient requirements (part 2/3)
- The above test levels must be considered referred to V CC = 13.5V except for pulse 5b
- Valid in case of external load dump clamp: 40V maximum referred to ground. The protection strategy
along the time and to transfer a part of it to the load.
- Suppressed load dump (pulse 5b) is withstood with a minimum load connected as specified in Table 3.
Table 14. Electrical transient requirements (part 3/3) C All functions of the device are performed as designed after exposure to disturbance.
2.4 Waveforms
Figure 11. Normal operation Figure 12. Overload or short to GND
2.5 Electrical char acteristics curves
Figure 17. Off-state output current Figure 18. High level input current Figure 19. Input clamp voltage Fi gure 20. Input low level voltage Figure 21. Input high level voltage Figure 22. Input hysteresis voltage
3 Application information
Figure 32. Application schematic
3.1 MCU I/Os protection
latch-up limit of the microcontroller I/Os.
3.2 Load dump protection
line that are greater than the ones shown in Table 12.
3.3 Current sense and diagnostic
characteristics in Table 9). – Open-load in off-state with additional external components. resistance and ADC line among different devices. Figure 33. Current sense and diagnostics
3.3.1 Short to V CC and off-state open-load detection
A short circuit between VCC and output is indicated by the relevant current sense pin set to VSENSEH during the device off-state. Little or no current is delivered by the current sense during the on-state depending on the nature of the short circuit. Off-state open-load with external circuitry Detection of an open-load in off mode requires an external pull-up resistor (RPU) connecting the output to a positive supply voltage (VPU). It is preferable that VPU be switched off during the module standby mode to avoid an increase in the overall standby current consumption in normal conditions, that is, when the load is connected. An external pull down resistor (RPD) connected between output and GND is mandatory to avoid misdetection in case of floating outputs in off-state (see Figure 33: Current sense and diagnostics). RPD must be selected in order to ensure VOUT < VOLmin unless pulled up by the external circuitry: RPD 22Kis recommended. For proper open-load detection in off-state, the external pull-up resistor must be selected according to the following formula: For the values of VOLmin,VOLmax, IL(off2)r and IL(off2)f see Table 10: Open-load detection (8 V < VCC < 18 V; VDE = 5 V). VOUT Pull-up_OFF RPD IL(off2)f VOLmin 2V== VOUT Pull-up_ON RPD VPU RPU– RPD IL(off2)r
Figure 34. Maximum turn-off current versus inductance
- Values are generated with R L = 0
the temperature specified above for curves A and B.
4 Package and PC board thermal data
4.1 MultiPowerSO-30 thermal data
Figure 35. MultiPowerSO-30 PC board
- Layout condition of R th and Zth measurements (PCB: double layer, thermal vias, FR4
areas: from minimum pad layout to 16 cm2). Figure 36. Rthj-amb vs PCB copper area in open box free air condition (one channel ON)
Table 15. Thermal parameters for MultiPowerSO-30
5 Package information
specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
5.1 MultiPowerSO-30 package information
Figure 39. MultiPowerSO-30 package outline Table 16. MultiPowerSO-30 mechanical data
Table 16. MultiPowerSO-30 mechanical data (continued)
5.2 MultiPowerSO-30 packing information
Figure 40. MultiPowerSO-30 tape and reel shipment (suffix “TR”)
6 Order codes
Table 17. Device summary
7 Revision history
Table 18. Document revision history 09-Jun-2015 1 Initial release. – Modified Section 5: Package information.