"OMNIFET II" fully autoprotected Power MOSFET

Document overview

  • Manufacturer or author: STMICROELECTRONICS
  • PDF pages: 31

Technical content

Datasheet sections

  • 1 Block diagram
  • 2 Electrical specification
  • 2.1 Absolute maximum rating
  • 2.2 Thermal data
  • 2.3 Electrical characteristics
  • 3 Protection features
  • 4 Package thermal data
  • 4.1 DPAK thermal data
  • 4.2 SO-8 thermal data
  • 4.3 D 2PAK thermal data
  • 5 Package information
  • 5.1 ECOPACK ®
  • 5.2 TO-251 (IPAK) mechanical data
  • 5.3 D 2PAK mechanical data
  • 5.4 TO-252 (DPAK) mechanical data
  • 5.5 SO-8 mechanical data
  • 6 Revision history

Features

■ Linear current limitation ■ Thermal shutdown ■ Short circuit protection ■ Integrated clamp ■ Low current drawn from input pin ■ Diagnostic feedback through input pin ■ ESD protection ■ Direct access to the gate of the Power MOSFET (analog driving) ■ Compatible with standard Power MOSFET

Description

The VNB14NV04, VND14NV04, VND14NV04-1 and VNS14NV04 are monolithic devices made using STMicroelectronics VIPower™ M0 technology, intended for replacement of standard power MOSFETS in DC to 50 KHz applications. Built-in thermal shutdown, linear current limitation and overvoltage clamp protect the chip in harsh environments. Fault feedback can be detected by monitoring the voltage at the input pin. TYPE R DS(on) Ilim Vclamp VNB14NV04 VND14NV04 VND14NV04-1 VNS14NV04 35 mΩ 12 A 40 V 3 3 TO-252 (DPAK) TO-251 (IPAK) SO-8 D 2PAK Table 1. Device summary

1 Block diagram

Figure 1. Block diagram

2 Electrical specification

Figure 2. Current and voltage conventions

2.1 Absolute maximum rating

Table 2. Absolute maximum rating

2.2 Thermal data

2.3 Electrical characteristics

-40 < Tj < 150 °C unless otherwise specified. Table 3. Thermal data

  1. When mounted on a standard single-sided FR4 board with 0.5 cm 2 of Cu (at least 35 µm thick) connected to all DRAIN

pins. Horizontal mounting and no artificial air flow. Table 4. Electrical characteristics

  1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %

Table 4. Electrical characteristics (continued)

VNB14NV04, VND14NV04, VND14NV04-1, VNS14NV04 Protection features Doc ID 7393 Rev 9 9/31

3 Protection features

During normal operation, the input pin is electrically connected to the gate of the internal power MOSFET through a low impedance path. The device then behaves like a standard power MOSFET and can be used as a switch from DC up to 50 KHz. The only difference from the user’s standpoint is that a small DC current I ISS (typ. 100 µA) flows into the input pin in order to supply the internal circuitry. The device integrates:

  • Overvoltage clamp protection: internally set at 45 V, along with the rugged avalanche characteristics of the Power MOSFET stage give this device unrivalled ruggedness and energy handling capability. This feature is mainly important when driving inductive loads.
  • Linear current limiter circuit: limits the drain current ID to Ilim whatever the input pin voltages. When the current limiter is active, the device operates in the linear region, so power dissipation may exceed the capability of the heatsink. Both case and junction temperatures increase, and if this phase lasts long enough, junction temperature may reach the over temperature threshold T jsh.
  • Over temperature and short circuit protection: these are based on sensing the chip temperature and are not dependent on the input voltage. The location of the sensing element on the chip in the power stage area ensures fast, accurate detection of the junction temperature. Over temperature cutout occurs in the range 150 to 190 °C, a typical value being 170 °C. The device is automatically restarted when the chip temperature falls of about 15 °C below shutdown temperature.
  • Status feedback: in the case of an over temperature fault condition (Tj > Tjsh), the device tries to sink a diagnostic current Igf through the input pin in order to indicate fault condition. If driven from a low impedance source, this current may be used in order to warn the control circuit of a device shutdown. If the drive impedance is high enough so that the input pin driver is not able to supply the current I gf, the input pin will fall to 0 V. This will not however affect the device operation: no requirement is put on the current capability of the input pin driver except to be able to supply the normal operation drive current I ISS. Additional features of this device are ESD protection according to the Human Body model and the ability to be driven from a TTL Logic circuit.

4 Package thermal data

4.1 DPAK thermal data

Figure 33. DPAK PC board (1)

  1. Layout condition of R th and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB thickness=2 mm,

Cu thickness=35 µm, Copper areas: from minimum pad lay-out to 8 cm 2). Figure 34. DPAK R thj-amb vs PCB copper area in open box free air condition

4.2 SO-8 thermal data

Figure 37. SO-8 PC board (1)

  1. Layout condition of R th and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness=2 mm,

Cu thickness=35 µm, Copper areas: 0.14 cm 2, 0.6 cm2, 1.6 cm2). Figure 38. SO-8 R thj-amb vs PCB copper area in open box free air condition Table 5. DPAK thermal parameter (continued)

4.3 D 2PAK thermal data

Figure 39. D 2PAK PC board(1)

  1. Layout condition of R th and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB thickness=2 mm,

Cu thickness=35 µm, Copper areas: from minimum pad lay-out to 8 cm 2). Figure 40. D 2PAK Rthj-amb vs PCB copper area in open box free air condition

Table 6. D 2PAK thermal parameter (continued)

5 Package information

5.1 ECOPACK ®

specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

5.2 TO-251 (IPAK) mechanical data

Figure 43. TO-251 (IPAK) package dimension Table 7. TO-251 (IPAK) mechanical data

5.3 D 2PAK mechanical data

Figure 44. D 2PAK package dimension Table 7. TO-251 (IPAK) mechanical data (continued)

Table 8. D 2PAK mechanical data

5.4 TO-252 (DPAK) mechanical data

Figure 45. TO-252 (DPAK) package dimension Table 9. TO-252 (DPAK) mechanical data

5.5 SO-8 mechanical data

Figure 46. SO-8 package dimension Table 9. TO-252 (DPAK) mechanical data (continued) Table 10. SO-8 mechanical data

Table 10. SO-8 mechanical data (continued)

6 Revision history

Table 11. Document revision history 21-Jun-2004 6 Initial release. Added Table 1: Device summary on page 1. Added part number VNS14NV04. 20-Sep-2013 9 Updated Disclaimer.