VND5004A-E STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 34

Technical content

Datasheet sections

  • 1 Block diagram and pin co nfigurations
  • 2 Electrical specifications
  • 2.1 Absolute maximum ratings
  • 2.2 Thermal data
  • 2.3 Electrical characteristics
  • 2.4 Electrical characteristics curves
  • 3 Application information
  • 3.1 MCU I/Os protection
  • 3.2 Load dump protection
  • 4 Package and PC board thermal data
  • 4.1 MultiPowerSO-30 thermal data
  • 4.2 PQFN - 12x12 Power lead-less thermal data
  • 5 Package and packing information
  • 5.1 ECOPACK ® packages
  • 5.2 MultiPowerSO-30 mechanical data
  • 5.3 PQFN - 12x12 Power lead-less mechanical data
  • 5.4 MultiPowerSO-30 packing information
  • 5.5 PQFN - 12x12 Power lead-less packing information
  • 6 Revision history

Features

■ General – Inrush current active management by power limitation – Very low stand-by current – 3.0V CMOS compatible input – Optimized electromagnetic emission – Very low electromag netic susceptibility – In compliance with the 2002/95/EC European directive ■ Diagnostic functions – Proportional load current sense – Current sense disable – Thermal shutdown indication ■ Protection – Undervoltage shut-down – Overvoltage clamp – Load current limitation – Thermal shut down – Self limiting of fast thermal transients – Protection against loss of ground and loss of V CC – Reverse battery protection with self switch on of the PowerMOS (see Application schematic on page 18) – Electrostatic discharge protection Application ■ All types of resistive, inductive and capacitive loads ■ Suitable for power management applications

Description

The VND5004ATR-E and VND5004ASP30-E are devices made using STMicroelectronics VIPower technology. They are intended for driving resistive or inductive loads with one side connected to ground. Active V CC pin voltage clamp and load dump protection circuit protect the devices against transients on the Vcc pin (see ISO7637 transient compatibility table). These devices integrate an analog current sense which delivers a current proportional to the load current (according to a known ratio) when CS_DIS is driven low or left open. When CS_DIS is driven high, the CURRENT SENSE pin is high impedance. Output current limitation protects the devices in overload condition. In case of long duration overload, the devicesa limit the dissipated power to a safe level up to thermal shut-down intervention. Thermal shut-down with automatic restart allows the device to recover normal operation as soon as a fault condition disappears. Max transient supply voltage V CC 41V Operating voltage range V CC 4.5 to 27V Max On-State resistance (per ch.) R ON 4 mΩ Current limitation (typ) I LIMH 100A Off state supply current I S 2 µA(1) 1. Typical value with all loads connected MultiPowerSO-30 PQFN - 12x12 Power lead-less Table 1. Devices summary

1 Block diagram and pin configurations

Figure 1. Block diagram Table 2. Pin functions

Figure 2. Configuration di agram (not in scale) Table 3. Suggested connections for unused and n.c. pins

2 NC 3 NC

4 GND

5 CS_DIS 6 CURRENT SENSE 2

7 CURRENT SENSE 1 8 INPUT 2

9 INPUT 110 NC

11 NC12 NC

13 FOR TEST ONL Y

16 OUTPUT 2

2 Electrical specifications

Figure 3. Current and voltage conventions

2.1 Absolute maximum ratings

and other relevant quality documents. Table 4. Absolute maximum ratings

2.2 Thermal data

Table 4. Absolute maximum ratings (continued) Table 5. Thermal data

  1. PCB FR4 area 58mmX58mm , PCB thickness 2mm, Cu thickness 35 µm, minimum pad layout.
  2. PCB FR4 area 78mmX78mm , PCB thickness 2mm, Cu thickness 35 µm, minimum pad layout.

2.3 Electrical characteristics

Table 6. Power section

  1. PowerMOS leakage included.

Table 7. Switching (V CC =1 3 V ; Tj =2 5 ° C )

Table 8. Logic input Table 9. Protection and diagnostics (1)

  1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related

abnormal conditions, this software must limit the duration and number of activation cycles.

Figure 4. Current sense delay characteristics Table 10. Current sense (8V<VCC<16V)

Figure 5. Switching characteristics Table 11. Truth table

  1. If V CSD is high, the SENSE output is at a high impedance. Its potential depends on leakage currents and

Table 12. Electrical transient requirements

  1. The above test levels must be considered referred to V CC = 13.5V except for pulse 5b
  2. Valid in case of external load dump clamp: 40V maximum referred to ground.
  3. Suppressed load dump (pul se 5b) is withstood with a minimum load connected as specified in Table 4.:

C All functions of the device are performed as designed after exposure to disturbance. disturbance and cannot be returned to proper operation without replacing the device.

Figure 6. Waveforms

2.4 Electrical characteristics curves

Figure 7. Off state output current Figure 8. High level input current Figure 9. Input clamp voltage Figure 10. Input low level Figure 11. Input high level Figure 12. Input hysteresis voltage

3 Application information

Figure 22. Application schematic

3.1 MCU I/Os protection

negative to approximately -1.5V.

3.2 Load dump protection

line that are greater than the ones shown in the ISO 7637-2: 2004(E) table.

Figure 23. Maximum turn off current versus inductance Note: Values are generated with R L = 0 Ω. must not exceed the temperature specified above for curves A and B.

4 Package and PC board thermal data

4.1 MultiPowerSO-30 thermal data

Figure 24. MultiPowerSO-30 PC board Figure 25. Rthj-amb Vs. PCB copper area in open box free air condition (one channel ON)

Table 13. Thermal parameters for MultiPowerSO-30

4.2 PQFN - 12x12 Power lead-less thermal data

Figure 28. 12x12 Power lead-less package PC board Copper areas: minimum pad lay-out). Figure 29. R

Table 14. Thermal parameters for PQFN - 12x12 Power lead-less

5 Package and packing information

5.1 ECOPACK ® packages

ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com.

5.2 MultiPowerSO-30 mechanical data

Figure 32. MultiPowerSO-30 outline

Table 15. MultiPowerSO-30 mechanical data

5.3 PQFN - 12x12 Power lead-less mechanical data

Figure 33. PQFN - 12x12 Power lead-less outline

Table 16. PQFN - 12x12 Power lead-less mechanical data

5.4 MultiPowerSO-30 packing information

on page 1 for packaging quantities). Figure 34. MultiPowerSO-30 tube shipment (no suffix) Figure 35. MultiPowerSO-30 tape and reel shipment (suffix “TR”)

5.5 PQFN - 12x12 Power lead -less packing information

page 1 for packaging quantities). Figure 36. PQFN - 12x12 Power lead-less tray shipment (no suffix)

Figure 37. PQFN - 12x12 Power lead-less tape and reel shipment (suffix “TR”)

6 Revision history

Table 17. Document revision history 15-Sep-2003 1 Initial release. 21-Jun-2004 2 MultiPowerSO-30 package insertion. Document converted into new ST corporate template. Contents and lists of tables and figures added. 10-Dec-2007 5 Table 12: Electrical transient requirements - added note 3.