Single channel high-side solid state relay
Document overview
- Manufacturer or author: STMICROELECTRONICS
- PDF pages: 26
Technical content
Datasheet sections
- 1 Block diagram and pin description
- 2 Electrical specifications
- 2.1 Absolute maximum ratings
- 2.2 Thermal data
- 2.3 Electrical characteristics
- 2.4 Electrical characteristics curves
- 3 Application information
- 3.1 GND protection network against reverse battery
- 3.1.1 Solution 1: resistor in the ground line (RGND only)
- 3.1.2 Solution 2: diode (DGND) in the ground line
- 3.2 Load dump protection
- 3.3 MCU I/Os protection
- 4 Package and PCB thermal data
- 4.1 P 2PAK thermal data
- 5 Package and packing information
- 5.1 ECOPACK ® packages
- 5.2 P 2PAK mechanical data
- 5.3 P 2PAK packing information
- 6 Revision history
Features
■ ECOPACK®: lead free and RoHS compliant ■ Automotive Grade: compliance with AEC Guidelines ■ Very low standby current ■ CMOS compatible input ■ Proportional load current sense ■ Current sense disable ■ Thermal shutdown protection and diagnosis ■ Undervoltage shutdown ■ Overvoltage clamp ■ Load current limitation
Description
The VN920B5-E is a monolithic device designed in STMicroelectronics™ VIPower™ M0-3 technology. The VN920B5-E is intended for driving any type of load with one side connected to ground. The active V CC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table). Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. The device integrates an analog current sense output which delivers a current proportional to the load current. The device automatically turns off in the case where the ground pin becomes disconnected. Type R DS(on) IOUT VCC VN920B5-E 16 m Ω 30 A 36 V P2PAK Table 1. Device summary
Table 6. Switching (V
1 Block diagram and pin description
Figure 1. Block diagram Figure 2. Configurati on diagram (top view) Table 2. Suggested connections for unused and not connected pins
2 Electrical specifications
Figure 3. Current and voltage conventions
2.1 Absolute maximum ratings
program and other relevant quality document. Table 3. Absolute maximum ratings
2.2 Thermal data
Table 3. Absolute maximum ratings (continued) Table 4. Thermal data
- When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35μm thick).
- When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35μm thick).
2.3 Electrical characteristics
Note: V CLAMP and VOV are correlated. Typical difference is 5V. Table 5. Power Table 6. Switching (V CC =1 3V )
Table 7. Logic inputs Table 8. Current sense (9 V ≤ VCC ≤ 16 V)
- Current sense signal delay after positive input slope.
Table 9. V CC output diode Table 10. Protections (1)
- To ensure long term reliability under heavy over-load or short circuit conditions, protection and related
abnormal conditions this software must limit the duration and number of activation cycles. Table 11. Truth table
Figure 4. Switching characteristics Table 12. Electrical transient requirements
- All functions of the device are performed as designed after exposure to disturbance.
- One or more functions of the device is not perfor med as designed after exposure and cannot be returned to
proper operation without replacing the device.
Figure 5. I OUT/ISENSE versus IOUT
Figure 6. Waveforms
2.4 Electrical char acteristics curves
Figure 7. Off-state output current Figure 8. High-level input current Figure 9. Input clamp voltage Figure 10. Turn-on voltage slope Figure 11. Overvoltage shutdown Figure 12. Turn-off voltage slope
3 Application information
Figure 19. Application schematic
3.1 GND protection network against reverse battery
3.1.1 Solution 1: resist or in the ground line (RGND only)
This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. maximum rating section of the device datasheet. maximum on-state currents of the different devices. the same resistor then ST suggests to utilize Solution 2 (see below).
3.1.2 Solution 2: diode (D GND) in the ground line
A resistor (RGND = 1 kΩ) should be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network produces a shift (≈600mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift not varies if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected.
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCC max DC rating. The same applies if the device is subject to transients on the VCC line that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transient are present on the VCC line, the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the microcontroller I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of microcontroller and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of microcontroller I/Os. CCpeak/Ilatchup ≤ Rprot ≤ (VOHµC -V IH -V GND) / IIHmax Calculation example: For VCCpeak= -100 V and Ilatchup ≥ 20 mA; VOHµC ≥ 4.5 V 5k Ω ≤ Rprot ≤ 65 kΩ. Recommended values: Rprot =10 kΩ.
Figure 20. P2PAK maximum turn-off current versus inductance(1)
- Values are generated with R L =0 Ω.
the temperature specified above for curves A and B.
4 Package and PCB thermal data
4.1 P 2PAK thermal data
Figure 21. P 2PAK PC board(1)
- Layout condition of R th and Zth measurements (PCB FR4 area = 60 mm x 60 mm, PCB thickness = 2 mm,
Cu thickness = 35 μm , Copper areas: 0.97 cm2, 8 cm2). Figure 22. P 2PAK Rthj-amb vs PCB copper area in open box free air condition
Table 13. P 2PAK thermal parameter
5 Package and packing information
5.1 ECOPACK ® packages
specifications, grade definitions and product status are available at: www.st.com.
5.2 P 2PAK mechanical data
Figure 25. P 2PAK package dimensions
Table 14. P 2PAK mechanical data
5.3 P 2PAK packing information
Figure 26. P 2PAK tube shipment (no suffix) Figure 27. P 2PAK tape and reel (suffix “TR”)
6 Revision history
Table 15. Document revision history 19-Jul-2010 1 Initial release.