VND10N0613TR STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 25

Technical content

Datasheet sections

  • 1 Block diagram and pin description
  • 2 Electrical specifications
  • 2.1 Absolute maximum ratings
  • 2.2 Thermal data
  • 2.3 Electrical characteristics
  • 2.4 Electrical characteristics curves
  • 3 Protection features
  • 4 Thermal data
  • 5 Package and packing information
  • 5.1 ECOPACK ® packages
  • 5.2 DPAK mechanical data
  • 5.3 IPAK mechanical data
  • 5.4 DPAK packing information
  • 5.5 IPAK packing information
  • 6 Revision history

Features

■ Linear current limitation ■ Thermal shutdown ■ Short circuit protection ■ Integrated clamp ■ Low current drawn from input pin ■ Logic level input threshold ■ ESD protection ■ Schmitt trigger on input ■ High noise immunity

Description

The VND10N06 and VND10N06-1 are monolithic devices designed in STMicroelectronics VIPower M0-2 technology, intended for replacement of standard Power MOSFETs in DC to 50KHz applications. Built in thermal shutdown, linear current limitation and overvoltage clamp protect the chip in harsh environments. Max on-state resistance (per ch.) R DS(on) 0.3Ω Current limitation (typ) I lim 10A Drain-Source clamp voltage V CLAMP 60V 3 3 DPAK TO-252 IPAK TO-251 Table 1. Device summary

1 Block diagram and pin description

Figure 1. Block diagram

2 Electrical specifications

2.1 Absolute maximum ratings

program and other relevant quality document.

2.2 Thermal data

Table 2. Absolute maximum ratings Table 3. Thermal data

2.3 Electrical characteristics

Tcase = 25 °C unless otherwise stated. Table 4. Off Table 5. Switching (1)

  1. Parameters guaranteed by design / characterization.

Table 6. On (1)

  1. Pulsed: pulse duration = 300µs, duty cycle 1.5%.

Figure 2. Switching waveforms Table 7. Dynamic Table 8. Source Drain diode

  1. Pulsed: pulse duration = 300µs, duty cycle 1.5%.
  2. Parameters guaranteed by design / characterization.

Table 9. Protections (-40°C < T j < 150°C, unless otherwise specified)

  1. Parameters guaranteed by design / characterization.

Figure 7. Unclamped inductive waveforms

2.4 Electrical characteristics curves

Figure 8. Static Drain-Source on Figure 9. Static Drain-Source on Figure 10. Derating curve Figure 11. Static Drain-Source on Figure 12. Current limit Vs. junction Figure 13. Source-Drain diode voltage

Figure 26. Normalized input threshold

Protection features VND10N06 / VND10N06-1

3 Protection features

During normal operation, the INPUT pin is electrically connected to the gate of the internal power MOSFET through a low impedance path as soon as VIN > VIH. The device then behaves like a standard power MOSFET and can be used as a switch from DC to 50KHz. The only difference from the user’s standpoint is that a small DC current IISS flows into the INPUT pin in order to supply the internal circuitry. During turn-off of an unclamped inductive load the output voltage is clamped to a safe level by an integrated Zener clamp between DRAIN pin and the gate of the internal Power MOSFET. In this condition, the Power MOSFET gate is set to a voltage high enough to sustain the inductive load current even if the INPUT pin is driven to 0V. The device integrates an active current limiter circuit which limits the drain current ID to Ilim whatever the INPUT pin Voltage. When the current limiter is active, the device operates in the linear region, so power dissipation may exceed the heatsinking capability. Both case and junction temperatures increase, and if this phase lasts long enough, junction temperature may reach the overtemperature threshold T jsh. If Tj reaches Tjsh, the device shuts down whatever the INPUT pin voltage. The device will restart automatically when Tj has cooled down to Tjrs.

4 Thermal data

Figure 27. Thermal impedance for DPAK / IPAK

5 Package and packing information

5.1 ECOPACK ® packages

specifications, grade definitions and product status are available at: www.st.com.

5.2 DPAK mechanical data

Figure 28. DPAK package dimensions

Table 10. DPAK mechanical data

5.3 IPAK mechanical data

Figure 29. IPAK mechanical data and package outline Table 11. IPAK mechanical data

5.4 DPAK packing information

Figure 30. DPAK footprint Figure 31. DPAK tube shipment (no suffix)

Figure 32. DPAK tape and reel shipment (suffix “TR”)

5.5 IPAK packing information

Figure 33. IPAK tube shipment (no suffix)

6 Revision history

Table 12. Document revision history 22-Aug-2006 2 Document restructured. 12-Dec-2008 3 Document restructured and reformatted. Added ECOPACK® packages information. 25-Sep-2013 4 Updated disclaimer.